CN104907779A - 用于在层系统中重新制造贯通孔的方法 - Google Patents

用于在层系统中重新制造贯通孔的方法 Download PDF

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CN104907779A
CN104907779A CN201510108706.4A CN201510108706A CN104907779A CN 104907779 A CN104907779 A CN 104907779A CN 201510108706 A CN201510108706 A CN 201510108706A CN 104907779 A CN104907779 A CN 104907779A
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diffusion part
substrate
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scanning
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巴哈德尔·巴斯德雷
戴安娜·费尔克尔
安德烈亚·玛萨
罗尔夫·维尔肯赫纳
亚德里恩·沃尔尼克
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Siemens Energy Global GmbH and Co KG
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Abstract

通过在覆层和随后移除之前将贯通孔事先引入到基底(4)中，缩短用于制造具有扩散部(13)的贯通孔(18)的加工时间进而中间层也更少地负荷。

Description

用于在层系统中重新制造贯通孔的方法
技术领域
本发明涉及在层系统中制造贯通孔。
背景技术
第一和第二级的涡轮叶片在非常高的温度下使用并且为了抗氧化和腐蚀以及热量设有金属的和/或热学的层。
尤其地，涡轮叶片还附加地具有冷却空气打孔，冷却空气从所述冷却空气孔中流出。
层相互间的和与基底的边界面能够为引发裂纹的原因。
所述冷却空气孔在其表面上在最外面的层上具有扩散部，借助所述扩散部，将进行保护的空气层置于涡轮叶片的表面之上。因为扩散部为对柱形的下部部分的拓宽部，所以必须移除非常多的材料。
发明内容
因此，本发明的目的是示出一种方法，借助所述方法，边界面在加工时较少地负荷。
所述目的通过根据权利要求1所述的方法来实现。
在从属权利要求中，列举其他有利的措施，所述措施能够彼此任意地组合，以便实现其他的优点。
通过所述方法，层相互间的和/或与基底的中间层接合部明显更少地负荷并且能够更快地制造贯通孔。
附图说明
附图示出：
图1、2示出现有技术中的用于制造扩散部的方法，
图3、4、5示出根据本发明的方法，
图6示出超合金列表和
图7示出涡轮叶片。
说明书和附图仅代表本发明的实施例。
具体实施方式
在图1中示出根据现有技术的制造方法和层系统1，所述层系统具有基底4连同可选的内部的层7和外部的陶瓷层10。
这在涡轮叶片120、130中(图7)是金属的基底4、尤其是镍基的或钴基的合金、更尤其是根据图6的合金连同可选的金属的增附层(MCrAlX)与在其上可选存在的氧化铝层和最外部的陶瓷层10。
为了制造扩散部13，首先尤其穿过层7、10并且穿过基底4制造柱形的孔11’、11”。
孔11’、11”的横截面也能够具有不同的几何形状，但是在深度之上观察，至少所述横截面在第一制造步骤之后在整个长度之上是恒定的。
贯通孔11’、11”的上部部分11”在层7、10的区域中并且优选在基底4的区域中被拓宽，使得形成扩散部13，如在图1右边中示出的那样。扩散部13也能够在基底4中具有扩散部分15。
图2示出在使用之后和在移除层之后的构件1’。
根据图1制造的涡轮叶片120、130能够在使用之后根据现有技术再次应用，其中首先将层7、10移除，对基底4进行检查并且必要时进行过加工并且随后施加新的层7、10。
基底4因此已经在其表面16上具有贯通孔19的扩散部分15，所述贯通孔由首次制造扩散部13(图1)产生。
随后，施加层7’、10’，所述层也沉积在扩散部的区域中(在此在区域15中)。随后，将过度喷射部移除或者采取适当的措施，以便通过阻塞来保护孔10，将所述层在覆层之后移除并且将扩散部13根据其最终几何形状成形。
