CN104976963A - Method for rapid measurement of surface shape of object surface, and application thereof - Google Patents
Method for rapid measurement of surface shape of object surface, and application thereof Download PDFInfo
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- CN104976963A CN104976963A CN201410147774.7A CN201410147774A CN104976963A CN 104976963 A CN104976963 A CN 104976963A CN 201410147774 A CN201410147774 A CN 201410147774A CN 104976963 A CN104976963 A CN 104976963A
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- 238000000034 method Methods 0.000 title claims abstract description 37
- 238000005259 measurement Methods 0.000 title claims abstract description 29
- 230000003287 optical effect Effects 0.000 claims abstract description 55
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 21
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 21
- 239000010703 silicon Substances 0.000 claims abstract description 21
- 239000004065 semiconductor Substances 0.000 claims abstract description 6
- 230000011664 signaling Effects 0.000 claims description 45
- 238000012937 correction Methods 0.000 claims description 4
- 238000012545 processing Methods 0.000 claims description 3
- 230000035882 stress Effects 0.000 description 9
- 238000001514 detection method Methods 0.000 description 3
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 206010042209 Stress Diseases 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 239000003344 environmental pollutant Substances 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 230000009191 jumping Effects 0.000 description 1
- 231100000719 pollutant Toxicity 0.000 description 1
- 238000013214 routine measurement Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 230000001360 synchronised effect Effects 0.000 description 1
- 238000013519 translation Methods 0.000 description 1
Abstract
The invention provides a method for rapid measurement of the surface shape of an object surface, for carrying out surface shape reconstruction on the object surface by use of optical signals, and an application of the method in measurement of residual global stress of a silicon chip surface in a semiconductor technology. The method comprises the following steps: a, obtaining relations between the optical signals and positions in advance, and determining a linearity interval in which the optical signals are in one-to-one correspondence with the positions; b, according to precision requirements, determining scanning lines on the object surface, and scanning the objet surface to obtain a scanning curve about the optical signals and scanning position changes; c, correcting the scanning curve in a scanning process to enable the optical signals beyond the linearity interval to return to the linearity interval; d, after scanning is finished, giving the location of each position on the scanning curve through the one-to-one corresponding relation between the optical signals and the positions; and e, vertically translating the corrected scanning curve until the corrected scanning curve is connected with a non-corrected scanning curve so as to reconstruct the surface shape of the whole object surface. According to the invention, the object surface is scanned through the optical signals and is rapidly corrected such that non-contact lossless rapid measurement of the surface of a measured object can be realized.
Description
Technical field
The present invention relates generally to and measures detection technique field, particularly relates to the application that body surface has the face shape reconfiguration technique of little height difference and measures the remaining overall stress of silicon chip surface in semiconductor processing.
Background technology
Face shape reconfiguration technique mainly measures the abundant height independently put of body surface, and these some composition lines, can know the face shape details on this line.Abundant and can cover whole body surface line can reconstruction of objects surface.
The technical need of face, reconstruction of objects surface shape is extremely important in precision process field.Such as in semiconductor industry, the exact instrument scannings such as use location Sensitive Apparatus (PSD) obtain silicon chip surface face shape, can estimate unrelieved stress further.In these cases, the height difference of body surface is very little.Meanwhile, for preventing destroying body surface, the technological means such as face shape reconstructs generally needs noncontact, can't harm.Optical measurement configuration is an extraordinary technological means of contactless nondestructive measurement body surface height.
Adopting optical measurement configuration to measure body surface height is generally measure optical signalling (such as energy, or focus on) at each measurement point, by the corresponding relation of optical signalling and position, obtains the elevation information of this point.The routine measurement mode of this acquisition optical signalling is feasible and correct for reconstruction of objects surface, but measuring speed is slow.
Summary of the invention
The object of the invention is to be improved above-mentioned existing measuring method, propose the method for a kind of Quick Measurement body surface face shape, utilize the surperficial face shape of optical signalling quick nondestructive ground reconstruction plane object.
According to an aspect of the present invention, use optical signalling to carry out face shape reconstruct to body surface in the method for Quick Measurement body surface face shape, described method comprises:
The relation of a, in advance acquisition optical signalling and position, determines that described optical signalling and position are one to one between linear zone;
B, sweep trace according to accuracy requirement determination body surface, scanning object surface, obtains the scanning curve of optical signalling and scanning position change;
C, in scanning process, scanning curve to be revised, make the optical signalling exceeded between described linear zone get back between linear zone;
After d, the end of scan, to provide on scanning curve position everywhere by the one-to-one relationship of described optical signalling and position;
E, the scanning curve through revising vertically is moved to and is connected with uncorrected scanning curve, to reconstruct whole body surface face shape.
