CN104900406A - Bondable multilayer ceramic capacitor and manufacturing method thereof - Google Patents
Bondable multilayer ceramic capacitor and manufacturing method thereof Download PDFInfo
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Abstract
The invention provides a bondable multilayer ceramic capacitor high in reliability and high in electric capacity, and a manufacturing method thereof. The bondable multilayer ceramic capacitor includes multiple ceramic dielectric layers, multiple first and second inner electrodes that are alternatively formed on the multiple ceramic dielectric layers, and first-type and second-type vertical passing holes that vertically penetrate the multiple ceramic dielectric layers. The first-type vertical passing holes are connected to main electrodes of the first inner electrodes, and the second-type vertical passing holes are connected to main electrodes of the second inner electrodes. The first-type vertical passing holes extend till the bottom of the capacitor and are connected to an outer electrode at the bottom. The second-type vertical passing holes extend till the top of the capacitor and are connected to an outer electrode on the top.
Description
Technical field
The present invention relates to a kind of multilayer ceramic capacitor.More specifically, the present invention relates to a kind of high reliability, the bonding multilayer ceramic capacitor of high capacity density and the preparation method of this bonding multilayer ceramic capacitor.
Background technology
Traditional three-dimensional discrete passive component is prepared by modes such as insertion, welding, surface mount, and along with electronics industry is to miniaturization, microwave assembly technology replaces the techniques such as insertion, welding, surface mount gradually.The key of microwave assembly technology is the bonding of components and parts.Bonding passive component technology can meet the demand reducing number of elements, compressor circuit board size, increase circuit board function, reduction overall product cost.In the electronic device, capacitor is one of three large major passive elements, and bonding multilayer ceramic capacitor occupies an important position at electronic applications.
The patent of multinomial bonding formula capacitor is disclosed both at home and abroad, substantially be all so-called single-layer ceramic capacitor (the Single Layer Capacitor of single layer structure, SLC), this capacitor is made up of single-layer ceramic medium and the metal electrode that is attached to ceramic dielectric upper and lower surface.Although single-layer ceramic capacitor can meet the gold wire bonding requirement of micro-assembling, capacity density is little, and jumbo capacitor (as capacity is greater than 0.01 μ F) still can not be prepared.As US Patent No. 2003016485, Chinese patent CN1396606A, 200410075380.1 etc. are the patent of the preparation disclosing single-layer ceramic capacitor.
In order to overcome single-layer ceramic condenser capacity density problem on the low side, a kind of solution is that multilayer ceramic capacitor is processed into bonding structure.Have developed multiple bonding multilayer ceramic capacitor both at home and abroad.Compared with traditional multilayer ceramic capacitor, its outer electrode is mainly placed in the upper and lower surface of capacitor by bonding multilayer ceramic capacitor, so that an electrode paste is loaded on another electrode of electroplax realize bonding assembling.This structure realizes mainly through following several method.
One is improve on the multilayer ceramic capacitor of traditional two ends, such as capacitor side is fallen, two sides originally containing electrode are made to become upper and lower surface, or continued respectively to extend to upper and lower surface by the outer electrode being positioned at capacitor both sides, No. US7791896B1st, U.S. Patent Application Publication discloses the multilayer ceramic capacitor of these two kinds of structures.The former internal electrode area is less, likely causes its capacitance not high; The latter need laminate, and in manufacture process and fragilely thereafter to split, thus breaks down.
