CN104930301B - 具有曲折实心壁导热路径的热间隔件 - Google Patents
具有曲折实心壁导热路径的热间隔件 Download PDFInfo
- Publication number
- CN104930301B CN104930301B CN201510120239.7A CN201510120239A CN104930301B CN 104930301 B CN104930301 B CN 104930301B CN 201510120239 A CN201510120239 A CN 201510120239A CN 104930301 B CN104930301 B CN 104930301B
- Authority
- CN
- China
- Prior art keywords
- hot spacer
- thermally conductive
- solid wall
- hot
- conductive pathways
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 125000006850 spacer group Chemical group 0.000 title claims abstract description 105
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- 229910001069 Ti alloy Inorganic materials 0.000 description 1
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Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16L—PIPES; JOINTS OR FITTINGS FOR PIPES; SUPPORTS FOR PIPES, CABLES OR PROTECTIVE TUBING; MEANS FOR THERMAL INSULATION IN GENERAL
- F16L59/00—Thermal insulation in general
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16L—PIPES; JOINTS OR FITTINGS FOR PIPES; SUPPORTS FOR PIPES, CABLES OR PROTECTIVE TUBING; MEANS FOR THERMAL INSULATION IN GENERAL
- F16L59/00—Thermal insulation in general
- F16L59/02—Shape or form of insulating materials, with or without coverings integral with the insulating materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
- F28F2013/005—Thermal joints
- F28F2013/006—Heat conductive materials
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F2270/00—Thermal insulation; Thermal decoupling
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Thermal Insulation (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Physical Or Chemical Processes And Apparatus (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US14/219041 | 2014-03-19 | ||
| US14/219,041 US9788459B2 (en) | 2014-03-19 | 2014-03-19 | Thermal stand-off with tortuous solid-wall thermal conduction path |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104930301A CN104930301A (zh) | 2015-09-23 |
| CN104930301B true CN104930301B (zh) | 2019-03-12 |
Family
ID=52780817
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510120239.7A Active CN104930301B (zh) | 2014-03-19 | 2015-03-19 | 具有曲折实心壁导热路径的热间隔件 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US9788459B2 (https=) |
| EP (1) | EP2921809B1 (https=) |
| JP (1) | JP6511301B2 (https=) |
| CN (1) | CN104930301B (https=) |
| RU (1) | RU2675972C2 (https=) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6144030A (en) * | 1997-10-28 | 2000-11-07 | Raytheon Company | Advanced small pixel high fill factor uncooled focal plane array |
| CN1349580A (zh) * | 1999-04-29 | 2002-05-15 | 罗克伍尔国际公司 | 包括固定装置的隔热制品及其生产和安装方法 |
| US6493233B1 (en) * | 2001-08-21 | 2002-12-10 | Intel Corporation | PCB-to-chassis mounting schemes |
| CN201063965Y (zh) * | 2007-05-29 | 2008-05-21 | 康舒科技股份有限公司 | 电子元件散热结构 |
| CN101706029A (zh) * | 2009-12-07 | 2010-05-12 | 中国科学院西安光学精密机械研究所 | 一种小空间间隙隔热装置 |
Family Cites Families (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3282011A (en) * | 1962-04-25 | 1966-11-01 | Johns Manville | Thermal insulating structure |
| US3705411A (en) * | 1970-12-02 | 1972-12-05 | Mc Donnell Douglas Corp | Shock and thermal isolation package for thermionic battery |
| FR2217628B1 (https=) * | 1973-02-15 | 1975-03-07 | Commissariat Energie Atomique | |
| US3916941A (en) * | 1974-04-24 | 1975-11-04 | E Systems Inc | Throttle valve assembly |
