CN104966689A - Wafer level packaging MEMS (Micro-Electro-Mechanical Systems) chip uncovering device and uncovering method - Google Patents
Wafer level packaging MEMS (Micro-Electro-Mechanical Systems) chip uncovering device and uncovering method Download PDFInfo
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- CN104966689A CN104966689A CN201510427764.3A CN201510427764A CN104966689A CN 104966689 A CN104966689 A CN 104966689A CN 201510427764 A CN201510427764 A CN 201510427764A CN 104966689 A CN104966689 A CN 104966689A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
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Abstract
A wafer level packaging MEMS (Micro-Electro-Mechanical Systems) chip uncovering device is composed of an uncovering fixture, an electric furnace and a vacuum system, wherein the uncovering fixture is placed on the electric furnace, and the electric furnace is placed in a vacuum room; the uncovering fixture is composed of a top layer, an upper layer, a lower layer, a guiding rod and a traction device, the guiding rod passes through the top layer and the upper layer and fixed on the lower layer, the traction device is located between the top layer and the upper layer, the main body of the top layer is a top plate, the top plate is fixed on the guiding rod via a top screw, the main body of the lower layer is a lower plate, the lower plate is provided with a lower fixed clamping plate and a lower movable clamping plate, a lower screw is connected with the lower movable clamping plate, the main body of the upper layer is an upper plate, the upper plate is provided with an upper fixed clamping plate and an upper movable clamping plate, an upper screw is connected with the upper movable clamping plate. According to the wafer level packaging MEMS chip uncovering method, solder is welded in vacuum, a cover plate and a MEMS structural layer are separated via the traction device, the cover plate of the wafer level packaging MEMS chip is removed, and preparation is made for subsequent failure analysis.
Description
Technical field
The present invention relates to the detection field of MEMS chip, be related specifically to a kind of hood-opening device and ends-opening method of MEMS chip of wafer level packaging.
Background technology
MEMS (Micro-Electro-Mechanical Systems) is the abbreviation of MEMS (micro electro mechanical system), MEMS components and parts are made up of MEMS chip and special control integration circuit (ASIC) chip, it is little that MEMS components and parts have volume, cost is low, low in energy consumption, intelligence degree is high, easy calibration, advantage easy of integration, be widely used in consumer electronics product (as mobile phone, panel computer, toy, digital camera, game machine, air mouse, remote controller, GPS etc.), national defense industry is (as smart bombs, guided missile, Aero-Space, unmanned aerial vehicle etc.) and industrial series products (as automobile, robot, intelligent transportation, industrial automation, environmental monitoring, platform stable controls, agricultural modernization, security monitoring etc.) in, can say, MEMS components and parts are foundation stones of technology of Internet of things.
Along with the rapid growth in portable type electronic product (as mobile phone, panel computer, wearable device etc.) market, consumer electronics product has become the biggest market of MEMS components and parts, for high-end smartphones, it has used several large class MEMS components and parts, and a class is MEMS motion sensor: gyroscope, accelerometer, digital compass; One class is MEMS environmental sensor: hygrometer, ambient temperature meter, pressure gauge, gas sensor; One class is communication MEMS: microphone, tuned antenna, filter etc.In order to reach, portable type electronic product is little to MEMS components and parts volume, performance is high, low in energy consumption, low-cost requirement; major part MEMS components and parts contain mobilizable parts; need first to carry out wafer level packaging in disk manufacture process; protect movable, frangible micro mechanical structure; then disk is cut into chip, then encapsulate by common plastics method for packing or according to different purposes.
Because the bascule of MEMS is very trickle and fragile, be subject to the mutual adhesive of meeting under the effects such as capillary force, Van der Waals force, electrostatic force, and produce the phenomenon such as structural break, irrecoverability displacement when external force shock and vibration, variations in temperature, thus MEMS is caused to lose efficacy; In addition, in the production process of MEMS, owing to designing bad or technology controlling and process is bad also can cause component failure.For improved products rate of finished products and reliability, just the MEMS that those lost efficacy must be analyzed, find failure cause.
Shown in Fig. 1 is the schematic diagram of the MEMS of a typical wafer level packaging, MEMS 10 is made up of cover plate 11, MEMS structure layer 12, base plate 14, MEMS structure layer 12 is combined by insulating barrier 13 and base plate 14, combined by solder layer 16 and cover plate 11, base plate 14 and cover plate 11 are manufactured with cavity, forming annular seal space 15, a MEMS bascule 12a altogether can be freely movable in annular seal space 15.
