CN104966689B - A kind of hood-opening device and ends-opening method of the MEMS chip of wafer level packaging - Google Patents
A kind of hood-opening device and ends-opening method of the MEMS chip of wafer level packaging Download PDFInfo
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- CN104966689B CN104966689B CN201510427764.3A CN201510427764A CN104966689B CN 104966689 B CN104966689 B CN 104966689B CN 201510427764 A CN201510427764 A CN 201510427764A CN 104966689 B CN104966689 B CN 104966689B
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- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
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Abstract
The hood-opening device of the MEMS chip of wafer level packaging, is made up of fixture of uncapping, electric furnace and vacuum system, and fixture of uncapping is placed on electric furnace, and electric furnace is placed in vacuum chamber；Fixture of uncapping is made up of top layer, upper strata, lower floor, guide post and draw-gear, and guide post is passed through from top layer and upper strata, is fixed in lower floor, and draw-gear is located between top layer and upper strata, and the main body of top layer is top board, and top board is fixed on the guide bar by top screw；The main body of lower floor is lower plate, there is lower strap and lower ambulatory splint in lower plate, and lower screw is connected with lower ambulatory splint；The main body on upper strata is upper plate, there is upper strap and upper ambulatory splint on upper plate, tightens up a screw and is connected with upper strap.The ends-opening method of the MEMS chip of wafer level packaging, is to melt solder in a vacuum, and cover plate is separated with MEMS structure layer by draw-gear, removes the cover plate of the MEMS chip of wafer level packaging, is that subsequent failure analysis is prepared.
Description
Technical field
The present invention relates to the detection field of MEMS chip, a kind of uncapping for MEMS chip of wafer level packaging is related specifically to
Device and ends-opening method.
Background technology
MEMS (Micro-Electro-Mechanical Systems) is the abbreviation of MEMS, MEMS components by
MEMS chip and special control integrated circuit (ASIC) chip are constituted, MEMS components have small volume, low cost, it is low in energy consumption,
Intelligence degree is high, easy calibration, advantage easy of integration, be widely used in consumer electronics product (such as mobile phone, panel computer,
Toy, digital camera, game machine, air mouse, remote control, GPS etc.), national defense industry (such as smart bombs, guided missile, aviation boat
My god, unmanned aerial vehicle etc.) and industrial class product (such as automobile, robot, intelligent transportation, industrial automation, environmental monitoring, platform
Stability contorting, agricultural modernization, security monitoring etc.) in, it may be said that MEMS components are the foundation stones of technology of Internet of things.
It is consumer with the swift and violent growth in portable type electronic product (such as mobile phone, panel computer, wearable device) market
Electronic product has turned into the biggest market of MEMS components, and by taking high-end smartphones as an example, it has used a few major class MEMS units device
Part a, class is MEMS motion sensors：Gyroscope, accelerometer, digital compass；One class is MEMS environmental sensors：Humidity
Meter, environment temperature meter, pressure gauge, gas sensor；One class is communication MEMS：Microphone, tuned antenna, wave filter etc..
The requirement high, low in energy consumption, cheap to MEMS components small volume, performance to reach portable type electronic product, it is most of
MEMS components contain mobilizable part, it is necessary to first carry out wafer level packaging in disk manufacturing process, protect movable, frangible
Micro mechanical structure, disk is then cut into chip, then sealed by common plasticses method for packing or according to different purposes
Dress.
Because the bascule of MEMS is very trickle and fragility, by capillary force, Van der Waals force, electrostatic force etc.
The lower mutual adhesive of meeting of effect, and structural break, irrecoverability displacement etc. are produced in external force shock and vibration, temperature change
Phenomenon, so as to cause MEMS to fail；In addition, in the production process of MEMS, due to designing bad or technology controlling and process
It is bad to also result in component failure.It is improved products yield rate and reliability, the MEMS that must be just failed to those is carried out
Analysis, finds failure cause.
Shown in Fig. 1 is a schematic diagram for the MEMS of typical wafer level packaging, MEMS 10 by cover plate 11,
MEMS structure layer 12, base plate 14 are constituted, and MEMS structure layer 12 is combined together by insulating barrier 13 with base plate 14, by solder layer
16 are combined together with cover plate 11, and base plate 14 has cavity with making on cover plate 11, collectively form an annular seal space 15, and MEMS lives
Dynamic structure 12a can the freely activity in annular seal space 15.
The main material of MEMS chip is typically silicon (Si), and silicon materials can be through wavelength 1000nm~10000nm's
Infrared light, in the case where cover plate 11 or base plate 14 is not removed, infrared microscope is a choosing of observation activity MEMS structure 12a
Select, but the resolution ratio of infrared microscope is inadequate, and often have metal level on the cover plate 11 of the MEMS chip of wafer level packaging, it is red
The outer impervious metal level of light, it is impossible to see the MEMS structure 12a below metal level.So for the MEMS cores of wafer level packaging
Piece, removes cover plate 11 or base plate 14, and it is an inevitable choice to be observed with visible light microscope or ESEM (SEM).It is existing
Be to remove cover plate 11 or base plate 14 by the means such as heating, chemical attack or mechanical force, it is fragile to there is sample to be analysed, behaviour
The problems such as being easily introduced secondary failure as process, such as when the cover plate 11 that brazing metal 16 is bonded is removed with heating means, easily
The solder of fusing is caused to be dropped on MEMS structure 12a, further, if being vacuum in annular seal space 15, the solder for melting
Can inwardly flow on MEMS structure 12a, and due to the draught head inside and outside annular seal space 15, cover plate 11 needs to be removed with larger power
Go, this can cause the transverse shifting of cover plate 11, damage MEMS structure 12a.
