CN110371923A - A kind of opening method of MEMS acceleration sensor device - Google Patents
A kind of opening method of MEMS acceleration sensor device Download PDFInfo
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- CN110371923A CN110371923A CN201910476795.6A CN201910476795A CN110371923A CN 110371923 A CN110371923 A CN 110371923A CN 201910476795 A CN201910476795 A CN 201910476795A CN 110371923 A CN110371923 A CN 110371923A
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- mems acceleration
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C99/00—Subject matter not provided for in other groups of this subclass
- B81C99/0035—Testing
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
- G01P21/00—Testing or calibrating of apparatus or devices covered by the preceding groups
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Abstract
The invention discloses a kind of opening methods of MEMS acceleration sensor device, comprising: (1) heating of the MEMS acceleration sensor device to secondary Kaifeng is made adhesive failure, natural cooling；(2) senser element is placed on the first sheet metal of gluing, the first sheet metal of the boss and gluing that make its bottom bonds；(3) glue is fully cured in heating, natural cooling；(4) the second sheet metal of gluing is placed on to the top of the senser element after natural cooling, bonds the second sheet metal of silicon cap and gluing；(5) glue is fully cured in heating, natural cooling；(6) clamp the first sheet metal and the second sheet metal respectively, separate boss and silicon cap to get.Opening method provided by the invention is low to hardware requirement, operation is simple, implementation is strong, success rate is high, and not damaged to the mechanical structure unit of secondary encapsulation inside cavity, has clear advantage.
Description
Technical field
The present invention relates to electronic component Kaifeng technical fields, particularly relate to a kind of Kaifeng of MEMS acceleration sensor device
Method.
Background technique
MEMS acceleration device is a kind of device for having gathered micromechanics unit and circuit structure.For MEMS accelerometer
It is internal to be generally integrated with the micromechanics unit of bulk silicon technological production for part, the amount of acceleration of specific direction can be incuded, converted
For electric signal, exported by circuit structure unit processing.MEMS acceleration sensor device higher for ratio of precision, except device is whole
Outer enclosure outside, often will do it secondary encapsulation in micromechanics unit part, make micro mechanical structure work in one it is relatively close
The environment closed avoids external interference.The general Si-Si glued construction of the secondary encapsulation material of micromechanics unit connects very tight
It is close.
When carrying out DPA test (destructive physical test) or structural analysis to MEMS device and testing, need to device into
Row breaks a seal, and is tested accordingly using means such as optics, machinery device behind Kaifeng.It is main for general component
There are two class opening methods, one is mechanical opening methods, apply in general to ceramic package, Metal Packaging etc.；Being of another kind
Opening method is learned, Plastic Package etc. is applied in general to.Since there are secondary envelopes inside high-precision MEMS acceleration sensor device
The phenomenon that dress, and package dimension is minimum, encapsulating material is special, generally uses Si-Si glued construction, traditional machinery and chemistry
Opening method can not break a seal, and the encapsulating material of fragmentation can generate biggish damage to micro mechanical structure behind mechanical Kaifeng by force
It is bad, lead to not carry out correlation test.
Summary of the invention
The present invention is for micromechanics unit secondary encapsulation existing for current high-precision MEMS acceleration sensor device inside
The characteristics of being not easy the problem of breaking a seal, analyzing packing forms and encapsulating material has cast aside traditional machinery and chemical opening method,
It is proposed a kind of opening method of MEMS acceleration sensor device.