The main material normally silicon (Si) of MEMS chip, silicon materials can through the infrared light of wavelength at 1000nm ~ 10000nm, when not removing cover plate 11 or base plate 14, infrared microscope is a selection of observation activity MEMS structure 12a, but the resolution of infrared microscope is inadequate, and the cover plate 11 of the MEMS chip of wafer level packaging often has metal level, the impervious metal level of infrared light, cannot see the MEMS structure 12a below metal level.So for the MEMS chip of wafer level packaging, removing cover plate 11 or base plate 14, observing with visible light microscope or ESEM (SEM) is an inevitable choice.Existing is by heating, the means such as chemical corrosion or mechanical force removing cover plate 11 or base plate 14, there is sample to be analyzed fragile, operating process easily introduces the problems such as secondary failure, such as when the cover plate 11 bonded with heating means removing brazing metal 16, the solder droplets melted easily is caused to drop on MEMS structure 12a, further, if be vacuum in annular seal space 15, the solder then melted can inwardly flow on MEMS structure 12a, and due to the draught head inside and outside annular seal space 15, cover plate 11 needs with the removing of larger power, this can cause cover plate 11 transverse shifting, damage MEMS structure 12a.
Summary of the invention
The technical problem to be solved in the present invention overcomes the deficiencies in the prior art, a kind of hood-opening device of MEMS chip of wafer level packaging is provided, this device can heat fused brazing metal in a vacuum, by the elastic force of spring, cover plate is separated with MEMS structure layer, thus remove the cover plate of the MEMS chip of wafer level packaging accurately, expose complete MEMS structure, for subsequent failure analysis is prepared.
For solving the problems of the technologies described above, the invention provides a kind of hood-opening device of MEMS chip of wafer level packaging, being made up of fixture of uncapping, electric furnace and vacuum system, fixture of uncapping is placed on electric furnace, and uncap fixture and electric furnace are all placed in vacuum chamber.
Described vacuum system is by vacuum pump, vacuum pipe and airtight container composition, vacuum pump connects airtight container by vacuum pipe, the air in airtight container can be extracted out, vacuum pipe is provided with extraction valve, open when vacuumizing, close before closing down vacuum pump, to maintain the air pressure in vacuum chamber, airtight container is provided with bleeder pipe, bleeder pipe is provided with vent valve, after the cover plate of MEMS chip is separated with MEMS structure layer, open vent valve, air enters in airtight container by bleeder pipe, make airtight container inner and outer air pressure identical, thus open airtight container, taking-up is uncapped fixture, airtight container is also provided with observation window, for monitoring the temperature of the process of uncapping and electric furnace.
Described electric furnace is closed electric furnace, and the surface in heating by electric cooker portion is metal or the pottery of level, can be heated to more than 500 degrees Celsius.
Described fixture of uncapping is made up of top layer, upper strata, lower floor, guide post and draw-gear, top layer, the upper and lower are arranged up and down, draw-gear, between top layer and upper strata, for regulating the distance of the relative lower floor in upper strata, thus will be clamped cover plate by upper strata and will be separated with MEMS structure layer.Guide post lower end is fixed in lower floor, and upper end passes from top layer, and upper strata can be free to slide in the vertical direction along guide post.
The main body of top layer is top board, top board there are at least two top pilot holes, guide post upper end is passed from the pilot hole of top, top board is fixing on the guide bar by top screw, vertical with guide post, top screw, except playing the effect of fixing top board, can also finely tune perpendicularity and the depth of parallelism of guide post, to ensure that upper strata can be free to slide; Roof window mouth is had, for observing the situation of MEMS chip in the middle of top board;
The main body of lower floor is lower plate, guide post lower end is fixed in lower plate, lower window is had in the middle of lower plate, lower the window's position is corresponding with top the window's position, to hold MEMS chip and upper plate projection, is separately installed with lower strap and lower ambulatory splint in the left and right sides of lower window, lower strap is fixed in lower plate, lower strap has lower fixed chuck, and for contacting MEMS chip, the thickness of lower fixed chuck is suitable with the base plate thickness of MEMS chip; Lower ambulatory splint is arranged in lower loose slot, lower ambulatory splint there is lower active chuck, the thickness of lower active chuck is suitable with the base plate thickness of MEMS chip, lower screw one end is stretched in lower loose slot, and be connected with lower ambulatory splint, for regulating the position of lower ambulatory splint, when implementing to uncap operation, MEMS chip is placed in lower window, by regulating lower screw, drive lower ambulatory splint motion, MEMS chip be fixed between lower fixed chuck and lower active chuck, the base plate of MEMS chip contacts with lower active chuck with lower fixed chuck.
