CN104949084A - Heat dissipation device - Google Patents

Abstract

The invention relates to the technical field of heat dissipation, in particular to a heat dissipation device. The heat dissipation device comprises a base, a first substrate, a second substrate and a plurality of heat dissipation columns, wherein the first substrate and the second substrate are connected and arranged on the same side surface of the base; the plurality of heat dissipation columns are arranged on the first substrate and the second substrate respectively; the first substrate and the second substrate have V-shaped sections. According to the heat dissipation device, the first substrate and the second substrate are arranged on the base, the base can have a fixing and limiting function so as to fix the substrates on the base, electronic components such as LED chips and the like are arranged on the substrates, and heat produced by the electronic components can be conducted to the outside through the substrates; further, the heat dissipation columns are arranged on the first substrate and the second substrate, heat is conducted to the heat dissipation columns from the substrates and dispersed into air by the heat dissipation columns, so that fast transmission and dispersion of heat are facilitated, the contact area of each of the first substrate and the second substrate with air is increased, and the heat dissipation performance of the heat dissipation device is improved effectively.

Description

Heat abstractor

Technical field

The present invention relates to technical field of heat dissipation, particularly relate to heat abstractor.

Background technology

LED is the abbreviation of English light emitting diode (light emitting diode); its basic structure is one piece of electroluminescent chip of semiconductor material; with elargol or latex solidified on support; then chip and circuit board is connected with silver-colored line or gold thread; then surrounding epoxy sealing, plays the effect of protection internal core, last mounting casing; so the anti-seismic performance of LED is good, be called as forth generation green light source.

LED illumination lamp is exactly a kind of lighting utilizing forth generation green light source LED to make, namely LED is called as forth generation lighting source or green light source, there is the features such as energy-saving and environmental protection, the life-span is long, volume is little, the fields such as various instruction, display, decoration, backlight, general lighting and urban landscape can be widely used in.

But whether LED work stablizes, quality quality, dispel the heat most important with lamp body itself, the heat radiation of the high-brightness LED lamp on market, usually adopts natural heat dissipation, and effect is unsatisfactory.The LED lamp that LED light source is made, is made up of LED, radiator structure, driver, lens, and therefore dispelling the heat also is a part and parcel, if LED can not dispel the heat very well, its life-span also can be influenced.

Such as, disclose a kind of radiator structure of LED power-type street lamp segmentation luminescence unit in Chinese patent CN201410741409.9, formed by for LED secondary light-distribution Tou Mirror module (1), the LED lamp bead (2) be welded in aluminum-based circuit board (3), aluminium radiator (5) and solid state si heat conducting film (4), solid state si heat conducting film (4) substitutes the liquid heat conductive silicone grease that tradition is continued to use, with the pattern of face contact, aluminum-based circuit board (3) is connected with aluminium radiator (5), produce the condition of high temperature in LED street lamp work under, the conductive structure of its mutual face contact can not be changed, the LED of Cheng Load in aluminum-based circuit board work electric heating can be made to conduct smoothly, be diffused on aluminium radiator, radiating fin (6) on radiator is coated with heat loss through radiation coating, this heat loss through radiation coating is the solution that cohesion occurs the modified colloidal particulate (being less than 100 nanometers) crossed through high-temperature process, solution is under the effect of curing agent after film-forming, in fish scale-shaped structure, be conducive to radiation of heat, its filler is CNT, the material of the high thermal conductance such as spinel metal oxide and infrared emission, this structure can increase heat radiation specific area and conductivity greatly, improve the radiation coefficient of luminescence unit infra-red radiation, promote the effect of exchange heat, reduce the light decay probability of luminescence unit.

And for example, disclose a kind of high-heat-dispersion LED wiring board in Chinese patent CN201410734343.0, it comprises and is provided with radiating base layer, thermal insulation layer and line layer successively from the bottom to top, and described radiating base layer is metallic plate, and its upper surface is provided with multiple taper projection; The top of described taper projection is provided with two heat transfer bars intersected.Stretch into the taper projection in thermal insulation layer, add the contact area of radiating base layer and thermal insulation layer, and then improve the heat transfer efficiency of radiating base layer and insulating heat-conductive interlayer.And the topside area of taper projection is less, thermal insulation layer can be avoided to be punctured by high-tension electricity.

But dissipation from electronic devices of the prior art has still been come by the heat transfer between heat carrier and fin substantially, and radiating effect is not very desirable, so provide a kind of new heat abstractor to be required.

Summary of the invention

Based on this, be necessary for the problems referred to above, the heat abstractor that a kind of good heat dispersion performance, radiating efficiency are higher is provided.

A kind of heat abstractor, comprising: pedestal, first substrate, second substrate and some thermal columns; Described first substrate is connected with described second substrate, and described first substrate and described second substrate are arranged at the same side of described pedestal; Some described thermal columns are arranged on described first substrate and described second substrate respectively; Described first substrate becomes V-type with the cross section of described second substrate.

Wherein in an embodiment, described substrate has kink, long heat sink and short heat sink.

Wherein in an embodiment, described long heat sink is connected with described kink respectively with described short heat sink.

Wherein in an embodiment, the width of described long heat sink is greater than the width of described short heat sink.

Wherein in an embodiment, the length of described long heat sink is equal with the length of described short heat sink.

Wherein in an embodiment, described pedestal has installed surface, and described installed surface offers the first mounting groove and the second mounting groove.

Wherein in an embodiment, described first mounting groove becomes V-type with the cross section of described second mounting groove.

Wherein in an embodiment, also comprise heating column, described heating column is arranged on described pedestal.

Wherein in an embodiment, described kink is connected with described heating column.

Wherein in an embodiment, the bearing of trend of described heating column is identical with the bearing of trend of described substrate.