The content of the invention
The technical problem to be solved in the present invention is to overcome the deficiencies in the prior art, there is provided a kind of MEMS cores of wafer level packaging
The hood-opening device of piece, the device can in a vacuum heat fusing metal solder, be tied cover plate and MEMS by the elastic force of spring
Structure layer is separated, so as to accurately remove the cover plate of the MEMS chip of wafer level packaging, exposes complete MEMS structure, is follow-up mistake
Effect analysis is prepared.
In order to solve the above technical problems, the invention provides a kind of hood-opening device of the MEMS chip of wafer level packaging, by
Fixture, electric furnace and the vacuum system of uncapping composition, fixture of uncapping is placed on electric furnace, uncaps fixture and electric furnace is all placed in vacuum chamber.
The vacuum system is made up of vavuum pump, vacuum pipe and sealing container, and vavuum pump connects close by vacuum pipe
Envelope container, can extract the air in sealing container out, and extraction valve is provided with vacuum pipe, be opened when vacuumizing, and close down
Closed before vavuum pump, to maintain the air pressure in vacuum chamber, bleeder pipe is installed in sealing container, deflation is installed on bleeder pipe
Valve, after the cover plate of MEMS chip is separated with MEMS structure layer, opens vent valve, and air enters sealing container by bleeder pipe
In, make sealing container inner and outer air pressure identical, so as to open sealing container, fixture of uncapping is taken out, it is also equipped with seeing in sealing container
Window is examined, the temperature for monitoring uncap process and electric furnace.
The electric furnace is closed electric furnace, and the surface in heating by electric cooker portion is horizontal metal or ceramics, can be heated to 500 Celsius
It is more than degree.
The fixture of uncapping is made up of top layer, upper strata, lower floor, guide post and draw-gear, and top layer, the upper and lower are upper and lower
Arrangement, draw-gear is located between top layer and upper strata, for adjusting distance of the upper strata with respect to lower floor, so that lid will be clamped by upper strata
Plate is separated with MEMS structure layer.Guide post lower end is fixed in lower floor, and upper end passes from top layer, and upper strata can hang down along guide post
Nogata is to slidably.
The main body of top layer is top board, there is at least two top pilot holes on top board, and guide post upper end passes through from the pilot hole of top,
Top board is fixed on the guide bar by top screw, and vertical with guide post, top screw may be used also in addition to playing a part of fixed top board
To finely tune the perpendicularity and the depth of parallelism of guide post, to ensure that upper strata can be slidably；There is roof window mouthful in the middle of top board, for observing
The situation of MEMS chip；
The main body of lower floor is lower plate, and guide post lower end is fixed in lower plate, and lower window, lower the window's position are provided with the middle of lower plate
It is corresponding with top the window's position, it is raised to accommodate MEMS chip and upper plate, it is separately installed with the left and right sides of lower window lower solid
Clamp plate and lower ambulatory splint, lower strap are fixed in lower plate, have lower fixed chuck on lower strap, for contacting
MEMS chip, the thickness of lower fixed chuck is suitable with the base plate thickness of MEMS chip；Lower ambulatory splint is located in lower loose slot, under
There is lower active chuck on ambulatory splint, the thickness of lower active chuck is suitable with the base plate thickness of MEMS chip, and lower screw one end is stretched
In entering lower loose slot, and it is connected with lower ambulatory splint, the position for adjusting lower ambulatory splint, when implementing to uncap operation,
MEMS chip is placed in lower window, by the lower screw of regulation, drives lower ambulatory splint motion, and MEMS chip is fixed on into lower fixation
Between chuck and lower active chuck, the base plate of MEMS chip is contacted with lower fixed chuck and lower active chuck.
The main body on upper strata is upper plate, there is pilot hole at least two on upper plate, and upper guiding hole site is oriented to hole site with top
Corresponding, guide post is passed through from upper pilot hole, to ensure that upper plate can only move up and down along guide post, is provided with the centre of upper plate
Upper window, to accommodate the situation of MEMS chip and observation lower floor, the front and rear both sides of upper window are provided with strap and upper work
Dynamic clamping plate, upper strap is fixed on upper plate, there is upper fixed chuck on upper strap, and upper ambulatory splint is located at upper loose slot
In, there is upper active chuck on upper ambulatory splint, one end of tightening up a screw is stretched into loose slot, and is connected with upper strap, upper spiral shell
Silk is used to adjust the position of ambulatory splint, and upper plate is made up of the raised peace layer segment of upper plate, upper strap, upper activity folder
Plate, upper window, upper loose slot and tighten up a screw positioned at upper plate high spot, flat bed is partially installed on lower plate top, upper plate projection is located at
In lower window, so, upper strap and upper ambulatory splint in upper plate projection just do not receive lower strap, lower activity
The thickness effect of clamping plate and MEMS chip can be clamped.