The main body on upper strata is upper plate, upper plate there are at least two upper pilot holes, upper pilot hole position is corresponding with pilot hole position, top, guide post passes from upper pilot hole, to ensure that upper plate can only move up and down along guide post, window is had in the centre of upper plate, to hold the situation of MEMS chip and observation lower floor, the both sides, front and back of upper window are provided with strap and upper ambulatory splint, upper strap is fixed on upper plate, upper strap there is upper fixed chuck, upper ambulatory splint is arranged in loose slot, upper ambulatory splint there is upper active chuck, one end of tightening up a screw is stretched in loose slot, and be connected with upper strap, the position of tightening up a screw for regulating upper ambulatory splint, upper plate is made up of the protruding peaceful layer segment of upper plate, upper strap, upper ambulatory splint, upper window, upper loose slot is positioned at upper plate high spot with tightening up a screw, flat bed part is arranged on above lower plate, upper plate projection is arranged in lower window, like this, be arranged on upper strap in upper plate projection and upper ambulatory splint just not by lower strap, the thickness effect of lower ambulatory splint and can MEMS chip be clamped.
When implementing to uncap operation, MEMS chip is placed in window, also be arranged in lower window simultaneously, adjustment is tightened up a screw, ambulatory splint motion in drive, the direction of motion of upper ambulatory splint and the direction of motion of lower ambulatory splint perpendicular, MEMS chip is fixed between upper fixed chuck and upper active chuck, the cover plate of MEMS chip contacts with upper active chuck with upper fixed chuck, and the base plate of MEMS chip and MEMS structure layer do not contact with upper active chuck with upper fixed chuck, when uncapping, the cover plate of MEMS chip moves upward under the traction of draw-gear with upper strata, base plate and MEMS structure layer are then motionless in position with lower floor, this completes the separation of cover plate.The hood-opening device of the MEMS chip of wafer level packaging of the present invention can remove the cover plate of the MEMS chip of wafer level packaging accurately, exposes complete MEMS structure, for subsequent failure analysis is prepared.
Described vacuum pipe comprises connected flexible pipe and hard tube, and flexible pipe is directly connected with vacuum pump, and hard tube is directly connected with airtight container, and flexible pipe is to reduce vibration that vacuum pump operationally produces to the impact of fixture of uncapping.
Described observation window is clear glass, and observation window is opened above airtight container, for monitoring the temperature of the process of uncapping and electric furnace
Described observation window is clear glass, can make of thick toughened glass or polymethyl methacrylate, observation window is positioned at airtight container side, and be connected with airtight container by sealing ring, observation window can also as hermatic door, surrounding closed chamber by sealing ring and airtight container, for holding electric furnace and fixture of uncapping, the temperature of the process of uncapping and electric furnace can be monitored simultaneously.
Described spring upper end is fixed on top board by top clip, lower end is fixed on upper plate by upper clip, for regulating the distance of the relative lower floor in upper strata, thus cover plate will be clamped by upper strata and be separated with MEMS structure layer, under the pulling of spring, cover plate along guide post upwards vertical sliding motion, thus is separated with MEMS structure layer by upper strata.
Described draw-gear is made up of fixed pulley, draught line and weight, and fixed pulley is fixed on top board, and draught line one end is fixed on upper plate, and the other end is walked around fixed pulley and is fixed on weight.By changing the weight of weight, regulate the distance of the relative lower floor in upper strata, thus cover plate will be clamped by upper strata and be separated with MEMS structure layer.
Present invention also offers the ends-opening method of the MEMS chip of wafer level packaging, comprise the following steps:
(1) MEMS chip to be uncapped is placed on electric furnace, adjusts the headroom height of fixture of uncapping, clamp the base plate of MEMS chip with lower fixed chuck and lower active chuck, clamp the cover plate of MEMS chip with fixed chuck and lower active chuck;
(2) set furnace temperature, open heating by electric cooker, then close airtight container, open vacuum pump evacuation;
(3) closing extraction valve close to during design temperature, vacuum pump is closed down;
(4) observe cover plate by observation window whether to be separated with MEMS structure layer, just cut off furnace power once separation, then open vent valve and inflate in vacuum chamber;
(5) to be cooled to close to room temperature, open airtight container, take out fixture of uncapping, take off MEMS chip and cover plate from fixture.
This ends-opening method is melting solder in a vacuum, by draw-gear, cover plate is separated with MEMS structure layer, the cover plate of the MEMS chip of wafer level packaging can be removed accurately, expose complete MEMS structure, for subsequent failure analysis is prepared, and MEMS structure can not be damaged.
Accompanying drawing explanation
Fig. 1 is the schematic diagram of existing typical MEMS chip.
Fig. 2 is the schematic diagram of the hood-opening device of embodiment one.
Fig. 3 is the schematic diagram before the fixture of uncapping of embodiment one is uncapped.
Fig. 4 is the schematic diagram after the fixture of uncapping of embodiment one is uncapped.