Above-mentioned heat abstractor, pedestal is provided with first substrate and second substrate, pedestal can play a fixing restriction to be fixed on pedestal by substrate, the electronic components such as LED chip are arranged on substrate, the heat that electronic component produces conducts to outside by substrate, and, first substrate and second substrate are provided with thermal column, heat is conducted from substrate toward thermal column, and be dispersed in air by thermal column, thus be conducive to fast transport and the dispersion of heat, improve the contact area of first substrate and second substrate and air, effectively improve the heat dispersion of heat abstractor.

Accompanying drawing explanation

Fig. 1 is the structural representation of one embodiment of the invention heat abstractor;

Fig. 2 is the structural representation at another visual angle of Fig. 1;

Fig. 3 is the structural representation of further embodiment of this invention heat abstractor;

Fig. 4 is the structural representation of further embodiment of this invention heat abstractor;

Fig. 5 is the mounting structure schematic diagram of controller;

Fig. 6 is the structural representation of cradle portion;

Fig. 7 is the structural representation at another visual angle of Fig. 6;

Fig. 8 is the structural representation of further embodiment of this invention heat abstractor;

Fig. 9 is the perspective view of Fig. 8.

Detailed description of the invention

For enabling above-mentioned purpose of the present invention, feature and advantage become apparent more, are described in detail the specific embodiment of the present invention below in conjunction with accompanying drawing.Set forth a lot of detail in the following description so that fully understand the present invention.But the present invention can be much different from alternate manner described here to implement, those skilled in the art can when without prejudice to doing similar improvement when intension of the present invention, therefore the present invention is by the restriction of following public specific embodiment.

In describing the invention, it will be appreciated that, term " " center ", " longitudinal direction ", " transverse direction ", " length ", " width ", " thickness ", " on ", D score, " front ", " afterwards ", " left side ", " right side ", " vertically ", " level ", " top ", " end ", " interior ", " outward ", " clockwise ", " counterclockwise ", " axis ", " radial direction ", orientation or the position relationship of the instruction such as " circumference " are based on orientation shown in the drawings or position relationship, only the present invention for convenience of description and simplified characterization, instead of indicate or imply that the device of indication or element must have specific orientation, with specific azimuth configuration and operation, therefore limitation of the present invention can not be interpreted as.

In addition, term " first ", " second " only for describing object, and can not be interpreted as instruction or hint relative importance or imply the quantity indicating indicated technical characteristic.Thus, be limited with " first ", the feature of " second " can express or impliedly comprise at least one this feature.In describing the invention, the implication of " multiple " is at least two, such as two, three etc., unless otherwise expressly limited specifically.

In the present invention, unless otherwise clearly defined and limited, the term such as term " installation ", " being connected ", " connection ", " fixing " should be interpreted broadly, and such as, can be fixedly connected with, also can be removably connect, or integral; Can be mechanical connection, also can be electrical connection; Can be directly be connected, also indirectly can be connected by intermediary, can be the connection of two element internals or the interaction relationship of two elements, unless otherwise clear and definite restriction.For the ordinary skill in the art, above-mentioned term concrete meaning in the present invention can be understood as the case may be.

In the present invention, unless otherwise clearly defined and limited, fisrt feature second feature " on " or D score can be that the first and second features directly contact, or the first and second features are by intermediary mediate contact.And, fisrt feature second feature " on ", " top " and " above " but fisrt feature directly over second feature or oblique upper, or only represent that fisrt feature level height is higher than second feature.Fisrt feature second feature " under ", " below " and " below " can be fisrt feature immediately below second feature or tiltedly below, or only represent that fisrt feature level height is less than second feature.

It should be noted that, when element is called as " being fixed on ", " being arranged at " another element, directly can there is element placed in the middle in it on another element or also.When an element is considered to " connection " another element, it can be directly connected to another element or may there is centering elements simultaneously.Term as used herein " vertical ", " level ", "left", "right" and similar statement just for illustrative purposes, do not represent it is unique embodiment.

Refer to Fig. 1, heat abstractor comprises pedestal 100, first substrate 110, second substrate 120 and some thermal columns 130, first substrate is connected with second substrate, and, first substrate and second substrate are arranged at the same side of pedestal, first substrate and second substrate arrange some thermal columns respectively, and that is, some thermal columns are arranged on first substrate and second substrate respectively.Such as, pedestal squarely body.Such as, pedestal has installed surface.Such as, first substrate becomes V-type with the cross section of second substrate, and it has kink, long heat sink and short heat sink, and long heat sink is connected with kink respectively with short heat sink.Such as, the width of the long heat sink of substrate is greater than the width of short heat sink, and both length is equal, and namely the length of long heat sink is equal with the length of short heat sink, and also just say, the area of long heat sink is greater than the area of short heat sink.Such as, installed surface offers the first mounting groove and the second mounting groove.First mounting groove becomes V-type with the cross section of the second mounting groove.Such as, first substrate is arranged at the first mounting groove, and second substrate is arranged at the second mounting groove, makes first substrate become X-type to be arranged on pedestal with second substrate.Like this, heat conducts to thermal column via first substrate and second substrate, and distributes heat in air by thermal column, to realize the object of dispelling the heat.

In order to increase the contact area of thermal column and air, refer to Fig. 1 and Fig. 2, such as, heat abstractor also comprises heating column 140, and heating column is arranged on pedestal, and kink is connected with heating column, and the bearing of trend of heating column is identical with the bearing of trend of substrate.Such as, first substrate 110 comprises the first kink 111, first long heat sink 112 and the first short heat sink 113.Such as, second substrate 120 comprises the second kink 121, second long heat sink 122 and the second short heat sink 123.Such as, the first kink is connected with heating column respectively with the second kink.Such as, the first long heat sink is positioned at the extending direction of the second short heat sink, and namely the first long heat sink and the second short heat sink are located along the same line.Same, the second long heat sink is positioned at the extending direction of the first short heat sink, and namely the second long heat sink and the first short heat sink are located along the same line.Further, the angle between the first long heat sink and the first short heat sink is acute angle, and the angle between the second long heat sink and the second short heat radiation is also be acute angle.So, angle between first long heat sink and the second long heat sink and the angle between the first short heat sink and the second short heat sink are obtuse angle, some thermal columns are arranged in the heat sink on two obtuse angles, to make, thermal column is as much as possible to be contacted with air, add the contact area of thermal column and air, improve radiating efficiency.

For the ease of being arranged on by thermal column on the first short heat sink and the second short heat sink, such as, the thermal column be arranged on the first short heat sink is crisscross arranged with the thermal column be arranged on the second short heat sink, and namely one end away from heat sink of thermal column is crisscross arranged.Such as, some thermal columns are divided into two groups, comprise first group of thermal column and second group of thermal column.Such as, first group of thermal column becomes matrix distribution on the first short heat sink and the second short heat sink with second group of thermal column respectively.So, the length of thermal column is not by the size of angle between the first short heat sink and the second short heat sink, that is, the no matter angle why number of degrees between the first short heat sink and the second short heat sink, thermal column all can be arranged on the first short heat sink and the second short heat sink, and, owing to being crisscross arranged between the first short heat sink and each thermal column of the second short heat sink, do not hinder each other, make need not consider its length when designing thermal column length, thus can easily thermal column be arranged on the first short heat sink and the second short heat sink.

In order to improve radiating efficiency, such as, thermal column comprises heat conduction core and external diffusion layer.Such as, heat conduction core and external diffusion layer are extended by the direction of substrate to vertical substrate.Such as, external diffusion layer parcel heat conduction core.Preferably, heat conduction core is that graphite is made, and external diffusion layer is aluminium alloy.Such as, described aluminium alloy comprises each component composition of following mass parts: aluminium: 81.2 parts ~ 89.5 parts, magnesium: 11.3 parts ~ 15.1 parts, silicon: 0.5 part ~ 1.5 parts, copper: 2.2 parts ~ 3.5 parts, manganese: 0.3 part ~ 1.0 parts, nickel: 2.3 parts ~ 4.6 parts, molybdenum: 0.1 part ~ 0.5 part, zirconium: 0.2 part ~ 0.5 part, above-mentioned aluminium alloy is primarily of aluminium, magnesium is made, not only can make the lighter weight of the base material of preparation, thermal conductivity is better, and silicon, copper, manganese, nickel, adding of molybdenum can make the outer wall of external diffusion layer have larger intensity, in addition, the fatigue-resistance characteristics adding the outer wall that can improve external diffusion layer of zirconium and decay resistance, when but the content of zirconium is greater than 0.5 part, its decay resistance improves less, and surrender degree and other mechanical mechanics properties of material can be affected, therefore the content controlling zirconium is less than 0.5 part, to ensure fatigue-resistance characteristics and the decay resistance of external diffusion layer.

In addition, for the ease of promptly by from the heat conduction on substrate in surrounding environment, preferably, external diffusion layer is graphite-aluminium alloy.So, because the thermal conductivity factor of graphite is high, aluminium has the hardness of metal, both in conjunction with time there is the heat transfer efficiency more excellent relative to aluminium alloy.Preferably, above-mentioned graphite-aluminium alloy comprises each component of following mass parts: Si:8 ~ 18 part, Cu:5 ~ 17 part, Pt:3 ~ 23 part, V:2 ~ 12 part, Ti:2 ~ 15 part, Mg:2 ~ 8 part, Ai:23 ~ 75 part, C:20 ~ 75 part, Ni:19 ~ 75 part.

And for example, graphite-aluminium alloy comprises each component of following mass parts: Si:10 ~ 14 part, Cu:13 ~ 17 part, Pt:6 ~ 20 part, V:4 ~ 10 part, Ti:5 ~ 9 part, Mg:2 ~ 4 part, Ai:25 ~ 43 part, C:36 ~ 55 part, Ni:36 ~ 55 part.

And for example, graphite-aluminium alloy comprises each component of following mass parts: Si:15 ~ 16 part, Cu:9 ~ 13 part, Pt:12 ~ 18 part, V:6 ~ 8 part, Ti:10 ~ 15 part, Mg:5 ~ 8 part, Ai:45 ~ 65 part, C:25 ~ 35 part, Ni:25 ~ 35 part.

Preferably, graphite-aluminium alloy comprises each component of following mass parts: Si:10 part, Cu:6 part, Pt:13 part, V:7 part, Ti:3 part, Mg:5 part, Ai:74 part, C:74 part, Ni:70 part.

After above-mentioned each combination is grouped into graphite-aluminium alloy, there is excellent thermal conductivity factor, there is the plasticity of metal simultaneously, can effectively by from the heat conduction on substrate in surrounding environment.

In order to improve radiating efficiency further, such as, heat conduction annular groove is offered between heat conduction core and external diffusion layer.Such as, heat conduction core and external diffusion layer are that aluminium alloy is made.Such as, heat conduction annular groove is filled with Graphene particle.And for example, heat conduction annular groove is filled with the thermal conductivity factor graphite granule low compared with Graphene particle.Preferably, heat conduction core and external diffusion layer and to be filled in the Graphene particle of heat conduction annular groove one-body molded, each contact surface is provided with heat conductive silica gel, to improve derivative coefficient.Be appreciated that, after being filled with Graphene particle, heat conduction core, thermal conductivity factor between heat conduction annular groove and external diffusion layer are unbalanced, and, Graphene Particle Thermal Conductivity in heat conduction annular groove is higher than heat conduction core and external diffusion layer, so, cause the heat accumulation of the Graphene particle in heat conduction annular groove and carry out horizontal proliferation, namely spread between the Graphene particle in heat conduction annular groove, temperature again due to the Graphene particle of the one end away from substrate is lower, therefore, the temperature of the Graphene particle in heat conduction annular groove is successively decreased to the direction away from substrate by near substrate.And then heat conduction annular groove and external diffusion layer all can dispel the heat, and further increase radiating efficiency.