When implementing to uncap operation, MEMS chip is placed in window, while also being located in lower window, regulation is tightened up a screw,
Ambulatory splint motion in drive, the direction of motion of upper ambulatory splint is perpendicular with the direction of motion of lower ambulatory splint, by MEMS cores
Piece is fixed between fixed chuck and upper active chuck, and the cover plate of MEMS chip connects with upper fixed chuck and upper active chuck
Touch, and the base plate of MEMS chip and MEMS structure layer are not contacted with upper fixed chuck and upper active chuck, when uncapping, MEMS cores
The cover plate of piece is moved upwards with upper strata under the traction of draw-gear, and base plate and MEMS structure layer then with lower floor in the original location not
It is dynamic, this completes the separation of cover plate.The hood-opening device of the MEMS chip of wafer level packaging of the invention can be removed accurately
The cover plate of the MEMS chip of wafer level packaging is removed, exposes complete MEMS structure, be that subsequent failure analysis is prepared.
The vacuum pipe includes connected flexible pipe and hard tube, and flexible pipe is directly connected with vavuum pump, hard tube directly with sealing
Container is connected, and flexible pipe is the influence in order to reduce vibration that vavuum pump operationally produces to fixture of uncapping.
The observation window is clear glass, and observation window is opened in sealing container top, for monitoring uncap process and electric furnace
Temperature
The observation window is clear glass, can be made of thick safety glass or lucite, and observation window is located at sealing
Container side, and be connected with sealing container by sealing ring, observation window is also used as hermatic door, by sealing ring and sealing container
Closed chamber is surrounded, for accommodating electric furnace and fixture of uncapping, while the temperature of the process of uncapping and electric furnace can be monitored.
The spring upper end is fixed on top board by pushing up clip, and lower end is fixed on upper plate by upper clip, is used
In distance of the regulation upper strata with respect to lower floor, so that cover plate will be clamped by upper strata separated with MEMS structure layer, under the pulling of spring,
Upper strata is along the upward vertical sliding motion of guide post, so as to cover plate be separated with MEMS structure layer.
The draw-gear is made up of fixed pulley, draught line and weight, and fixed pulley is fixed on top board, and draught line one end is consolidated
It is scheduled on upper plate, the other end bypasses fixed pulley and is fixed on weight.Upper strata is adjusted by changing the weight of weight with respect to lower floor
Distance, so as to cover plate will be clamped by upper strata be separated with MEMS structure layer.
Present invention also offers the ends-opening method of the MEMS chip of wafer level packaging, comprise the following steps：
(1) MEMS chip to be uncapped is placed on electric furnace, adjustment is uncapped the headroom height of fixture, with lower fixed chuck and
Lower active chuck clamps the base plate of MEMS chip, and the cover plate of MEMS chip is clamped with fixed chuck and lower active chuck；
(2) furnace temperature is set, heating by electric cooker is opened, sealing container is then shut off, vavuum pump is opened and is vacuumized；
(3) extraction valve is closed when close to design temperature, closes down vavuum pump；
(4) observe whether cover plate separates with MEMS structure layer by observation window, once separation is switched off furnace power, then
Vent valve is opened to be inflated in vacuum chamber；
(5) to be cooled to close to room temperature, opening sealing container, taking-up is uncapped fixture, removed from fixture MEMS chip and
Cover plate.
This ends-opening method melts solder in a vacuum, and cover plate is separated with MEMS structure layer by draw-gear, Neng Goujing
The cover plate of the MEMS chip of wafer level packaging is removed accurately, exposes complete MEMS structure, be that subsequent failure analysis is prepared, and
And MEMS structure will not be damaged.
Brief description of the drawings
Fig. 1 is the schematic diagram of existing typical MEMS chip.
Fig. 2 is the schematic diagram of the hood-opening device of embodiment one.
Fig. 3 be embodiment one fixture of uncapping uncap before schematic diagram.
Fig. 4 be embodiment one fixture of uncapping uncap after schematic diagram.
Fig. 5 is the top view of top layer.
Fig. 6 is the upward view of lower floor.
Fig. 7 is the A-A sectional views of Fig. 6.
Fig. 8 is the top view on upper strata.
Fig. 9 is the B-B sectional views of Fig. 8.
Figure 10 is the C-C sectional views of Fig. 8.
Figure 11 is the schematic diagram of the hood-opening device of embodiment two.
Figure 12 is the schematic diagram of the hood-opening device of embodiment three.
Figure 13 is the schematic diagram of the hood-opening device of example IV.
Specific embodiment
The invention will be further described with reference to the accompanying drawings and examples.
Embodiment one
The hood-opening device of the MEMS chip of wafer level packaging, as shown in Fig. 2 by fixture 100 of uncapping, electric furnace 200 and vacuum
System is constituted, and fixture 100 of uncapping is placed on electric furnace 200, is placed in vacuum chamber 309.