Fig. 5 is the vertical view of top layer.
The upward view of Tu6Shi lower floor.
Fig. 7 is the A-A cutaway view of Fig. 6.
Fig. 8 is the vertical view on upper strata.
Fig. 9 is the B-B cutaway view of Fig. 8.
Figure 10 is the C-C cutaway view of Fig. 8.
Figure 11 is the schematic diagram of the hood-opening device of embodiment two.
Figure 12 is the schematic diagram of the hood-opening device of embodiment three.
Figure 13 is the schematic diagram of the hood-opening device of embodiment four.
Embodiment
Below in conjunction with drawings and Examples, the invention will be further described.
Embodiment one
The hood-opening device of the MEMS chip of wafer level packaging, as shown in Figure 2, be made up of fixture 100 of uncapping, electric furnace 200 and vacuum system, fixture 100 of uncapping is placed on electric furnace 200, and is placed in vacuum chamber 309.
Described vacuum system is made up of vacuum pump 301, vacuum pipe and airtight container 305, vacuum pump 301 connects airtight container 305 by flexible pipe 302, hard tube 303, the air in airtight container 305 can be extracted out, flexible pipe 301 is to reduce vibration that vacuum pump 301 operationally produces to the impact of fixture 100 of uncapping, hard tube 303 is provided with extraction valve 304, opening when vacuumizing, closing before closing down vacuum pump 301, to maintain the air pressure in vacuum chamber 309; Airtight container 305 is provided with bleeder pipe 306, bleeder pipe 306 is provided with vent valve 307, after the cover plate 11 of MEMS chip 10 is separated with MEMS structure layer 12, open vent valve 307, air enters in airtight container 309 by bleeder pipe 306, make airtight container 309 inner and outer air pressure identical, thus opening encapsulation door, take out fixture 100 of uncapping; Airtight container 309 is also provided with observation window 308, for monitoring the temperature of the process of uncapping and electric furnace 200.
Described electric furnace 200 is not for having the closed electric furnace of naked light, and the surface of its heating part is smooth metal or pottery, parallel to the ground, can be heated to more than 500 DEG C.
Described fixture 100 of uncapping is made up of top layer 110, upper strata 120, lower floor 130, guide post 140 and spring 150, as shown in Figure 3, the lower end of four guide posts 140 is all fixed in lower floor 130, and upper end passes from top layer 110, and upper strata 120 can be free to slide in the vertical direction along guide post 140.The upper end of spring 150 is fixed on top layer 110, and lower end is fixed on upper strata 120, for regulating the distance of the relative lower floor 130 in upper strata 120, thus will be clamped cover plate 11 by upper strata 120 and is separated with MEMS structure layer 12.Top layer 110, for fixing four guide posts 140, makes it be parallel to each other and all perpendicular to lower floor 130, to ensure that upper strata 120 can be free to slide in the vertical direction along guide post 140.Upper strata 120 is for clamping the cover plate 11 of MEMS chip 10, and under the pulling of spring 150, cover plate 11, along guide post 140 upwards vertical sliding motion, is separated with MEMS structure layer 12, as shown in Figure 4 by upper strata 120; Lower floor 130, for clamping the base plate 14 of MEMS chip 10, for separation cover plate 11 provides reaction force, meanwhile, leads 140 for fixing four, for whole fixture 100 of uncapping provides support.
As shown in Figure 5, the main body of top layer 110 is top boards 112,112 4 angles are manufactured with four top pilot holes 111 to top board, guide post 140 passes from the pilot hole 111 of top, top board 112 is fixed on guide post 140 by top screw 113, vertical with guide post 140, and top screw 113 is except playing the effect of fixing top board 112, perpendicularity and the depth of parallelism of four guide posts 140 can also be finely tuned, to ensure that upper strata 120 can be free to slide; The central authorities of top board 112 are manufactured with roof window mouth 115, for observing the situation of MEMS chip 10; Top board 111 also has top clip 114, for fixing spring 150.
As shown in Figure 6, Figure 7, the main body of lower floor 130 is lower plates 131, guide post 140 is fixed on four angles of lower plate 131, lower window 136 is had in the middle of lower plate 131, to hold MEMS chip 10 and the protruding 122a of upper plate, lower strap 132 and lower ambulatory splint 133 is separately installed with in the left and right sides of lower window 136, lower strap 132 is fixed in lower plate 131, lower strap 132 there is lower fixed chuck 132a, for contacting MEMS chip 10, the thickness of lower fixed chuck 132a is suitable with base plate 14 thickness of MEMS chip 10; Lower ambulatory splint 133 is arranged in lower loose slot 135, lower ambulatory splint there is lower active chuck 133a, the thickness of lower active chuck 133a is suitable with base plate 14 thickness of MEMS chip 10, lower screw 134 one end is stretched in lower loose slot 135, and be connected with lower ambulatory splint 133, lower screw 134 is for regulating the position of lower ambulatory splint 133.When implementing to uncap operation, MEMS chip 10 is placed in lower window 136, by regulating lower screw 134, lower ambulatory splint 133 is driven to move, MEMS chip 10 be fixed between lower fixed chuck 132a and lower active chuck 133a, the base plate 14 of MEMS chip 10 contacts with lower active chuck 133a with lower fixed chuck 122a.