Two is improve internal electrode structure, changes internal electrode structure, it be directly connected with the outer electrode of upper and lower surface by various method.Such as: No. US7230815B1st, U.S. Patent Application Publication discloses the bonding multilayer ceramic capacitor of this structure, in in this capacitor first and second, electrode all contains two extraction electrodes respectively, and is connected to upper and lower outer electrode respectively by these extraction electrodes.The capacitor of this structure may cause bulk deformation in lamination or compression process, thus causes cutting defect, is arranged on also easily fragmentation or the cracking of circuit board inside simultaneously.The Chinese patent application of Samsung Electro-Mechanics Co., Ltd's application discloses the bonding multilayer chip capacitor that No. 1832070, CN shows a kind of high reliability, this capacitor utilizes via hole that internal electrode is connected to outer electrode, it is cracked fewer, but, in lamination process, via hole compares and is difficult to abundant aligning, therefore, easy formation electrode loose contact, not easily makes undersized capacitor.
Summary of the invention
In view of above Problems existing, technical problem to be solved by this invention is to provide the bonding multilayer ceramic capacitor of a kind of high reliability, high-capacitance and the preparation method of this bonding multilayer ceramic capacitor.
According to an aspect of the present invention, a kind of bonding multilayer ceramic capacitor is provided, comprises: multiple ceramic dielectric layers; Alternately be formed in multiple first and second internal electrodes in described multiple ceramic dielectric layers respectively; And pass perpendicularly through the first kind and the Equations of The Second Kind vertical vias of described multiple ceramic dielectric layers, described first kind vertical vias is connected with the main electrode of described first internal electrode, and described Equations of The Second Kind vertical vias is connected with the main electrode of described second internal electrode; Described first kind vertical vias leads to the bottom of described capacitor, is connected with the outer electrode of bottom, and described Equations of The Second Kind vertical vias leads to the top of described capacitor, is connected with the outer electrode at top.
According to bonding multilayer ceramic capacitor of the present invention, outer electrode is positioned at the upper-lower position of multilayer ceramic capacitor, and capacitor is allowed to install in substrate inside, can stand less cracked, and can be made into small size capacitor.
In the present invention, also can be that described first internal electrode comprises main electrode and auxiliary electrode, this main electrode and auxiliary electrode spaced a predetermined distance from; Described second internal electrode comprises main electrode and auxiliary electrode, this main electrode and auxiliary electrode spaced a predetermined distance from.
According to the present invention, main electrode and the auxiliary electrode of described first and second internal electrodes do not contact with each other.
In the present invention, also can be that the described first kind is contacted with face by point with the connection of the first and second internal electrodes with Equations of The Second Kind vertical vias.
At vertical centering control of the present invention, also can be that each in described first and second internal electrodes has two or more first kind and Equations of The Second Kind through hole respectively; Wherein, described first via hole is by the described first kind through hole in described first and second internal electrodes; Described Equations of The Second Kind vertical vias is by the described Equations of The Second Kind through hole in described first and second internal electrodes; The described first kind and Equations of The Second Kind vertical vias contact with the inner periphery of the described first kind and Equations of The Second Kind through hole respectively.
In the present invention, also can be that the described first kind is contacted with face by point with the connection of described first and second internal electrodes with Equations of The Second Kind via hole.
In the present invention, also can be that described first kind vertical vias contacts with the electrode surface of the main electrode of the first internal electrode, contacts with the electrode surface of the auxiliary electrode of the second internal electrode; And Equations of The Second Kind vertical vias contacts with the electrode surface of the main electrode of the second internal electrode, contact with the electrode surface of the auxiliary electrode of the first internal electrode.This structure makes the main electrode of the first internal electrode only be connected with first kind vertical vias, and the main electrode of the second internal electrode is only connected with Equations of The Second Kind vertical vias.
In the present invention, also can be, bonding multilayer ceramic capacitor can comprise further: upper outer electrode, i.e. top electrode, be formed in the top of described capacitor; And lower outer electrode, i.e. hearth electrode, is formed in the bottom of described capacitor, wherein, the main electrode of the first internal electrode is connected with described lower outer electrode by first kind vertical vias, and the main electrode of the second internal electrode is connected with described upper outer electrode by Equations of The Second Kind vertical vias.Upper outer electrode and lower outer electrode be can with the metal level of spun gold, gold ribbon, aluminium wire or copper wire bonding.