| JPS6174998A (ja) * | 1984-09-19 | 1986-04-17 | 株式会社 テイエルブイ | スチ−ムトラツプの運転時間積算計 |
| CA1328724C (en) | 1988-04-15 | 1994-04-26 | David K. Benson | Compact vacuum insulation |
| FR2631691B1 (fr) * | 1988-05-20 | 1990-07-13 | Commissariat Energie Atomique | Dispositif de transmission de chaleur sous vide par des grains |
| US5003744A (en) * | 1989-07-31 | 1991-04-02 | Innovative Building Products, Inc. | Glass-block panels with improved thermal conduction characteristics |
| US6131364A (en) * | 1997-07-22 | 2000-10-17 | Alumet Manufacturing, Inc. | Spacer for insulated windows having a lengthened thermal path |
| US6002588A (en) * | 1997-12-04 | 1999-12-14 | Lockheed Martin Corporation | Thermally conductive vibration isolators |
| KR100294317B1 (ko) * | 1999-06-04 | 2001-06-15 | 이정현 | 초소형 냉각 장치 |
| GB9920330D0 (en) * | 1999-08-28 | 1999-11-03 | Norfrost Ltd | Freezers |
| US6631078B2 (en) * | 2002-01-10 | 2003-10-07 | International Business Machines Corporation | Electronic package with thermally conductive standoff |
| US7485860B2 (en) * | 2003-03-28 | 2009-02-03 | Bae Systems Information And Electronic Systems Integration Inc. | Thermoelectric bridge IR detector |
| FR2854277B1 (fr) * | 2003-04-24 | 2005-08-05 | Commissariat Energie Atomique | Detecteur thermique de rayonnement electromagnetique a structure alveolee |
| US7057895B2 (en) * | 2003-06-30 | 2006-06-06 | Intel Corporation | Thermal standoff for close proximity thermal management |
| RU2280294C2 (ru) * | 2004-10-11 | 2006-07-20 | Юрий Васильевич Таланин | Силовой блок |
| DE102005052683B4 (de) * | 2005-10-27 | 2012-05-31 | Visteon Global Technologies Inc. | Mehrkanalflachrohr für Wärmeübertrager |
| EP2429793A4 (en) | 2009-05-13 | 2012-11-28 | Husky Injection Molding | HEATING CHANNEL SYSTEM COMPRISING A NON-STRUCTURAL SUPPORT THERMAL INSULATION COMPRISING A VISIBLE MATERIAL |
| US9230877B2 (en) * | 2012-12-21 | 2016-01-05 | Intel Corporation | Methods of forming serpentine thermal interface material and structures formed thereby |
-
2014
- 2014-03-19 US US14/219,041 patent/US9788459B2/en active Active
-
2015
- 2015-03-13 JP JP2015050136A patent/JP6511301B2/ja active Active
- 2015-03-16 RU RU2015108910A patent/RU2675972C2/ru active
- 2015-03-18 EP EP15159645.9A patent/EP2921809B1/en active Active
- 2015-03-19 CN CN201510120239.7A patent/CN104930301B/zh active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6144030A (en) * | 1997-10-28 | 2000-11-07 | Raytheon Company | Advanced small pixel high fill factor uncooled focal plane array |
| CN1349580A (zh) * | 1999-04-29 | 2002-05-15 | 罗克伍尔国际公司 | 包括固定装置的隔热制品及其生产和安装方法 |
| US6493233B1 (en) * | 2001-08-21 | 2002-12-10 | Intel Corporation | PCB-to-chassis mounting schemes |
| CN201063965Y (zh) * | 2007-05-29 | 2008-05-21 | 康舒科技股份有限公司 | 电子元件散热结构 |
| CN101706029A (zh) * | 2009-12-07 | 2010-05-12 | 中国科学院西安光学精密机械研究所 | 一种小空间间隙隔热装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| RU2675972C2 (ru) | 2018-12-25 |
| JP6511301B2 (ja) | 2019-05-15 |
| EP2921809A1 (en) | 2015-09-23 |
| JP2015178902A (ja) | 2015-10-08 |
| RU2015108910A3 (https=) | 2018-10-24 |
| US9788459B2 (en) | 2017-10-10 |
| EP2921809B1 (en) | 2019-02-13 |
| US20150271955A1 (en) | 2015-09-24 |
| RU2015108910A (ru) | 2016-10-10 |
| CN104930301A (zh) | 2015-09-23 |
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|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |