CN104964485A - Temperature adjusting device and heat exchange system for compressor - Google Patents
Temperature adjusting device and heat exchange system for compressor Download PDFInfo
- Publication number
- CN104964485A CN104964485A CN201510394311.5A CN201510394311A CN104964485A CN 104964485 A CN104964485 A CN 104964485A CN 201510394311 A CN201510394311 A CN 201510394311A CN 104964485 A CN104964485 A CN 104964485A
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- Prior art keywords
- heat
- compressor
- heat pipe
- register
- semiconductor cooler
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- 239000004065 semiconductor Substances 0.000 claims abstract description 75
- 230000008859 change Effects 0.000 claims abstract description 5
- 239000002470 thermal conductor Substances 0.000 claims description 29
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims description 25
- 239000006096 absorbing agent Substances 0.000 claims description 15
- 230000035939 shock Effects 0.000 claims description 15
- 239000000758 substrate Substances 0.000 claims description 15
- 230000005855 radiation Effects 0.000 claims description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 3
- 238000005452 bending Methods 0.000 claims description 3
- 239000000463 material Substances 0.000 claims description 3
- 239000000741 silica gel Substances 0.000 claims description 3
- 229910002027 silica gel Inorganic materials 0.000 claims description 3
- 239000003507 refrigerant Substances 0.000 abstract description 17
- 239000007788 liquid Substances 0.000 abstract description 8
- 230000008901 benefit Effects 0.000 abstract description 4
- 238000005485 electric heating Methods 0.000 abstract 1
- 238000013021 overheating Methods 0.000 abstract 1
- 238000004781 supercooling Methods 0.000 abstract 1
- 238000010438 heat treatment Methods 0.000 description 11
- 230000005494 condensation Effects 0.000 description 5
- 238000009833 condensation Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 230000008569 process Effects 0.000 description 5
- 230000001105 regulatory effect Effects 0.000 description 4
- 238000013016 damping Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000009434 installation Methods 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 239000002360 explosive Substances 0.000 description 1
- 238000002309 gasification Methods 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 238000005057 refrigeration Methods 0.000 description 1
- 238000010079 rubber tapping Methods 0.000 description 1
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B31/00—Compressor arrangements
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B21/00—Machines, plants or systems, using electric or magnetic effects
- F25B21/02—Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
- F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
- F25B2500/00—Problems to be solved
- F25B2500/28—Means for preventing liquid refrigerant entering into the compressor
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Mechanical Engineering (AREA)
- Thermal Sciences (AREA)
- General Engineering & Computer Science (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention provides a temperature adjusting device and a heat exchange system for a compressor. The temperature adjusting device comprises: the semiconductor refrigerator is used for exchanging heat with the compressor to change the temperature of a suction port of the compressor; and the heat pipe exchanges heat with the semiconductor refrigerator. The compressor is arranged on the temperature adjusting device, so that the cold end or the hot end of the semiconductor refrigerator can selectively heat or cool the compressor, the temperature of the air suction port of the compressor is adjusted, the supercooling or overheating of a refrigerant at the air suction port is avoided, the operation reliability of the compressor is improved, and the phenomena of liquid impact and overhigh temperature of the exhaust gas of the compressor are eliminated. The mutual influence of the cold end and the hot end of the semiconductor refrigerator is eliminated through the combined action of the semiconductor refrigerator and the heat pipe, so that the heat exchange efficiency of the semiconductor refrigerator and the compressor is ensured. The heat exchange efficiency of the semiconductor refrigerator can reach 160% of the electric heating efficiency, so that the temperature adjusting device has the advantage of high heat exchange efficiency.
Description
Technical field
The present invention relates to technical field of heat exchange, in particular to a kind of register for compressor and heat-exchange system.
Background technology
The reliability of refrigerant state on compressor at the air entry place of compressor has important impact.When the refrigerant degree of superheat is too low, easily there is liquid hammer in compressor; And the refrigerant degree of superheat too high time, then can cause the excessive discharge temperature of compressor, overheat of compressor is protected.Therefore, need the degree of superheat of the refrigerant of the air entry regulating compressor, make it be in certain working range, to ensure that compressor can reliability service.
Often adopt in prior art in two ways to improve the refrigerant temperature at the air entry place of compressor.