In the present invention, also can be, first kind vertical vias is led to the part of lower outer electrode and is connected with the conductive layer on circuit substrate, and the part that Equations of The Second Kind vertical vias leads to outer electrode can be carried out bonding or be connected with the upper conductive layer of the printed circuit board (PCB) embedded in micro-assembling.
According to embodiments of the invention, the ratio of the thickness of bonding multilayer ceramic capacitor and length and width should be enough large, to guarantee the reliability of capacitor.
Another aspect provides a kind of preparation method of bonding multilayer ceramic capacitor, the method comprises: employing solvent is that the casting slurry of alcohol-ester mixed solvent prepares ceramic green tape, section, punching, the preparation first kind, Equations of The Second Kind ceramic green sheet and the 3rd class external electrode ceramic green sheet; By forming two or more first kind and Equations of The Second Kind vertical vias on first kind ceramic green sheet, and on first kind ceramic green sheet, form main electrode and auxiliary electrode and form the first internal electrode, main electrode and auxiliary electrode spaced a predetermined distance from, the first kind and Equations of The Second Kind vertical vias are respectively used to main electrode and the auxiliary electrode of extraction first internal electrode; By forming two or more first kind and Equations of The Second Kind vertical vias on Equations of The Second Kind ceramic green sheet, and on Equations of The Second Kind ceramic green sheet, form main electrode and auxiliary electrode and form the second internal electrode, main electrode and auxiliary electrode spaced a predetermined distance from, the first kind and Equations of The Second Kind vertical vias are respectively used to auxiliary electrode and the main electrode of extraction second internal electrode; By forming two or more first kind or Equations of The Second Kind through hole on the 3rd ceramic green sheet, for connecting first kind via hole or the Equations of The Second Kind vertical vias of internal electrode; By alternately stacked described first kind ceramic green sheet and Equations of The Second Kind ceramic green sheet, and at top layer and overlapping 3rd ceramic green sheet of bottom, thus form ceramic body, and sinter ceramic wafer into.Bottom ceramic wafer, form upper and lower outer electrode with top, be connected to the described first kind and Equations of The Second Kind vertical vias respectively.
In the present invention, also can be, multiple fill up electrode the described first kind and Equations of The Second Kind through hole overlap respectively and form the described first kind and Equations of The Second Kind vertical vias.
According to the present invention, being interconnected between electrode is aligned by point and face, with point compared with an aligning, interelectrode connection function can be increased, meanwhile, two or more first and second via holes also can improve interelectrode connectedness, make multilayer ceramic capacitor inside not easily open circuit occur, improve the reliability of capacitor, small size capacitor can be prepared into.In addition, the face electrode in the bonding multilayer ceramic capacitor in the present invention can and adjacent Inner electrode between form a small capacitances, the capacitance of single capacitor can be promoted.
Following detailed description in conjunction with the drawings, above-mentioned and feature & benefits that is other side of the present invention will be more apparent.
Accompanying drawing explanation
The sectional view that Fig. 1 to diagrammatically illustrate according to the bonding multilayer ceramic capacitor of an example of the present invention in x direction, y side is upward through via hole;
Fig. 2 a to Fig. 2 b shows the schematic structure stereogram according to electrode in first and second of the bonding multilayer ceramic capacitor of this example of the present invention;
Fig. 3 a to Fig. 3 b shows the schematic structure stereogram according to the top of the bonding multilayer ceramic capacitor of this example of the present invention and the outer electrode up and down of bottom.
Embodiment
Describe preferred example of the present invention in detail below with reference to accompanying drawing, or rather, the present invention may be implemented as many multi-form and do not limit by embodiment described in this paper.In whole specification, identical or equivalent element indicates with identical Reference numeral.