In some cases, if there is multiple optical signalling and position one to one between linear zone, then choose Jian Zhong position, multiple linear zone between the maximum linear zone of the responsive intensity of optical signalling.
In some cases, the height adjusting described object is modified to described in described step c.
In some cases, the described correction in described step c makes the optical signalling exceeded between described linear zone get back to centre position between linear zone.
In some cases, described optical signalling is focus error signal FES, interference fringe or light intensity.
According to a kind of embodiment, described optical signalling is focus error signal FES, and described position is the height z of object, wherein, and FES maximal value FES
maxcorresponding z maximal value z
max, FES minimum value FES
mincorresponding z minimum value z
min, described optical signalling and position are z one to one between linear zone
maxto z
minbetween.
Advantageously, in described step c, when the FES value measured is close to FES
maxtime, namely | FES-FES
max| < | FES
max-FES
min|/10, adjustment object height z values arrive | FES
max-FES
min|/2 places; When the FES value measured is close to FES
mintime, namely | FES-FES
min| < | FES
max-FES
min|/10, adjustment object height z values arrive | FES
max-FES
min|/2 places.
Advantageously, when adjusting object height z value, to the same point scanning record twice FES value before and after adjustment.
According to a further aspect in the invention, the method for above-mentioned Quick Measurement body surface face shape is employed to measure the remaining overall stress of silicon chip surface in semiconductor processing.The fluctuating of the surperficial face shape of silicon chip is only below millimeter magnitude, and usually, silicon chip surface needs to grow various film layer structure by physics or chemical method, and these film layer structures can cause silicon chip surface to have remaining stress.In order to prevent silicon chip to be destroyed, need to understand these unrelieved stresss at any time.The method measuring remaining overall stress is exactly measure the surface configuration of silicon chip before and after growth structure, generally only needs a line, does not need whole shape.Apply the method for Quick Measurement body surface face of the present invention shape, by the reflected light signal on detecting object surface, the one-to-one relationship between reflected light signal and height is utilized to obtain surperficial face shape, contact plane body surface is not needed in measuring process, can prevent from destroying or pollutant surface, measuring process is accurate fast simultaneously.
Embodiment
Discuss enforcement and the use of the specific embodiment of the method for application Quick Measurement body surface face of the present invention shape below in detail.But, should be appreciated that discussed specific embodiment only exemplarily illustrates and implement and use ad hoc fashion of the present invention, but not limit the scope of the invention.
To measure the remaining overall stress of silicon chip surface in semiconductor technology, the present invention is described.
Overall situation stress measurement mainly obtains the relative height change of silicon chip in diametric(al).In common optical signalling metering system, the optical signalling that can adopt has a lot.Those skilled in the art will be understood that, for the present invention, adoptable optical signalling need change within the specific limits along with the change in the certain limit of the surface elevation of object being measured, such measuring-signal such as can include but not limited to focus error signal (Focus ErrorSignal, FES), interference fringe or light intensity etc.Exemplarily, FES can be selected in one embodiment as measuring-signal, wherein, the height of FES value and silicon chip surface
zhave between longer linear zone between value, different z value position FES values is different.At FES maximal value FES
max(corresponding z
max) and FES minimum value FES
min(corresponding z
min) between, z value and FES value are one to one, namely between linear zone.
During the present invention makes full use of between linear zone, optical signalling measured value (such as, FES value) and positional value is (such as, height z value) one-to-one relationship, design makes to carry the chuck of silicon chip and drives silicon chip to move along predetermined diameter direction with certain rate curve v=f (r), wherein r be in motion process each point to the distance at silicon chip center.Synchronous acquisition optical signalling measured value FES value FES=g (r) simultaneously.First select a bit to focus on successfully on the predetermined sweep diameter direction of silicon chip, generally select sweep starting point, next carry out under the z coordinate of diametric scanning just at this height value.
During measurement, the sweep trace of body surface can be determined according to required accuracy requirement, such as, include but not limited to point by point scanning line, by-line sweep trace or inter-bank sweep trace etc.For example, when adopting the way of by-line scanning, by-line scanning testee surface, obtains optical signalling measured value simultaneously, obtains the change curve of optical signalling measured value and scanning position value (object height value) during the end of scan.Height everywhere, abundant scanning curve restructural whole body surface face shape is provided on scanning curve by the one-to-one relationship of optical signalling and height.