Such as, the outside of external diffusion layer is extended some fin.Such as, some fin are uniformly distributed in the outside of external diffusion layer.Such as, fin is tabular, and it is evenly distributed on the outer wall of body.Such as, fin is reversed acanthoid, and it is evenly distributed on the outer wall of body.Such as, fin is aerofoil profile, and it is evenly distributed on the outside of external diffusion layer.Like this, by the fin in numerous difference outside of diffusion layer outside, more easily by fin emitting air when making the outside of heat diffusion layer outside, thus effectively improve radiating efficiency.

Preferably, substrate is provided with some heat radiation projections.Such as, the bearing of trend of heat radiation projection is identical with the bearing of trend of thermal column.Such as, each heat radiation projection is prism structure.Such as, each heat radiation projection is sphere structure.For each heat radiation projection for prism structure, such as, each heat radiation projection is positive six prism structures, each sidewall of each positive six prism is evenly provided with the first heat radiation scale, each incline of each positive six prism is provided with one and ranked second heat radiation scale, further, the second heat radiation scale between adjacent heat radiation projection mutually intersects and does not abut against each other.Such as, each heat radiation projection is regular triangular prism structure, each sidewall of each regular triangular prism is provided with into the 3rd heat radiation scale of matrix distribution, each incline of each regular triangular prism is provided with one and ranked fourth heat radiation scale, further, the 4th heat radiation scale between adjacent heat radiation projection mutually intersects and does not abut against each other.Like this, by stacked more multiple-branching construction design in a substrate, the heat radiation projection with multiple heat radiation scale, make the heat on substrate conduct to outside from each heat radiation projection rapidly, improve the radiating efficiency of substrate.

In order to improve the radiating efficiency of heat radiation projection, such as, heat radiation projection is hollow structure, and heat radiation projection also offers some thermal vias.That is, heat radiation projection is the prism structure of hollow, and, each sidewall also offers some thermal vias.Such as, heat radiation projection is positive six prism structures of hollow, each sidewall of each positive six prism is provided with into the 5th heat radiation scale of matrix distribution, and the sidewall between adjacent 5th heat radiation scale offers first thermal vias.Such as, heat radiation projection is the regular triangular prism structure of hollow, each sidewall of each regular triangular prism is provided with into the 6th heat radiation scale of matrix distribution, and the sidewall between adjacent 6th heat radiation scale offers second thermal vias.Like this, because the temperature of air is greater than the temperature of heat radiation projection outer air in heat radiation projection, make air heats uneven, the air that in heat radiation projection, temperature is higher expands and rises, the air that the outer temperature of heat radiation projection is lower is padded in heat radiation projection by thermal vias, thus forms local air convection current.And, the air that temperature is lower outside heat radiation projection is padded in the process in heat radiation projection by thermal vias, drive the flowing of each heat radiation scale surrounding air on sidewall, increase the radiating efficiency of each heat radiation scale, thus improve the radiating efficiency of heat radiation projection on the whole.

In order to improve the radiating efficiency of heat radiation projection, such as, heat radiation projection is provided with thermal dispersant coatings.Such as, heat radiation projection lateral wall is provided with thermal dispersant coatings.Such as, thermal dispersant coatings is arranged on other plane domain except described thermal vias and each heat radiation scale of lateral wall, and that is, thermal dispersant coatings covers the plane domain of lateral wall, to improve its radiating efficiency.Such as, thermal dispersant coatings is provided with heat radiation coating, and this heat radiation coating is special material, because it is present product and technology, so place repeats no more.By being provided with thermal dispersant coatings on heat radiation projection lateral wall, improving the radiating efficiency on this sidewall areas surface, thus improving the radiating efficiency of heat radiation projection.

In order to improve radiating effect, such as, described long heat sink arranges radiating area, it superposes successively and arranges the first rete, second rete, third membrane layer, 4th rete, 5th rete, i.e. the first rete, second rete, third membrane layer, 4th rete, 5th rete superposes successively and is attached on described long heat sink as radiating area, that is, first rete is attached on described long heat sink, second rete is attached on the first rete, third membrane layer is attached on the second rete, 4th rete is attached in third membrane layer, 5th rete is attached on the 4th rete, 6th rete is attached on the 5th rete.And for example, described radiating area is arranged at a side or the two sides of described long heat sink; And for example, described radiating area is arranged on all surfaces of described long heat sink.

Such as, first rete comprises each component of following mass parts: 40 parts ~ 70 parts, carborundum, alundum (Al2O3) 13 parts ~ 55 parts, silica 2 parts ~ 15 parts, pyrite 4 parts ~ 13 parts, 2 parts ~ 28 parts, spinelle, binding agent 3 parts ~ 25 parts, kaolin 2 parts ~ 20 parts, 0.5 part ~ 2 parts, magnesia, 0.5 part ~ 2 parts, Dongyang soil, light weight calcium 0.5 part ~ 2 parts and rare earth oxide 0.2 part ~ 0.5% part.

Above-mentioned first rete utilizes carborundum as primary raw material, and mix the raw material that remaining may be used for preparing pottery, thus thermal conductivity factor is high, good insulation preformance, thermal coefficient of expansion are low and the good advantage of heat resistance to make above-mentioned first rete possess simultaneously, in addition, above-mentioned first rete also has the advantage being easy to the manufacturing and low cost of manufacture.

