CN105598544B - The ends-opening method and device of a kind of microcircuit module housing and cover plate sealed with brazing - Google Patents
The ends-opening method and device of a kind of microcircuit module housing and cover plate sealed with brazing Download PDFInfo
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- CN105598544B CN105598544B CN201610172514.4A CN201610172514A CN105598544B CN 105598544 B CN105598544 B CN 105598544B CN 201610172514 A CN201610172514 A CN 201610172514A CN 105598544 B CN105598544 B CN 105598544B
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- China
- Prior art keywords
- housing
- cover plate
- sealed
- main body
- microscope carrier
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/018—Unsoldering; Removal of melted solder or other residues
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
Abstract
The ends-opening method and device of a kind of microcircuit module housing and cover plate sealed with brazing, are provided with alignment pin and heating module in microscope carrier main body, and housing is embedded between alignment pin and heating module；Sealed elastic pad is additionally provided with microscope carrier main body, housing and cover plate are placed on sealed elastic pad so that cover plate, sealed elastic pad and microscope carrier main body can form the space of a closing；Vacuum extractor is connected with the space of the closing, can carry out pumping process to the space of the closing.The negative pressure back shroud that closing space reaches certain is adsorbed on sealed elastic pad, is moved up heating module and is ejected housing upwards, then detaches housing and cooled, then electric iron coordinates suction tin braid to clear up scolding tin remaining on housing and cover plate.It is of the invention quick, safety to separate cover plate with housing, and the solder flux of melting will not be allowed to flow to inside the circuit module of housing and polluted.
Description
Technical field
The present invention relates to a kind of ends-opening method of seal, and in particular to a kind of microcircuit module is used using after welded seal
Ends-opening method and device.
Background technology
With the development of electronics industry, extensive utilization of the microcircuit module in every field.Due to microcircuit module cavity
Substantial amounts of bare chip is inside equipped with, and its assembling solder melt point is relatively low, for guarantee that can be permanent in face of various varying environments
Its performance must just carry out hermetically sealed.
In existing microcircuit module encapsulating method, sealed with brazing method is applied to the sealing of metal shell, simple to operate,
Cost is cheap, and closure cap applying apparatus is less demanding, favorable sealing property, is a kind of high capping method of reliability of extensive utilization.But
It is the defects of this method has itself, due to being covered using the solder compared with low melting point, during uncapping, molten condition
Scolding tin and solder flux are easily splashed in housing chamber, and the bare chip of intracavitary is polluted, so as to influence the electrical of micromodule
Can, reduce its service life.
In order to which the scolding tin and solder flux that easily occur when solving and being uncapped compared with eutectic solder sealed with brazing pollute asking for bare chip
Topic, therefore a kind of easy ends-opening method of operation is devised, this method can efficiently solve scolding tin and solder flux pollutes intracavitary chip
Situation.
The content of the invention
The technical problem to be solved in the present invention is：Scolding tin and solder flux for molten condition are easily splashed in housing chamber,
The circuit module of intracavitary is polluted, leaves potential safety hazard, and proposes one kind and tips upside down on housing and cover plate on hood-opening device
The method and device uncapped.
Pin is with above mentioned problem, technical scheme proposed by the present invention：A kind of microcircuit module housing and cover plate sealed with brazing
Ends-opening method, with alignment pin housing is carried out spacing, and housing and cover plate added with heating module in microscope carrier main body
Heat, also cover plate and microscope carrier main body are sealed using sealed elastic pad, and cover plate is adsorbed using vacuumizing；Ends-opening method
It is further comprising the steps of：
A. clean：Lid surface is cleaned with absolute ethyl alcohol；
B. clamping：The space that housing and cover plate loading alignment pin are surrounded, and housing is placed on heating module；
C. vacuumize：Vavuum pump is opened, by cover plate absorption on sealed elastic pad；
D. heat：Housing and cover plate are heated with heating module；
E. detach and cool：First housing is ejected upwards with heating module, then housing is detached and cooled；
F. clear up：Suction tin braid is coordinated to clear up scolding tin remaining on housing and cover plate with electric iron.