One, electric heater heating.At the air entry place of compressor around Shang Yiquan electric heater, carry out intensification heating with the refrigerant too low to temperature;
Two, electric machine rotation heating.Utilize the electric machine rotation of compressor self to generate heat to heat up with the refrigerant at the air entry place to compressor.
But all there is temperature and regulate inefficient problem in above-mentioned two kinds of thermoregulator modes.
Summary of the invention
Main purpose of the present invention is to provide a kind of register for compressor and heat-exchange system, there is temperature and regulate inefficient problem during to solve and to carry out temperature adjustment to the air entry of compressor in prior art.
To achieve these goals, according to an aspect of the present invention, provide a kind of register for compressor, comprising: for compressor heat exchange to change the semiconductor cooler of the air entry temperature of compressor; At least one heat pipe, heat pipe and semiconductor cooler heat exchange.
Further, register also comprises pedestal, and pedestal has container cavity, and semiconductor cooler is arranged in container cavity, the first end of heat pipe and semiconductor cooler heat exchange, and the second end of heat pipe is protruding by pedestal.
Further, register also comprises at least one thermal conductor, and thermal conductor is arranged in container cavity, is provided with thermal conductor between semiconductor cooler and compressor and/or between semiconductor cooler and heat pipe.
Further, thermal conductor is that silica gel material is made.
Further, register also comprises heat transfer block, and heat transfer block is arranged in container cavity, heat transfer block and semiconductor cooler heat exchange, the first end of heat pipe and heat transfer block contact heat-exchanging.
Further, be provided with thermal conductor between semiconductor cooler and heat pipe, register also comprises heat transfer block, and heat transfer block is by thermal conductor and semiconductor cooler contact heat-exchanging, and heat pipe is by heat transfer block and thermal conductor contact heat-exchanging.
Further, heat transfer block has spliced eye, and the first end of heat pipe stretches in spliced eye.
Further, at least one heat pipe is divided into two groups of heat pipe heat, and often organize in heat pipe heat and have at least one heat pipe, the through heat transfer block of spliced eye, one group of heat pipe heat is inserted by the first end of spliced eye, and another group heat pipe heat is inserted by the second end of spliced eye.
Further, heat pipe is bending shape.
Further, pedestal comprises: underframe; Surround structure for the circumference that is incubated, circumference to be surrounded vibrational power flow on underframe and is surrounded container cavity.
Further, underframe comprises: substrate; Multiple spacing leg, multiple spacing leg surrounds locating area, and circumference is surrounded structure and is positioned at locating area.
Further, pedestal also comprises shock absorber part, and shock absorber part is arranged on the surface deviating from the side of container cavity of underframe.
Further, substrate has perforate, and pedestal also comprises shock absorber part, and shock absorber part is arranged on tapping.
Further, substrate has perforate, and circumference surrounds the area that the frontal projected area of structure in the plane at substrate place is less than or equal to perforate.
Further, underframe also comprises multiple compressor foot pad, and compressor foot pad is arranged on one end away from substrate of spacing leg.
According to a further aspect in the invention, provide a kind of heat-exchange system, comprise compressor and register, register is above-mentioned register, and the air entry of compressor is positioned at the heat radiation region of the heat pipe of register, and the semiconductor cooler contact heat-exchanging of the shell of compressor and register.
Further, the bottom of the shell of compressor and semiconductor cooler contact heat-exchanging.
Apply technical scheme of the present invention, compressor is needed to be arranged on register, optionally compressor to be heated or lowers the temperature process to make the cold junction of semiconductor cooler or hot junction, thus the temperature of the air entry of compressor is regulated, avoid the refrigerant at air entry place to cross cold or overheated, thus improve compressor operational reliability, effectively eliminate liquid hammer and the too high phenomenon of compressor exhaust temperature.By the acting in conjunction of semiconductor cooler and heat pipe, to eliminate the cold junction of semiconductor cooler and influencing each other of hot junction, thus ensure the heat exchange efficiency of semiconductor cooler and compressor.Because the heat exchange efficiency of semiconductor cooler can reach 160% of electrical heating efficiency, the register in the present invention is thus made to have the high advantage of heat exchange efficiency.