As shown in Figure 8, Figure 9, the main body on upper strata 120 is upper plates 122, and upper plate 122 4 angles are manufactured with four upper pilot holes 121, guide post 140 passes from upper pilot hole 121, to ensure that upper plate 122 can only move up and down along guide post 140, window 127 is had, to hold the situation of MEMS chip 10 and observation lower floor 130 in the centre of upper plate 120, strap 128 and upper ambulatory splint 124 are installed in the both sides, front and back of upper window 127, upper strap 128 is fixed on upper plate 122, upper strap 128 there is upper fixed chuck 128a, upper ambulatory splint 124 is arranged in loose slot 126, upper ambulatory splint 124 there is upper active chuck 124a, 125 one end of tightening up a screw are stretched in loose slot 126, and be connected with upper strap 128, tighten up a screw 125 for regulating the position of upper ambulatory splint 124, upper plate 122 also has upper clip 123, upper clip 123 position is corresponding with clip 114 position, top, for fixing spring 150, upper plate 122 is made up of upper plate protruding 122a peace layer segment 122b, upper strap 128, upper ambulatory splint 124, upper window 127, upper loose slot 126 and tighten up a screw and 125 be positioned at the protruding 122a place of upper plate, flat bed part 122b is arranged on above lower plate 131, the protruding 122a of upper plate is then arranged in lower window 136, like this, upper strap 128 on the protruding 122a of upper plate is arranged on and upper ambulatory splint 124 just can not clamp MEMS chip 10 by the thickness effect of lower strap 132, lower ambulatory splint 133.
When implementing to uncap operation, MEMS chip 10 is placed in window 127, also be arranged in lower window 136 simultaneously, as shown in Figure 10, adjustment tightens up a screw 125, in drive, ambulatory splint 124 moves, the direction of motion of upper ambulatory splint 124 and the direction of motion of lower ambulatory splint 133 perpendicular, MEMS chip 10 is fixed between upper fixed chuck 128a and upper active chuck 124a, the cover plate 11 of MEMS chip 10 contacts with upper active chuck 124a with upper fixed chuck 128a, and the base plate 14 of MEMS chip 10 and MEMS structure layer 12 do not contact with upper active chuck 124a with upper fixed chuck 128a, when uncapping, the cover plate 11 of MEMS chip 10 moves upward under the pulling of spring 150 with upper strata 120, base plate 14 and MEMS structure layer 12 are then motionless in position with lower floor 130, this completes the separation of cover plate 11.
It should be noted that, in the present embodiment, the quantity of guide post 140 can also be two or three.Top screw 113 has one at least, and its quantity can be identical with guide post 140 quantity, also can not be identical.
Embodiment two
From the difference of embodiment one, embodiment two is only that vacuum system is different, as shown in figure 11, the hood-opening device of the MEMS chip of wafer level packaging, is made up of vacuum system, electric furnace 200, fixture 100 of uncapping, fixture 100 of uncapping is placed on electric furnace 200, and is placed in vacuum chamber 309.
Described vacuum system is made up of vacuum pump 301, vacuum pipe and airtight container 305, vacuum pump 301 connects airtight container 305 by flexible pipe 302, hard tube 303, the air in airtight container 305 can be extracted out, flexible pipe 301 is to reduce vibration that vacuum pump 301 operationally produces to the impact of fixture 100 of uncapping, hard tube 303 is provided with extraction valve 304, opening when vacuumizing, closing before closing down vacuum pump 301, to maintain the air pressure in vacuum chamber 309; Airtight container 305 is provided with bleeder pipe 306, bleeder pipe 306 is provided with vent valve 307, after the cover plate 11 of MEMS chip 10 is separated with MEMS structure layer 12, open vent valve 307, air enters in airtight container 309 by bleeder pipe 306, make airtight container 309 inner and outer air pressure identical, thus opening encapsulation door, take out fixture 100 of uncapping; Hermatic door 311 is equipped with in airtight container 309 side, hermatic door 311 is transparent, both can as door, also can as observation window, hermatic door 311 can make of thick toughened glass or polymethyl methacrylate, hermatic door 311 surrounds closed chamber 309 by sealing ring 310 and airtight container 305, for holding electric furnace 200 and fixture 100 of uncapping, can monitor the temperature of the process of uncapping and electric furnace 200 simultaneously.
