CN104976963B - The method and its application of quick measurement body surface face shape - Google Patents
The method and its application of quick measurement body surface face shape Download PDFInfo
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- CN104976963B CN104976963B CN201410147774.7A CN201410147774A CN104976963B CN 104976963 B CN104976963 B CN 104976963B CN 201410147774 A CN201410147774 A CN 201410147774A CN 104976963 B CN104976963 B CN 104976963B
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- 238000005259 measurement Methods 0.000 title claims abstract description 41
- 238000000034 method Methods 0.000 title claims abstract description 37
- 230000003287 optical effect Effects 0.000 claims abstract description 52
- 230000011664 signaling Effects 0.000 claims abstract description 49
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 22
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 22
- 239000010703 silicon Substances 0.000 claims abstract description 22
- 239000004065 semiconductor Substances 0.000 claims abstract description 6
- 238000012545 processing Methods 0.000 claims abstract description 3
- 230000035945 sensitivity Effects 0.000 claims description 2
- 238000012986 modification Methods 0.000 description 4
- 230000004048 modification Effects 0.000 description 4
- 238000001514 detection method Methods 0.000 description 3
- 230000033001 locomotion Effects 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000010408 sweeping Methods 0.000 description 1
- 230000001360 synchronised effect Effects 0.000 description 1
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Abstract
Provide the method for the quick measurement body surface face shape for carrying out face shape reconstruct to body surface with optical signalling and its measure the application of the remaining global stress of silicon chip surface in semiconductor processing.Methods described includes：A, the relation of optical signalling and position is obtained in advance, determines optical signalling and the one-to-one linearly interval in position；B, the scan line of body surface is determined according to required precision, scans body surface, obtains optical signalling and the scanning curve of scan position change；C, scanning curve is modified in scanning process, the optical signalling beyond linearly interval is returned to linearly interval；D, after the end of scan, the position on scanning curve everywhere is provided by the one-to-one relationship of optical signalling and position；E, the scanning curve being corrected is moved to vertically and be connected with uncorrected scanning curve to reconstruct whole object surface face shape.The present invention scans body surface by optical signalling and quickly corrected, and the quick measurement on Non-contact nondestructive testee surface can be achieved.
Description
Technical field
Present invention relates generally to measurement detection technique field, more particularly to body surface the face shape weight of little height difference
Structure technology and its application for measuring the remaining global stress of silicon chip surface in semiconductor processing.
Background technology
Face shape reconfiguration technique is mainly the height for measuring the enough independent points of body surface, these point composition lines, i.e.,
It may know that the face shape details on this line.Line that is enough and can covering whole object surface can reconstruction of objects surface.
The technical need of reconstruction of objects surface face shape is extremely important in precision process field.Such as in semiconductor industry,
Scan to obtain silicon chip surface face shape using precision instruments such as position sensitive detectors (PSD), can further estimate residual stress.
In the case of these, the height difference very little of body surface.Meanwhile to prevent from destroying body surface, shape reconstruct in face generally requires non-
The technological means such as contact, lossless.Optical measurement configuration is one of contactless nondestructive measurement body surface height extraordinary
Technological means.
Using optical measurement configuration come measure body surface highly be usually each measurement point measure optical signalling (such as
Energy, or focus on), by optical signalling and the corresponding relation of position, obtain the elevation information of the point.This acquisition optics letter
Number general measure mode be feasible and correct for reconstruction of objects surface, but measuring speed is slow.
The content of the invention
It is an object of the invention to be improved above-mentioned existing measuring method, a kind of quick measurement body surface face is proposed
The surface face shape of the method for shape, reconstruction plane object using optical signalling quick nondestructive.
According to an aspect of the present invention, optical signalling quickly is used to object table in the method for measurement body surface face shape
Face carries out face shape reconstruct, and methods described includes：
A, the relation of optical signalling and position is obtained in advance, determines the optical signalling and the one-to-one linear zone in position
Between；
B, the scan line of body surface is determined according to required precision, scans body surface, obtains optical signalling and scanning position
Put the scanning curve of change；
C, scanning curve is modified in scanning process, the optical signalling beyond the linearly interval is returned to linearly
Section；
D, after the end of scan, the position on scanning curve everywhere is provided by the one-to-one relationship of the optical signalling and position
Put；
E, the scanning curve being corrected is moved to vertically and be connected with uncorrected scanning curve, to reconstruct whole object table
Face face shape.