图3示出根据本发明的流程。基底4、尤其是涡轮叶片120、130重新制造、尤其是铸造(图3最左边)。
在第二步骤中，将贯通孔18引入到基底4中。
如果应制造扩散部，贯通孔18在最外部的表面16’上还不具有这种扩散部，并且尤其在其深度之上具有恒定的横截面、尤其是柱形的形状。
可选地，在中间步骤中用材料、尤其是用砂、碳化硅球(SiC)或钢球(没有示出)喷射穿孔的基底4。这用于激活后面的覆层并且也用于除去打孔的贯通孔18的毛刺。
在其他的步骤中，在第一扫描中借助于扫描设备30确定并且尤其保存贯通孔18的进而孔图案的位置和定向。
之后，用可选的金属的增附层7”、尤其是MCrAlX(M＝Ni、Co；X＝Y、Ta、Re、Si和/或Fe)和外部的陶瓷层10”进行覆层。
优选地，首先尤其借助于LVPS、HVOF、APS施加金属的覆层7”。
可选地，尤其借助金刚锉将覆层的孔19打开、尤其是手动地打开并且将金属材料移除(没有示出)。
之后，进行陶瓷的覆层10”、尤其借助于APS进行。
在此，随后，孔19也至少部分地或完全地被覆层。
之后，进行第二扫描，其中探测并且检测覆层的基底4的表面上的孔19并且通过与第一扫描进行数据比较或者通过其他的检查方法检测孔18、19的位置和定向。
之后，将陶瓷材料从贯通孔18中借助于激光移除。借此，制造不具有扩散部的贯通孔。
优选地，在相同的设备中首次制造靠外的扩散部13’，所述扩散部尤其在层7”、10”中为对贯通孔18的横截面的拓宽部。这能够在其他的加工步骤中或在具有移除陶瓷材料的工作进程中进行。
在图4中概括示出用于重新制造具有扩散部13的贯通孔18’的根据本发明的方法。
在基底4中制造贯通孔18，所述贯通孔尤其是旋转对称的或者在其深度之上观察具有恒定的横截面。这能够通过EDM或激光处理来进行。
但是基底4在其表面16’的区域中不具有如在根据图2的再加工的(再处理)的构件1’中那样的拓宽部。
随后才施加层7”(金属的、更优选为MCrAlX)和10”(陶瓷)。
层7”、10”的材料进入到孔18中。
随后，至少将陶瓷材料从贯通孔19中移除。
优选地，随后，穿过所述层7”、10”制造扩散部13并且首次在基底4中制造扩散部13的扩散部分15，即首次移除基底4的用于扩散部13的材料。
这优选通过激光加工来进行。
在图5中示出表面16’的俯视图。左边是贯通孔18在表面16’上在用于制造扩散部13的拓宽之前(图5右边)的初始轮廓(根据图3最左边)。
贯通孔18优选借助在毫秒范围中的脉冲持续时间制造，尤其以脉冲持续时间≥1ms制造。
扩散部13或至少移除陶瓷材料和部分15借助在纳秒范围中或在亚纳秒范围中、尤其小于等于800ns、更尤其小于等于600ns的脉冲持续时间制造。
这种构件1、120、130优选具有镍基的或钴基的超合金、尤其是根据图6的超合金并且优选为根据图7的涡轮叶片120、130。
在这种新的工艺链中的技术要求是：以一定精度将已经引入的冷却空气打孔定位以用于随后的激光造型和/或激光再打开冷却空气打孔，使得不会在贯通打孔和薄膜冷却打孔的漏斗部之间出现不可接受的错位。当前，考虑至少两个能够实现重新得到的可能性：
1)手动地在激光造型之前进行设定，尤其是通过借助相机系统接近每个打孔排或打孔图案的全部的或可选的一定数量的打孔。在此，记录所接近的孔的打孔坐标，以及(如果需要的话)通过内插法确定其余的孔的坐标。
2)测量打孔图案并且将打孔坐标传递给激光造型机。这能够优选地借助于条带光投影来进行。对此，在柱形的打孔进行打孔之后并且在覆层之后测量叶片尺寸。通过最佳配合法，从所述两个测量中确定打孔孔坐标和打孔角度并且将其传递给激光造型机。借助于所述数据，随后建立用于激光造型/激光再打开的打孔程序。
根据本发明的步骤一方面在于，将柱形的贯通打孔18在施加陶瓷的隔热层10”之前引入，使得隔热层不通过引入过程受到损坏。仅借助于激光造型在能量明显减少的情况下引入漏斗形的冷却空气打孔19，并且(如果需要)将陶瓷的涂层从贯通打孔19中移除。
另一个根据本发明的步骤在于，通过测量确定实际的打孔图案，尤其是在覆层之前和之后通过几何确定来确定。每个单独的贯通打孔18的实际的位置和角度被传递到激光造型机上，使得不在贯通打孔和薄膜冷却漏斗之间得到不可接受的错位。3D模型和打孔的实际位置之间的可能的生产方面的差异因此被检测并且考虑。
其他的根据本发明的步骤在于，也将在覆层(喷砂)之前的激活处理用于在激光打孔之后的清洁和去除毛刺。