Embodiment three
Embodiment three is only to replace spring with pulley gear with the difference of embodiment one, as shown in figure 12, the hood-opening device of the MEMS chip of wafer level packaging, is made up of vacuum system, electric furnace 200, fixture 100 of uncapping, fixture 100 of uncapping is placed on electric furnace 200, and is placed in vacuum chamber 309.
Described fixture 100 of uncapping is made up of top layer 110, upper strata 120, lower floor 130, guide post 140 and pulley gear, the lower end of four guide posts 140 is all fixed in lower floor 130, upper end is fixed by top layer 110, and upper strata 120 can be free to slide in the vertical direction along guide post 140.Pulley gear comprises fixed pulley 160, metal wire 170 and weight 180, fixed pulley 160 is fixed on the top board 112 of top layer 100, metal wire 170 one end is fixed on the upper plate 122 on upper strata 120, the other end is walked around fixed pulley 160 and is connected with weight 180, by changing the weight of weight 180, regulate the distance of upper strata 120 lower floor 130 relatively, thus cover plate 11 will be clamped by upper strata 120 and be separated with MEMS structure layer 12.Top layer 110, for fixing four guide posts 140, makes it be parallel to each other and all perpendicular to lower floor 130, to ensure that upper strata 120 can be free to slide in the vertical direction along guide post 140.Upper strata 120 is for clamping the cover plate 11 of MEMS chip 10, and under the pulling of weight 180, cover plate 11, along guide post 140 upwards vertical sliding motion, is separated with MEMS structure layer 12 by upper strata 120; Lower floor 130, for clamping the base plate 14 of MEMS chip 10, for separation cover plate 11 provides reaction force, meanwhile, leads 140 for fixing four, for whole fixture 100 of uncapping provides support.
Embodiment four
Embodiment four is only to replace spring with pulley gear with the difference of embodiment two, as shown in figure 13, the hood-opening device of the MEMS chip of wafer level packaging, is made up of vacuum system, electric furnace 200, fixture 100 of uncapping, fixture 100 of uncapping is placed on electric furnace 200, and is placed in vacuum chamber 309.
Described vacuum system is made up of vacuum pump 301, vacuum pipe and airtight container 305, vacuum pump 301 connects airtight container 305 by flexible pipe 302, hard tube 303, the air in airtight container 305 can be extracted out, flexible pipe 301 is to reduce vibration that vacuum pump 301 operationally produces to the impact of fixture 100 of uncapping, hard tube 303 is provided with extraction valve 304, opening when vacuumizing, closing before closing down vacuum pump 301, to maintain the air pressure in vacuum chamber 309; Airtight container 305 is provided with bleeder pipe 306, bleeder pipe 306 is provided with vent valve 307, after the cover plate 11 of MEMS chip 10 is separated with MEMS structure layer 12, open vent valve 307, air enters in airtight container 309 by bleeder pipe 306, make airtight container 309 inner and outer air pressure identical, thus opening encapsulation door, take out fixture 100 of uncapping; Hermatic door 311 is equipped with in airtight container 309 side, hermatic door 311 is transparent, both can as door, also can as observation window, hermatic door 311 can make of thick toughened glass or polymethyl methacrylate, hermatic door 311 surrounds closed chamber 309 by sealing ring 310 and airtight container 305, for holding electric furnace 200 and fixture 100 of uncapping, can monitor the temperature of the process of uncapping and electric furnace 200 simultaneously.
Described fixture 100 of uncapping is made up of top layer 110, upper strata 120, lower floor 130, guide post 140 and pulley gear, the lower end of four guide posts 140 is all fixed in lower floor 130, upper end is fixed by top layer 110, and upper strata 120 can be free to slide in the vertical direction along guide post 140.Pulley gear comprises fixed pulley 160, metal wire 170 and weight 180, fixed pulley 160 is fixed on the top board 112 of top layer 100, metal wire 170 one end is fixed on the upper plate 122 on upper strata 120, the other end is walked around fixed pulley 160 and is connected with weight 180, by changing the weight of weight 180, regulate the distance of upper strata 120 lower floor 130 relatively, thus cover plate 11 will be clamped by upper strata 120 and be separated with MEMS structure layer 12.Top layer 110, for fixing four guide posts 140, makes it be parallel to each other and all perpendicular to lower floor 130, to ensure that upper strata 120 can be free to slide in the vertical direction along guide post 140.Upper strata 120 is for clamping the cover plate 11 of MEMS chip 10, and under the pulling of weight 180, cover plate 11, along guide post 140 upwards vertical sliding motion, is separated with MEMS structure layer 12 by upper strata 120; Lower floor 130, for clamping the base plate 14 of MEMS chip 10, for separation cover plate 11 provides reaction force, meanwhile, leads 140 for fixing four, for whole fixture 100 of uncapping provides support.
