CN104918418A - Automatic heat dissipation device - Google Patents
Automatic heat dissipation device Download PDFInfo
- Publication number
- CN104918418A CN104918418A CN201510408565.8A CN201510408565A CN104918418A CN 104918418 A CN104918418 A CN 104918418A CN 201510408565 A CN201510408565 A CN 201510408565A CN 104918418 A CN104918418 A CN 104918418A
- Authority
- CN
- China
- Prior art keywords
- automatic heat
- heat radiator
- fan
- pcba
- static board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000017525 heat dissipation Effects 0.000 title abstract 7
- 230000001681 protective effect Effects 0.000 claims abstract description 13
- 229910000831 Steel Inorganic materials 0.000 claims abstract description 8
- 239000010959 steel Substances 0.000 claims abstract description 8
- 230000003068 static effect Effects 0.000 claims description 37
- RVCKCEDKBVEEHL-UHFFFAOYSA-N 2,3,4,5,6-pentachlorobenzyl alcohol Chemical compound OCC1=C(Cl)C(Cl)=C(Cl)C(Cl)=C1Cl RVCKCEDKBVEEHL-UHFFFAOYSA-N 0.000 claims description 32
- 229910001220 stainless steel Inorganic materials 0.000 claims description 5
- 239000010935 stainless steel Substances 0.000 claims description 4
- 239000004575 stone Substances 0.000 claims description 4
- 238000004519 manufacturing process Methods 0.000 abstract description 17
- 238000005516 engineering process Methods 0.000 abstract description 9
- 238000000034 method Methods 0.000 abstract description 5
- 238000005476 soldering Methods 0.000 abstract description 5
- 239000000758 substrate Substances 0.000 abstract description 5
- 230000009471 action Effects 0.000 abstract description 2
- 230000008569 process Effects 0.000 abstract description 2
- 238000003466 welding Methods 0.000 description 8
- 238000001816 cooling Methods 0.000 description 7
- 230000000694 effects Effects 0.000 description 6
- 230000008859 change Effects 0.000 description 4
- 230000008901 benefit Effects 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 230000005855 radiation Effects 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 2
- 230000001276 controlling effect Effects 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000000739 chaotic effect Effects 0.000 description 1
- 239000006071 cream Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000004927 fusion Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000012797 qualification Methods 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 230000007306 turnover Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1121—Cooling, e.g. specific areas of a PCB being cooled during reflow soldering
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention provides an automatic heat dissipation device which is arranged on a connection platform for bearing an SMT (Surface Mount Technology) equipment substrate rail and used for performing heat dissipation on a PCBA (Printed Circuit Board Assembly) which is arranged on the SMT equipment substrate rail. The automatic heat dissipation device comprises an electrostatic plate, at least one fan, a support and a protective frame; the fan is embedded in the electrostatic plate; the electrostatic plate is supported by the support; the protective frame is arranged on the surface on the electrostatic plate and used for protecting the fan; the protective frame is formed by a plurality of steel wire frames which are uniformly arranged on the surface of the electrostatic plate in a straddled mode; the support comprises adjustable lead screws and fixing rods; the electrostatic plate is supported by the adjustable lead screws; the height of every adjustable lead screw can be adjusted; every fixing rod is connected between the two corresponding adjustable lead screws and used for fixing the adjustable lead screws. When the PCBA is out of the SMT equipment substrate rail after entering a furnace for reflow soldering, the automatic heat dissipation device is placed on the connection platform, the fan is started to perform heat dissipation on the PCBA, and accordingly the heat dissipation on the PCBA is accelerated in the conveying process of the substrate rail and the secondary production can be immediately started without waiting for the PCBA under the action of the fan.
Description
Technical field
The present invention relates to circuit board technology field, particularly relate to SMT production line interior circuit board production equipment technical field, be specially a kind of automatic heat radiator.
Background technology
Along with extensively popularizing of various electronic equipment, surface mounting technology (Surface Mounted Technology " SMT ") obtains and applies more and more widely.SMT penetrates into every field as circuit assembly technology of new generation, SMT product has that compact conformation, volume are little, vibration resistance, shock resistance, high frequency characteristics is good, production efficiency advantages of higher.SMT occupies leading position in circuit board dress connection technique, is most popular a kind of technology and technique in current Electronic Assemblies industry.In SMT industry, each production line must face the maintenance problem of equipment.Such as, the printing equipment on SMT production line, patch device, furnace installation is running stores and also thinks required precision quite high, constantly maintaining.
PCBA is the abbreviation of English Printed Circuit Board+Assembly, that is PCB hollow plate part on SMT, then through the whole processing procedure of DIP plug-in unit, is called for short PCBA.Printed circuit board (PCB), also known as printed circuit board, printed substrate, normal use english abbreviation PCB (Printed circuit board), being important electronic unit, is the supporter of electronic component, is the supplier of electronic devices and components connection.Because it adopts terahertz wave quasi-optics to make, therefore be called as " printing " circuit board.In prior art, PCBA is when SMT processing, first carry out printing-paster-Reflow Soldering supervisor, but put the PCB after part after entering stove, the temperatures as high 265 degree of burner hearth carries out tin cream fusion, welding, temperature due to PCBA body after having welded is higher, secondary cannot be continued produce at once, therefore can produce by secondary after needing to wait the temperature cooling of PCBA itself, have a strong impact on the efficiency of producing.Current mode of operation, product P CBA places more chaotic, and after PCB welding, cooling is slow, and cannot continue secondary and produce, turn around time is longer, affects product 5S.
Summary of the invention
The shortcoming of prior art in view of the above, the object of the present invention is to provide a kind of automatic heat radiator, for solving problem low for the slow production efficiency brought of cooling after pcb board welding on SMT production line in prior art.
For achieving the above object and other relevant objects, the invention provides a kind of automatic heat radiator, being installed in refuting of carrying SMT equipment support plate track connects on platform, for dispelling the heat to the PCBA board on SMT equipment support plate track, described automatic heat radiator comprises: static board, be embedded at least one fan in described static board, support the support of described static board and be installed in the protective frame of described static board surface for protecting described fan.
Preferably, described protective frame is made up of the some steel wire racks being evenly set up in described static board surface.
Preferably, described support comprises: support described static board and Height Adjustable adjustable road screw mandrel and the fixed lever that is connected to for fixing described adjustable road screw mandrel between the screw mandrel of described adjustable road.
Preferably, the height adjustment range of described adjustable road screw mandrel is 10cm ~ 50cm.
Preferably, firm banking is equiped with bottom the screw mandrel of described adjustable road.
Preferably, described firm banking is that ESD synthesizes stone firm banking.
Preferably, described support is stainless steel stent.
Preferably, described static board is ESD static board.
Preferably, described static board is also equiped with the control switch controlling described fan and open and close.
Preferably, the quantity of described fan is 1 ~ 10.
As mentioned above, a kind of automatic heat radiator of the present invention, has following beneficial effect:
1, when PCBA board to enter in stove after Reflow Soldering by SMT equipment support plate track out, automatic heat radiator in the present invention is placed on to refute and connects platform, and start fan PCBA board is dispelled the heat, due to the effect of fan, PCBA board accelerates heat radiation in the way of support plate track transmission, need not wait for that PCBA can enter secondary at once and produce, so automatic heat radiator of the present invention efficiently solves problem low for the slow production efficiency brought of cooling after PCB welding on SMT production line in prior art.
2, the automatic heat radiator in the present invention is enhanced productivity, and ensures product quality.
3, the automatic heat radiator structure in the present invention is simple, with low cost, has stronger practicality and versatility.
Accompanying drawing explanation
Fig. 1 is shown as the overall structure schematic diagram of automatic heat radiator of the present invention.
Element numbers explanation
1 automatic heat radiator
11 static boards
12 fans
13 supports
131 adjustable road screw mandrels
132 fixed levers
133 firm bankings
14 protective frame
15 control switchs
2 SMT equipment support plate tracks
3 PCBA board
Embodiment
By particular specific embodiment, embodiments of the present invention are described below, person skilled in the art scholar the content disclosed by this specification can understand other advantages of the present invention and effect easily.
Refer to Fig. 1.Notice, structure, ratio, size etc. that this specification institute accompanying drawings illustrates, content all only in order to coordinate specification to disclose, understand for person skilled in the art scholar and read, and be not used to limit the enforceable qualifications of the present invention, therefore the not technical essential meaning of tool, the adjustment of the modification of any structure, the change of proportionate relationship or size, do not affecting under effect that the present invention can produce and the object that can reach, still all should drop on disclosed technology contents and obtain in the scope that can contain.Simultaneously, quote in this specification as " on ", D score, "left", "right", " centre " and " one " etc. term, also only for ease of understanding of describing, and be not used to limit the enforceable scope of the present invention, the change of its relativeness or adjustment, under changing technology contents without essence, when being also considered as the enforceable category of the present invention.
The object of the present embodiment is to provide a kind of automatic heat radiator, for solving problem low for the slow production efficiency brought of cooling after pcb board welding on SMT production line in prior art.To principle and the execution mode of a kind of automatic heat radiator of the present invention be elaborated below, and make those skilled in the art not need creative work can understand a kind of automatic heat radiator of the present invention.
Particularly, as shown in Figure 1, the present embodiment provides a kind of automatic heat radiator 1, described automatic heat radiator 1 is installed in refuting of carrying SMT equipment support plate track 2 and connects on platform, for dispelling the heat to the PCBA board 3 on SMT equipment support plate track 2, automatic heat radiator 1 advantage that the present embodiment provides is be adapted to SMT processing better, convenient mobile, avoid that PCB is overall overheatedly cannot be produced, enhance productivity, and the automatic heat radiator 1 that the present embodiment provides will change operating type, improve and produce line 5S, for product back-tracing provides clear and definite scheme.Reform relative to traditional work pattern, the automatic heat radiator 1 provided through putting into practice the present embodiment not only makes product programming well be promoted, and product line 5S can better be safeguarded, improve the fail safe of product initial workpiece, thus make the present invention program more have operational feasibility.
Particularly, as shown in Figure 1, in the present embodiment, automatic heat radiator 1 comprises: static board 11, be embedded at least one fan 12 in described static board 11, support the support 13 of described static board 11 and be installed in the protective frame 14 of described static board 11 surface for protecting described fan 12.
Described static board 11 is equivalent to an operating platform, and particularly, in the present embodiment, described static board 11 is ESD static board.ESD (Electro-Static discharge) is meant to " Electro-static Driven Comb ".ESD formed since being mid-term in 20th century to study the generation of electrostatic, the subject of harm and electrostatic defending etc.Therefore, be accustomed to the equipment being used for electrostatic defending to be referred to as ESD in the world, Chinese is electrostatic impedor.For preventing electrostatic, equipment that PCBA board 3 is relevant all adopts ESD material.
In the present embodiment, the shape of described static board 11 is rectangle, but is not limited to long hair shape, and oval, the static board 11 of the shapes such as polygon also can realize the function of static board 11 in the present embodiment.
Described protective frame 14 is made up of the some steel wire racks being evenly set up in described static board 11 surface, and described steel wire rack is stainless steel steel wire rack.Described protective frame 14 plays protective action, avoids fan 12 at operating state, because operation or other problems hurt fan 12 or other the accident of running.Particularly, described some steel wire racks are evenly set up on described static board 11 at regular intervals, and the shape of described steel wire rack can be arch or top is bending shape.
Described support 13 plays the effect of fixed support to described static board 11.Particularly, in the present embodiment, described support 13 is stainless steel stent, and described support 13 comprises: support described static board 11 and Height Adjustable adjustable road screw mandrel 131 and the fixed lever 132 that is connected to for fixing described adjustable road screw mandrel 131 between described adjustable road screw mandrel 131.Be connected and fixed by screw, nut etc. between described adjustable road screw mandrel 131 and described fixed lever 132.
Particularly, the height adjustment range of described adjustable road screw mandrel 131 is 10cm ~ 50cm, and in the present embodiment, the maximum that the height adjustment range of described adjustable road screw mandrel 131 is is 35cm.
Be equiped with firm banking 133 bottom described adjustable road screw mandrel 131, described firm banking 133 synthesizes stone firm banking for ESD, can prevent electrostatic, avoid triboelectrification.
Dried to PCBA board 3 by fan 12, PCBA board 3 is dispelled the heat and is exceedingly fast, better protection PCBA striker, the problems such as heat radiation, thus indirectly put forward the production efficiency having done product, reduce product quality risk.In the present embodiment, described fan 12 is ion fan, and voltage is 48V.The quantity of described fan 12 is 1 ~ 10, and in the present embodiment, described fan 12 is 3.
Described fan 12 is fixed on described static board 11 by screw, nut etc., described static board 11 is also equiped with the control switch 15 controlling described fan 12 and open and close.
According to product line, operating personnel better safeguards the special demand of PCBA product and 5S; product turnover carrying problem better protects the automatic heat radiator 1 dispelled the heat for PCBA board 3 into background; make to produce line to have enough to meet the need PCBA, carrying and secondary Productive statistics can have better management and control.
For making those skilled in the art understand automatic heat radiator 1 in the present embodiment further, install and use process by what automatic heat radiator 1 in the present embodiment was described below.
Be embedded on static board 11 by the structure such as screw or nut by fan 12, static board 11 and fan 12 can be referred to as tool working region, play support fixation by stainless fixed lever 132 and the combination of stainless adjustable road screw mandrel 131.Stainless steel wire rack fixed jig working region, plays protective action, avoids fan 12 at operating state, because operation or other problems hurt fan 12 or other the accident of running.Adjustable road screw mandrel 131 and ESD synthesize stone base and are combined and play height regulating action, and simultaneously ESD synthesizes base and will select electrostatic, avoids triboelectrification.The present invention is after being fixed by each component combination of automatic heat radiator 1 with screw, nut, being placed on to refute connects on platform, PCBA board 3 enters to refute at SMT equipment support plate track 2 and connects platform and carry out the cooling down online to PCBA board 3 by the automatic heat radiator 1 in the present embodiment, and the speed that PCBA board 3 temperature declines is exceedingly fast.
Particularly, PCBA board 3 enters stove Reflow Soldering at equipment support plate track and melts, welding, enters to refute to connect platform after having waited welding action in support plate track, and start fan 12 pairs of PCBA board 3 and dispel the heat, after PCBA temperature reduces, operating personnel can carry out having enough to meet the need and start the production of second.PCBA service cycle can be shortened by the automatic heat radiator 1 in the present embodiment, can reduce rapidly one side produce PCBA temperature, can make second look unfamiliar produce put into production in time.
In sum, when PCBA board to enter in stove after Reflow Soldering by SMT equipment support plate track 2 out, automatic heat radiator in the present invention is placed on to refute and connects platform, and start fan PCBA board is dispelled the heat, due to the effect of fan, PCBA board accelerates heat radiation in the way of support plate track transmission, need not wait for that PCBA can enter secondary at once and produce, so automatic heat radiator of the present invention efficiently solves problem low for the slow production efficiency brought of cooling after PCB welding on SMT production line in prior art; Automatic heat radiator in the present invention is enhanced productivity, and ensures product quality; Automatic heat radiator structure in the present invention is simple, with low cost, has stronger practicality and versatility.So the present invention effectively overcomes various shortcoming of the prior art and tool high industrial utilization.
Above-described embodiment is illustrative principle of the present invention and effect thereof only, but not for limiting the present invention.Any person skilled in the art scholar all without prejudice under spirit of the present invention and category, can modify above-described embodiment or changes.Therefore, such as have in art usually know the knowledgeable do not depart from complete under disclosed spirit and technological thought all equivalence modify or change, must be contained by claim of the present invention.