Based on above-mentioned purpose, a kind of opening method of MEMS acceleration sensor device provided by the invention, the Kaifeng side
Method is used to break a seal to micromechanics unit secondary encapsulation inside MEMS acceleration sensor device, in MEMS acceleration sensor device
The encapsulating structure of portion's micromechanics unit secondary encapsulation includes boss and silicon cap, and the boss and silicon cap form inside by adhesive
Cavity, MEMS acceleration sensor device inside micromechanics unit are encapsulated in the internal cavity, include the following steps:
(1) the MEMS acceleration sensor device to secondary Kaifeng is carried out heating makes adhesive failure, natural cooling；
(2) glue is coated on the first sheet metal, MEMS acceleration sensor device is placed on the first sheet metal of gluing,
First sheet metal of the boss and gluing that make MEMS acceleration sensor device bottom bonds；
(3) the MEMS acceleration sensor device bonded with the first sheet metal is carried out heating is fully cured glue, naturally cold
But；
(4) glue is coated on the second sheet metal, the MEMS after the second sheet metal of gluing to be placed on to natural cooling accelerates
Second sheet metal at the top for spending senser element, the silicon cap and gluing that make top bonds；
(5) the MEMS acceleration sensor device bonded with the second sheet metal is carried out heating is fully cured glue, naturally cold
But；
(6) the first sheet metal and the second sheet metal are clamped respectively, separate boss and silicon cap, the MEMS acceleration to be broken a seal
Micromechanics unit inside senser element.
In some embodiments of the invention, in step (1), the temperature of heating is 450-550 DEG C, and heating time is
0.5-1.5 hours.
In some embodiments of the invention, in step (3), the temperature of heating is 100-200 DEG C, and heating time is
0.2-0.5 hours.
In some embodiments of the invention, in step (5), the temperature of heating is 100-200 DEG C, and heating time is
0.5-1.5 hours.
In some embodiments of the invention, the glue is AB glue, and first sheet metal/second sheet metal is iron
Piece.
In some embodiments of the invention, coating thickness of the glue on the first sheet metal is 0.1-0.3mm, described
Glue is 0.1-0.3mm in the coating thickness of the second sheet metal.
In some embodiments of the invention, in step (2), MEMS acceleration sensor device is put down gently the of gluing
It on one sheet metal, gently presses, the first sheet metal of the boss and gluing that make MEMS acceleration sensor device bottom bonds, operation
When avoid MEMS acceleration sensor device slide.
In some embodiments of the invention, in step (4), after the second sheet metal of gluing is placed on natural cooling
Second sheet metal at the top of MEMS acceleration sensor device, the silicon cap and gluing that make top bonds, and when operation avoids MEMS from adding
The sliding of velocity pick-up device.
In some embodiments of the invention, in step (6), the first sheet metal and the second sheet metal are clamped respectively, gently
Light separation boss and silicon cap up and down, the MEMS acceleration sensor device inside micromechanics unit to be broken a seal.
In some embodiments of the invention, micromechanics unit is secondary inside a kind of MEMS acceleration sensor device
Encapsulate opening method, comprising the following steps:
(a) the MEMS acceleration sensor device to secondary Kaifeng is placed on quartz boat, is integrally put into high-temperature test chamber,
The power supply of high-temperature test chamber is opened, is arranged 450-550 DEG C of temperature, when using timer, heating makes adhesive in 0.5-1.5 hours
Failure wears proximity gloves and takes out quartz boat, is placed on high temperature resistant slabstone, natural cooling；
(b) AB glue is mixed well in proportion, the AB glue after mixing well is coated on the first iron plate, clamps MEMS acceleration with tweezers
Senser element is put down gently on the first iron plate for applying AB glue, gently presses, make boss and the painting of MEMS acceleration sensor device bottom
First iron plate of AB glue bonds, and when operation avoids MEMS acceleration sensor device from sliding；
(c) the MEMS acceleration sensor device bonded with the first iron plate is put into quartz boat, is integrally put into high-temperature test chamber
In, the power supply of high-temperature test chamber is opened, is arranged 100-200 DEG C of temperature, when using timer, heating makes AB in 0.2-0.5 hours
Adhesive curing wears proximity gloves and takes out quartz boat, is placed on high temperature resistant slabstone, natural cooling；
(d) AB glue after mixing well is coated on the second iron plate, after the second iron plate for applying AB glue is placed on natural cooling
Second sheet metal at the top of MEMS acceleration sensor device, the silicon cap and gluing that make top bonds, and when operation avoids MEMS from adding
The sliding of velocity pick-up device；
(e) the MEMS acceleration sensor device bonded with the second iron plate is put into quartz boat, is integrally put into high-temperature test chamber
In, the power supply of high-temperature test chamber is opened, is arranged 100-200 DEG C of temperature, when using timer, heating makes AB in 0.5-1.5 hours
Adhesive curing wears proximity gloves and takes out quartz boat, is placed on high temperature resistant slabstone, natural cooling；
(f) the MEMS acceleration sensor device being cured, natural cooling, with two tweezers point are taken out from high-temperature test chamber
The first iron plate and the second iron plate are not clamped, gently separate boss and silicon cap, the MEMS acceleration sensor device to be broken a seal up and down
Internal micromechanics unit.