Embodiment five
The ends-opening method of the MEMS chip of wafer level packaging, opens this device for foundation with embodiment one, comprises the following steps:
(1) fixture 100 of uncapping is placed on electric furnace 200, unclamps the top screw 113 of fixture 100 of uncapping, and regulates top layer 100 position in the vertical direction, spring 150 elastic force is adjusted to suitable degree, fastening top screw 113; Lift upper strata 120, MEMS chip 10 be placed between lower fixed chuck 132a and lower active chuck 133a, MEMS chip 10 is arranged in lower window 136, is also positioned at the position of window 127 correspondence simultaneously; Put down upper strata 120, now due to the pulling force of spring 150, upper strata 120 is positioned at above MEMS chip 10, regulates lower screw 134, promotes lower ambulatory splint 133 and moves, clamp the base plate 14 of MEMS chip 10 with lower fixed chuck 132a and lower active chuck 133a; Adjustment ambulatory splint 124 in 125 promotions of tightening up a screw moves, and clamps the cover plate 11 of MEMS chip 10 with fixed chuck 128a and upper active chuck 124a.
(2) electric furnace 200 is put into vacuum chamber 309 gently together with fixture 100 of uncapping, plug in, setting electric furnace 200 heating-up temperature, electric furnace 200 starts heating; Close airtight container 305 and vent valve 307, open extraction valve 304, open vacuum pump 301 and start to vacuumize; The object vacuumized ensures when being and uncapping that the air pressure in the annular seal space 15 of MEMS chip 10 is close to or higher than the air pressure in vacuum chamber 309, like this after solder layer 16 melts, can not causing lower than external pressure uncapping because of annular seal space 15 internal gas pressure, required mechanical force causes too greatly that uncap difficulty or cover plate 11 moves horizontally, also solder layer 16 can be avoided inwardly to extrude under gas pressure, destroy MEMS structure 12a; The temperature setting of electric furnace 200 will be determined according to the type of the solder melt point of the solder layer 16 of MEMS chip 10.
(3) when electric furnace 200 be heated to close to uncap temperature time, when namely reaching the solder melt point of solder layer 16, close extraction valve 304, then close vacuum pump 301, because closed container 305 is sealings, the air pressure in vacuum chamber 309 can maintain the quite a long time.
(4) observe from observation window 308 process of uncapping, when being separated to cover plate 11 with MEMS structure layer 12, the upper strata 120 of namely clamping cover plate 11 moves upward under the pulling of spring 150, when being separated with lower floor 130, close electric furnace 200, the fixture 100 that makes to uncap cools together with the MEMS chip 10 of having uncapped, simultaneously, open vent valve 307, allow extraneous air slowly be flow in vacuum chamber 309 by bleeder pipe 306, until inside and outside air pressure balance.
(5) be cooled to close to room temperature at fixture 100 of uncapping, and vacuum chamber 309 internal gas pressure identical with the external world time, open airtight container 305, taking-up is uncapped fixture 100, then lower screw 134 is regulated, lower active chuck 133a is separated with lower fixed chuck 132a, takes off the MEMS chip 10 without cover plate 11, just can the detection that MEMS structure 12a carries out next step be analyzed; Equally, regulate and tighten up a screw 125, active chuck 124a is separated with upper fixed chuck 128a, takes off cover plate 11, can analyze cover plate 11, so far just complete the process of uncapping of whole MEMS chip 11.
It should be noted that, the main purpose of step (3) is in order to avoid producing vibration influence when vacuum pump 301 works to quality of uncapping, namely after solder layer 16 melts, cover plate 11 is separated with MEMS structure layer 12, and when moving upward with upper strata 120, the vibrations of vacuum pump 301 can cause cover plate 11 horizontal jitter, may cause solder contact MEMS structure 12a, cause MEMS structure 12a to damage.If vacuum pump 301 is enough far away apart from airtight container 305, flexible pipe 302 length enough slows down vibrations, and step (3) also can be omitted.