Preferably, first rete comprises each component of following mass parts: 50 parts ~ 60 parts, carborundum, alundum (Al2O3) 30 parts ~ 50 parts, silica 10 part ~ 15 parts, pyrite 7 parts ~ 11 parts, 4 parts ~ 18 parts, spinelle, binding agent 10 parts ~ 20 parts, kaolin 15 parts ~ 20 parts, 1 part ~ 1.5 parts, magnesia, 1 part ~ 1.5 parts, Dongyang soil, light weight calcium 1 part ~ 1.5 parts and rare earth oxide 0.3 part ~ 0.4% part.Preferably, the first rete comprises each component of following mass parts: 55 parts, carborundum, alundum (Al2O3) 40 parts, silica 13 parts, pyrite 11 parts, 15 parts, spinelle, binding agent 15 parts, kaolin 18 parts, 1.5 parts, magnesia, 1.5 parts, Dongyang soil, light weight calcium 1.5 parts and rare earth oxide 0.3 part.

Preferably, the second rete comprises each component of following mass parts: Graphene 85 parts ~ 90 parts, CNT 5 parts ~ 15 parts and carbon nano-fiber 5 parts ~ 15 parts.Preferably, Graphene 90 parts, CNT 10 parts and carbon nano-fiber 10 parts.

It should be noted that, because the heat of long heat sink is through front two-layer, namely after described first rete and described second rete, understand the heat loss of some in the air in the external world.In addition, because the cost of described second rete is higher, its main cause is, the primary raw material of described second rete is the Graphene that preparation cost is higher, therefore, based on described third membrane layer heat transfer and heat radiation burden relatively little when, the heat dissipation metal material that described third membrane layer can use current market the most frequently used, to reach the effect reducing costs and obtain better heat transfer property.

Preferably, described third membrane layer comprises each component of following mass parts: copper 94 parts ~ 96 parts, 3 parts ~ 4 parts, aluminium, 0.2 part ~ 0.3 part, nickel, vanadium 0.5 part ~ 1 part, 0.1 part ~ 0.5 part, platinum, silver 0.2 part ~ 0.3,0.2 part ~ 0.3 part, tungsten, 0.2 part ~ 0.3 part, manganese, titanium 0.2 part ~ 0.3 part and chromium 0.2 part ~ 0.3 part.Preferably, described third membrane layer comprises each component of following mass parts: copper 95 parts, 3.5 parts, aluminium, 0.3 part, nickel, vanadium 0.8 part, 0.1 part ~ 0.5 part, platinum, silver 0.2 part ~ 0.3 part, 0.2 part ~ 0.3 part, tungsten, 0.2 part ~ 0.3 part, manganese, titanium 0.2 part ~ 0.3 part and chromium 0.2 part ~ 0.3 part.

Such as, the 4th rete comprises each component of following mass parts: copper 47 parts ~ 50 parts, 49 parts ~ 52 parts, aluminium, 0.2 part ~ 0.7 part, magnesium, iron 0.2 part ~ 0.7 part, 0.1 part ~ 0.5 part, platinum, silver 0.2 part ~ 0.3, tungsten 0.2 part ~ 0.3,0.2 part ~ 0.5 part, manganese, titanium 0.1 part ~ 0.3 part, chromium 0.05 part ~ 0.1 part and vanadium 0.1 part ~ 0.3 part.

Preferably, described 4th rete comprises each component of following mass parts: copper 48 parts ~ 49 parts, 50 parts ~ 52 parts, aluminium, 0.2 part ~ 0.5 part, magnesium, iron 0.2 part ~ 0.5 part, 0.1 part ~ 0.5 part, platinum, silver 0.2 part ~ 0.3 part, 0.2 part ~ 0.3 part, tungsten, 0.3 part ~ 0.5 part, manganese, titanium 0.2 part ~ 0.3 part, chromium 0.05 part ~ 0.08 part and vanadium 0.2 part ~ 0.3 part.Preferably, described 4th rete comprises each component of following mass parts: copper 48 parts, 51 parts, aluminium, 0.3 part, magnesium, iron 0.3 part, 0.5 part, platinum, silver 0.3 part, 0.3 part, tungsten, 0.4 part, manganese, titanium 0.4 part, chromium 0.08 part and vanadium 0.3 part.

In order to alleviate the weight of described 4th rete further, and obtain good radiating effect, such as, the present invention also provides auxiliary 4th rete, and described auxiliary 4th rete is arranged at described 4th rete away from described third membrane layer one side.

Such as, auxiliary 4th rete comprises each component of following mass parts: 88 parts ~ 93 parts, aluminium, silicon 5.5 parts ~ 10.5 parts, 0.3 part ~ 0.7 part, magnesium, copper 0.05 part ~ 0.3 part, iron 0.2 part ~ 0.8 part, 0.1 part ~ 0.5 part, platinum, silver 0.2 part ~ 0.3 part, 0.2 part ~ 0.5 part, manganese, titanium 0.05 part ~ 0.3 part, chromium 0.05 part ~ 0.1 part and vanadium 0.05 part ~ 0.3 part.It should be noted that, because the heat of long heat sink is through first four layers, namely after described first rete, described second rete, described third membrane layer and described 4th rete, greatly the heat of a part has been lost in extraneous air.Therefore; heat radiation burden based on described 5th rete is relatively little; and self-temperature lower when; when the impact of the larger generation of thermal coefficient of expansion is minimum; the plastic material that described third membrane layer can use current market the most frequently used; reduce costs and weight to reach, and obtain better surface protection performance.