The vacuum system is made up of vavuum pump 301, vacuum pipe and sealing container 305, and vavuum pump 301 passes through flexible pipe
302nd, the connection of hard tube 303 sealing container 305, can extract the air in sealing container 305 out, and flexible pipe 301 is to reduce vacuum
Influence of the vibration that pump 301 is operationally produced to fixture 100 of uncapping, is provided with extraction valve 304 on hard tube 303, vacuumizing
Shi Kaiqi, closes, before vavuum pump 301 is closed down to maintain the air pressure in vacuum chamber 309；Deflation is installed in sealing container 305
Pipe 306, is provided with vent valve 307 on bleeder pipe 306, after the cover plate 11 of MEMS chip 10 is separated with MEMS structure layer 12, beat
Open air valve 307, air is entered in sealing container 309 by bleeder pipe 306, makes the inner and outer air pressure of sealing container 309 identical, so that
Hermatic door is opened, fixture 100 of uncapping is taken out；Observation window 308 is also equipped with sealing container 309, for monitor uncap process with
And the temperature of electric furnace 200.
The electric furnace 200 is the closed electric furnace without naked light, and the surface of its heating part is flat metal or ceramics, with ground
Face is parallel, can be heated to more than 500 DEG C.
The fixture 100 of uncapping is made up of top layer 110, upper strata 120, lower floor 130, guide post 140 and spring 150, such as schemes
Shown in 3, the lower end of four guide posts 140 is each attached in lower floor 130, and upper end passes from top layer 110, and upper strata 120 can be along guiding
Bar 140 in vertical direction slidably.The upper end of spring 150 is fixed on top layer 110, and lower end is fixed on upper strata 120, is used for
The distance of the relative lower floor 130 in regulation upper strata 120, so as to cover plate 11 will be clamped by upper strata 120 be separated with MEMS structure layer 12.Top layer
110 are used to fix four guide posts 140, it is parallel to each other and all perpendicular to lower floor 130, to ensure that upper strata 120 can be along leading
To bar 140 in vertical direction slidably.Upper strata 120 is used to clamp the cover plate 11 of MEMS chip 10, in the pulling of spring 150
Under, upper strata 120 separates cover plate 11 with MEMS structure layer 12, as shown in Figure 4 along the upward vertical sliding motion of guide post 140；Lower floor
130 base plates 14 for being used to clamp MEMS chip 10, are that separation cover plate 11 provides reaction force, meanwhile, for fixing four guiding
Firmly 140, it is that fixture 100 of entirely uncapping provides support.
As shown in figure 5, the main body of top layer 110 is top board 112, being made on 112 4 angles of top board has four top pilot holes
111, guide post 140 is passed through from the pilot hole 111 of top, and top board 112 is fixed on guide post 140 by top screw 113, with guiding
Bar 140 is vertical, and top screw 113 can also finely tune the vertical of four guide posts 140 in addition to playing a part of fixed top board 112
Degree and the depth of parallelism, to ensure that upper strata 120 can be slidably；The center of top board 112 makes roof window mouthful 115, for observing
The situation of MEMS chip 10；There is top clip 114 on top board 111, for fixing spring 150.
As shown in Figure 6, Figure 7, the main body of lower floor 130 is lower plate 131, and guide post 140 is fixed on four angles of lower plate 131
On, lower window 136 is provided with the middle of lower plate 131, to accommodate MEMS chip 10 and upper plate projection 122a, in the left and right of lower window 136
Both sides are separately installed with lower strap 132 and lower ambulatory splint 133, and lower strap 132 is fixed in lower plate 131, lower solid
There is lower fixed chuck 132a on clamp plate 132, for contacting MEMS chip 10, the thickness and MEMS chip of lower fixed chuck 132a
10 thickness of base plate 14 is suitable；Lower ambulatory splint 133 is located in lower loose slot 135, has lower active chuck on lower ambulatory splint
133a, the thickness of lower active chuck 133a is suitable with the thickness of base plate 14 of MEMS chip 10, and lower activity is stretched into lower one end of screw 134
In groove 135, and it is connected with lower ambulatory splint 133, lower screw 134 is used to adjust the position of lower ambulatory splint 133.Implementing to uncap
During operation, MEMS chip 10 is placed in lower window 136, by the lower screw 134 of regulation, drives lower ambulatory splint 133 to move, will
MEMS chip 10 is fixed between lower fixed chuck 132a and lower active chuck 133a, the base plate 14 of MEMS chip 10 and lower fixation
Chuck 122a and lower active chuck 133a is contacted.