Claims (8)
1. the hood-opening device of the MEMS chip of wafer level packaging, is characterized in that: be made up of fixture of uncapping, electric furnace and vacuum system, and fixture of uncapping is placed on electric furnace, and uncap fixture and electric furnace are all placed in vacuum chamber;
Described vacuum system is made up of vacuum pump, vacuum pipe and airtight container, vacuum pump connects airtight container by vacuum pipe, and vacuum pipe is provided with extraction valve, and airtight container is provided with bleeder pipe, bleeder pipe is provided with vent valve, airtight container is also provided with observation window;
Described electric furnace is closed electric furnace, and the surface in heating by electric cooker portion is metal or the pottery of level;
Described fixture of uncapping is made up of top layer, upper strata, lower floor, guide post and draw-gear, and top layer, the upper and lower are arranged up and down, and draw-gear is between top layer and upper strata, the main body of top layer is top board, top board has at least two top pilot holes, and guide post upper end is passed from the pilot hole of top, and top board is fixing on the guide bar by top screw, vertical with guide post, has roof window mouth in the middle of top board, the main body of lower floor is lower plate, guide post lower end is fixed in lower plate, have lower window in the middle of lower plate, lower the window's position is corresponding with top the window's position, is separately installed with lower strap and lower ambulatory splint in the left and right sides of lower window, lower strap is fixed in lower plate, lower strap has lower fixed chuck, and lower ambulatory splint is arranged in lower loose slot, and lower ambulatory splint has lower active chuck, lower screw one end is stretched in lower loose slot, and is connected with lower ambulatory splint, the main body on upper strata is upper plate, upper plate there are at least two upper pilot holes, upper pilot hole position is corresponding with pilot hole position, top, guide post passes from upper pilot hole, window is had in the centre of upper plate, the both sides, front and back of upper window are provided with strap and upper ambulatory splint, upper strap is fixed on upper plate, upper strap there is upper fixed chuck, upper ambulatory splint is arranged in loose slot, one end of tightening up a screw is stretched in loose slot, and be connected with upper strap, upper ambulatory splint there is upper active chuck, upper plate is made up of the protruding peaceful layer segment of upper plate, upper strap, upper ambulatory splint, upper window, upper loose slot is positioned at upper plate high spot with tightening up a screw, flat bed part is arranged on above lower plate, upper plate projection is arranged in lower window.
2. the hood-opening device of the MEMS chip of wafer level packaging as claimed in claim 1, it is characterized in that: described vacuum pipe comprises connected flexible pipe and hard tube, flexible pipe is directly connected with vacuum pump, and hard tube is directly connected with airtight container.
3. the hood-opening device of the MEMS chip of wafer level packaging as claimed in claim 1, is characterized in that: described observation window is clear glass, and observation window is opened above airtight container.
4. the hood-opening device of the MEMS chip of wafer level packaging as claimed in claim 1, is characterized in that: described observation window is clear glass, and observation window is positioned at airtight container side, and is connected with airtight container by sealing ring.
5. the hood-opening device of the MEMS chip of the wafer level packaging as described in claim 3 or 4, is characterized in that: described draw-gear is spring, and spring upper end is fixed on top board, and lower end is fixed on upper plate.
6. the hood-opening device of the MEMS chip of wafer level packaging as claimed in claim 5, is characterized in that: described spring upper end is fixed on top board by top clip, and lower end is fixed on upper plate by upper clip.
7. the hood-opening device of the MEMS chip of the wafer level packaging as described in claim 3 or 4, it is characterized in that: described draw-gear is made up of fixed pulley, draught line and weight, fixed pulley is fixed on top board, and draught line one end is fixed on upper plate, and the other end is walked around fixed pulley and is fixed on weight.
8. the ends-opening method of the MEMS chip of wafer level packaging, is characterized in that: utilize the hood-opening device according to any one of claim 1 to 7, comprise the following steps:
(1) MEMS chip to be uncapped is placed on electric furnace, adjusts the headroom height of fixture of uncapping, clamp the base plate of MEMS chip with lower fixed chuck and lower active chuck, clamp the cover plate of MEMS chip with fixed chuck and lower active chuck;
(2) set furnace temperature, open heating by electric cooker, then close airtight container, open vacuum pump evacuation;
(3) closing extraction valve close to during design temperature, vacuum pump is closed down;
(4) observe cover plate by observation window whether to be separated with MEMS structure layer, just cut off furnace power once separation, then open vent valve and inflate in vacuum chamber;
(5) to be cooled to close to room temperature, open airtight container, take out fixture of uncapping, take off MEMS chip and cover plate from fixture.
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| CN201510427764.3A CN104966689B (en) | 2015-07-17 | 2015-07-17 | A kind of hood-opening device and ends-opening method of the MEMS chip of wafer level packaging |
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| CN201510427764.3A CN104966689B (en) | 2015-07-17 | 2015-07-17 | A kind of hood-opening device and ends-opening method of the MEMS chip of wafer level packaging |
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| CN110371923A (en) * | 2019-06-03 | 2019-10-25 | 航天科工防御技术研究试验中心 | A kind of opening method of MEMS acceleration sensor device |
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