Accompanying drawing explanation
The Figure of description forming a application's part is used to provide a further understanding of the present invention, and schematic description and description of the present invention, for explaining the present invention, does not form inappropriate limitation of the present invention.In the accompanying drawings:
Fig. 1 shows the structural representation of the heat-exchange system in the present invention;
Fig. 2 shows the installation relation schematic diagram of register in the present invention and compressor;
Fig. 3 shows the structural representation of the register in the present invention;
Fig. 4 shows the internal structure schematic diagram of the register in Fig. 1;
Fig. 5 shows the explosive view of the register in Fig. 1; And
Fig. 6 shows the P place partial enlarged drawing in Fig. 5.
Wherein, above-mentioned accompanying drawing comprises the following drawings mark:
10, compressor; 20, semiconductor cooler; 30, heat pipe; 40, pedestal; 41, underframe; 411, substrate; 412, spacing leg; 413, perforate; 414, compressor foot pad; 415, set bolt; 42, circumference surrounds structure; 421, hole is dodged; 43, shock absorber part; 50, thermal conductor; 60, heat transfer block; 61, spliced eye; 70, dividing plate; 80, side plate.
Detailed description of the invention
It should be noted that, when not conflicting, the embodiment in the application and the feature in embodiment can combine mutually.Below with reference to the accompanying drawings and describe the present invention in detail in conjunction with the embodiments.
It is noted that following detailed description is all exemplary, be intended to provide further instruction to the application.Unless otherwise, all technology used herein and scientific terminology have the identical meanings usually understood with the application person of an ordinary skill in the technical field.
In the present invention, when not doing contrary explanation, the noun of locality of use if " top, the end " is normally for direction shown in the drawings, or for parts this in vertically, on vertical or gravity direction; Similarly, for ease of understanding and describing, " inside and outside " refers to profile inside and outside relative to each parts itself, but the above-mentioned noun of locality is not limited to the present invention.
Regulating inefficient problem to there is temperature when solving and carry out temperature adjustment to the air entry of compressor in prior art, the invention provides a kind of register for compressor and heat-exchange system.Wherein, heat-exchange system comprises compressor 10 and register, and register is following register.
As shown in Figures 1 to 6, register comprise for compressor 10 heat exchange to change semiconductor cooler 20 and at least one heat pipe 30 of the air entry temperature of compressor, heat pipe 30 and semiconductor cooler 20 heat exchange.
When using the register in the present invention, compressor 10 is needed to be arranged on register, optionally compressor 10 to be heated or is lowered the temperature process to make the cold junction of semiconductor cooler 20 or hot junction, thus the temperature of the air entry of compressor 10 is regulated, avoid the refrigerant at air entry place to cross cold or overheated, thus improve compressor operational reliability, effectively eliminate liquid hammer and the too high phenomenon of compressor exhaust temperature.By the acting in conjunction of semiconductor cooler 20 and heat pipe 30, to eliminate the cold junction of semiconductor cooler 20 and influencing each other of hot junction, thus ensure the heat exchange efficiency of semiconductor cooler 20 and compressor 10.Because the heat exchange efficiency of semiconductor cooler 20 can reach 160% of electrical heating efficiency, the register in the present invention is thus made to have the high advantage of heat exchange efficiency.
As shown in Figure 2, because the air entry of compressor 10 is arranged near the bottom of compressor 10, thus by register being arranged on the bottom of the shell of compressor 10, with semiconductor cooler 20 contact heat-exchanging of the bottom and register that make compressor 10, and make the two to have enough heat transfer areas, ensure that the bottom of compressor 10 be heated evenly.When semiconductor cooler 20 is when heating compressor 10, the liquid refrigerants in the lower chamber of compressor 10 is subject to bottom heating, and boiling heat transfer occurs, and its coefficient of heat transfer is larger, and its gasification rate is promoted.
It should be noted that, semiconductor cooler 20 a kind ofly utilizes the movement of electronics between P pole and N pole, thus carry out the element of energy transferring, and respectively at formation hot junction, the two poles of the earth and cold junction, its refrigerating efficiency is about 0.6, and heating efficiency is about 1.6.Compared with electrical heating, its efficiency is higher, and by changing the flow direction of electric current, hot junction and cold junction can be made to exchange.When the sense of current conversion of semiconductor cooler, its cold junction and hot junction exchange, and now originally can change cold junction into the hot junction that compressor 10 heats, and then carry out cooling process to compressor 10.