In scanning process, may occur that the optical signalling of scanning position exceeds the situation between linear zone, such as close to the optical signalling upper limit.This can cause two problems: the maximal phase of a, silicon chip diametrically each point may to be greater than between linear zone included z value difference to difference in height; B, linear interval endpoint place z value change greatly and FES value changes very little, cannot by the current z value of FES value inverse.
To this, the invention provides the scan mode of correction, when there is the situation needing adjustment to revise, the plummer of adjustable object, allows object height be adjusted, and the optical signalling exceeded between linear zone is come back between linear zone.After measurement terminates, the scanning curve obtained occurred jumping in the moment that plummer adjusts, and now, the scanning curve of direct translation height makes it be connected with scanning curve when not adjusting, and allows jump disappear.Specifically, for z value and FES value one to one between linear zone, when the FES value of detection is close to FES maximal value FES
maxtime, namely | FES-FES
max| < | FES
max-FES
min|/10, stop mobile, the chuck height z value of adjustment carrying silicon chip arrives | FES
max-FES
min|/2 places; When the FES value of detection is close to FES minimum value FES
mintime, namely | FES-FES
min| < | FES
max-FES
min|/10, stop mobile, adjustment chuck height z value arrives | FES
max-FES
min|/2 places.When chuck height adjustment, need the same point scanning record twice FES value before and after to adjustment.After the end of scan, from scanning the FES value inverse z value obtained.All z values are linked to be curve, are exactly the place having adjustment chuck height in scanning process there being the place of jump.Directly the curve of rear scanning is vertically moved to and be connected with the curve first scanned, thus realize the reconstruct of silicon chip surface face shape.
In method according to Quick Measurement body surface face of the present invention shape, one to one in linear zone, by scanning object surface, obtain corresponding Optical signal graph at height and optical signalling.Body surface height is obtained by the one-to-one relationship of height and optical signalling.In scanning process, the height of body surface may exceed between linear zone, and the optical signalling measured value now obtained cannot convert height value to by one-to-one relationship.The present invention gives the scan mode of correction.When scan the optical signalling that obtains close to when border (at boundary, the change of general optical signalling measured value to height is insensitive), suspend scanning, adjust a fixing distance, allow the optical signalling measured value obtained move to centre position between linear zone, then continue scanning.Finally can realize the Quick Measurement of noncontact, harmless testee surface elevation, to the surperficial face shape reconstruct of exact instrument, especially the measurement of silicon chip surface overall situation unrelieved stress is very favourable.
Above the specific embodiment of the present invention is described.Should be understood that, the present invention is not limited to above-mentioned particular implementation, and above-mentioned embodiment exists many alter modes, and these modes are clearly concerning various equivalent modifications.These amendment/modification fall into association area of the present invention, also should be included in the scope of appended claim.
Claims (9)
1. the method for Quick Measurement body surface face shape, is characterized in that, described method uses optical signalling to carry out face shape reconstruct to body surface, comprising:
The relation of a, in advance acquisition optical signalling and position, determines that described optical signalling and position are one to one between linear zone;
B, sweep trace according to accuracy requirement determination body surface, scanning object surface, obtains the scanning curve of optical signalling and scanning position change;
C, in scanning process, scanning curve to be revised, make the optical signalling exceeded between described linear zone get back between linear zone;
After d, the end of scan, to provide on scanning curve position everywhere by the one-to-one relationship of described optical signalling and position;
e, the scanning curve through revising vertically is moved to and is connected with uncorrected scanning curve, to reconstruct whole body surface face shape.
2. the method for Quick Measurement body surface face according to claim 1 shape, is characterized in that, described optical signalling and position are Jian Zhong position, multiple linear zone between linear zone between the maximum linear zone of the responsive intensity of optical signalling one to one.
3. the method for Quick Measurement body surface face according to claim 1 shape, is characterized in that, in described step c, described in be modified to the height adjusting described object.
4. the method for Quick Measurement body surface face according to claim 1 shape, is characterized in that, in described step c, described correction makes the optical signalling exceeded between described linear zone get back to centre position between linear zone.
5. the method for Quick Measurement body surface face according to any one of claim 1 to 4 shape, it is characterized in that, described optical signalling is focus error signal FES, interference fringe or light intensity.