As shown in Figure 8, Figure 9, the main body on upper strata 120 is upper plate 122, and being made on 122 4 angles of upper plate has four upper guiding
Hole 121, guide post 140 is passed through from upper pilot hole 121, to ensure that upper plate 122 can only move up and down along guide post 140；Upper
The centre of plate 120 is provided with window 127, to accommodate the situation of MEMS chip 10 and observation lower floor 130；Before upper window 127
Both sides are provided with strap 128 and upper ambulatory splint 124 afterwards, and upper strap 128 is fixed on upper plate 122, upper fixation
Have upper fixed chuck 128a on clamping plate 128, upper ambulatory splint 124 is located in upper loose slot 126, have on upper ambulatory splint 124 on
Active chuck 124a, 125 one end of tightening up a screw are stretched into loose slot 126, and are connected with upper strap 128,125 use of tightening up a screw
There are upper clip 123, the position of upper clip 123 and top clip in the position of the upper ambulatory splint 124 of regulation, on upper plate 122
114 positions correspondence, for fixing spring 150；Upper plate 122 is made up of upper plate projection 122a peace layer segment 122b, upper geometrical clamp
Plate 128, upper ambulatory splint 124, upper window 127, upper loose slot 126 and tighten up a screw 125 be located at upper plate projection 122a at, flat bed portion
122b is divided to be arranged on the top of lower plate 131, upper plate projection 122a is then located in lower window 136, so, installed in upper plate projection 122a
On upper strap 128 and upper ambulatory splint 124 just by lower strap 132, the thickness effect of lower ambulatory splint 133 and
MEMS chip 10 can be clamped.
When implementing to uncap operation, MEMS chip 10 is placed in window 127, while also being located in lower window 136, is such as schemed
Shown in 10, regulation tightens up a screw 125, and ambulatory splint 124 is moved drives in, the direction of motion of upper ambulatory splint 124 and lower movable presss from both sides
The direction of motion of plate 133 is perpendicular, and MEMS chip 10 is fixed between upper fixed chuck 128a and upper active chuck 124a,
The cover plate 11 of MEMS chip 10 is contacted with upper fixed chuck 128a and upper active chuck 124a, and the He of base plate 14 of MEMS chip 10
MEMS structure layer 12 is not contacted with upper fixed chuck 128a and upper active chuck 124a, when uncapping, the cover plate of MEMS chip 10
11 move upwards with upper strata 120 under the pulling of spring 150, and base plate 14 and MEMS structure layer 12 then with lower floor 130 in the original location
It is motionless, this completes the separation of cover plate 11.
It should be noted that in the present embodiment, the quantity of guide post 140 can also be two or three.Top screw 113
At least one, its quantity can be identical with the quantity of guide post 140, it is also possible to differs.
Embodiment two
Embodiment two the difference is that only that vacuum system is different from embodiment one, as shown in figure 11, wafer level packaging
MEMS chip hood-opening device, be made up of vacuum system, electric furnace 200, fixture 100 of uncapping, fixture 100 of uncapping is placed in electric furnace
On 200, it is placed in vacuum chamber 309.
The vacuum system is made up of vavuum pump 301, vacuum pipe and sealing container 305, and vavuum pump 301 passes through flexible pipe
302nd, the connection of hard tube 303 sealing container 305, can extract the air in sealing container 305 out, and flexible pipe 301 is to reduce vacuum
Influence of the vibration that pump 301 is operationally produced to fixture 100 of uncapping, is provided with extraction valve 304 on hard tube 303, vacuumizing
Shi Kaiqi, closes, before vavuum pump 301 is closed down to maintain the air pressure in vacuum chamber 309；Deflation is installed in sealing container 305
Pipe 306, is provided with vent valve 307 on bleeder pipe 306, after the cover plate 11 of MEMS chip 10 is separated with MEMS structure layer 12, beat
Open air valve 307, air is entered in sealing container 309 by bleeder pipe 306, makes the inner and outer air pressure of sealing container 309 identical, so that
Hermatic door is opened, fixture 100 of uncapping is taken out；The side of sealing container 309 be equipped with hermatic door 311, hermatic door 311 be it is transparent, both
Can be as door, it is also possible to used as observation window, hermatic door 311 can make of thick safety glass or lucite, hermatic door
311 surround closed chamber 309 by sealing ring 310 and sealing container 305, for accommodating electric furnace 200 and fixture 100 of uncapping, while
The temperature of the process of uncapping and electric furnace 200 can be monitored.
Embodiment three
Embodiment three replaces spring, as shown in figure 12, disk with pulley gear with the difference is that only for embodiment one
The hood-opening device of the MEMS chip of level encapsulation, is made up of vacuum system, electric furnace 200, fixture 100 of uncapping, and fixture 100 of uncapping is placed in
On electric furnace 200, it is placed in vacuum chamber 309.