In addition, heat pipe 30 is a kind of elements transmitted for heat, is made up of copper pipe, capillary and working media three parts.Heat pipe 30 is mainly divided into evaporator section, adiabatic section and condensation segment, and its advantage is that thermal conductivity factor is large, can balance the temperature at two ends very soon.When heat pipe 30 works, according to the difference of the two ends temperature of heat pipe 30, working media carries out liquefaction condensation release heat at condensation segment (cold section), the evaporator section (hot arc) that liquid working media has got back to heat pipe 30 under the effect of capillary absorbs heat and carries out evaporative phase-change, then move to the condensation segment of heat pipe 30 under the effect of the internal differential pressure of heat pipe 30, thus form a circulation, repeat the process of heat absorption evaporation and exothermic condensation, thus the heat at the two ends of heat pipe 30 is shifted.
As shown in Figure 4, when the bottom of the register in the present invention to compressor 10 is heated, the first end towards compressor 10 of semiconductor cooler 20 is hot junction, and one end of compressor 10 is cold junction dorsad, this cold junction contacts with heat pipe 30, with the cold junction making heat pipe 30 heat in air be passed to semiconductor cooler 20 by heat pipe 30, with in and the temperature of cold junction, avoid the heating effect in the hot junction affecting semiconductor cooler 20 because cold junction temperature is too low, thus ensure that the heating properties of the air entry to compressor 10.
As shown in Figure 4, when the register in the present invention carries out cooling process to the bottom of compressor 10, the first end towards compressor 10 of semiconductor cooler 20 is cold junction, and one end of compressor 10 is hot junction dorsad, this hot junction contacts with heat pipe 30, to make heat pipe 30, the heat in the hot junction of semiconductor cooler 20 is passed to surrounding air by heat pipe 30, to play the effect of heat radiation, thus avoid the hot junction of semiconductor cooler 20 to affect the temperature of cold junction, ensure that the cooling-down effect of the air entry of semiconductor cooler 20 pairs of compressors 10.Freezed rapidly by one end that the bottom of compressor 10 is contacted, freeze with the refrigerant of the air entry to compressor 10, thus effectively avoid the degree of superheat of air entry place refrigerant too high, effectively can reduce the delivery temperature of compressor 10, so improve compressor 10 operational reliability, avoid the excessive discharge temperature of compressor 10, avoid pressure excessive.
Register in the present invention also comprises pedestal 40, pedestal 40 has container cavity, semiconductor cooler 20 is arranged in container cavity, the first end of heat pipe 30 and semiconductor cooler 20 heat exchange, and the second end of heat pipe 30 is by pedestal 40 protruding (please refer to Fig. 3 and Fig. 4).Because pedestal 40 has container cavity, thus ensure that the installation reliability of semiconductor cooler 20, and heat pipe 30 reliably can be connected with pedestal 40.
As shown in Figures 3 to 5, register also comprises at least one thermal conductor 50, and thermal conductor 50 is arranged in container cavity, is provided with thermal conductor 50 between semiconductor cooler 20 and compressor 10 and/or between semiconductor cooler 20 and heat pipe 30.Owing to being provided with thermal conductor 50, thus improve the heat conduction efficiency between compressor 10, semiconductor cooler 20, heat pipe 30, thus further increase the temperature adjustment efficiency of register.
In the detailed description of the invention shown in Fig. 4, between semiconductor cooler 20 and compressor 10, be provided with a thermal conductor 50, and semiconductor cooler 20 and heat pipe 30 are provided with another thermal conductor 50.Certainly, only a thermal conductor 50 can also be set between semiconductor cooler 20 and compressor 10, or only a thermal conductor 50 be set at semiconductor cooler 20 and heat pipe 30.
Preferably, semiconductor cooler 20 by the bottom close contact of thermal conductor 50 with compressor 10, thus strengthens the heat transfer efficiency of the bottom of semiconductor cooler 20 and compressor 10.
Preferably, thermal conductor 50 is that silica gel material is made.
Register in the present invention also comprises heat transfer block 60, and heat transfer block 60 is arranged in container cavity, heat transfer block 60 and semiconductor cooler 20 heat exchange, the first end of heat pipe 30 and heat transfer block 60 contact heat-exchanging (please refer to Fig. 4).Owing to being provided with heat transfer block 60, thus further increase the heat exchange efficiency of semiconductor cooler 20 and heat pipe 30.