From the above it can be seen that the invention has the following advantages that
The opening method pair of micromechanics unit secondary encapsulation inside a kind of MEMS acceleration sensor device provided by the invention
Hardware requirement is low, operation is simple, implementation is strong, success rate is high and lossless to the mechanical structure unit of secondary encapsulation inside cavity
Wound has clear advantage.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of the encapsulating structure of micromechanics unit secondary encapsulation inside MEMS acceleration sensor device；
Fig. 2 is the main view of the encapsulating structure of micromechanics unit secondary encapsulation inside MEMS acceleration sensor device；
Fig. 3 is a kind of stream of opening method of micromechanics unit secondary encapsulation inside MEMS acceleration sensor device of the present invention
Cheng Tu；
Fig. 4 is another opening method of micromechanics unit secondary encapsulation inside MEMS acceleration sensor device of the present invention
Flow chart；
Fig. 5 is that micromechanics unit opens the structural schematic diagram after cap inside MEMS acceleration sensor device of the present invention；
Fig. 6 is that micromechanics unit opens the partial structural diagram after cap inside MEMS acceleration sensor device of the present invention.
Specific embodiment
To make the objectives, technical solutions, and advantages of the present invention clearer, below in conjunction with specific embodiment, and reference
Attached drawing, the present invention is described in more detail.
Micromechanics unit secondary encapsulation uses Si-Si glued construction inside high-precision MEMS acceleration sensor device, in
Between bonding component be organic bond.As depicted in figs. 1 and 2, micromechanics unit inside existing MEMS acceleration sensor device
The encapsulating structure of secondary encapsulation includes boss 1 and silicon cap 2, and boss 1 and silicon cap 2 pass through the formation internal cavity 5, MEMS of adhesive 3
Micromechanics unit 4 is encapsulated in internal cavity 5 inside acceleration sensor device.
It has silicon wafer on the surface of boss 1 to fix, the silicon wafer on boss 1 and silicon cap 2 (sealing cap silicon wafer) pass through 3 shape of adhesive
At Si-Si glued construction.Inventor is the study found that high-temperature heating can make adhesive 3 fail, it is contemplated that Si has high resistance to
By temperature and stability, therefore, the present embodiment is asked using the method processing bonding that high-temperature heating makes intermediate adhesive 33 fail
Topic, using specific method, realizes that the Si cap structure of secondary encapsulation is separated with the structure of micromechanics unit, to complete secondary envelope
Fill Kaifeng process.
As shown in figure 3,4 secondary encapsulation of micromechanics unit inside a kind of MEMS acceleration sensor device provided by the invention
Opening method includes the following steps:
(1) the MEMS acceleration sensor device to secondary Kaifeng is carried out heating makes adhesive 3 fail, and the temperature of heating is
450-550 DEG C, heating time is 0.5-1.5 hours, natural cooling；
(2) it after mixing the A agent (host agent) in AB glue with weight ratio 1:1 with B agent (curing agent), stirs evenly, mixes well
AB glue afterwards is coated on the first iron plate, and MEMS acceleration sensor device is gently placed on the first iron plate of gluing, is gently pressed
It closes, the first iron plate of the boss 1 and gluing that make MEMS acceleration sensor device bottom bonds, and when operation avoids MEMS acceleration from passing
Inductor component sliding, which causes AB glue to accumulate around, influences subsequent operation；AB glue coating thickness is controlled, avoids subsequent bonding occurred
Phenomenon, coating thickness of the AB glue on the first iron plate are 0.1-0.3mm；
(3) the MEMS acceleration sensor device bonded with the first iron plate is carried out heating is fully cured AB glue, heating
Temperature is 100-200 DEG C, and heating time is 0.2-0.5 hours, natural cooling；
(4) AB glue after mixing well is coated on the second iron plate, after the second iron plate of gluing is placed on natural cooling
The top of MEMS acceleration sensor device, gently presses, and the second iron plate of the silicon cap 2 and gluing that make top bonds, and when operation keeps away
Exempt from the sliding of MEMS acceleration sensor device, causing AB glue to accumulate around influences subsequent operation；AB glue coating thickness is controlled, is avoided
Subsequent bonding phenomenon occurred, coating thickness of the AB glue on the second iron plate is 0.1-0.3mm；
(5) the MEMS acceleration sensor device bonded with the second iron plate is carried out heating is fully cured AB glue, heating
Temperature is 100-200 DEG C, and heating time is 0.5-1.5 hours, natural cooling；
(6) the first iron plate and the second iron plate are clamped respectively, gently separates boss 1 and silicon cap 2 up and down, avoid the bonding of failure
Agent 3 falls into the internal cavity 5 of secondary encapsulation, micromechanics unit 4 inside the MEMS acceleration sensor device to be broken a seal.