The sectional view that Fig. 1 to diagrammatically illustrate according to the bonding multilayer ceramic capacitor of an example of the present invention in x direction, y side is upward through via hole; Fig. 2 a to Fig. 2 b be the bonding multilayer ceramic capacitor schematically showing Fig. 1 first and second in the stereogram of structure of electrode; And Fig. 3 a to Fig. 3 b is the stereogram of the structure of the top of the bonding multilayer ceramic capacitor schematically showing Fig. 1 and the outer electrode up and down of bottom.
According to this example of the present invention, x direction refers to the length direction of ceramic body, and y direction refers to the Width of ceramic body, z direction (thickness direction of ceramic body) refers to such direction internal electrode stacks, and a dielectric layer is between stacking adjacent internal electrode.
With reference to Fig. 1, Fig. 2 a-Fig. 2 b and Fig. 3 a-Fig. 3 b, dielectric layer, the first and second internal electrodes 103 and 104, the first kind and Equations of The Second Kind vertical vias 113 and 114 can be comprised according to the bonding multilayer ceramic capacitor 100 of example of the present invention and be respectively formed at the top of capacitor 100 and the external electrode up and down 101 and 102 of bottom.
The shape and size of capacitor 100 have no particular limits, and can make the bonding multilayer ceramic capacitor of high power capacity.
Capacitor 100 has stacking multiple dielectric layers (Reference numeral 41,42,51 and 52 with reference in figure 1, Fig. 2 a-Fig. 2 b and Fig. 3 a-Fig. 3 b), sinters stacking dielectric layer thus forms capacitor body.The ceramic green sheet that dielectric layer 41,42,51 and 52 comprises ceramic powders, alcohol-ester mixed solvent and organic adhesive by sintering is formed, and the present invention is adoptable is the ceramic powders with X7R or X8R equitemperature characteristic.
As shown in Fig. 1, the first internal electrode 103 and the second internal electrode 104 are respectively formed on dielectric layer 41 and 42, and alternately stacking, thus form capacitor body.First internal electrode 103 and the second internal electrode 104 have contrary polarity.
According to this example of the present invention, the first internal electrode 103 and the second internal electrode 104 can comprise conducting metal, and described conducting metal can be silver-colored palladium electrode, nickel electrode etc.
As shown in Figure 2 a, the first internal electrode 103 comprises main electrode 103a and auxiliary electrode 103b, and as shown in Figure 2 b, the second internal electrode 104 comprises main electrode 104a and auxiliary electrode 104b.In addition, the first kind and Equations of The Second Kind vertical vias 113 and 114 vertically extend in capacitor body 105.First kind vertical vias 113 is connected with the auxiliary electrode 104b of the second internal electrode 104 with the main electrode 103a of the first internal electrode 103, and Equations of The Second Kind vertical vias 114 is connected with the main electrode 104a of the second internal electrode 104 with the auxiliary electrode 103b of the first internal electrode 103.
The first kind and Equations of The Second Kind vertical vias 113 and 114 all can be conducted electricity, and conducting metal can be silver-colored palladium electrode.First kind vertical vias 113 leads to the bottom of capacitor 100, and be connected with lower outer electrode 102, Equations of The Second Kind vertical vias 114 leads to the bottom of capacitor 100, is connected with upper outer electrode 101.
Fig. 2 a to Fig. 2 b is the stereogram of the structure of the first and second internal electrodes of the bonding multilayer ceramic capacitor schematically showing Fig. 1.With reference to figure 2a to Fig. 2 b, first internal electrode 103 and the second internal electrode 104 are respectively formed on dielectric layer 41 and 42, and the first internal electrode 103 and the second internal electrode 104 all have two first kind vertical vias 113 and Equations of The Second Kind vertical vias 114.
As shown in Fig. 2 a, dash area is the first internal electrode 103.First internal electrode 103 is divided into the two parts differed in size, the part that area is larger is main electrode 103a, another part is auxiliary electrode 103b, auxiliary electrode 103b and main electrode 103a is spaced a predetermined distance from, first kind vertical vias 113 is connected to the auxiliary electrode 103b of described first internal electrode 103, Equations of The Second Kind vertical vias 114 is connected to the main electrode 103a of the first internal electrode 103, make on the first internal electrode 103, Equations of The Second Kind vertical vias 114 is not connected with first kind vertical vias 113.
As shown in Fig. 2 b, dash area is the second internal electrode 104.Second internal electrode 104 is divided into the two parts differed in size, the part that area is larger is main electrode 104a, another part is auxiliary electrode 104b, auxiliary electrode 104b and main electrode 104a is spaced a predetermined distance from, first kind vertical vias 113 is connected to the main electrode 104a of the second internal electrode 104, Equations of The Second Kind vertical vias 114 is connected to the auxiliary electrode 104b of the second internal electrode 104, make on the second internal electrode 104, Equations of The Second Kind vertical vias 114 is not connected with first kind vertical vias 113.
First internal electrode 103 and the second internal electrode 104 can adopt silk screen printing to be formed on the dielectric layer.
Fig. 3 a to Fig. 3 b is the stereogram of the structure of the outer electrode up and down of the bonding multilayer ceramic capacitor schematically showing Fig. 1, and dash area is outer electrode.Upper and lower external electrode 101 and 102 is formed on dielectric layer 51 and 52.
Shown in Fig. 3 a, upper outer electrode 101 is connected with Equations of The Second Kind vertical vias 114, is not connected with first kind vertical vias 113.
Shown in Fig. 3 b, lower outer electrode 102 is connected with first kind vertical vias 113, is not connected with Equations of The Second Kind vertical vias 114.
Upper and lower external electrode 101 and 102 can comprise conducting metal, and described conducting metal can be the metal that silver-colored palladium electrode, gold electrode etc. can meet bonding needs.
The present invention provides the preparation method of above-mentioned embedded bonding multilayer ceramic capacitor on the other hand.
Adopt the casting slurry being mixed with ceramic powders, alcohol-ester mixed solvent and organic adhesive to prepare ceramic green tape, ceramic powders can comprise the barium titanate (BaTiO with X7R or X8R equitemperature characteristic
3) or calcium titanate (CaTiO
3) etc. all ceramic dielectric materials.
Ceramic green tape is cut into slices, by Mechanical Method or laser method, ceramic green sheet is punched, the preparation first kind, Equations of The Second Kind ceramic green sheet and the 3rd class external electrode ceramic green sheet.
Adopt the methods such as silk screen printing, plating, physical vapour deposition (PVD), chemical vapour deposition (CVD) on ceramic green sheet, form electrode, and electrode material can comprise silver-colored palladium electrode, nickel electrode, a kind of or several combination in the conductive metallic material such as copper electrode, gold electrode.
First kind ceramic green sheet is formed main electrode and auxiliary electrode and forms the first internal electrode 103, main electrode and auxiliary electrode spaced a predetermined distance from, the first kind and Equations of The Second Kind vertical vias are respectively used to main electrode 103a and the auxiliary electrode 103b of extraction first internal electrode 103; Equations of The Second Kind ceramic green sheet is formed main electrode and auxiliary electrode and forms the second internal electrode 104, main electrode and auxiliary electrode spaced a predetermined distance from, the first kind and Equations of The Second Kind vertical vias are respectively used to auxiliary electrode 104b and the main electrode 104a of extraction second internal electrode.
By alternately stacked described first kind ceramic green sheet and Equations of The Second Kind ceramic green sheet, and at top layer and overlapping 3rd ceramic green sheet of bottom, thus form ceramic body, and sinter ceramic wafer into.Bottom ceramic wafer, form upper and lower outer electrode with top, be connected to the described first kind and Equations of The Second Kind vertical vias respectively.
Multiple fill up electrode the described first kind and Equations of The Second Kind through hole overlap respectively and form the described first kind and Equations of The Second Kind vertical vias.
Embodiment of illustrating further is below to describe the present invention in detail; should understand equally; following examples are only used to further illustrate the present invention; can not be interpreted as limiting the scope of the invention, some nonessential improvement that those skilled in the art's foregoing according to the present invention is made and adjustment all belong to protection scope of the present invention.
As embodiment 1, can comprise the following steps.
(1) by each matched in casting slurry system, the business-like barium titanate (BaTiO with X7R temperature characterisitic is taken
3) ceramic powders, add alcohol-ester mixed solvent, dispersant, binding agent and plasticizer and carry out disposable ball milling, after vacuum defoamation, flow casting molding, obtains the LTCC green tape material of described embedded multi-layer ceramic capacitor.
(2) the rolling LTCC green tape surfacing adopting preparation method of the present invention to obtain, thickness is even.
(3) the rolling LTCC green tape material prepared is cut into the identical individual layer LTCC raw cook of size, and punches, preparation first kind ceramic green sheet, Equations of The Second Kind ceramic green sheet, the 3rd class external electrode ceramic green sheet.
(4) filling perforation half tone is prepared according to pattern designed by Fig. 2 a-Fig. 2 b and Fig. 3 a-Fig. 3 b, interior electrode half tone.First filling perforation is carried out to ceramic green sheet by silk screen printing, and the pattern that prints electrode.
(5) lamination is positioned to ceramic green sheet.
(6) to ceramic green sheet printing top and bottom electrode.Adopt hip moulding, then cut into single capacitor.Ceramic green sheet hard board is put into Muffle furnace, plastic removal, sintering, can obtain bonding multilayer ceramic capacitor.
As embodiment 2, can comprise the following steps.
(1) slurry preparation in this bonding multilayer ceramic capacitor preparation process, curtain coating, punching, silk screen printing, lamination flow process are identical with 5 steps front in example 1.
(2) hip moulding is adopted to ceramic green sheet, cut into large stretch of ceramic body, containing multiple multilayer ceramic capacitor base substrate in every sheet.Large stretch of ceramic body is put into Muffle furnace, plastic removal, sintering, calms down.
(3) surface metalation is carried out to the large stretch of ceramic sintered bodies after sintering, and cut, bonding multilayer ceramic capacitor can be obtained.
The present invention adopts LTCC (LTCC) technology to prepare bonding multilayer ceramic capacitor, and product controllability is high, reproducible, and cost is lower, is applicable to large-scale production.Prepared bonding multilayer ceramic capacitor has the small size capacitor of top-bottom electrode structure, can be used for micro-assembling bonding technology, also can use as embedded capacitor in multilayer printed circuit board (PCB), thus reduce space shared on circuit board.The ratio of the thickness of bonding multilayer ceramic capacitor and length and width should be enough large, even make it when printed circuit plate benging, also not cracked.In addition, the face electrode in this bonding multilayer ceramic capacitor can and adjacent Inner electrode between form a small capacitances, the capacitance of single capacitor can be promoted.
Under the aim not departing from essential characteristic of the present invention, the present invention can be presented as various ways, therefore the example in the present invention is illustrative rather than definitive thereof, be defined by the claims due to scope of the present invention but not limited by specification, and drop on the scope that claim defines, or all changes in the full scope of equivalents of its scope defined all are understood to include in detail in the claims.
Claims (9)
1. a bonding multilayer ceramic capacitor, comprising:
Multiple ceramic dielectric layers; Alternately be formed in multiple first and second internal electrodes in described multiple ceramic dielectric layers respectively; And pass perpendicularly through the first kind and the Equations of The Second Kind vertical vias of described multiple ceramic dielectric layers, described first kind vertical vias is connected with the main electrode of described first internal electrode, and described Equations of The Second Kind vertical vias is connected with the main electrode of described second internal electrode; Described first kind vertical vias leads to the bottom of described capacitor, is connected with the outer electrode of bottom, and described Equations of The Second Kind vertical vias leads to the top of described capacitor, is connected with the outer electrode at top.
