CN202095185U - Improved heat-dissipation structure for surface mounting equipment for circuit board - Google Patents
Improved heat-dissipation structure for surface mounting equipment for circuit board Download PDFInfo
- Publication number
- CN202095185U CN202095185U CN2011201826557U CN201120182655U CN202095185U CN 202095185 U CN202095185 U CN 202095185U CN 2011201826557 U CN2011201826557 U CN 2011201826557U CN 201120182655 U CN201120182655 U CN 201120182655U CN 202095185 U CN202095185 U CN 202095185U
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- workshop
- circuit board
- surface mounting
- heat
- air port
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Abstract
The utility model discloses an improved heat-dissipation structure for surface mounting equipment for circuit board, which comprises a backflow furnace, wherein a heat-dissipation air port is arranged on the backflow furnace; a sealed housing is arranged at the air port; one end of an exhaust tube stretches into the housing; and the other end of the exhaust tube extends into an air exhaust channel to discharge heat at the air port of the backflow furnace outside a workshop. In the improved heat-dissipation structure, a metal cover is additionally arranged at a ventilation cooling fan of a recovery furnace, and at least one exhaust tube is additionally adopted, hot air and the like are uniformly collected and discharged to the unified exhaust port of the workshop, so as to meet the requirements of constant humidity and temperature in the workshop; and the improved heat-dissipation structure has the advantages of convenience in control, energy conservation and environmental protection.
Description
Technical field
The utility model discloses a kind of circuit board surface mounting device heat radiation and improves structure, belong to circuit board surface by International Patent Classification (IPC) (IPC) division and mount the manufacturing technology field, especially relate to a kind of circuit board surface and mount production line reflow ovens heat radiation new structure.
Background technology
Surface mounting technology is called SMT again, it has the packaging density height, the electronic product volume is little, in light weight, the volume and weight of surface mount elements has only about 1/10 of traditional inserting element, electronic product volume-diminished 40% ~ 60% behind the general employing SMT, reliability height, antivibration ability are strong, the welding point defect rate is low, are popular a kind of technology in the present electronics assembling industry.SMT comprises following technology: printing (or some glue)--〉mounts--〉reflow soldering--〉and detects---next procedure.In general, the SMT workshop belongs to high-accuracy workshop, and the operator will wear antistatic clothing, cap, footwear etc., and to require the workshop be highly dustlessization, constant temperature and humidity.And at SMT production line process reflow ovens heating, drying circuit board, there is radiator fan existing backflow furnace wall, and the heat of its generation directly discharges in the workshop, thereby has influence on constant temperature and humidity control in the workshop.
Summary of the invention
At the deficiencies in the prior art, the utility model provides the heat radiation of a kind of circuit board surface mounting device to improve structure, makes the heat collection of its radiator fan discharging and discharges outside the workshop, thereby effectively control warm, humidity in the workshop in.
For achieving the above object, the utility model is achieved through the following technical solutions:
A kind of circuit board surface mounting device heat radiation improves structure, comprise reflow ovens, has the heat radiation air port on it, place, described air port is provided with airtight case, exhaust column one end extend in the above-mentioned case, the exhaust column other end extend in the air exhaust passage to the workshop efflux put place, reflow ovens air port heat with effective control workshop in temperature, humidity.
Further, there is the exhaust column more than two or two to be connected between described airtight case and the air exhaust passage.
Further, described case is the confined space structure that is processed to form by metal material, its objective is the heat collection that makes reflow ovens ventilation and heat mouth place and enters outside the workshop, thereby can conveniently control constant temperature and humidity in the workshop.
The utility model is to add a metal cap at the ventilation and heat fan place of recovery furnace, and additional at least one exhaust column, a plurality of such exhaust columns, unified hot gas etc. is collected together is discharged to the unified exhaust ports in workshop, to reach wet, temperature constant requirement in the workshop, have the advantages of control convenience, energy-conserving and environment-protective.