As another embodiment of the invention, a kind of MEMS acceleration sensor device inside microcomputer provided in this embodiment
The opening method of 4 secondary encapsulation of tool unit, includes the following steps:
(1) the MEMS acceleration sensor device to secondary Kaifeng is carried out heating makes adhesive 3 fail, and the temperature of heating is
500 DEG C, heating time is 1 hour, natural cooling；
(2) it after mixing the A agent (host agent) in AB glue with weight ratio 1:1 with B agent (curing agent), stirs evenly, mixes well
AB glue afterwards is coated on the first iron plate, and MEMS acceleration sensor device is gently placed on the first iron plate of gluing, is gently pressed
It closes, the first iron plate of the boss 1 and gluing that make MEMS acceleration sensor device bottom bonds, and when operation avoids MEMS acceleration from passing
Inductor component sliding, which causes AB glue to accumulate around, influences subsequent operation；AB glue coating thickness is controlled, avoids subsequent bonding occurred
Phenomenon, coating thickness of the AB glue on the first iron plate are 0.1-0.3mm；
(3) the MEMS acceleration sensor device bonded with the first iron plate is carried out heating is fully cured AB glue, heating
Temperature is 150 DEG C, and heating time is 0.5 hour, natural cooling；
(4) AB glue after mixing well is coated on the second iron plate, after the second iron plate of gluing is placed on natural cooling
The top of MEMS acceleration sensor device, gently presses, and the second iron plate of the silicon cap 2 and gluing that make top bonds, and when operation keeps away
Exempt from the sliding of MEMS acceleration sensor device, causing AB glue to accumulate around influences subsequent operation；AB glue coating thickness is controlled, is avoided
Subsequent bonding phenomenon occurred, coating thickness of the AB glue on the second iron plate is 0.1-0.3mm；
(5) the MEMS acceleration sensor device bonded with the second iron plate is carried out heating is fully cured AB glue, heating
Temperature is 150 DEG C, and heating time is 1 hour, natural cooling；
(6) the first iron plate and the second iron plate are clamped respectively, gently separates boss 1 and silicon cap 2 up and down, avoid the bonding of failure
Agent 3 falls into the internal cavity 5 of secondary encapsulation, micromechanics unit 4 inside the MEMS acceleration sensor device to be broken a seal.