The fixture 100 of uncapping is made up of top layer 110, upper strata 120, lower floor 130, guide post 140 and pulley gear, four
The lower end of guide post 140 is each attached in lower floor 130, and upper end is fixed by top layer 110, and upper strata 120 can be along guide post 140 vertical
Direction is slidably.Pulley gear includes fixed pulley 160, metal wire 170 and weight 180, and fixed pulley 160 is fixed on top layer 100
Top board 112 on, the one end of metal wire 170 is fixed on the upper plate 122 on upper strata 120, the other end bypass fixed pulley 160 and and weight
180 connections, distance of the upper strata 120 with respect to lower floor 130 are adjusted by changing the weight of weight 180, so that will be by upper strata 120
Cover plate 11 is clamped to be separated with MEMS structure layer 12.Top layer 110 is used to fix four guide posts 140, it is parallel to each other and is all hung down
It is straight in lower floor 130, with ensure upper strata 120 can along guide post 140 in vertical direction slidably.Upper strata 120 is used to clamp
The cover plate 11 of MEMS chip 10, under the pulling of weight 180, upper strata 120 along the upward vertical sliding motion of guide post 140, by cover plate 11
Separated with MEMS structure layer 12；Lower floor 130 is used to clamp the base plate 14 of MEMS chip 10, is that separation cover plate 11 provides reaction
Power, meanwhile, 140 are oriented to for fixing four, it is the offer support of fixture 100 of entirely uncapping.
Example IV
Example IV replaces spring, as shown in figure 13, disk with pulley gear with the difference is that only for embodiment two
The hood-opening device of the MEMS chip of level encapsulation, is made up of vacuum system, electric furnace 200, fixture 100 of uncapping, and fixture 100 of uncapping is placed in
On electric furnace 200, it is placed in vacuum chamber 309.
The vacuum system is made up of vavuum pump 301, vacuum pipe and sealing container 305, and vavuum pump 301 passes through flexible pipe
302nd, the connection of hard tube 303 sealing container 305, can extract the air in sealing container 305 out, and flexible pipe 301 is to reduce vacuum
Influence of the vibration that pump 301 is operationally produced to fixture 100 of uncapping, is provided with extraction valve 304 on hard tube 303, vacuumizing
Shi Kaiqi, closes, before vavuum pump 301 is closed down to maintain the air pressure in vacuum chamber 309；Deflation is installed in sealing container 305
Pipe 306, is provided with vent valve 307 on bleeder pipe 306, after the cover plate 11 of MEMS chip 10 is separated with MEMS structure layer 12, beat
Open air valve 307, air is entered in sealing container 309 by bleeder pipe 306, makes the inner and outer air pressure of sealing container 309 identical, so that
Hermatic door is opened, fixture 100 of uncapping is taken out；The side of sealing container 309 be equipped with hermatic door 311, hermatic door 311 be it is transparent, both
Can be as door, it is also possible to used as observation window, hermatic door 311 can make of thick safety glass or lucite, hermatic door
311 surround closed chamber 309 by sealing ring 310 and sealing container 305, for accommodating electric furnace 200 and fixture 100 of uncapping, while
The temperature of the process of uncapping and electric furnace 200 can be monitored.
The fixture 100 of uncapping is made up of top layer 110, upper strata 120, lower floor 130, guide post 140 and pulley gear, four
The lower end of guide post 140 is each attached in lower floor 130, and upper end is fixed by top layer 110, and upper strata 120 can be along guide post 140 vertical
Direction is slidably.Pulley gear includes fixed pulley 160, metal wire 170 and weight 180, and fixed pulley 160 is fixed on top layer 100
Top board 112 on, the one end of metal wire 170 is fixed on the upper plate 122 on upper strata 120, the other end bypass fixed pulley 160 and and weight
180 connections, distance of the upper strata 120 with respect to lower floor 130 are adjusted by changing the weight of weight 180, so that will be by upper strata 120
Cover plate 11 is clamped to be separated with MEMS structure layer 12.Top layer 110 is used to fix four guide posts 140, it is parallel to each other and is all hung down
It is straight in lower floor 130, with ensure upper strata 120 can along guide post 140 in vertical direction slidably.Upper strata 120 is used to clamp
The cover plate 11 of MEMS chip 10, under the pulling of weight 180, upper strata 120 along the upward vertical sliding motion of guide post 140, by cover plate 11
Separated with MEMS structure layer 12；Lower floor 130 is used to clamp the base plate 14 of MEMS chip 10, is that separation cover plate 11 provides reaction
Power, meanwhile, 140 are oriented to for fixing four, it is the offer support of fixture 100 of entirely uncapping.
Embodiment five
The ends-opening method of the MEMS chip of wafer level packaging, the device is opened as foundation with embodiment one, including following step
Suddenly：
(1) fixture 100 that will uncap is placed on electric furnace 200, the top screw 113 of fixture 100 of uncapping, and adjusts top layer 100
In the position of vertical direction, the elastic force of spring 150 is adjusted to suitable degree, fastens top screw 113；Upper strata 120 is lifted, will
MEMS chip 10 is placed between lower fixed chuck 132a and lower active chuck 133a, and MEMS chip 10 is located in lower window 136,
It also is located at the corresponding position of window 127 simultaneously；Upper strata 120 is put down, now due to the pulling force of spring 150, upper strata 120 is located at
The top of MEMS chip 10, the lower screw 134 of regulation promotes lower ambulatory splint 133 to move, with lower fixed chuck 132a and lower activity folder
Head 133a clamps the base plate 14 of MEMS chip 10；Adjust ambulatory splint 124 in 125 promotions of tightening up a screw to move, use fixed chuck
128a and upper active chuck 124a clamp the cover plate 11 of MEMS chip 10.