Further, vacuumizing in step C is that bleeding point is opened in microscope carrier main body, and vavuum pump passes through conduit and bleeding point
Connection；And cover plate is placed on sealed elastic pad, cover plate, sealed elastic pad and microscope carrier main body is set to form the space of a closing；Open
Dynamic vavuum pump can vacuumize to the space of the closing, make cover plate absorption on sealed elastic pad.
Further, the heating described in step D is that housing is placed on heating module, by the temperature liter of heating module
Height heats to 250 DEG C -300 DEG C to housing.
Further, detaching with cooling in step E is after vacuumizing and heating, and cover plate is adsorbed in sealed elastic pad
On, when the solder between cover plate and housing is in molten condition, heating module is moved up, so that housing and cover plate point
From, and the housing after separation is detached and cooled.
Further, the sealed elastic pad is the macromolecular material of 100 DEG C ~ 200 DEG C of heatproof；The heating module
It can move up or down.
A kind of uncap the device of microcircuit module housing and cover plate sealed with brazing, be provided with microscope carrier main body alignment pin and
Heating module, housing are embedded between alignment pin and heating module；Sealed elastic pad, housing and cover plate are additionally provided with microscope carrier main body
It is placed on sealed elastic pad so that cover plate, sealed elastic pad and microscope carrier main body can form the space of a closing；Take out true device with
The space connection of the closing, can be vacuumized to the space of the closing.
Further, the alignment pin set in microscope carrier main body is more than 3, and when housing is placed in alignment pin, outside housing
Side can be with being bonded on the inside of alignment pin.
Further, heating module is higher by microscope carrier main body, and housing is located in the top of heating module, and heating module
The shapes and sizes at top and the top of housing match.
Further, sealed elastic pad is hollow ring bodies, when cover plate is placed on sealed elastic pad, cover plate, sealing bullet
Property pad and microscope carrier main body between formed one closing space.
Further, the vacuum means are set to：Bleeding point is provided with microscope carrier main body, bleeding point has run through microscope carrier main body；
Vavuum pump is connected by conduit with bleeding point so that vavuum pump can connect with the space of the closing.
It is an advantage of the invention that：
1. housing and microcircuit module are upside down in thermal station, the scolding tin of sealed with brazing joint and the solder flux of residual will not flow to
Polluted inside the circuit module of housing.
2. microscope carrier main body is provided with alignment pin, housing can quickly be navigated to the position uncapped, and can prevents housing
Transverse shifting is produced during uncapping, influence to uncap is smoothed out.
3. the space of cover plate, sealed elastic pad and microscope carrier main body formed with a closing, vacuumizes the suction that back shroud can be tightly
It is attached on sealed elastic pad, is advantageous to the separation of cover plate and housing.
4. heating module can be moved smoothly up and down, and heating module can move upwardly without and encounter cover plate,
So that housing moves upwardly without inclination with heating module, dropped；And ejected housing with backheat module, it is avoided that operator
Member grabbing the housing of high temperature for a long time because being burned.
5. the shapes and sizes of the top shape and size of liftable heating module all with case top match, it can allow and add
Thermal modules and case top fully contact, and increase the heating surface area of case top, are heated evenly case top, can allow faster
Solder fusing between housing and cover plate；Simultaneously heating module apart from enclosure interior circuit module farther out, can prevent heating when
Have influence on the welding original paper of enclosure interior.
Brief description of the drawings
Fig. 1 is the structural representation in main view direction of the present invention；
Fig. 2 is the overlook direction structural representation of section components of the present invention；
In figure：1 housing, 2 cover plates, 3 sealed elastic pads, 4 heating modules, 5 microscope carrier main bodys, 6 vavuum pumps, 61 bleeding points, 62
Conduit, 7 alignment pins.
Embodiment
The description of a step is done to the present invention with reference to embodiment and accompanying drawing：
Embodiment one
As depicted in figs. 1 and 2, there is microcircuit mould housing 1 and the part that cover plate 2 is in contact by welded seal in housing 1
Block, microcircuit module are not drawn into.Opening cover plate 2 needs the solder fusing between housing 1 and cover plate 2, to prevent solder from melting
Pollution microcircuit module in housing 1 is flowed into after change, it is necessary to which housing 1 and cover plate 2 are upside down on heating module 4.
In the present embodiment：Alignment pin 7 is set to carry out housing 1 in microscope carrier main body 5 spacing, and with heating module 4 to shell
Body 1 and cover plate 2 are heated, and also pad 3 pairs of cover plates 2 using sealed elastic seals with microscope carrier main body 5, and uses and vacuumize
To adsorb cover plate 2.The present embodiment is further comprising the steps of：
A. clean：The surface of cover plate 2 is cleaned with absolute ethyl alcohol；
B. clamping：Housing 1 and cover plate 2 are loaded into the space that alignment pin 7 surrounds, and housing 1 is placed on heating module 4
On；
C. vacuumize：Vavuum pump 6 is opened, cover plate 2 is adsorbed on sealed elastic pad 3；
D. heat：Housing 1 and cover plate 2 are heated with heating module 4；
E. detach and cool：First housing 1 is ejected upwards with heating module 4, then housing 1 is detached and cooled；
F. clear up：Suction tin braid is coordinated to clear up scolding tin remaining on housing 1 and cover plate 2 with electric iron.
In order to allow, the solder between housing 1 and cover plate 2 is quick, uniformly melts, the temperature except suitably lifting heating module 4
Be outside one's consideration, it is often more important that need to increase the contact area of heating module 4 and housing 1, make the top of whole housing 1 all with heated mould
Block 4 fully contacts, and this just needs the shapes and sizes by the top of heating module 4 and the top of housing 1 to match.
Because housing 1 and cover plate 2 are upside down on heating module 4, therefore the solder fusing between housing 1 and cover plate 2
Afterwards, housing 1 and the separation of cover plate 2 there is into two ways：One is cover plate 2 is fixed, housing 1 is moved upward out；The second is will
Housing 1 is fixed, and cover plate 2 is downward out, is fixed in the present embodiment using by cover plate 2, and housing 1 is moved upward out.
Should also ensure that when housing 1 and cover plate 2 are separated housing 1 and cover plate 2 will not occurred level direction movement or
Rotation, also for housing 1 can be allowed fast, accurately to be bonded with heating module 4, used in the present embodiment in microscope carrier main body 5
If alignment pin 7, with alignment pin 7 come to the fast positioning of housing 1 and prevent the water of housing 1 to movement and rotation.The number of alignment pin 7
Above-mentioned function could be realized well more than 3.In the present embodiment the 3 of housing 1 has been surrounded using 4 alignment pins 7
Individual face, and the inner side of alignment pin 7 is bonded with the outside of housing 1.Obviously, alignment pin 7 enclose a housing 14 faces can also, simply
Housing 1 and cover plate 2 just need to be moved to from the top down on heating module 4.
It is previously noted that when housing 1 and cover plate 2 are separated, fixed in the present embodiment using by cover plate 2, by housing 1
Move upward out.And fix cover plate 2, adsorb cover plate 2 using vacuumizing in the present embodiment.It is fixed in microscope carrier main body 5
Sealed elastic pad 3, the centre of sealed elastic pad 3 is hollow, the bore for being dimensioned slightly smaller than housing 1 of sealed elastic pad 3.Cover plate
2 when being placed on sealed elastic pad 3, and the space of a closing is formed between cover plate 2, sealed elastic pad 3 and microscope carrier main body 5.Carrying
The bleeding point 61 of an insertion microscope carrier main body 5 is opened in platform main body 5, vavuum pump 6 is connected by conduit 62 with bleeding point 61, is started
Vavuum pump 6 can just vacuumize to the space of above-mentioned closing, so that by the absorption of cover plate 2 tightly on sealed elastic pad 3.
Heating module 4 is embedded in microscope carrier main body 5 and can moved up or down, when cover plate 2 is adsorbed in sealed elastic pad 3
On, and during solder fusing between housing 1 and cover plate 2, backheat module is moved up and housing 1 can just be ejected upwards.Then
Staff puts on high temperature-proof gloves and rapidly detaches housing 1, is cooled.After housing 1 is down to normal temperature, matched somebody with somebody with electric iron
Suction tin braid is closed to clear up scolding tin remaining on housing 1 and cover plate 2.
During with heating module 4 to melt the solder between housing 1 and cover plate 2, according to the difference of solder, heating module 4
Temperature is also different.When generally melting indium tin solder, the temperature of heating module 4 is adjusted to 250 DEG C or so；And melt tin-lead weldering
During material, the temperature of heating module 4 is adjusted to 300 DEG C or so., can be faster by weldering although the temperature of thermal modules is adjusted into get Geng Gao
Material fusing, but the hidden danger for also melting the solder in microcircuit module in shell be present.
In addition, sealed elastic pad 3 is nearer apart from the top of housing 1, thus sealed elastic pad 3 need using 100 DEG C of heatproof ~
200 DEG C of macromolecular material, such as：Silicon rubber, polyurethane etc. can high temperature resistant have the high polymer material of fine elasticity again.
Finally, coordinate suction tin braid to clear up scolding tin remaining on housing 1 and cover plate 2 with electric iron, complete the mistake entirely uncapped
Journey.
It will be apparent that on the premise of principle of the present invention is not departed from, some improvement or modification made are regarded as this
The protection domain of invention.
Claims (9)
1. the ends-opening method of a kind of microcircuit module housing and cover plate sealed with brazing, it is characterised in that in microscope carrier main body（5）Upper use
Alignment pin（7）To housing（1）Carry out spacing, and use heating module（4）To housing（1）And cover plate（2）Heated, also using close
Seal cushion（3）To cover plate（2）With microscope carrier main body（5）Sealed, and cover plate is adsorbed using vacuumizing（2）；The side of uncapping
Method is further comprising the steps of：
A. clean：With absolute ethyl alcohol to cover plate（2）Surface is cleaned；
B. clamping：By housing（1）And cover plate（2）Load alignment pin（7）The space surrounded, and by housing（1）It is placed on heated mould
Block（4）On；
C. vacuumize：Open vavuum pump（6）, by cover plate（2）Absorption is in sealed elastic pad（3）On；
D. heat：Use heating module（4）To housing（1）And cover plate（2）Heated；
E. detach and cool：First use heating module（4）By housing（1）Ejection upwards, then by housing（1）Detach and cooled；
F. clear up：Coordinated with electric iron and inhale tin braid to housing（1）And cover plate（2）Upper remaining scolding tin is cleared up.
2. the ends-opening method of a kind of microcircuit module housing according to claim 1 and cover plate sealed with brazing, its feature exist
In vacuumizing in step C is in microscope carrier main body（5）On open bleeding point（61）, vavuum pump（6）Pass through conduit（62）With bleeding point
（61）Connection；And cover plate（2）It is placed on sealed elastic pad（3）On, make cover plate（2）, sealed elastic pad（3）With microscope carrier main body（5）
Form the space of a closing；Start vavuum pump（6）The space of the closing can be vacuumized, make cover plate（2）Absorption is close
Seal cushion（3）On.
3. the ends-opening method of a kind of microcircuit module housing according to claim 1 and cover plate sealed with brazing, its feature exist
In the heating described in step D is by housing（1）It is placed on heating module（4）On, by heating module（4）Temperature be increased to
250 DEG C -300 DEG C, to housing（1）Heated.
4. the ends-opening method of a kind of microcircuit module housing according to claim 1 and cover plate sealed with brazing, its feature exist
In detaching with cooling in step E is the cover plate after vacuumizing and heating（2）Absorption is in sealed elastic pad（3）On, cover plate（2）
With housing（1）Between solder when being in molten condition, by heating module（4）Move up, so that housing（1）With cover plate
（2）Separation, and by the housing after separation（1）Detach and cooled.
5. the ends-opening method of a kind of microcircuit module housing according to claim 1 and cover plate sealed with brazing, its feature exist
In the sealed elastic pad（3）For 100 DEG C ~ 200 DEG C of macromolecular material of heatproof；The heating module（4）Can be upward
Or move down.
6. the device uncapped of a kind of microcircuit module housing and cover plate sealed with brazing, it is characterised in that in microscope carrier main body（5）On
Provided with alignment pin（7）And heating module（4）, housing（1）Embedded in alignment pin（7）With heating module（4）Between；In microscope carrier main body
（5）On be additionally provided with sealed elastic pad（3）, housing（1）And cover plate（2）It is placed on sealed elastic pad（3）On so that cover plate（2）, it is close
Seal cushion（3）With microscope carrier main body（5）The space of a closing can be formed；The space that true device is taken out with the closing is connected, can be right
The space of the closing is vacuumized；Heating module（4）It is higher by microscope carrier main body（5）, housing（1）It is located in heating module
（4）Top, and heating module（4）Top and housing（1）The shapes and sizes at top match.