2. bonding multilayer ceramic capacitor according to claim 1, described first internal electrode comprises main electrode and auxiliary electrode, this main electrode and auxiliary electrode spaced a predetermined distance from; Described second internal electrode comprises main electrode and auxiliary electrode, this main electrode and auxiliary electrode spaced a predetermined distance from.
3. bonding multilayer ceramic capacitor according to claim 1, each in described first and second internal electrodes has two or more first kind and Equations of The Second Kind through hole respectively;
Wherein, described first kind vertical vias is by the described first kind through hole in described first and second internal electrodes; Described Equations of The Second Kind vertical vias is by the described Equations of The Second Kind through hole in described first and second internal electrodes; The described first kind and Equations of The Second Kind vertical vias contact with the inner periphery of the described first kind and Equations of The Second Kind through hole respectively.
4. bonding multilayer ceramic capacitor according to claim 1, the described first kind is contacted with face by point with the connection of described first and second internal electrodes with Equations of The Second Kind vertical vias.
5. bonding multilayer ceramic capacitor according to claim 2, described first kind vertical vias contacts with the electrode surface of the main electrode of described first internal electrode, contacts with the electrode surface of the auxiliary electrode of described second internal electrode;
Described Equations of The Second Kind vertical vias contacts with the electrode surface of the auxiliary electrode of described first internal electrode, contacts with the electrode surface of the main electrode of described second internal electrode.
6. bonding multilayer ceramic capacitor according to claim 1, comprises further:
Be formed in the upper outer electrode at the top of described capacitor; And be formed in the lower outer electrode of bottom of described capacitor, wherein, described first internal electrode is connected with described lower outer electrode by described first kind vertical vias, and described second internal electrode is connected with described upper outer electrode by described Equations of The Second Kind vertical vias; Described upper outer electrode and lower outer electrode be can with the metal level of spun gold, gold ribbon, aluminium wire or copper wire bonding.
7. a preparation method for bonding multilayer ceramic capacitor, comprising:
By forming two or more first kind and Equations of The Second Kind through hole on first kind ceramic green sheet, and on described first kind ceramic green sheet, form main electrode and auxiliary electrode and form the first internal electrode, this main electrode and auxiliary electrode spaced a predetermined distance from, the described first kind and Equations of The Second Kind through hole are respectively used to main electrode and the auxiliary electrode of drawing described first internal electrode;
By forming two or more first kind and Equations of The Second Kind through hole on Equations of The Second Kind ceramic green sheet, and on described Equations of The Second Kind ceramic green sheet, form main electrode and auxiliary electrode and form the second internal electrode, this main electrode and auxiliary electrode spaced a predetermined distance from, the described first kind and Equations of The Second Kind through hole are respectively used to auxiliary electrode and the main electrode of drawing described second internal electrode;
By forming two or more first kind or Equations of The Second Kind through hole on the 3rd class external electrode ceramic green sheet, for connecting the first kind or the Equations of The Second Kind vertical vias of internal electrode;
By alternately stacked described first kind ceramic green sheet and Equations of The Second Kind ceramic green sheet, and at top layer and the overlapping 3rd class external electrode ceramic green sheet of bottom, thus form ceramic body, and sinter ceramic wafer into;
Bottom ceramic wafer, form upper and lower outer electrode with top, be connected to the described first kind and Equations of The Second Kind vertical vias respectively.
8. according to the preparation method described in claim 7, the multiple described first kind and the Equations of The Second Kind through hole described first kind of overlapped formation and Equations of The Second Kind vertical vias respectively of filling up electrode.
9. bonding multilayer ceramic capacitor according to any one of claim 1 to 6 uses as embedded capacitor in multilayer printed circuit board.
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| CN104900406B (en) | 2017-10-10 |
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