(2) electric furnace 200 is gently put into vacuum chamber 309 together with fixture 100 of uncapping, is plugged in, setting electric furnace 200 adds
Hot temperature, electric furnace 200 begins to warm up；Sealing container 305 and vent valve 307 are closed, extraction valve 304 is opened, vavuum pump 301 is opened
Start to vacuumize；The purpose for vacuumizing is that the air pressure in the annular seal space 15 for ensure when uncapping MEMS chip 10 is close to or higher than vacuum
Air pressure in room 309, so after the fusing of solder layer 16, will not cause open because of air pressure in annular seal space 15 less than external pressure
What mechanical force needed for lid caused greatly very much uncapped, and difficult or cover plate 11 is moved horizontally, can also avoid solder layer 16 under gas pressure to
Interior extruding, destruction MEMS structure 12a；The temperature setting of electric furnace 200 will be according to the solder melt point of the solder layer 16 of MEMS chip 10
Type determine.
(3) when electric furnace 200 is heated to approach uncaps temperature, that is, when reaching the solder melt point of solder layer 16, close
Extraction valve 304, is then shut off vavuum pump 301, and because closed container 305 is sealing, the air pressure in vacuum chamber 309 can be maintained
For quite a long time.
(4) process of uncapping is observed from observation window 308, is separated with MEMS structure layer 12 when to cover plate 11, that is, clamp lid
The upper strata 120 of plate 11 is moved upwards under the pulling of spring 150, when being separated with lower floor 130, closes electric furnace 200, makes fixture of uncapping
100 cool down together with the MEMS chip 10 uncapped, meanwhile, vent valve 307 is opened, allow the air in the external world to pass through bleeder pipe
306 slowly flow into vacuum chamber 309, until inside and outside air pressure balance.
(5) be cooled to close to room temperature in fixture 100 of uncapping, and in vacuum chamber 309 air pressure with it is extraneous identical when, open it is close
Envelope container 305, takes out fixture 100 of uncapping, and then adjusts lower screw 134, makes lower active chuck 133a with lower fixed chuck 132a
Separate, remove the MEMS chip 10 without cover plate 11, it is possible to the detection and analysis of next step is carried out to MEMS structure 12a；
Equally, regulation tightens up a screw 125, active chuck 124a is separated with upper fixed chuck 128a, removes cover plate 11, can be to cover plate
11 are analyzed, and so far just complete the process of uncapping of whole MEMS chip 11.
It should be noted that the main purpose of step (3) is in order to avoid producing vibration influence to arrive when vavuum pump 301 works
Uncap quality, i.e., after solder layer 16 melts, cover plate 11 is separated with MEMS structure layer 12, and is moved upwardly together with upper strata 120
When, the vibrations of vavuum pump 301 can cause the horizontal jitter of cover plate 11, may result in solder contact MEMS structure 12a, cause MEMS
Structure 12a is damaged.If vavuum pump 301 is remote enough apart from sealing container 305, the length of flexible pipe 302 slows down if vibrations enough, step
Suddenly (3) can also omit.
Claims (8)
1. the hood-opening device of the MEMS chip of wafer level packaging, it is characterised in that：By fixture of uncapping, electric furnace and vacuum system group
Into fixture of uncapping is placed on electric furnace, uncaps fixture and electric furnace is all placed in vacuum chamber；
The vacuum system is made up of vavuum pump, vacuum pipe and sealing container, and vavuum pump connects sealing by vacuum pipe to be held
Device, is provided with extraction valve on vacuum pipe, bleeder pipe is provided with sealing container, and vent valve is provided with bleeder pipe, and sealing is held
Observation window is additionally provided with device；
The electric furnace is closed electric furnace, and the surface in heating by electric cooker portion is horizontal metal or ceramics；
The fixture of uncapping is made up of top layer, upper strata, lower floor, guide post and draw-gear, top layer, the upper and lower cloth in the upper and lower
Put, draw-gear is located between top layer and upper strata；The main body of top layer is top board, there is at least two top pilot holes on top board, is oriented to
Bar upper end is passed through from the pilot hole of top, and top board is fixed on the guide bar by top screw, vertical with guide post, there is top in the middle of top board
Window；The main body of lower floor is lower plate, and guide post lower end is fixed in lower plate, is provided with lower window in the middle of lower plate, lower the window's position with
Top the window's position is corresponding, and lower strap and lower ambulatory splint, lower geometrical clamp are separately installed with the left and right sides of lower window
Plate is fixed in lower plate, there is lower fixed chuck on lower strap, and lower ambulatory splint is located in lower loose slot, on lower ambulatory splint
There is lower active chuck, lower screw one end is stretched into lower loose slot, and is connected with lower ambulatory splint；The main body on upper strata is upper plate, on
There is pilot hole at least two on plate, upper guiding hole site is corresponding with top guiding hole site, and guide post is worn from upper pilot hole
Cross, window is provided with the centre of upper plate, the front and rear both sides of upper window are provided with strap and upper ambulatory splint, upper fixation
Boards wall has upper fixed chuck on upper plate on upper strap, upper ambulatory splint is located in upper loose slot, one end of tightening up a screw
In stretching into loose slot, and it is connected with upper strap, there is upper active chuck on upper ambulatory splint, upper plate is by the raised peace of upper plate
Layer segment is constituted, and upper strap, upper ambulatory splint, upper window, upper loose slot and is tightened up a screw positioned at upper plate high spot, flat bed portion
Divide and be arranged on lower plate top, upper plate is raised to be located in lower window.
