CN203896609U

CN203896609U - Clamp for preventing falling of PCB bottom surface electronic component in wave soldering

Info

Publication number: CN203896609U
Application number: CN201420348823.9U
Authority: CN
Inventors: 聂文平; 许俊; 王勇
Original assignee: HUIZHOU DESAY INTELLIGENT TECHNOLOGY CO LTD
Current assignee: HUIZHOU DESAY INTELLIGENT TECHNOLOGY CO LTD
Priority date: 2014-06-27
Filing date: 2014-06-27
Publication date: 2014-10-22
Anticipated expiration: 2024-06-27

Abstract

The utility model discloses a clamp for preventing the falling of a PCB bottom surface electronic component in wave soldering. The clamp comprises a clamp body which is provided with a plurality of containing grooves (1) used for sleeving the electronic component at the corresponding position of a PCB to play a role of heat insulation and protection when the clamp and the PCB are jointed. The clamp body is a mesh-like structure. The containing grooves (1) are at mesh connection parts. Compared with the prior art, according to the clamp, the electronic component and a soldering point on the PCB can be effectively protected, a problem that the soldering point is melted to fall when the PCB bottom surface electronic component goes through the wave soldering is solved, the structure of the clamp is simple, the yield rate in the product manufacturing process can be effectively raised, and the enterprise benefit is raised.

Description

The fixture that a kind of PCB of preventing bottom surface electronic component drops while crossing wave soldering

Technical field

The utility model relates to a kind of fixture, particularly relates to a kind of fixture that can prevent that PCB bottom surface electronic component from dropping while crossing wave soldering.

Background technology

The driving electronic component of the lamp plate of display screen module is now by SMT tin cream technique, to be welded on the back side of PCB lamp (LED), while needing by wave soldering technique, LED pin to be welded on PCB after rear operation PCB is plugged LED, due to the molten Xi Wendu of the electronic component on PCB low (approximately 230 ℃ of the molten tin temperature of tin cream), and crest tin soldering furnace temperature higher (approximately 255 ℃), the pcb board of good other electronic devices and components of welding is when through wave soldering technique, because crest tin soldering furnace temperature is higher, the bump of the electronic component on pcb board is easy to melt, cause the electronic component on pcb board very easily to come off, fraction defective in production process is very high.

And in order to address the above problem, original technique increases the operation that adopts red glue electronic component to cross crest tin soldering, because of electronic element base pin spacing little, this mode often causes the solder joint on pcb board to connect tin short circuit, fraction defective is high, and produces in process of production new problem, causes the loss of enterprise.

Utility model content

The technical problem of the required solution of the utility model is, how to make reducing element at PCB bottom surface electronic component during by wave soldering and drops.

In view of this, the utility model provides a kind of fixture that element drops can effectively prevent PCB bottom surface electronic component by wave soldering time, and this technical scheme is as follows:

Comprise some holding tanks that play thermal insulation protection effect for be socketed in the electronic component of relevant position on pcb board when fixture engages with pcb board, described fixture is fenestral fabric, and described holding tank is positioned at Mesh connection place.

Preferably, described holding tank is size, the degree of depth and the electronic component that will cover outstanding size, highly suitable groove on pcb board.

Preferably, described fixture is to have glass-fiber-plate or high temperature resistant synthetic slabstone high temperature resistant and a heat-blocking action.

Preferably, described fixture also comprises the analog bracket for fixed placement pcb board, and described analog bracket is arranged on the frame of fixture, and forms bearing cavity with fixture.

Preferably, described analog bracket is fixed on fixture frame by securing member.

Compared with prior art; the utility model can effectively make electronic component and the solder joint thereof on PCB be protected, and while having solved PCB bottom surface electronic component by wave soldering, solder joint fusing causes the problem dropping, simple in structure; can effectively improve the yields in manufacture course of products, improve the performance of enterprises.

Accompanying drawing explanation

Fig. 1 is the fixture diagrammatic top view of fixture embodiment described in the utility model;

Fig. 2 is the overall structure schematic diagram of fixture embodiment described in the utility model.