Claims (10)
1. an automatic heat radiator, being installed in refuting of carrying SMT equipment support plate track connects on platform, for dispelling the heat to the PCBA board on SMT equipment support plate track, it is characterized in that, described automatic heat radiator comprises: static board, be embedded at least one fan in described static board, support the support of described static board and be installed in the protective frame of described static board surface for protecting described fan.
2. automatic heat radiator according to claim 1, is characterized in that: described protective frame is made up of the some steel wire racks being evenly set up in described static board surface.
3. automatic heat radiator according to claim 1, is characterized in that: described support comprises: support described static board and Height Adjustable adjustable road screw mandrel and the fixed lever that is connected to for fixing described adjustable road screw mandrel between the screw mandrel of described adjustable road.
4. automatic heat radiator according to claim 3, is characterized in that: the height adjustment range of described adjustable road screw mandrel is 10cm ~ 50cm.
5. automatic heat radiator according to claim 3, is characterized in that: be equiped with firm banking bottom the screw mandrel of described adjustable road.
6. automatic heat radiator according to claim 5, is characterized in that: described firm banking is that ESD synthesizes stone firm banking.
7. the automatic heat radiator according to claim 1 or 3, is characterized in that: described support is stainless steel stent.
8. automatic heat radiator according to claim 1, is characterized in that: described static board is ESD static board.
9. automatic heat radiator according to claim 1, is characterized in that: described static board is also equiped with the control switch controlling described fan and open and close.
10. the automatic heat radiator according to claim 1 or 9, is characterized in that: the quantity of described fan is 1 ~ 10.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510408565.8A CN104918418B (en) | 2015-07-13 | 2015-07-13 | A kind of automatic heat radiator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510408565.8A CN104918418B (en) | 2015-07-13 | 2015-07-13 | A kind of automatic heat radiator |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104918418A true CN104918418A (en) | 2015-09-16 |
| CN104918418B CN104918418B (en) | 2018-01-02 |
Family
ID=54086987
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510408565.8A Active CN104918418B (en) | 2015-07-13 | 2015-07-13 | A kind of automatic heat radiator |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104918418B (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201438792U (en) * | 2009-07-09 | 2010-04-14 | 佛山市顺德区顺达电脑厂有限公司 | Transmission structure of SMT buffer convey |
| CN201839576U (en) * | 2010-09-27 | 2011-05-18 | 飞旭电子(苏州)有限公司 | Cooling transmission platform used for AOI (Automatic Optical Inspection) |
| CN202035256U (en) * | 2011-03-24 | 2011-11-09 | 华容电子（昆山）有限公司 | Heat radiation tool arranged behind furnace |
| CN202095185U (en) * | 2011-06-01 | 2011-12-28 | 厦门天能电子有限公司 | Improved heat-dissipation structure for surface mounting equipment for circuit board |
| CN202607024U (en) * | 2012-05-28 | 2012-12-19 | 苏州友佳电子有限公司 | Reflow soldering machine |
-
2015
- 2015-07-13 CN CN201510408565.8A patent/CN104918418B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201438792U (en) * | 2009-07-09 | 2010-04-14 | 佛山市顺德区顺达电脑厂有限公司 | Transmission structure of SMT buffer convey |
| CN201839576U (en) * | 2010-09-27 | 2011-05-18 | 飞旭电子(苏州)有限公司 | Cooling transmission platform used for AOI (Automatic Optical Inspection) |
| CN202035256U (en) * | 2011-03-24 | 2011-11-09 | 华容电子（昆山）有限公司 | Heat radiation tool arranged behind furnace |
| CN202095185U (en) * | 2011-06-01 | 2011-12-28 | 厦门天能电子有限公司 | Improved heat-dissipation structure for surface mounting equipment for circuit board |
| CN202607024U (en) * | 2012-05-28 | 2012-12-19 | 苏州友佳电子有限公司 | Reflow soldering machine |
Also Published As
| Publication number | Publication date |