2. the hood-opening device of the MEMS chip of wafer level packaging as claimed in claim 1, it is characterised in that：The vacuum pipe
Including the flexible pipe and hard tube that are connected, flexible pipe is directly connected with vavuum pump, and hard tube is directly connected with sealing container.
3. the hood-opening device of the MEMS chip of wafer level packaging as claimed in claim 1, it is characterised in that：The observation window is
Clear glass, observation window is opened in sealing container top.
4. the hood-opening device of the MEMS chip of wafer level packaging as claimed in claim 1, it is characterised in that：The observation window is
Clear glass, observation window is located at sealing container side, and is connected with sealing container by sealing ring.
5. the hood-opening device of the MEMS chip of the wafer level packaging as described in claim 3 or 4, it is characterised in that：The traction
Device is spring, and spring upper end is fixed on top board, and lower end is fixed on upper plate.
6. the hood-opening device of the MEMS chip of wafer level packaging as claimed in claim 5, it is characterised in that：The spring upper end
It is fixed on top board by pushing up clip, lower end is fixed on upper plate by upper clip.
7. the hood-opening device of the MEMS chip of the wafer level packaging as described in claim 3 or 4, it is characterised in that：The traction
Device is made up of fixed pulley, draught line and weight, and fixed pulley is fixed on top board, and draught line one end is fixed on upper plate, another
End bypasses fixed pulley and is fixed on weight.
8. the ends-opening method of the MEMS chip of wafer level packaging, it is characterised in that：Using any one of claim 1 to 7
Hood-opening device, comprise the following steps：
(1) MEMS chip to be uncapped is placed on electric furnace, the headroom height of fixture of uncapping is adjusted, with lower fixed chuck and lower work
Dynamic chuck clamps the base plate of MEMS chip, and the cover plate of MEMS chip is clamped with fixed chuck and lower active chuck；
(2) furnace temperature is set, heating by electric cooker is opened, sealing container is then shut off, vavuum pump is opened and is vacuumized；
(3) extraction valve is closed when close to design temperature, closes down vavuum pump；
(4) observe whether cover plate separates with MEMS structure layer by observation window, once separation is switched off furnace power, be then turned on
Vent valve is inflated in vacuum chamber；
(5) it is to be cooled to open sealing container to close to room temperature, fixture of uncapping is taken out, MEMS chip and cover plate are removed from fixture.
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| CN105598544B (en) * | 2016-03-24 | 2018-02-23 | 株洲天微技术有限公司 | The ends-opening method and device of a kind of microcircuit module housing and cover plate sealed with brazing |
| CN110095706B (en) * | 2018-12-24 | 2021-01-08 | 纳瑞科技(北京)有限公司 | DECAP case |
| CN110371923A (en) * | 2019-06-03 | 2019-10-25 | 航天科工防御技术研究试验中心 | A kind of opening method of MEMS acceleration sensor device |
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| CN1821052A (en) * | 2006-01-13 | 2006-08-23 | 中国科学院上海微系统与信息技术研究所 | Low temperature airtightness packaging method for wafer level micro machinery device and photoelectric device |
| CN102401706A (en) * | 2010-08-23 | 2012-04-04 | 飞思卡尔半导体公司 | MEMS pressure sensor device and method of fabricating same |
| CN204741006U (en) * | 2015-07-17 | 2015-11-04 | 安徽北方芯动联科微系统技术有限公司 | Device of uncapping of MEMS chip of wafer level encapsulation |
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| WO2009133506A2 (en) * | 2008-04-29 | 2009-11-05 | Nxp B.V. | Mems device and manufacturing method |
| US8247253B2 (en) * | 2009-08-11 | 2012-08-21 | Pixart Imaging Inc. | MEMS package structure and method for fabricating the same |
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| CN1821052A (en) * | 2006-01-13 | 2006-08-23 | 中国科学院上海微系统与信息技术研究所 | Low temperature airtightness packaging method for wafer level micro machinery device and photoelectric device |
| CN102401706A (en) * | 2010-08-23 | 2012-04-04 | 飞思卡尔半导体公司 | MEMS pressure sensor device and method of fabricating same |
| CN204741006U (en) * | 2015-07-17 | 2015-11-04 | 安徽北方芯动联科微系统技术有限公司 | Device of uncapping of MEMS chip of wafer level encapsulation |
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Address after: 233042 Anhui province Bengbu City Choi Road No. 10 Patentee after: Anhui Xindong Lianke microsystem Co.,Ltd. Address before: 233042 Anhui province Bengbu City Choi Road No. 10 Patentee before: ANHUI BEIFANG XINDONG LIANKE MICROSYSTEM TECHNOLOGY CO.,LTD. |