Preferably, described 5th rete comprises each component of following mass parts: 30 parts ~ 35 parts, graphite, 25 parts ~ 30 parts, carbon fiber, polyamide 45 parts ~ 50 parts, water-soluble silicate 15 parts ~ 20 parts, hexagonal boron nitride 4 parts ~ 6 parts, BMI 3 parts ~ 4 parts, silane coupler 1 part ~ 1.5 parts, 0.5 part ~ 1 part, antioxidant.Preferably, described 5th rete comprises each component of following mass parts: 35 parts, graphite, 28 parts, carbon fiber, polyamide 45 parts, water-soluble silicate 18 parts, hexagonal boron nitride 5 parts, BMI 3.5 parts, silane coupler 1.8 parts, 0.7 part, antioxidant.

In order to make described first rete better, described second rete, described third membrane layer, heat conduction and the sinking path of described 4th rete and described 5th rete are optimized more, therefore, considering cost, weight, heat conduction and radiating effect, and when surface protection performance, described second rete of an embodiment of the present invention, described third membrane layer, described 4th rete and described 5th thicknesses of layers ratio are 1 ~ 1.5:8 ~ 12:5 ~ 7:6 ~ 10:2 ~ 2.5, so, described first rete can be made, described second rete, described third membrane layer, heat conduction and the sinking path of described 4th rete and described 5th rete are optimized more.

In order to make each Rotating fields, i.e. described first rete, described second rete, described third membrane layer, described 4th rete and described 5th rete are fixed together better, to improve Stability Analysis of Structures performance, such as, described first rete, described second rete, described third membrane layer, described 4th rete and described 5th rete be provided with inserted tooth and caulking groove between adjacent interfaces between two, when adjacent two layers structure is fitted, inserted tooth is embedded in caulking groove, each Rotating fields of described long heat sink can be made like this, i.e. described first rete, described second rete, described third membrane layer, described 4th rete and described 5th rete are fixed together better, to improve Stability Analysis of Structures performance.And for example, described first rete, described second rete, described third membrane layer, described 4th rete and described 5th rete be provided with buckle and draw-in groove between adjacent interfaces between two, when adjacent two layers structure is fitted, buckle is embedded in draw-in groove, each Rotating fields of described long heat sink can be made like this, namely described first rete, described second rete, described third membrane layer, described 4th rete and described 5th rete are fixed together, better to improve Stability Analysis of Structures performance further.

Like this, the first rete, the second rete, third membrane layer, the 4th rete, the 5th rete are set by superposition successively, good insulating can be obtained, the coefficient of expansion is low, thermal conductivity factor is large, the advantage of good heat dissipation effect and light weight.

Refer to Fig. 2, pedestal has host cavity, is provided with the first blower fan in host cavity.Such as, pedestal offers two exhaust outlets, comprises first row air port 151 and second row air port 152.Such as, described first row air port is towards described first substrate, and/or described second row air port is towards described second substrate.Such as, the air draft direction in first row air port and second row air port is respectively towards first substrate and second substrate.Such as, first substrate and second substrate are provided with negative temperature coefficient thermistor, itself and the first fans in series are in the same circuit.When the temperature on first substrate and second substrate is elevated to preset value, the resistance of negative temperature coefficient thermistor declines, first blower fan work after the conducting of loop, first row air port and second row air port are towards first substrate and second substrate air-supply, thus the air flow rate increased on first substrate and second substrate, improve the radiating efficiency of first substrate and second substrate.When the temperature on first substrate and second substrate is reduced to preset value, the resistance of negative temperature coefficient thermistor rises, and loop turns off, and the first blower fan quits work.So, under the effect of the first blower fan and negative temperature coefficient thermistor, can avoid because of first substrate and second substrate heat accumulation, temperature is too high causes the component damage being arranged on first substrate and second substrate, namely when temperature is too high, mode by manual intervention improves the air flow rate on first substrate and second substrate, and first substrate and second substrate temperature are reduced fast.

As shown in Figure 4, such as, pedestal offers power interface 101, and power interface is connected with the first blower fan, for powering for the first blower fan.Such as, pedestal is provided with rechargeable lithium ion batteries, and the output of rechargeable lithium ion batteries is connected with the first blower fan, for powering for the first blower fan, the input of rechargeable lithium ion batteries and power interface are rechargeable lithium ion batteries charging for external power supply.Such as, rechargeable lithium ion batteries is also provided with control chip, and when power interface and external power source are connected, control chip cuts off the connection with the first blower fan, is connected separately to make the first blower fan with power interface.Like this, the first blower fan both can work after connection external power source, also can work under the power supply of rechargeable lithium ion batteries.

Refer to Fig. 3, in order to expand the usable floor area of heat abstractor, such as, the first substrate dorsad of pedestal and the side of second substrate are provided with the 3rd substrate 160 and tetrabasal 170, namely the 3rd substrate and tetrabasal are arranged at the first substrate dorsad of pedestal and the side of second substrate, 3rd substrate and tetrabasal are provided with some thermal columns, also can be understood as pedestal bilateral symmetry and be provided with two first substrates, two second substrates, two first substrates and two second substrates are provided with some thermal columns, the i.e. first substrate of pedestal both sides, second substrate and some thermal columns are adopted and are arranged connection in the same way.Thus expand the usable floor area of heat abstractor, when heat abstractor is provided with LED, illumination zone also expands thereupon.