In some cases, if there is multiple optical signallings and the one-to-one linearly interval in position, then choose multiple
A linearly interval of the position to optical signalling sensitivity maximum intensity in linearly interval.
In some cases, described in the step c is modified to the height for adjusting the object.
In some cases, the amendment in the step c make it that the optical signalling beyond the linearly interval returns to
The centre position of linearly interval.
In some cases, the optical signalling is focus error signal FES, interference fringe or light intensity.
According to a kind of embodiment, the optical signalling is focus error signal FES, and the position is the height z of object,
Wherein, FES maximums FESmaxCorresponding z maximums zmax, FES minimum values FESminCorresponding z minimum values zmin, the optical signalling with
The one-to-one linearly interval in position is zmaxTo zminBetween.
Advantageously, in the step c, when the FES values of measurement are close to FESmaxWhen, i.e., | FES-FESmax| ＜ | FESmax-
FESmin|/10, adjustment object height z values arrive | FESmax-FESmin| at/2；When the FES values of measurement are close to FESminWhen, i.e., | FES-
FESmin| ＜ | FESmax-FESmin|/10, adjustment object height z values arrive | FESmax-FESmin| at/2.
Advantageously, when adjusting object height z values, to adjusting front and rear same spot scan record FES values twice.
According to another aspect of the present invention, the method for above-mentioned quick measurement body surface face shape is used in semiconductor technology
The middle remaining global stress of measurement silicon chip surface.The fluctuating of the surface face shape of silicon chip is only below millimeter magnitude, generally, silicon chip surface
Need to grow various film layer structures with physics or chemical method, these film layer structures can cause silicon chip surface to have answering for remnants
Power.In order to prevent silicon chip destroyed, it is necessary to understand these residual stress at any time.One method of measurement remnant overall situation stress is exactly
Surface configuration of the silicon chip before and after growth structure is measured, normally only needs a line, it is not necessary to entire surface shape.Using the present invention's
The method of quick measurement body surface face shape, reflected light signal and height can be utilized by the reflected light signal on detecting object surface
One-to-one relationship between degree obtains surface face shape, and contact plane body surface is not required in measurement process, can prevent from destroying
Or pollution body surface, while measurement process is quickly accurate.
Embodiment
Be discussed further below the specific embodiment of the method using the quick measurement body surface face shape of the present invention implementation and
Use.It will be appreciated, however, that the specific embodiment discussed is merely illustrative the certain party implemented and using the present invention
Formula, the scope being not intended to limit the present invention.
Illustrate the present invention exemplified by the remaining global stress of silicon chip surface is measured in semiconductor technology.
Global stress measurement is mainly the relative altitude change for obtaining silicon chip in diametric(al).In common optical signalling
In metering system, the optical signalling that can be used has a lot.Those skilled in the art will be understood that for the present invention, can
The optical signalling of use need to change within the specific limits with a range of change of the apparent height of object being measured,
Such measurement signal can for example include but is not limited to focus error signal (Focus Error Signal, FES), interference fringe
Or light intensity etc..As an example, FES may be selected in one embodiment as measurement signal, wherein, FES values and silicon chip surface
HeightzThere is longer linearly interval between value, different z value opening position FES values are different.In FES maximums FESmaxIt is (right
Answer zmax) and FES minimum values FESmin(corresponding zmin) between, z values and FES values are one-to-one, i.e. linearly intervals.
The present invention makes full use of optical signalling measured value in linearly interval (for example, FES values) and positional value (for example, height z
Value) one-to-one relationship, design causes the chuck of carrying silicon chip to drive silicon chip along pre- with certain rate curve v=f (r)
Determine diametric(al) motion, wherein r be motion process in each point to silicon chip center distance.Synchronous acquisition optical signalling measurement simultaneously
Value FES value FES=g (r).Selection a little focuses on successfully first on the predetermined sweep diameter direction of silicon chip, is typically chosen and scans
Point, next carried out under diametric the scanning just z coordinate in this height value.
