CN111128939A - Radio frequency chip bonding pad - Google Patents
Radio frequency chip bonding pad Download PDFInfo
- Publication number
- CN111128939A CN111128939A CN201911407446.5A CN201911407446A CN111128939A CN 111128939 A CN111128939 A CN 111128939A CN 201911407446 A CN201911407446 A CN 201911407446A CN 111128939 A CN111128939 A CN 111128939A
- Authority
- CN
- China
- Prior art keywords
- radio frequency
- frequency chip
- bonding pad
- pad
- coupling inductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
- H01L23/64—Impedance arrangements
- H01L23/647—Resistive arrangements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/023—Redistribution layers [RDL] for bonding areas
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
- H01L2224/0554—External layer
- H01L2224/0555—Shape
- H01L2224/05552—Shape in top view
- H01L2224/05554—Shape in top view being square
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/02—Bonding areas; Manufacturing methods related thereto
- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
- H01L2224/06—Structure, shape, material or disposition of the bonding areas prior to the connecting process of a plurality of bonding areas
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- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Coils Or Transformers For Communication (AREA)
Abstract
A radio frequency chip bonding pad relates to the technical field of radio frequency chips and solves the technical problem of eliminating capacitance effect. This pad, including the pad body that is used for carrying on the radio frequency chip, the ground connection pin electrical connection of pad body and radio frequency chip, its characterized in that: the pad body is connected to the ground terminal through a coupling inductor. The bonding pad provided by the invention is suitable for a radio frequency chip.
Description
Technical Field
The invention relates to a radio frequency chip technology, in particular to a radio frequency chip bonding pad technology.
Background
The radio frequency chip is connected with an external structure through the bonding pad, the bonding pad has a capacitance effect, and particularly for frequency bands above millimeter waves, the capacitance effect of the bonding pad influences the performance of the circuit.
Disclosure of Invention
In view of the above-mentioned drawbacks in the prior art, the present invention provides a radio frequency chip bonding pad capable of eliminating capacitance effect.
In order to solve the technical problem, the pad for the radio frequency chip provided by the invention comprises a pad body for carrying the radio frequency chip, wherein the pad body is electrically connected with a grounding pin of the radio frequency chip, and the pad is characterized in that: the pad body is connected to the ground terminal through a coupling inductor.
Furthermore, the coupling inductor is formed by a section of conducting wire which is bent repeatedly left and right.
Furthermore, the coupling inductor is formed by a section of conducting wire bent into a spiral planar coil shape.
Furthermore, the coupling inductor is formed by a section of conducting wire bent into a square planar coil shape.
According to the radio frequency chip bonding pad provided by the invention, the bonding pad body is connected to the ground in parallel by using the coupling inductor connected to the ground in parallel, and the impedance change caused by the capacitance effect of the bonding pad body is offset by using the coupling inductor connected to the ground in parallel, so that the capacitance effect of the bonding pad body can be eliminated, and the performance of a radio frequency chip is not influenced.
Drawings
FIG. 1 is a diagram illustrating a pad structure of a RF chip according to a first embodiment of the present invention;
FIG. 2 is a diagram illustrating a pad structure of a RF chip according to a second embodiment of the present invention;
fig. 3 is a schematic structural diagram of a rf chip pad according to a third embodiment of the invention.
Detailed Description
The embodiments of the present invention will be described in further detail with reference to the following description of the drawings, but the embodiments are not intended to limit the present invention, and all similar structures and similar variations using the present invention shall be included in the scope of the present invention, and the pause numbers in the present invention shall have a relation of the same.
As shown in fig. 1, a pad for a radio frequency chip according to a first embodiment of the present invention includes a pad body 11 for mounting a radio frequency chip, where the pad body 11 is electrically connected to a ground pin of the radio frequency chip, and is characterized in that: the welding pad further comprises a grounding terminal 12, the welding pad body 11 is connected to the grounding terminal 12 through a coupling inductor 13, and the coupling inductor 13 is formed by a section of conducting wire which is bent to and fro left and right for multiple times.
As shown in fig. 2, the second embodiment of the present invention is different from the first embodiment in that: the coupling inductor 23 connecting the pad body 21 and the ground terminal 22 is formed by a section of wire bent into a spiral planar coil shape, and other electronic components can be arranged in the inner coil space of the coupling inductor adopting the spiral planar coil shape, so that the space can be fully utilized, and the occupied area of the circuit is reduced.
As shown in fig. 3, the third embodiment of the present invention is different from the first embodiment in that: the coupling inductor 33 connecting the pad body 31 and the ground terminal 32 is formed by a section of wire bent into a square planar coil shape, and other electronic components can be arranged in the inner space of the coupling inductor in the square planar coil shape, so that the space can be fully utilized, and the circuit occupation area can be reduced.
In the embodiments of the invention, the coupling inductor can be used for offsetting the impedance change caused by the capacitance effect of the bonding pad body, and the capacitance effect of the bonding pad body can be eliminated.
Claims (4)
1. The utility model provides a radio frequency chip bonding pad, is including the bonding pad body that is used for carrying the radio frequency chip, the bonding pad body is connected its characterized in that with the ground connection pin electrical connection of radio frequency chip: the pad body is connected to the ground terminal through a coupling inductor.
2. The rf chip pad of claim 1, wherein: the coupling inductor is formed by a section of conducting wire which is bent repeatedly left and right.
3. The rf chip pad of claim 1, wherein: the coupling inductor is formed by a section of conducting wire which is bent into a spiral plane coil shape.
4. The rf chip pad of claim 1, wherein: the coupling inductor is formed by a section of conducting wire bent into a square planar coil shape.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911407446.5A CN111128939A (en) | 2019-12-31 | 2019-12-31 | Radio frequency chip bonding pad |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911407446.5A CN111128939A (en) | 2019-12-31 | 2019-12-31 | Radio frequency chip bonding pad |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111128939A true CN111128939A (en) | 2020-05-08 |
Family
ID=70506162
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201911407446.5A Withdrawn CN111128939A (en) | 2019-12-31 | 2019-12-31 | Radio frequency chip bonding pad |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN111128939A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114628373A (en) * | 2022-05-16 | 2022-06-14 | 成都芯盟微科技有限公司 | Air bridge and method for improving isolation between air bridge and lower-layer metal |
-
2019
- 2019-12-31 CN CN201911407446.5A patent/CN111128939A/en not_active Withdrawn
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114628373A (en) * | 2022-05-16 | 2022-06-14 | 成都芯盟微科技有限公司 | Air bridge and method for improving isolation between air bridge and lower-layer metal |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WW01 | Invention patent application withdrawn after publication |
Application publication date: 20200508 |
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| WW01 | Invention patent application withdrawn after publication |