|---|---|
| CN104918418B (en) | 2018-01-02 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR101049199B1 (en) | Glass substrate rounding device and rounding method using glass substrate rounding device | |
| CN104918418A (en) | Automatic heat dissipation device | |
| US11167364B2 (en) | Jet solder bath and jet soldering apparatus | |
| CN206879235U (en) | One kind welding containment mould and welding structure | |
| CN110911076B (en) | Processing equipment for wrapped buckled and welding wire extension-preventing resistor | |
| CN104779186A (en) | Device for column planting technology of CCGA chip | |
| CN113102901A (en) | Material processing method, material processing apparatus, storage medium, and electronic device | |
| CN209021031U (en) | A kind of copper bar perforating device | |
| CN105834539B (en) | A kind of intelligent spot welder | |
| CN103433590A (en) | Crest welder | |
| CN105537204A (en) | Cleaning assembly for production of mobile phone PCB (Printed Circuit Board) | |
| CN106735684B (en) | Automatic machine of repairing of PCBA through-hole direct insert device | |
| CN205988978U (en) | Knuckle equipment | |
| CN205551741U (en) | Nozzle dish and backflow welder | |
| US20180358723A1 (en) | Pin header | |
| CN206116987U (en) | Spacing guider of regulator cubicle exhaust smoke | |
| CN205437405U (en) | High -speed laser soldering equipment | |
| CN205309509U (en) | Single contact pin wave -soldering welding jig | |
| CN205309495U (en) | Device of dismouting cell -phone circuit board components and parts | |
| CN203896609U (en) | Clamp for preventing falling of PCB bottom surface electronic component in wave soldering | |
| CN103406634A (en) | Welding and blowing jig for PCB | |
| CN213126600U (en) | Circuit board with prevent static function | |
| CN210093699U (en) | Reflow soldering furnace-passing jig | |
| CN203596978U (en) | PCB solder coating hanger | |
| CN204524638U (en) | A kind of welded plate device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20201130 Address after: Room 10242, No. 260, Jiangshu Road, Xixing street, Binjiang District, Hangzhou City, Zhejiang Province Patentee after: Hangzhou Jiji Intellectual Property Operation Co.,Ltd. Address before: 201616 Shanghai city Songjiang District Sixian Road No. 3666 Patentee before: Phicomm (Shanghai) Co.,Ltd. |
|
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20201217 Address after: 233000 3rd floor, Dong'an Market, Fengyang West Road, Longzihu District, Bengbu City, Anhui Province Patentee after: Bengbu 309 Technology Consulting Co.,Ltd. Address before: Room 10242, No. 260, Jiangshu Road, Xixing street, Binjiang District, Hangzhou City, Zhejiang Province Patentee before: Hangzhou Jiji Intellectual Property Operation Co.,Ltd. |
|
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20210203 Address after: 313001 room 1019, Xintiandi office building, Yishan street, Wuxing District, Huzhou, Zhejiang, China Patentee after: Huzhou YingLie Intellectual Property Operation Co.,Ltd. Address before: 233000 3rd floor, Dong'an Market, Fengyang West Road, Longzihu District, Bengbu City, Anhui Province Patentee before: Bengbu 309 Technology Consulting Co.,Ltd. |
|
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20240529 Address after: 860, Xinfabu Group, Wobao Village, Wangquan Jiazhi, Haizhou Township, Kangping County, Shenyang City, Liaoning Province, 110500 Patentee after: Tian Shumei Country or region after: China Address before: 313001 room 1019, Xintiandi office building, Yishan street, Wuxing District, Huzhou, Zhejiang, China Patentee before: Huzhou YingLie Intellectual Property Operation Co.,Ltd. Country or region before: China |
|
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20240712 Address after: 721, 7th Floor, Building 4, No. 7 Guangyang New Road, Fangshan District, Beijing, 102400 Patentee after: Beijing Yuanshuo avionics Technology Co.,Ltd. Country or region after: China Address before: 860, Xinfabu Group, Wobao Village, Wangquan Jiazhi, Haizhou Township, Kangping County, Shenyang City, Liaoning Province, 110500 Patentee before: Tian Shumei Country or region before: China |