As another embodiment of the invention, a kind of MEMS acceleration based on high-temperature test chamber is present embodiments provided
4 secondary encapsulation opening method of micromechanics unit inside senser element, the tool for needing to use in the opening method are as follows: hot test
Case, the first iron plate, the second iron plate, AB glue, quartz boat, tweezers, proximity gloves and timer, specifically includes the following steps:
(a) the MEMS acceleration sensor device to secondary Kaifeng is placed on quartz boat, is integrally put into high-temperature test chamber,
The power supply of high-temperature test chamber is opened, is arranged 450-550 DEG C of temperature, when using timer, heating makes adhesive in 0.5-1.5 hours
3 failures wear proximity gloves and take out quartz boat, are placed on high temperature resistant slabstone, natural cooling；
(b) it after mixing the A agent (host agent) in AB glue with weight ratio 1:1 with B agent (curing agent), stirs evenly, mixes well
AB glue afterwards is coated on the first iron plate, is clamped MEMS acceleration sensor device with tweezers, is put down gently in the first iron plate for applying AB glue
On, it gently presses, the boss 1 for making MEMS acceleration sensor device bottom and the first iron plate for applying AB glue bond, and when operation avoids
The sliding of MEMS acceleration sensor device, causing AB glue to accumulate around influences subsequent operation；AB glue coating thickness is controlled, after avoiding
Continuous bonding phenomenon occurred, coating thickness of the AB glue on the first iron plate is 0.1-0.3mm；
(c) the MEMS acceleration sensor device bonded with the first iron plate is put into quartz boat, is integrally put into high-temperature test chamber
In, the power supply of high-temperature test chamber is opened, is arranged 100-200 DEG C of temperature, when using timer, heating makes AB in 0.2-0.5 hours
Glue is fully cured, and wears proximity gloves and takes out quartz boat, is placed on high temperature resistant slabstone, natural cooling；
(d) AB glue after mixing well is coated on the second iron plate, after the second iron plate for applying AB glue is placed on natural cooling
Second sheet metal at the top of MEMS acceleration sensor device, the silicon cap 2 and gluing that make top bonds, and when operation avoids MEMS from adding
The sliding of velocity pick-up device, causing AB glue to accumulate around influences subsequent operation；
(e) the MEMS acceleration sensor device bonded with the second iron plate is put into quartz boat, is integrally put into high-temperature test chamber
In, the power supply of high-temperature test chamber is opened, is arranged 100-200 DEG C of temperature, when using timer, heating makes AB in 0.5-1.5 hours
Glue is fully cured, and wears proximity gloves and takes out quartz boat, is placed on high temperature resistant slabstone, natural cooling；
(f) the MEMS acceleration sensor device being cured, natural cooling, with two tweezers point are taken out from high-temperature test chamber
The first iron plate and the second iron plate are not clamped, gently separates boss 1 and silicon cap 2 up and down, and the adhesive 3 of failure is avoided to fall into secondary envelope
The internal cavity 5 of dress, the MEMS acceleration sensor device inside micromechanics unit 4 to be broken a seal.
As shown in figure 4, it is micro- to present embodiments provide a kind of MEMS acceleration sensor device inside based on high-temperature test chamber
4 secondary encapsulation opening method of machine assembly, the tool for needing to use in the opening method are as follows: high-temperature test chamber, the first iron plate,
Two iron plates, AB glue, quartz boat, tweezers, proximity gloves and timer, specifically includes the following steps:
(a) the MEMS acceleration sensor device to secondary Kaifeng is placed on quartz boat, is integrally put into high-temperature test chamber,
Open the power supply of high-temperature test chamber, be arranged 500 DEG C of temperature, when using timer, heating makes adhesive 3 fail for 1 hour, wear every
Hot gloves take out quartz boat, are placed on high temperature resistant slabstone, natural cooling；
(b) it after mixing the A agent (host agent) in AB glue with weight ratio 1:1 with B agent (curing agent), stirs evenly, mixes well
AB glue afterwards is coated on the first iron plate, is clamped MEMS acceleration sensor device with tweezers, is put down gently in the first iron plate for applying AB glue
On, it gently presses, the boss 1 for making MEMS acceleration sensor device bottom and the first iron plate for applying AB glue bond, and when operation avoids
The sliding of MEMS acceleration sensor device, causing AB glue to accumulate around influences subsequent operation；AB glue coating thickness is controlled, after avoiding
Continuous bonding phenomenon occurred, coating thickness of the AB glue on the first iron plate is 0.1-0.3mm；
(c) the MEMS acceleration sensor device bonded with the first iron plate is put into quartz boat, is integrally put into high-temperature test chamber
In, the power supply of high-temperature test chamber is opened, is arranged 150 DEG C of temperature, when using timer, heating keeps AB glue completely solid in 0.5 hour
Change, wears proximity gloves and take out quartz boat, be placed on high temperature resistant slabstone, natural cooling；
(d) AB glue after mixing well is coated on the second iron plate, after the second iron plate for applying AB glue is placed on natural cooling
Second sheet metal at the top of MEMS acceleration sensor device, the silicon cap 2 and gluing that make top bonds, and when operation avoids MEMS from adding
The sliding of velocity pick-up device, causing AB glue to accumulate around influences subsequent operation；
(e) the MEMS acceleration sensor device bonded with the second iron plate is put into quartz boat, is integrally put into high-temperature test chamber
In, the power supply of high-temperature test chamber to be opened, is arranged 150 DEG C of temperature, when using timer, heating is fully cured AB glue in 1 hour,
It wears proximity gloves and takes out quartz boat, be placed on high temperature resistant slabstone, natural cooling；
(f) the MEMS acceleration sensor device being cured, natural cooling, with two tweezers point are taken out from high-temperature test chamber
The first iron plate and the second iron plate are not clamped, gently separates boss 1 and silicon cap 2 up and down, and the adhesive 3 of failure is avoided to fall into secondary envelope
The internal cavity 5 of dress, the MEMS acceleration sensor device inside micromechanics unit 4 to be broken a seal.
As shown in Figure 5 and Figure 6, after micromechanics unit opens cap inside MEMS acceleration sensor device, micro mechanical structure unit
It is not damaged, i.e., it is not damaged to the mechanical structure unit of secondary encapsulation inside cavity using above-mentioned opening method, it related can try
It tests, such as carries out DPA test or structural analysis test.
From the above, it is seen that micromechanics unit two inside a kind of MEMS acceleration sensor device provided by the invention
The opening method of secondary encapsulation is low to hardware requirement, operation is simple, implementation is strong, success rate is high, and to secondary encapsulation inside cavity
Mechanical structure unit it is not damaged, have clear advantage.
It should be understood by those ordinary skilled in the art that: the discussion of any of the above embodiment is exemplary only, not
It is intended to imply that the scope of the present disclosure (including claim) is limited to these examples；Under thinking of the invention, above embodiments
Or can also be combined between the technical characteristic in different embodiments, step can be realized with random order, and be existed such as
Many other variations of the upper different aspect of the invention, for simplicity, they are not provided in details.
The embodiment of the present invention be intended to cover fall into all such replacements within the broad range of appended claims,
Modifications and variations.Therefore, all within the spirits and principles of the present invention, any omission, modification, equivalent replacement, the improvement made
Deng should all be included in the protection scope of the present invention.
Claims (10)
1. a kind of opening method of MEMS acceleration sensor device, the opening method is used for in MEMS acceleration sensor device
Portion's micromechanics unit secondary encapsulation breaks a seal, which is characterized in that micromechanics unit is secondary inside MEMS acceleration sensor device
The encapsulating structure of encapsulation includes boss and silicon cap, and the boss and silicon cap pass through adhesive formation internal cavity, MEMS acceleration
Micromechanics unit is encapsulated in the internal cavity inside senser element, is included the following steps:
(1) the MEMS acceleration sensor device to secondary Kaifeng is carried out heating makes adhesive failure, natural cooling；
(2) glue is coated on the first sheet metal, MEMS acceleration sensor device is placed on the first sheet metal of gluing, is made
The boss of MEMS acceleration sensor device bottom and the first sheet metal of gluing bond；
(3) the MEMS acceleration sensor device bonded with the first sheet metal is carried out heating is fully cured glue, natural cooling；
(4) glue is coated on the second sheet metal, the MEMS acceleration after the second sheet metal of gluing to be placed on to natural cooling passes
Second sheet metal at the top of inductor component, the silicon cap and gluing that make top bonds；
(5) the MEMS acceleration sensor device bonded with the second sheet metal is carried out heating is fully cured glue, natural cooling；
(6) the first sheet metal and the second sheet metal are clamped respectively, separate boss and silicon cap, the MEMS acceleration sensing to be broken a seal
Device inside micromechanics unit.
2. the opening method of MEMS acceleration sensor device according to claim 1, which is characterized in that in step (1),
The temperature of heating is 450-550 DEG C, and heating time is 0.5-1.5 hours.
3. the opening method of MEMS acceleration sensor device according to claim 1, which is characterized in that in step (3),
The temperature of heating is 100-200 DEG C, and heating time is 0.2-0.5 hours.