During measurement, the scan line of body surface can be determined according to the required accuracy requirement, such as is included but is not limited to point-by-point
Scan line, by-line scan line or inter-bank scan line etc..For example, when using the method for by-line scanning, by-line scanning is tested
Body surface, while obtain optical signalling measured value, optical signalling measured value and scan position value (i.e. thing are obtained during the end of scan
Height value) change curve.Height on scanning curve everywhere is provided by the one-to-one relationship of optical signalling and height, foot
Enough scanning curve restructural whole object surface faces shape.
In scanning process, it is possible that the optical signalling of scan position exceeds the situation of linearly interval, such as close to light
Learn the signal upper limit.This can cause two problems：A, the maximum relative height differential of silicon chip diametrically each point may be more than linear zone
Between included z value differences；B, z value changes are larger at linearly interval end points and FES value changes very littles, can not pass through FES value inverses
Current z values.
On the other hand, the invention provides the scan mode of amendment, when occurring to need to adjust the situation of amendment, object can adjust
Plummer, allow object height to be adjusted so that the optical signalling beyond linearly interval comes back to linearly interval.Measurement knot
Shu Hou, obtained scanning curve jump at the time of plummer adjusts, and now, directly translating the scanning curve of height makes it
Scanning curve during with not adjusting is connected, and allows jump to disappear.Specifically, with z values and the one-to-one linear zone of FES values
Between exemplified by, when the FES values of detection are close to FES maximums FESmaxWhen, i.e., | FES-FESmax| ＜ | FESmax-FESmin|/10, stop
Mobile, the chuck height z values of adjustment carrying silicon chip arrive | FESmax-FESmin| at/2；When the FES values of detection are close to FES minimum values
FESminWhen, i.e., | FES-FESmin| ＜ | FESmax-FESmin|/10, stop movement, adjustment chuck height z values arrive | FESmax-
FESmin| at/2.When chuck height adjusts, it is necessary to adjusting front and rear same spot scan record FES values twice.Scanning
After end, from the obtained FES value inverse z values of scanning.All z values are linked to be curve, are exactly scanning process in the place for having jump
In have adjustment chuck height place.Directly the curve of rear scanning is moved to vertically and is connected with the curve first scanned, from
And realize the reconstruct of silicon chip surface face shape.
According to the present invention quick measurement body surface face shape method in, height and the one-to-one line of optical signalling
In property section, by scanning body surface, Optical signal graph corresponding to acquisition.Closed by the one-to-one corresponding of height and optical signalling
System obtains body surface height.In scanning process, the height of body surface may exceed linearly interval, the light now obtained
Height value can not be converted into by one-to-one relationship by learning signal measurements.The present invention gives the scan mode of amendment.When sweeping
It is (unwise in boundary, change of the general optical signalling measured value to height when the optical signalling for retouching to obtain is close to border
Sense), pause scanning, a fixed distance is adjusted, the optical signalling measured value for allowing obtain is moved to the interposition of linearly interval
Put, then proceed to scan.The quick measurement of non-contact, lossless testee apparent height finally can be achieved, to precision instrument
The shape reconstruct of surface face, the measurement of especially silicon chip surface overall situation residual stress are highly beneficial.
The embodiment of the present invention is described above.It should be appreciated that the invention is not limited in upper
Particular implementation is stated, above-mentioned embodiment has many modification modes, and these modes are for various equivalent modifications
Apparent.These modification/modifications are fallen into the association area of the present invention, it should also are included in the scope of appended claim
In.
Claims (9)
1. the quickly method of measurement body surface face shape, it is characterised in that methods described is entered using optical signalling to body surface
The shape reconstruct of row face, including：
A, the relation of optical signalling and position is obtained in advance, determines the optical signalling and the one-to-one linearly interval in position；
B, the scan line of body surface is determined according to required precision, scans body surface, optical signalling is obtained and scan position becomes
The scanning curve of change；
C, scanning curve is modified in scanning process, the optical signalling beyond the linearly interval is returned to linear zone
Between；
D, after the end of scan, the position on scanning curve everywhere is provided by the one-to-one relationship of the optical signalling and position；
E, the scanning curve being corrected is moved to vertically and be connected with uncorrected scanning curve, to reconstruct whole object surface face
Shape.
2. the method for quick measurement body surface face shape according to claim 1, it is characterised in that the optical signalling with
A linear zone of the one-to-one linearly interval in position for position in multiple linearly intervals to optical signalling sensitivity maximum intensity
Between.
3. the method for quick measurement body surface face shape according to claim 1, it is characterised in that in the step c, institute
State the height for being modified to and adjusting the object.
4. the method for quick measurement body surface face shape according to claim 1, it is characterised in that in the step c, institute
Amendment is stated so that the optical signalling beyond the linearly interval returns to the centre position of linearly interval.
5. the method for quick measurement body surface face shape according to any one of claim 1 to 4, it is characterised in that institute
It is focus error signal FES, interference fringe or light intensity to state optical signalling.
6. the method for quick measurement body surface face shape according to claim 5, it is characterised in that the optical signalling is
Focus error signal FES, the position are the height z of object, wherein, FES maximums FESmaxCorresponding z maximums zmax, FES is most
Small value FESminCorresponding z minimum values zmin, the optical signalling and the one-to-one linearly interval in position are zmaxTo zminBetween.
7. the method for quick measurement body surface face shape according to claim 6, it is characterised in that in the step c, when
The FES values of measurement are close to FESmaxWhen, i.e., | FES-FESmax|<|FESmax-FESmin|/10, adjustment object height z values arrive |
FESmax-FESmin| at/2；When the FES values of measurement are close to FESminWhen, i.e., | FES-FESmin|<|FESmax-FESmin|/10, adjustment
Object height z values arrive | FESmax-FESmin| at/2.
8. the method for quick measurement body surface face shape according to claim 7, it is characterised in that in adjustment object height
During z values, to adjusting front and rear same spot scan record FES values twice.
A kind of 9. method for measuring the remaining global stress of silicon chip surface in semiconductor processing, it is characterised in that it includes, and uses
The method of quick measurement body surface face shape according to any one of claim 1 to 8 measures silicon chip before growth structure
Surface configuration afterwards.
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4525858A (en) * | 1983-01-03 | 1985-06-25 | General Electric Company | Method and apparatus for reconstruction of three-dimensional surfaces from interference fringes |
| CN101050949A (en) * | 2007-05-22 | 2007-10-10 | 天津大学 | Measuring system and its measuring method for large field object micro surface three dimension topography |
| EP1992905A1 (en) * | 2007-05-16 | 2008-11-19 | Nederlandse Organisatie voor toegepast- natuurwetenschappelijk onderzoek TNO | Optical sensor with tilt error correction |
| CN201534392U (en) * | 2009-07-16 | 2010-07-28 | 上海理工大学 | High-precision detection system of tablet stamping equipment |
| CN102305601A (en) * | 2011-05-18 | 2012-01-04 | 天津大学 | High-precision non-contact measurement method and device for three-dimensional profile of optical freeform curved surface |
-
2014
- 2014-04-14 CN CN201410147774.7A patent/CN104976963B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4525858A (en) * | 1983-01-03 | 1985-06-25 | General Electric Company | Method and apparatus for reconstruction of three-dimensional surfaces from interference fringes |
| EP1992905A1 (en) * | 2007-05-16 | 2008-11-19 | Nederlandse Organisatie voor toegepast- natuurwetenschappelijk onderzoek TNO | Optical sensor with tilt error correction |
| CN101050949A (en) * | 2007-05-22 | 2007-10-10 | 天津大学 | Measuring system and its measuring method for large field object micro surface three dimension topography |
| CN201534392U (en) * | 2009-07-16 | 2010-07-28 | 上海理工大学 | High-precision detection system of tablet stamping equipment |
| CN102305601A (en) * | 2011-05-18 | 2012-01-04 | 天津大学 | High-precision non-contact measurement method and device for three-dimensional profile of optical freeform curved surface |
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| CN104976963A (en) | 2015-10-14 |
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