7. the device uncapped of a kind of microcircuit module housing according to claim 6 and cover plate sealed with brazing, its feature
It is, microscope carrier main body（5）On the alignment pin that sets（7）For more than 3, and housing（1）It is placed on alignment pin（7）When middle, housing（1）
Outside meeting and alignment pin（7）Inner side is bonded.
8. the device uncapped of a kind of microcircuit module housing according to claim 6 and cover plate sealed with brazing, its feature
It is, sealed elastic pad（3）For hollow ring bodies, cover plate（2）It is placed on sealed elastic pad（3）When upper, cover plate（2）, sealing bullet
Property pad（3）With microscope carrier main body（5）Between formed one closing space.
9. the device uncapped of a kind of microcircuit module housing according to claim 6 and cover plate sealed with brazing, its feature
It is, the vacuum means are set to：Microscope carrier main body（5）On be provided with bleeding point（61）, bleeding point（61）Microscope carrier main body is run through
（5）；Vavuum pump（6）Pass through conduit（62）With bleeding point（61）Connection so that vavuum pump（6）It can connect with the space of the closing
It is logical.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610172514.4A CN105598544B (en) | 2016-03-24 | 2016-03-24 | The ends-opening method and device of a kind of microcircuit module housing and cover plate sealed with brazing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610172514.4A CN105598544B (en) | 2016-03-24 | 2016-03-24 | The ends-opening method and device of a kind of microcircuit module housing and cover plate sealed with brazing |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105598544A CN105598544A (en) | 2016-05-25 |
| CN105598544B true CN105598544B (en) | 2018-02-23 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201610172514.4A Active CN105598544B (en) | 2016-03-24 | 2016-03-24 | The ends-opening method and device of a kind of microcircuit module housing and cover plate sealed with brazing |
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| CN (1) | CN105598544B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106425098B (en) * | 2016-11-22 | 2018-05-04 | 株洲天微技术有限公司 | Housing and cover board Laser seal welding positioning tool and method |
| CN111799195B (en) * | 2020-07-17 | 2022-09-20 | 安徽腾达微电子有限公司 | Chip arrangement and packaging device |
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| CN101719476A (en) * | 2009-12-07 | 2010-06-02 | 苏州富士胶片映像机器有限公司 | High-precision automatic ball-embedding equipment and BGA solder ball-embedding method using same |
| CN103390561A (en) * | 2012-05-09 | 2013-11-13 | 鸿骐新技股份有限公司 | Method and equipment for reflow soldering and leveling of solder ball protrusion blocks of flip chip substrate |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE60032364T2 (en) * | 2000-10-02 | 2007-10-31 | Siemens Ag | Sealant against a potting compound |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2781715Y (en) * | 2005-02-02 | 2006-05-17 | 倚天资讯股份有限公司 | Dismounting device for cover |
| CN201119129Y (en) * | 2007-11-22 | 2008-09-17 | 中国电子科技集团公司第三十八研究所 | Heteromorphism micro-circuit box with demountable airproof encapsulation mechanism |
| CN101719476A (en) * | 2009-12-07 | 2010-06-02 | 苏州富士胶片映像机器有限公司 | High-precision automatic ball-embedding equipment and BGA solder ball-embedding method using same |
| CN103390561A (en) * | 2012-05-09 | 2013-11-13 | 鸿骐新技股份有限公司 | Method and equipment for reflow soldering and leveling of solder ball protrusion blocks of flip chip substrate |
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| CN105598544A (en) | 2016-05-25 |
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Effective date of registration: 20190722 Address after: 412000, 1297 Xinhua East Road, lotus pond area, Hunan, Zhuzhou Patentee after: ZHUZHOU HONGDA ELECTRONICS CORP., LTD. Address before: 412000 No. 2, Laijiang Road, Tianyuan District, Zhuzhou City, Hunan Province Patentee before: ZHUZHOU HONGDA MICROELECTRONICS TECHNOLOGY CO., LTD. |
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