Claims (12)

1.一种用于在由金属的基底(4)和至少一个层(7”，10”)组成的层系统中重新制造贯通孔(18’)的方法，
尤其是重新制造具有靠外的扩散部(13)的贯通孔(18’)，
其中首先制造所述基底(4)，尤其是铸造所述基底，
随后在第一次覆层之前将具有横截面、尤其是具有在所述基底(4)的整个厚度之上恒定的横截面的至少一个贯通孔(18)引入到所述基底(4)中，
可选地执行材料喷射、尤其是喷砂或喷丸处理，
在借助于扫描设备(30)的第一扫描中扫描和保存所述贯通孔(18)的孔图案，
其中随后才将所述基底(4)用内部的金属层(7”)和/或外部的陶瓷层(10”)覆层，
可选地，在施加所述陶瓷层(10”)之前将尤其金属材料从所述基底(4)中的所述贯通孔(19)中移除，
在第二扫描中扫描和保存覆层的所述贯通孔(19)的孔图案，
其中基于所述第一扫描和所述第二扫描，识别所述贯通孔(18)和/或还确定所述贯通孔(18)的定向和位置，
其中所述贯通孔(18)的定向和位置能够可选地通过单独的测量方法来进行，使得随后至少将陶瓷材料从所述贯通孔(18)中移除以用于完成至少一个所述贯通孔(18’)。
可选地，在其他的加工步骤中或在相同的工作进程中，将扩散部(13)引入到所述层(7”，10”)中并且可选地将扩散部分(15)引入到所述基底(4)中以用于完成至少一个具有扩散部(13)的所述贯通孔(18’)。
2.根据权利要求1所述的方法，
其中制造不具有扩散部的贯通孔(18’)，
尤其是柱形的贯通孔(18’)。
3.根据权利要求1所述的方法，
其中制造扩散部(13)。
4.根据权利要求1所述的方法，
其中从所述基底(4)中的所述贯通孔(19)中移除材料在所述第二扫描之前进行。
5.根据权利要求4所述的方法，
其中手动地进行移除材料。
6.根据权利要求1所述的方法，
其中首次为所述扩散部(13)移除所述基底(4)的所述扩散部分(15)中的附加的材料，
其中所述扩散部分(15)为对所述基底(4)的表面(16’)上的所述贯通孔(18’)的拓宽部，
并且尤其地，其中所述扩散部(13)表示对所述贯通孔(18’)的上部部分的不对称的拓宽部。
7.根据权利要求1所述的方法，
其中对金属的基底(4)进行加工。
8.根据权利要求1所述的方法，
其中存在至少一个内部的金属层(7”)。
9.根据权利要求1所述的方法，
其中使用激光去除法，
尤其在将明显不同的、尤其以至少20％不同的脉冲频率用于制造所述贯通孔(18’)和所述扩散部(13)或者从所述贯通孔(18’)中移除陶瓷材料的条件下使用激光去除法。
10.根据权利要求1所述的方法，
其中借助在毫秒范围中的、尤其是大于等于1ms的脉冲持续时间来制造所述贯通孔(18’)。
11.根据权利要求1所述的方法，
其中所述扩散部(13)或从所述贯通孔(19)至少移除陶瓷材料和/或所述扩散部分(15)以在纳秒范围中或在亚纳秒范围中的、尤其小于等于800ns、更尤其小于等于600ns的脉冲持续时间进行。
12.根据权利要求1所述的方法，
其中从所述贯通孔(18’)中移除材料在用内部的所述金属层(7”)覆层之后并且在用所述陶瓷层(10”)的陶瓷材料覆层之前进行。
CN201510108706.4A 2014-03-14 2015-03-12 用于在层系统中重新制造贯通孔的方法 Pending CN104907779A (zh)

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