6. the method for Quick Measurement body surface face according to claim 5 shape, it is characterized in that, described optical signalling is focus error signal FES, and described position is the height z of object, wherein, FES maximal value FES
maxcorresponding z maximal value z
max, FES minimum value FES
mincorresponding z minimum value z
min, described optical signalling and position are z one to one between linear zone
maxto z
minbetween.
7. the method for Quick Measurement body surface face according to claim 6 shape, is characterized in that, in described step c, when the FES value measured is close to FES
maxtime, namely | FES-FES
max| < | FES
max-FES
min|/10, adjustment object height z values arrive | FES
max-FES
min|/2 places; When the FES value measured is close to FES
mintime, namely | FES-FES
min| < | FES
max-FES
min|/10, adjustment object height z values arrive | FES
max-FES
min|/2 places.
8. the method for Quick Measurement body surface face according to claim 7 shape, is characterized in that, when adjusting object height z value, to the same point scanning record twice FES value before and after adjustment.
9. the method for the Quick Measurement body surface face shape according to any one of claim 1 to 8 measures the application of the remaining overall stress of silicon chip surface in semiconductor processing.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410147774.7A CN104976963B (en) | 2014-04-14 | 2014-04-14 | The method and its application of quick measurement body surface face shape |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410147774.7A CN104976963B (en) | 2014-04-14 | 2014-04-14 | The method and its application of quick measurement body surface face shape |
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| Publication Number | Publication Date |
|---|---|
| CN104976963A true CN104976963A (en) | 2015-10-14 |
| CN104976963B CN104976963B (en) | 2018-03-09 |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4525858A (en) * | 1983-01-03 | 1985-06-25 | General Electric Company | Method and apparatus for reconstruction of three-dimensional surfaces from interference fringes |
| CN101050949A (en) * | 2007-05-22 | 2007-10-10 | 天津大学 | Measuring system and its measuring method for large field object micro surface three dimension topography |
| EP1992905A1 (en) * | 2007-05-16 | 2008-11-19 | Nederlandse Organisatie voor toegepast- natuurwetenschappelijk onderzoek TNO | Optical sensor with tilt error correction |
| CN201534392U (en) * | 2009-07-16 | 2010-07-28 | 上海理工大学 | High-precision detection system of tablet stamping equipment |
| CN102305601A (en) * | 2011-05-18 | 2012-01-04 | 天津大学 | High-precision non-contact measurement method and device for three-dimensional profile of optical freeform curved surface |
-
2014
- 2014-04-14 CN CN201410147774.7A patent/CN104976963B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4525858A (en) * | 1983-01-03 | 1985-06-25 | General Electric Company | Method and apparatus for reconstruction of three-dimensional surfaces from interference fringes |
| EP1992905A1 (en) * | 2007-05-16 | 2008-11-19 | Nederlandse Organisatie voor toegepast- natuurwetenschappelijk onderzoek TNO | Optical sensor with tilt error correction |
| CN101050949A (en) * | 2007-05-22 | 2007-10-10 | 天津大学 | Measuring system and its measuring method for large field object micro surface three dimension topography |
| CN201534392U (en) * | 2009-07-16 | 2010-07-28 | 上海理工大学 | High-precision detection system of tablet stamping equipment |
| CN102305601A (en) * | 2011-05-18 | 2012-01-04 | 天津大学 | High-precision non-contact measurement method and device for three-dimensional profile of optical freeform curved surface |
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| CN104976963B (en) | 2018-03-09 |
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Denomination of invention: Method for rapid measurement of surface shape of object surface, and application thereof Effective date of registration: 20190121 Granted publication date: 20180309 Pledgee: Shanghai Xingcheng Investment Management Co.,Ltd. Pledgor: RAINTREE SCIENTIFIC INSTRUMENTS (SHANGHAI) Corp. Registration number: 2019310000002 |
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Denomination of invention: Method for rapid measurement of surface shape of object surface, and application thereof Effective date of registration: 20190710 Granted publication date: 20180309 Pledgee: Shanghai Pudong Emerging Industry Investment Co.,Ltd. Pledgor: RAINTREE SCIENTIFIC INSTRUMENTS (SHANGHAI) Corp. Registration number: 2019310000040 |
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Date of cancellation: 20230724 Granted publication date: 20180309 Pledgee: Shanghai Pudong Emerging Industry Investment Co.,Ltd. Pledgor: RAINTREE SCIENTIFIC INSTRUMENTS (SHANGHAI) Corp. Registration number: 2019310000040 |
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