Such as, same, pedestal offers the 3rd exhaust outlet and the 4th exhaust outlet, and such as, the air draft direction of the 3rd exhaust outlet and the 4th exhaust outlet is respectively towards the 3rd substrate and tetrabasal.Such as, the 3rd substrate and tetrabasal are provided with negative temperature coefficient thermistor, and itself and fans in series are in the same circuit.In order to avoid waste power supply, pedestal sets up the second blower fan in addition, the negative temperature coefficient thermistor that second blower fan and the 3rd substrate and tetrabasal are arranged is connected in the same circuit, and, second blower fan and the first blower fan are individually arranged in two loops, and the air outlet of the second blower fan is towards the 3rd exhaust outlet and the 4th exhaust outlet.When the temperature on the 3rd substrate and tetrabasal is elevated to preset value, the resistance of negative temperature coefficient thermistor declines, second blower fan work after the conducting of loop, 3rd exhaust outlet and the 4th exhaust outlet are towards the 3rd substrate and tetrabasal air-supply, thus the air flow rate increased on the 3rd substrate and tetrabasal, improve the radiating efficiency of the 3rd substrate and tetrabasal.When the temperature on the 3rd substrate and tetrabasal is reduced to preset value, the resistance of negative temperature coefficient thermistor rises, and loop turns off, and the second blower fan quits work.So, under the effect of the second blower fan and negative temperature coefficient thermistor, can avoid because of the 3rd substrate and tetrabasal heat accumulation, temperature is too high causes the component damage being arranged on the 3rd substrate and tetrabasal, namely when temperature is too high, mode by manual intervention improves the air flow rate on the 3rd substrate and tetrabasal, 3rd substrate and tetrabasal temperature are reduced fast, simultaneously, because the second blower fan and the first blower fan are individually arranged in two loops, when the substrate temperature rise of pedestal both sides is unequal, the asynchronous working of the second blower fan and the first blower fan, namely only have when the temperature of the substrate of certain side reaches preset value, the blower fan of its correspondence just works and blows to this substrate, thus reach the object of saving electric energy.

Like this, under the effect of first row air port to the 4th exhaust outlet, when the substrate temperature at thermal column place reaches preset value, first row air port is to corresponding the blowing to thermal column region of the 4th exhaust outlet, make heat conduction core, external diffusion layer, and fin ambient air flow velocity is strengthened, to reach the effect that heat conduction core and external diffusion layer are synchronously lowered the temperature, thus, in inside essentially by the constituent changing heat conduction core and external diffusion layer, by improving the air velocity of heat conduction core and external diffusion layer in external structure, thus effectively improve radiating efficiency in the mode of the combination of inner and outside, enhance radiating effect.

Refer to Fig. 4, for the ease of by equipment mounted externally for pedestal or be arranged on wall, such as, pedestal is provided with external connection portion 102.Such as, external connection portion and pedestal one-body molded.Such as, external connection portion is provided with the position that is spirally connected, and by being spirally connected, pedestal and external equipment are spirally connected fixing by position.Such as, external connection portion is provided with welding position, is welded on pedestal at external equipment by welding position.Such as, external connection portion is provided with grafting position, is plugged on external equipment by pedestal by grafting position.Such as, external connection portion comprises the first external connection portion and the second external connection portion.Such as, such as, the first external connection portion and the second external connection portion are symmetricly set on the both sides of power interface, damage from exterior object with protection power source interface.

Refer to Fig. 5, base interior is provided with controller 180, and controller is used for being connected with external power source.Such as, described pedestal is provided with rechargeable lithium ion batteries, and described controller is connected with described rechargeable lithium ion batteries.Such as, first substrate and second substrate are provided with installing zone, and it is fixedly installed wiring board 190, and that is, installing zone is used for arranging wiring board.Controller is connected with wiring board, for controlling described wiring board.Such as, controller is connected with outside switch, for according to the state conducting of switch or the connection of line disconnection plate and external power source.Such as, wiring board is provided with some LED chip.Such as, some LED chip become matrix distribution in the circuit board.Such as, wiring board comprises first line plate and the second wiring board.Such as, first substrate 110 is provided with the first installing zone 114.Such as, first line plate is arranged on the first installing zone.Such as, second substrate is provided with the second installing zone.Such as, the second wiring board is arranged on the second installing zone.Such as, the first installing zone is arranged on the first short heat sink.Such as, the second installing zone is arranged on the second short heat sink.Such as, the first installing zone is towards the first long heat sink.Such as, the second installing zone is towards the second long heat sink.

Preferably, first line plate and the second wiring board are separately positioned on the described first rete position near first substrate and second substrate, so that the heat on first line plate and the second wiring board conducts to described first rete and rapidly and then by heat conduction to outside.

In order to realize state or the parameter of intelligent control LED chip, such as, described controller also comprises induction installation.Such as, described base interior is provided with fixed bit, and described induction installation is installed on described fixed bit.Such as, described induction installation is also connected with each wiring board by wire.That is, induction installation is integrated with the power line of each wiring board, is connected in parallel between each wiring board.Described induction installation comprises and connecting successively: power module, receiver module, time delay module, processing unit and scheduling module.Such as, power module is directly connected with external power source, for the 220V voltage transitions of outside being become the driving voltage of LED chip.Such as, receiver module is by being connected with the output of power module, and described receiver module is for receiving the break-make frequency of power module and external power source and generated frequency signal.Such as, frequency signal adopts p/s (secondary per second) as unit.Such as, described time delay module is for receiving described frequency signal generated frequency signal value and contrasting.Such as, described time delay module presets some frequency reduced values, and some described frequency reduced value contrasts judge the frequency signal value of actual reception and generate relative processing signals.Such as, frequency reduced value adopts p/s (secondary per second) as unit.Such as, some frequency reduced values comprise: 1p/s, 2p/s, 3p/s and 4p/s.Such as, when the frequency signal value that time delay module receives is 1p/s, the frequency reduced value that this frequency signal value and value are 1p/s is mated and is generated the processing signals of normally opening.Such as, when the frequency signal value that time delay module receives is 2p/s, the frequency reduced value that this frequency signal value and value are 2p/s is mated and generates the processing signals of closing all LED chip.Such as, when the frequency signal value that time delay module 413 receives is 3p/s, the frequency reduced value that this frequency signal value and value are 3p/s is mated and generates the processing signals of opening LED chip.Such as, when the frequency signal value that time delay module receives is 4p/s, the frequency reduced value that this frequency signal value and value are 4p/s is mated and generates the processing signals changing LED chip parameter.Such as, each processing signals for receiving described processing signals, and is dispensed to scheduling module by described processing unit.Such as, described scheduling module for receiving the processing signals from processing unit, and changes the state of LED chip or the parameter of adjustment LED chip according to this processing signals.Such as, when described processing unit receives normal processing signals of opening, this processing signals of normally opening is dispensed to scheduling module by described processing unit, and described scheduling module is normal after receiving this processing signals of normally opening opens each LED chip.Such as, when described processing unit receives the processing signals changing LED chip parameter, the processing signals of this change LED chip parameter is dispensed to scheduling module by described processing unit, and described scheduling module changes the parameter of each LED chip after receiving the processing signals of this change LED chip parameter.It should be noted that, the operation principle of power module, receiver module, time delay module, processing unit and scheduling module and hardware formation are prior art, those skilled in the art can write out the control program of each unit module according to content disclosed by the invention, and this control program can change flexibly according to needs of production, therefore, the present invention repeats no more the operation principle of each unit module, hardware is formed and control program.So, the state of intelligent control LED chip or the beneficial effect of parameter can be realized by above-mentioned induction installation.

In order to improve illumination range, such as, the first long heat sink and the second long heat sink are respectively arranged with the 3rd installing zone and the 4th installing zone, and the 3rd installing zone and the 4th installing zone are respectively towards the first short heat sink and the second short heat sink.Such as, the 3rd installing zone and the 4th installing zone are respectively arranged with LED lamp panel.Such as, LED lamp panel is provided with arc diffusion shell, and arc diffusion shell stretches out bending by described kink, and arcwall face is respectively towards the first short heat sink and the second short heat sink.So, under the effect of LED lamp panel, effectively can improve illumination range.

See also Fig. 6 to Fig. 9, such as, pedestal is provided with several cradle portion 104.Such as, pedestal is provided with some cradle portion, and baffle plate 200 is connected with some cradle portion.Such as, pedestal is provided with four cradle portion.Such as, cradle portion one end is arranged at pedestal, and the other end is extended along the direction perpendicular to pedestal.Such as, cradle portion is cylinder.Such as, chord position is propped up for installing baffle plate.Such as, baffle plate correspondence is provided with several chord positions.Such as, baffle plate correspondence is provided with four chord positions.Such as, prop up chord position to be connected with cradle portion.Such as, one chord position correspondence connects a cradle portion.Such as, after baffle plate is arranged on cradle portion, by coordinating of chord position and cradle portion, baffle plate is fixed on cradle portion.Such as, chord position is propped up and cradle portion is spirally connected fixing.Such as, described chord position and described cradle portion are welded and fixed.

Object in order to avoid the external world falls on substrate, such as, and the area covering pedestal of baffle plate and each substrate.Such as, baffle plate has certain radian, can skid off plate washer to make the object dropped on plate washer.Such as, baffle plate adopts metal material to make.So, when pedestal is arranged on outdoor, baffle plate effectively can play and prevent foreign objects substrate and thermal column, meanwhile, can prevent contacting rain water pedestal to a certain extent.

Be that rechargeable lithium ion batteries, controller and wiring board are powered to make full use of solar cell, such as, baffle plate is provided with solar panel.Such as, solar panel is arranged on the side of baffle plate pedestal dorsad.So, when pedestal is disposed in the outdoor, solar energy can be utilized fully, charge for rechargeable lithium ion batteries and be that controller and wiring board are powered, realize the normal operating illumination of LED chip.

Each technical characteristic of the above embodiment can combine arbitrarily, for making description succinct, the all possible combination of each technical characteristic in above-described embodiment is not all described, but, as long as the combination of these technical characteristics does not exist contradiction, be all considered to be the scope that this description is recorded.

The above embodiment only have expressed several embodiment of the present invention, and it describes comparatively concrete and detailed, but can not therefore be construed as limiting the scope of the patent.It should be pointed out that for the person of ordinary skill of the art, without departing from the inventive concept of the premise, can also make some distortion and improvement, these all belong to protection scope of the present invention.Therefore, the protection domain of patent of the present invention should be as the criterion with claims.

Claims (10)

1. a heat abstractor, is characterized in that,

Comprise: pedestal, first substrate, second substrate and some thermal columns;

Described first substrate is connected with described second substrate,

Further,

Described first substrate and described second substrate are arranged at the same side of described pedestal;

Some described thermal columns are arranged on described first substrate and described second substrate respectively;

Described first substrate becomes V-type with the cross section of described second substrate.

2. heat abstractor according to claim 1, is characterized in that, described substrate has kink, long heat sink and short heat sink.

3. heat abstractor according to claim 2, is characterized in that, described long heat sink is connected with described kink respectively with described short heat sink.

4. heat abstractor according to claim 3, is characterized in that, the width of described long heat sink is greater than the width of described short heat sink.

5. heat abstractor according to claim 4, is characterized in that, the length of described long heat sink is equal with the length of described short heat sink.

6. heat abstractor according to claim 5, is characterized in that, described pedestal has installed surface, and described installed surface offers the first mounting groove and the second mounting groove.

7. heat abstractor according to claim 6, is characterized in that, described first mounting groove becomes V-type with the cross section of described second mounting groove.

8. heat abstractor according to claim 7, is characterized in that, also comprises heating column, and described heating column is arranged on described pedestal.

9. heat abstractor according to claim 8, is characterized in that, described kink is connected with described heating column.

10. heat abstractor according to claim 9, is characterized in that, the bearing of trend of described heating column is identical with the bearing of trend of described substrate.