In the detailed description of the invention shown in Fig. 4, a thermal conductor 50 is provided with between semiconductor cooler 20 and heat pipe 30, heat transfer block 60 is by thermal conductor 50 and semiconductor cooler 20 contact heat-exchanging, and heat pipe 30 is by heat transfer block 60 and thermal conductor 50 contact heat-exchanging.
Preferably, heat transfer block 60 passes through thermal conductor 50 and semiconductor cooler 20 close contact, to strengthen the heat transfer efficiency of semiconductor cooler 20 and heat transfer block 60.
Preferably, heat transfer block 60 is heat radiation aluminium blocks.
In order to ensure the heat exchange reliability of heat pipe 30 and heat transfer block 60, the heat transfer block 60 in the present invention has spliced eye 61, and the first end of heat pipe 30 stretches in spliced eye 61 (please refer to Fig. 3, Fig. 5 and Fig. 6).Because heat pipe 30 inserts in spliced eye 61, by the contact area of both increases, not only improve heat exchange efficiency, effectively can also improve the connection reliability of the two.
As shown in Figures 3 to 6, at least one heat pipe 30 is divided into two groups of heat pipe heat, often organizes in heat pipe heat and has at least one heat pipe 30, the through heat transfer block 60 of spliced eye 61, one group of heat pipe heat is inserted by the first end of spliced eye 61, and another group heat pipe heat is inserted by the second end of spliced eye 61.
In the detailed description of the invention shown in Fig. 5, there are in each heat pipe heat five heat pipes 30.Second end of heat pipe 30 and the dividing plate 70 of heat-exchange system or side plate 80 are adjacent to, and are fixed on dividing plate 70 or side plate 80 by heat pipe 30 with securing member.
In the detailed description of the invention shown in Fig. 5, heat pipe 30 is bending shape.
As shown in Figures 3 to 5, pedestal 40 comprises underframe 41 and surrounds structure 42 for the circumference that is incubated, and circumference is surrounded structure 42 and to be arranged on underframe 41 and to surround container cavity.Circumference is surrounded structure 42 and semiconductor cooler 20 and heat transfer block 60 can be locked, and prevents the loss of the heat/cold of semiconductor cooler 20.
In the specific embodiment shown in Fig. 5, circumference surround structure 42 have arrange with spliced eye 61 one_to_one corresponding dodge hole 421, to ensure that heat pipe 30 can be connected with spliced eye 61 through dodging hole 421.
In the detailed description of the invention shown in Fig. 5, underframe 41 comprises substrate 411 and multiple spacing leg 412, and multiple spacing leg 412 surrounds locating area, and circumference is surrounded structure 42 and is positioned at locating area.Owing to being provided with spacing leg 412, thus ensure that circumference surrounds the installation reliability of structure 42.
As shown in Figure 4 and Figure 5, underframe 41 also comprises multiple compressor foot pad 414, and compressor foot pad 414 is arranged on one end away from substrate 411 of spacing leg 412.
Preferably, underframe 41 also comprises set bolt 415, and compressor 10 is fixed, by arranging compressor foot pad 414, to improve the damping performance of compressor register to compressor by the spacing leg 412 of set bolt 415 with underframe 41.
In order to optimize the damping performance of register, pedestal 40 also comprises shock absorber part 43, and shock absorber part 43 is arranged on the surface deviating from the side of container cavity of underframe 41.
In the preferred embodiment shown in Fig. 4 and Fig. 5, substrate 411 has perforate 413, and pedestal 40 also comprises shock absorber part 43, and shock absorber part 43 is arranged on perforate 413 place.Because shock absorber part 43 is arranged on perforate 413 place, thus when ensureing the damping performance of register, effectively reducing the thickness of register, being conducive to the Miniaturization Design of register.
Preferably, shock absorber part 43 comprises at least one in rubber blanket, plastic mattress or sponge.
Surround structure 42 for the ease of installing circumference, circumference surrounds the area that the frontal projected area of structure 42 in the plane at substrate 411 place is less than or equal to perforate 413.
Register in the present invention can regulate the refrigerant temperature at the air entry place of compressor 10; be within the scope of normal working temperature with the refrigerant at the air entry place ensureing compressor 10; compressor 10 liquid hammer can be prevented; also can cool the superheated refrigerant of the air entry of compressor 10 simultaneously; thus prevent compressor 10 overtemperature protection, and then improve the reliability of compressor 10.
