CN104952820A - Chip package using bonding wires for millimeter-wave radio frequency communication - Google Patents
Chip package using bonding wires for millimeter-wave radio frequency communication Download PDFInfo
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- CN104952820A CN104952820A CN201510316291.XA CN201510316291A CN104952820A CN 104952820 A CN104952820 A CN 104952820A CN 201510316291 A CN201510316291 A CN 201510316291A CN 104952820 A CN104952820 A CN 104952820A
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- chip
- chip package
- wave
- antenna
- bonding line
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Abstract
The invention discloses a chip package using bonding wires for millimeter-wave radio frequency communication. The chip package is characterized by comprising a spiral antenna body formed by serially connecting a plurality of the bonding wires with a bare chip welding pad sequentially, and two ports used for being connected with a radio frequency circuit on a chip are arranged at two ends of the antenna body. By the chip package, miniaturization of a millimeter-wave communication system is realized, area of the chip is reduced, an antenna, a matched network and a connector which are extra are eliminated, and cost is lowered; quality higher than an on-chip antenna can be realized, and efficiency of the whole circuit is improved.
Description
Technical field
The present invention relates to chip package bonding line being used for mm wave RF communication.
Background technology
Antenna is indispensable module in wireless communication system, and it plays the effect mutually transformed between the signal of telecommunication and radio wave, and existing chip antenna mainly contains following two kinds:
1, sheet outside antenna: the antenna utilizing PCB and wire coil to manufacture, needs to be connected on chip circuit by match circuit and connector.Therefore volume is large; Signal attenuation is large; Assembly cost is high.
2, on-chip antenna: utilize the antenna that the top-level metallic of the semi-conductor industries such as CMOS, BJT manufactures, can realize being connected with circuit at chip internal.Antenna quality factor (Q value is little); Efficiency is low, increases circuit power consumption; Inductance value is less, cannot be applied in low frequency radio circuit.
Bonding line is the indispensable important component part of chip: the circuit in chip dies has a lot of input/output interface, such as VDD-to-VSS, clock and input/output signal.These interfaces are connected with the pad on nude film at chip internal.In the process of chip package, pad is connected to the lead-in wire on encapsulating package by bonding line, and then realizes being connected of circuit in chip and other electronic devices.Material mainly gold thread or the aluminum steel of bonding line.Bonding line is an inductance in essence, comprises series resistance and and the column capacitance of some parasitisms.If bonding line can be used as the antenna of mm wave RF communication, will greatly improve the defect of existing antenna.
Summary of the invention
The object of the present invention is to provide a kind of chip package bonding line being used for mm wave RF communication, millimeter-wave communication system is miniaturized, reduce chip area, eliminate extra antenna, matching network and connector simultaneously, reduce costs; The quality higher than on-chip antenna can also be realized, improve the efficiency of whole circuit.
For achieving the above object, technical scheme of the present invention is a kind of chip package bonding line being used for mm wave RF communication of design, it is characterized in that, bonding line is used for the chip package of mm wave RF communication, it is characterized in that, comprise the helical antenna main body formed by some bonding lines successively series chip die pad, the two ends of this antenna body are two ports for being connected with the radio circuit on chip.
Preferably, described bonding line is the gold thread of diameter 25 μm.
Preferably, also top-level metallic is parallel with, to reduce dead resistance between adjacent two pads.
Preferably, two ports of described antenna body are drawn by top-level metallic, and top-level metallic may be used for two ports of extraction antenna body and is connected with the radio circuit on chip.
Advantage of the present invention is with beneficial effect: provide a kind of chip package bonding line being used for mm wave RF and communicating, and millimeter-wave communication system is miniaturized, reduces chip area, eliminates extra antenna, matching network and connector simultaneously, reduce costs; The quality higher than on-chip antenna can also be realized, improve the efficiency of whole circuit.
Accompanying drawing explanation
Fig. 1 is schematic diagram of the present invention.
Embodiment
Below in conjunction with drawings and Examples, the specific embodiment of the present invention is further described.Following examples only for technical scheme of the present invention is clearly described, and can not limit the scope of the invention with this.
The technical scheme that the present invention specifically implements is:
As shown in Figure 1, a kind of chip package bonding line being used for mm wave RF communication, it is characterized in that, bonding line is used for the chip package of mm wave RF communication, it is characterized in that, comprise the helical antenna main body formed by some bonding lines 3 successively series chip nude film 1 pad 2, the two ends of this antenna body are two port P and N for being connected with the radio circuit on chip.