Description of drawings
Fig. 1 is the utility model structural representation.
Embodiment
The utility model is described in further detail below in conjunction with accompanying drawing:
Embodiment: the SMT workshop belongs to high-accuracy workshop, the operator will wear antistatic clothing, cap, footwear etc., and requiring the workshop is highly dustlessization, constant temperature and humidity, but existing reflow ovens equipment top also has opening and radiator fan is housed except discharge duct 5 is arranged, and does not add other devices.The utility model provides a kind of reflow ovens heat radiation to improve structure.See also Fig. 1, a kind of circuit board surface mounting device heat radiation improves structure, comprise reflow ovens 1, has heat radiation air port 10 on it, place, described air port is provided with airtight case 2, exhaust column 3 one ends extend in the above-mentioned case 2, the exhaust column other end extend to be used in the air exhaust passage 4 to the workshop efflux put reflow ovens air port place heat with effective control workshop in temperature, humidity.There is the exhaust column 3 more than two or two to be connected between airtight case 2 and the air exhaust passage 4.Described case is the confined space structure that is processed to form by metal material, its objective is the heat collection that makes reflow ovens ventilation and heat mouth place and enters outside the workshop.
The utility model is to add a metal cap at the ventilation and heat fan place of recovery furnace, and additional at least one exhaust column, unified hot gas etc. is collected together is discharged to the unified exhaust ports in workshop, to reach wet, temperature constant requirement in the workshop, has that control is convenient, the advantages of energy-conserving and environment-protective.
The above record only for utilizing the embodiment of this origination techniques content, anyly is familiar with modification, the variation that this skill person uses this creation to do, and all belongs to the claim of this creation opinion, and is not limited to those disclosed embodiments.
Claims (3)
1. a circuit board surface mounting device heat radiation improves structure, it is characterized in that comprising reflow ovens, has the heat radiation air port on it, place, described air port is provided with airtight case, exhaust column one end extend in the above-mentioned case, the exhaust column other end extend in the air exhaust passage to the workshop efflux put place, reflow ovens air port heat with effective control workshop in temperature, humidity.
2. circuit board surface mounting device according to claim 1 heat radiation improves structure, it is characterized in that: have the exhaust column more than two or two to be connected between described airtight case and the air exhaust passage.
3. circuit board surface mounting device heat radiation according to claim 1 improves structure, and it is characterized in that: described case is the confined space structure that is processed to form by metal material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011201826557U CN202095185U (en) | 2011-06-01 | 2011-06-01 | Improved heat-dissipation structure for surface mounting equipment for circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011201826557U CN202095185U (en) | 2011-06-01 | 2011-06-01 | Improved heat-dissipation structure for surface mounting equipment for circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202095185U true CN202095185U (en) | 2011-12-28 |
Family
ID=45370222
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011201826557U Expired - Fee Related CN202095185U (en) | 2011-06-01 | 2011-06-01 | Improved heat-dissipation structure for surface mounting equipment for circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202095185U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104918418A (en) * | 2015-07-13 | 2015-09-16 | 上海斐讯数据通信技术有限公司 | Automatic heat dissipation device |
| CN108534282A (en) * | 2018-03-13 | 2018-09-14 | 同济大学 | A kind of binary channels air exhausting device and exhaust method |
-
2011
- 2011-06-01 CN CN2011201826557U patent/CN202095185U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104918418A (en) * | 2015-07-13 | 2015-09-16 | 上海斐讯数据通信技术有限公司 | Automatic heat dissipation device |
| CN108534282A (en) * | 2018-03-13 | 2018-09-14 | 同济大学 | A kind of binary channels air exhausting device and exhaust method |
| CN108534282B (en) * | 2018-03-13 | 2020-12-11 | 同济大学 | Double-channel air exhaust device and air exhaust method |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20111228 Termination date: 20150601 |
|
| EXPY | Termination of patent right or utility model |