Semiconductor refrigerating technology and heat transfer technology of heat pipe are applied in the problem of the reliability how improving compressor 10 by the present invention, effectively can reduce by this invention the probability that liquid hammer and overtemperature protection occur compressor 10.Because semiconductor refrigerating technology has refrigeration (heat) soon, and by multi-stage superimposed conversion, can very low low temperature or very high high temperature be formed, thus the state parameter of the air entry place refrigerant of compressor 10 can be changed rapidly, and effectively can increase the range of operation of compressor 10.
It should be noted that used term is only to describe detailed description of the invention here, and be not intended to the illustrative embodiments of restricted root according to the application.As used herein, unless the context clearly indicates otherwise, otherwise singulative is also intended to comprise plural form, in addition, it is to be further understood that, " comprise " when using term in this manual and/or " comprising " time, it indicates existing characteristics, step, work, device, assembly and/or their combination.
It should be noted that, term " first ", " second " etc. in the description of the application and claims and above-mentioned accompanying drawing are for distinguishing similar object, and need not be used for describing specific order or precedence.Should be appreciated that the data used like this can be exchanged in the appropriate case, so as the embodiment of the application described herein can with except here diagram or describe those except order implement.
The foregoing is only the preferred embodiments of the present invention, be not limited to the present invention, for a person skilled in the art, the present invention can have various modifications and variations.Within the spirit and principles in the present invention all, any amendment done, equivalent replacement, improvement etc., all should be included within protection scope of the present invention.
Claims (17)
1. for a register for compressor, it is characterized in that, comprising:
For with compressor (10) heat exchange to change the semiconductor cooler (20) of the air entry temperature of described compressor (10);
At least one heat pipe (30), described heat pipe (30) and described semiconductor cooler (20) heat exchange.
2. register according to claim 1, it is characterized in that, described register also comprises pedestal (40), described pedestal (40) has container cavity, described semiconductor cooler (20) is arranged in described container cavity, the first end of described heat pipe (30) and described semiconductor cooler (20) heat exchange, the second end of described heat pipe (30) is protruding by described pedestal (40).
3. register according to claim 2, it is characterized in that, described register also comprises at least one thermal conductor (50), described thermal conductor (50) is arranged in described container cavity, is provided with described thermal conductor (50) between described semiconductor cooler (20) and described compressor (10) and/or between described semiconductor cooler (20) and described heat pipe (30).
4. register according to claim 3, is characterized in that, described thermal conductor (50) is that silica gel material is made.
5. register according to claim 2, it is characterized in that, described register also comprises heat transfer block (60), described heat transfer block (60) is arranged in described container cavity, described heat transfer block (60) and described semiconductor cooler (20) heat exchange, the first end of described heat pipe (30) and described heat transfer block (60) contact heat-exchanging.
6. register according to claim 3, it is characterized in that, described thermal conductor (50) is provided with between described semiconductor cooler (20) and described heat pipe (30), described register also comprises heat transfer block (60), described heat transfer block (60) is by described thermal conductor (50) and described semiconductor cooler (20) contact heat-exchanging, and described heat pipe (30) is by described heat transfer block (60) and described thermal conductor (50) contact heat-exchanging.
7. the register according to claim 5 or 6, is characterized in that, described heat transfer block (60) has spliced eye (61), and the first end of described heat pipe (30) stretches in described spliced eye (61).
8. register according to claim 7, it is characterized in that, described at least one heat pipe (30) is divided into two groups of heat pipe heat, often organize in described heat pipe heat and there is at least one described heat pipe (30), the through described heat transfer block (60) of described spliced eye (61), heat pipe heat described in one group is inserted by the first end of described spliced eye (61), and another is organized described heat pipe heat and is inserted by the second end of described spliced eye (61).
9. register according to claim 1, is characterized in that, described heat pipe (30) is bending shape.
10. register according to claim 2, is characterized in that, described pedestal (40) comprising:
Underframe (41);
Circumference for being incubated surrounds structure (42), and described circumference encirclement structure (42) is arranged on described underframe (41) and goes up and surround described container cavity.
11. registers according to claim 10, is characterized in that, described underframe (41) comprising:
Substrate (411);
Multiple spacing leg (412), described multiple spacing leg (412) surrounds locating area, and described circumference is surrounded structure (42) and is positioned at described locating area.