Described bonding line is the gold thread of diameter 25 μm.
Top-level metallic can also be parallel with, to reduce dead resistance between adjacent two pads.
Two ports of described antenna body can be drawn by top-level metallic, and top-level metallic may be used for two ports of extraction antenna body and is connected with the radio circuit on chip.
The above is only the preferred embodiment of the present invention; it should be pointed out that for those skilled in the art, under the prerequisite not departing from the technology of the present invention principle; can also make some improvements and modifications, these improvements and modifications also should be considered as protection scope of the present invention.
Claims (4)
1. bonding line is used for the chip package of mm wave RF communication, it is characterized in that, bonding line is used for the chip package of mm wave RF communication, it is characterized in that, comprise the helical antenna main body formed by some bonding lines successively series chip die pad, the two ends of this antenna body are two ports for being connected with the radio circuit on chip.
2. chip package bonding line being used for mm wave RF communication according to claim 1, it is characterized in that, described bonding line is the gold thread of diameter 25 μm.
3. chip package bonding line being used for mm wave RF communication according to claim 2, is characterized in that, be also parallel with top-level metallic between adjacent two pads.
4. chip package bonding line being used for mm wave RF communication according to claim 2, it is characterized in that, two ports of described antenna body are drawn by top-level metallic.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510316291.XA CN104952820A (en) | 2015-06-10 | 2015-06-10 | Chip package using bonding wires for millimeter-wave radio frequency communication |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510316291.XA CN104952820A (en) | 2015-06-10 | 2015-06-10 | Chip package using bonding wires for millimeter-wave radio frequency communication |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104952820A true CN104952820A (en) | 2015-09-30 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510316291.XA Pending CN104952820A (en) | 2015-06-10 | 2015-06-10 | Chip package using bonding wires for millimeter-wave radio frequency communication |
Country Status (1)
| Country | Link |
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| CN (1) | CN104952820A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2019061389A1 (en) * | 2017-09-30 | 2019-04-04 | 深圳传音制造有限公司 | Printed circuit board for performing radio frequency testing for terminal, and terminal |
| CN117476589A (en) * | 2023-12-28 | 2024-01-30 | 西安格易安创集成电路有限公司 | Chip packaging structure |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101023560A (en) * | 2004-08-06 | 2007-08-22 | 国际商业机器公司 | Apparatus and methods for constructing antennas using wire bonds as radiating elements |
| KR20090055974A (en) * | 2007-11-29 | 2009-06-03 | 엘지이노텍 주식회사 | Radio frequency module |
| CN103828871A (en) * | 2012-11-23 | 2014-06-04 | 王悦 | Electric oven for enabling food to have isaria cicadae miq flavor |
| US20140253391A1 (en) * | 2013-03-07 | 2014-09-11 | Taiwan Semiconductor Manufacturing Company, Ltd. | Bond Wire Antenna |
-
2015
- 2015-06-10 CN CN201510316291.XA patent/CN104952820A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101023560A (en) * | 2004-08-06 | 2007-08-22 | 国际商业机器公司 | Apparatus and methods for constructing antennas using wire bonds as radiating elements |
| KR20090055974A (en) * | 2007-11-29 | 2009-06-03 | 엘지이노텍 주식회사 | Radio frequency module |
| CN103828871A (en) * | 2012-11-23 | 2014-06-04 | 王悦 | Electric oven for enabling food to have isaria cicadae miq flavor |
| US20140253391A1 (en) * | 2013-03-07 | 2014-09-11 | Taiwan Semiconductor Manufacturing Company, Ltd. | Bond Wire Antenna |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2019061389A1 (en) * | 2017-09-30 | 2019-04-04 | 深圳传音制造有限公司 | Printed circuit board for performing radio frequency testing for terminal, and terminal |
| CN117476589A (en) * | 2023-12-28 | 2024-01-30 | 西安格易安创集成电路有限公司 | Chip packaging structure |
| CN117476589B (en) * | 2023-12-28 | 2024-04-12 | 西安格易安创集成电路有限公司 | Chip packaging structure |
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Legal Events
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20150930 |
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| RJ01 | Rejection of invention patent application after publication |