Embodiment

In order to allow those skilled in the art be easier to understand the content of this utility model, below in conjunction with drawings and Examples, the utility model content is described in further detail.

Fig. 1 is the fixture diagrammatic top view of this utility model embodiment.

As shown in Figure 1, for thering is the fixture of fenestral fabric, on grid, be provided with the holding tank 1 that on some PCB of being socketed in, corresponding electronic element shields, the position of holding tank 1 is corresponding with the positions of electronic parts on pcb board, grid plays location here, settle the effect of holding tank 1, this holding tank 1 is positioned at the connection part of grid, grid place hollow, be convenient to the welding of other positions except the electronic component that needs to protect, electronic component on the size dimension of this holding tank 1 and its pcb board that need be socketed is suitable, and the height of the degree of depth and this electronic component is suitable, should be noted, this fixture thickness is greater than the height of electronic component, this holding tank 1 can well be socketed on electronic component like this, this fixture adopts has glass-fiber-plate or high temperature resistant synthetic slabstone high temperature resistant and a heat-blocking action, make this fixture more durable, and can utilize better effect of heat insulation to protect the particularly effect of its solder joint of electronic component.

This fixture frame 2 is also provided with some through holes 3, and this through hole 3 is for allowing securing member pass, and fixing with analog bracket 4.

It should be noted that, during practical application, position, the size of the size of grid and holding tank 1 all can be adjusted according to need of production, and the utility model does not limit this.

As shown in Figure 2, on this fixture frame 2, there is the analog bracket 4 for fixed placement pcb board, this bracket and fixture form trapezium structure, middle formation can be used for placing and the fixing bearing cavity of pcb board, analog bracket 4 is fixed by the set through hole 3 of fixture frame 2 in Fig. 1 and through securing member and the fixture of through hole 3, the securing member using can be steady pin and screw etc. for the part of fastening effect, or fixture and analog bracket 4 one-body molded, here and be not construed as limiting.

During use, pcb board is placed in the bearing cavity that fixture and analog bracket 4 form fixing, the container cavity of fixture is socketed on the electronic component of opposite position on pcb board, after installing, this fixture is put into the wave soldering machine for wave soldering together with pcb board, because the thermal insulation protection effect that this fixture has, make this electronic component and solder joint thereof avoid the impact of wave soldering machine high temperature, protected the solder joint of electronic component, greatly reduced the situation that electronic component that solder joint fusing causes is dropped because of wave soldering machine high temperature, and greatly improved the yields of product in manufacture process.

The above; it is only embodiment of the present utility model; but the protection range of this utility model is not limited to this; anyly be familiar with those skilled in the art in the technical scope that the utility model discloses; the variation that can expect easily or replacement, within all should being encompassed in protection range of the present utility model.

Claims

1. a fixture that prevents that PCB bottom surface electronic component from dropping while crossing wave soldering; it is characterized in that; comprise chuck body; in chuck body, be provided with some holding tanks (1) that play thermal insulation protection effect for be socketed in the electronic component of relevant position on pcb board when fixture engages with pcb board; described chuck body is fenestral fabric, and described holding tank (1) is positioned at Mesh connection place.

2. according to the fixture that PCB bottom surface electronic component drops while crossing wave soldering that prevents described in claim 1 or 2 any one, it is characterized in that, described holding tank (1) is size, the degree of depth and the electronic component that will cover outstanding size, highly suitable groove on pcb board.

3. the fixture dropping when the PCB of preventing according to claim 1 bottom surface electronic component is crossed wave soldering, is characterized in that, described chuck body is to have glass-fiber-plate or high temperature resistant synthetic slabstone high temperature resistant and a heat-blocking action.

4. the fixture dropping when the PCB of preventing according to claim 1 bottom surface electronic component is crossed wave soldering, it is characterized in that, described fixture also comprises for the analog bracket of fixed placement pcb board (4), described analog bracket (4) is arranged on the frame (2) of chuck body, and forms bearing cavity with chuck body.

5. the fixture dropping when the PCB of preventing according to claim 4 bottom surface electronic component is crossed wave soldering, is characterized in that, described analog bracket (4) is fixed on the frame (2) of chuck body by securing member.