12. registers according to claim 10, it is characterized in that, described pedestal (40) also comprises shock absorber part (43), and described shock absorber part (43) is arranged on the surface deviating from the side of described container cavity of described underframe (41).
13. registers according to claim 11, it is characterized in that, described substrate (411) has perforate (413), described pedestal (40) also comprises shock absorber part (43), and described shock absorber part (43) is arranged on described perforate (413) place.
14. registers according to claim 11, it is characterized in that, described substrate (411) has perforate (413), and described circumference surrounds the area that structure (42) frontal projected area in the plane at described substrate (411) place is less than or equal to described perforate (413).
15. registers according to claim 11, it is characterized in that, described underframe (41) also comprises multiple compressor foot pad (414), and described compressor foot pad (414) is arranged on one end away from described substrate (411) of described spacing leg (412).
16. 1 kinds of heat-exchange systems, comprise compressor (10) and register, it is characterized in that, described register is the register according to any one of claim 1 to 15, and the air entry of described compressor (10) is positioned at the heat radiation region of the heat pipe (30) of described register, and semiconductor cooler (20) contact heat-exchanging of the shell of described compressor (10) and described register.
17. heat-exchange systems according to claim 16, is characterized in that, the bottom of the shell of described compressor (10) and described semiconductor cooler (20) contact heat-exchanging.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510394311.5A CN104964485A (en) | 2015-07-03 | 2015-07-03 | Temperature adjusting device and heat exchange system for compressor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510394311.5A CN104964485A (en) | 2015-07-03 | 2015-07-03 | Temperature adjusting device and heat exchange system for compressor |
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| CN104964485A true CN104964485A (en) | 2015-10-07 |
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| CN201510394311.5A Pending CN104964485A (en) | 2015-07-03 | 2015-07-03 | Temperature adjusting device and heat exchange system for compressor |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105318613A (en) * | 2015-12-05 | 2016-02-10 | 广东志高空调有限公司 | Air-conditioning system |
| CN108120002A (en) * | 2016-11-28 | 2018-06-05 | 珠海格力电器股份有限公司 | Electric cabinet and air conditioner |
| CN114111100A (en) * | 2021-11-16 | 2022-03-01 | 珠海格力电器股份有限公司 | Refrigerating system, control method and air conditioner |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003042594A (en) * | 2001-07-27 | 2003-02-13 | Matsushita Electric Ind Co Ltd | Temperature regulating device |
| CN101842646A (en) * | 2007-10-10 | 2010-09-22 | 开利公司 | Suction superheat control based on refrigerant condition at discharge |
| CN203809238U (en) * | 2010-05-26 | 2014-09-03 | 安捷伦科技有限公司 | Cooling system for pumping system |
| CN204006778U (en) * | 2014-07-21 | 2014-12-10 | 广东美的集团芜湖制冷设备有限公司 | Air-conditioner |
| CN204757455U (en) * | 2015-07-03 | 2015-11-11 | 珠海格力电器股份有限公司 | Temperature adjusting device and heat exchange system for compressor |
-
2015
- 2015-07-03 CN CN201510394311.5A patent/CN104964485A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003042594A (en) * | 2001-07-27 | 2003-02-13 | Matsushita Electric Ind Co Ltd | Temperature regulating device |
| CN101842646A (en) * | 2007-10-10 | 2010-09-22 | 开利公司 | Suction superheat control based on refrigerant condition at discharge |
| CN203809238U (en) * | 2010-05-26 | 2014-09-03 | 安捷伦科技有限公司 | Cooling system for pumping system |
| CN204006778U (en) * | 2014-07-21 | 2014-12-10 | 广东美的集团芜湖制冷设备有限公司 | Air-conditioner |
| CN204757455U (en) * | 2015-07-03 | 2015-11-11 | 珠海格力电器股份有限公司 | Temperature adjusting device and heat exchange system for compressor |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105318613A (en) * | 2015-12-05 | 2016-02-10 | 广东志高空调有限公司 | Air-conditioning system |
| CN108120002A (en) * | 2016-11-28 | 2018-06-05 | 珠海格力电器股份有限公司 | Electric cabinet and air conditioner |
| CN114111100A (en) * | 2021-11-16 | 2022-03-01 | 珠海格力电器股份有限公司 | Refrigerating system, control method and air conditioner |
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