4. the opening method of MEMS acceleration sensor device according to claim 1, which is characterized in that in step (5),
The temperature of heating is 100-200 DEG C, and heating time is 0.5-1.5 hours.
5. the opening method of MEMS acceleration sensor device according to claim 1, which is characterized in that the glue is AB
Glue, first sheet metal/second sheet metal is iron plate.
6. the opening method of MEMS acceleration sensor device according to claim 1, which is characterized in that the glue is first
Coating thickness on sheet metal is 0.1-0.3mm, and the glue is 0.1-0.3mm in the coating thickness of the second sheet metal.
7. the opening method of MEMS acceleration sensor device according to claim 1, which is characterized in that in step (2),
MEMS acceleration sensor device is put down gently on the first sheet metal of gluing, is gently pressed, MEMS acceleration sensor device bottom is made
First sheet metal of the boss in portion and gluing bonds, and when operation avoids MEMS acceleration sensor device from sliding.
8. the opening method of MEMS acceleration sensor device according to claim 1, which is characterized in that in step (4),
The top of MEMS acceleration sensor device after second sheet metal of gluing to be placed on to natural cooling makes the silicon cap and gluing at top
The bonding of the second sheet metal, when operation avoids MEMS acceleration sensor device from sliding.
9. the opening method of MEMS acceleration sensor device according to claim 1, which is characterized in that in step (6),
The first sheet metal and the second sheet metal are clamped respectively, and gently separation boss and silicon cap, the MEMS acceleration to be broken a seal pass up and down
Micromechanics unit inside inductor component.
10. micromechanics unit secondary encapsulation opening method inside MEMS acceleration sensor device according to claim 1,
It is characterized in that, comprising the following steps:
(a) the MEMS acceleration sensor device to secondary Kaifeng is placed on quartz boat, is integrally put into high-temperature test chamber, opened
The power supply of high-temperature test chamber is arranged 450-550 DEG C of temperature, when using timer, and heating loses adhesive in 0.5-1.5 hours
Effect wears proximity gloves and takes out quartz boat, is placed on high temperature resistant slabstone, natural cooling；
(b) AB glue is mixed well in proportion, the AB glue after mixing well is coated on the first iron plate, clamps MEMS acceleration sensing with tweezers
Device is put down gently on the first iron plate for applying AB glue, is gently pressed, and makes the boss of MEMS acceleration sensor device bottom and applies AB glue
The bonding of the first iron plate, when operation avoids MEMS acceleration sensor device from sliding；
(c) the MEMS acceleration sensor device bonded with the first iron plate is put into quartz boat, is integrally put into high-temperature test chamber, beats
The power supply of high-temperature test chamber is opened, is arranged 100-200 DEG C of temperature, when using timer, heating consolidates AB glue in 0.2-0.5 hours
Change, wears proximity gloves and take out quartz boat, be placed on high temperature resistant slabstone, natural cooling；
(d) AB glue after mixing well is coated on the second iron plate, the MEMS after the second iron plate for applying AB glue to be placed on to natural cooling
Second sheet metal at the top of acceleration sensor device, the silicon cap and gluing that make top bonds, and when operation avoids MEMS acceleration
Senser element sliding；
(e) the MEMS acceleration sensor device bonded with the second iron plate is put into quartz boat, is integrally put into high-temperature test chamber, beats
The power supply of high-temperature test chamber is opened, is arranged 100-200 DEG C of temperature, when using timer, heating consolidates AB glue in 0.5-1.5 hours
Change, wears proximity gloves and take out quartz boat, be placed on high temperature resistant slabstone, natural cooling；
(f) the MEMS acceleration sensor device being cured is taken out from high-temperature test chamber, natural cooling is pressed from both sides respectively with two tweezers
Firmly the first iron plate and the second iron plate, gently separation boss and silicon cap up and down, inside the MEMS acceleration sensor device to be broken a seal
Micromechanics unit.
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| CN112735981A (en) * | 2020-12-29 | 2021-04-30 | 北京振兴计量测试研究所 | Unsealing method of metal ceramic packaged crystal oscillator for chip injection molding packaging |
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