CN104900406B - Bonding multilayer ceramic capacitor and preparation method thereof - Google Patents
Bonding multilayer ceramic capacitor and preparation method thereof Download PDFInfo
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Abstract
The present invention provides a kind of high reliability, bonding multilayer ceramic capacitor of high-capacitance and preparation method thereof, and the bonding multilayer ceramic capacitor includes：Multiple ceramic dielectric layers；Multiple first and second internal electrodes in the multiple ceramic dielectric layers are alternately formed at respectively；And pass perpendicularly through the first kind and Equations of The Second Kind vertical vias of the multiple ceramic dielectric layers, the first kind vertical vias is connected with the main electrode of first internal electrode, and the Equations of The Second Kind vertical vias is connected with the main electrode of second internal electrode；The first kind vertical vias leads to the bottom of the capacitor, is connected with the outer electrode of bottom, and the Equations of The Second Kind vertical vias leads to the top of the capacitor, is connected with the outer electrode at top.
Description
Technical field
The present invention relates to a kind of multilayer ceramic capacitor.More particularly it relates to which a kind of high reliability, high power capacity are close
The bonding multilayer ceramic capacitor of degree and the preparation method of the bonding multilayer ceramic capacitor.
Background technology
Traditional three-dimensional discrete passive element is prepared by modes such as insertion, welding, surface mounts, with electronics work
Industry is to miniaturization, and microwave assembly technology gradually replaces the techniques such as insertion, welding, surface mount.The key of microwave assembly technology exists
In the bonding of component.Bonding passive element technology disclosure satisfy that reduction number of elements, compressor circuit board size, increase electricity
The demand of road plate function, the overall cost of reduction product.In the electronic device, capacitor is one of three big major passive elements, can
Bonding multilayer ceramic capacitor occupies an important position in electronic applications.
The patent of multinomial bonding formula capacitor is disclosed both at home and abroad, is substantially the so-called individual layer pottery of single layer structure
Porcelain condenser（Single Layer Capacitor, SLC）, this capacitor is by single-layer ceramic medium and is attached to ceramics
The metal electrode of medium upper and lower surface is constituted.Although single-layer ceramic capacitor can meet the gold wire bonding requirement of micro-group dress,
Capacity density is small, the capacitor of Large Copacity（As capacity is more than 0.01 μ F）It can not possibly still prepare.Such as United States Patent (USP)
US2003016485, Chinese patent CN1396606A, 200410075380.1 etc. are the system for disclosing single-layer ceramic capacitor
Standby patent.
In order to overcome the problem of single-layer ceramic condenser capacity density is relatively low, a kind of solution is by multi-layer ceramic capacitance
Device is processed into bonding structure.A variety of bonding multilayer ceramic capacitors are have developed both at home and abroad.Made pottery with traditional multilayer
Porcelain condenser is compared, and its outer electrode is mainly placed in the upper and lower surface of capacitor by bonding multilayer ceramic capacitor, in order to
Loaded on electroplax, another electrode realizes bonding assembling to one electrode paste.This structure is mainly realized by following several method.
One is improved on traditional two ends multilayer ceramic capacitor, for example, fall capacitor-side, is made original containing electricity
Two sides of pole become upper and lower surface, or two above and below respectively being continued and extend to positioned at the outer electrode of capacitor both sides
Face, the multilayer ceramic capacitor that U.S. Patent Application Publication No. US7791896B1 discloses both structures.The former is internal electric
Pole-face product is less, it is possible to cause its capacitance not high；The latter need to laminate, in manufacturing process and it is fragile thereafter split, from
And break down.
Two be that internal electrode structure is improved, by various methods change internal electrode structure, by its directly with it is upper
The outer electrode on lower two sides is connected.For example：What U.S. Patent Application Publication No. US7230815B1 disclosed this structure can
It is bonded electrode in first and second in multilayer ceramic capacitor, the capacitor and all contains two extraction electrodes respectively, and respectively
By these extraction electrodes be connected to above and below outer electrode.The capacitor of this structure may in lamination or compression process
Cause bulk deformation, so as to cause cutting defect, while installed in also easy fragmentation or cracking inside circuit board.The strain of Samsung motor
The Chinese patent application of formula commercial firm application discloses the bonding multilayer chip that CN 1832070 shows a kind of high reliability
Capacitor, the capacitor is using via by the externally connected electrode of internal electrode, and its fragmentation is fewer, still, during lamination,
Via is relatively difficult to abundant alignment, therefore, easily forms electrode loose contact, is difficult to make the capacitor of small size.
The content of the invention
In view of the problem of existing above, the technical problems to be solved by the invention are to provide a kind of high reliability, high electricity
The preparation method of the bonding multilayer ceramic capacitor of capacity and the bonding multilayer ceramic capacitor.
According to an aspect of the present invention there is provided a kind of bonding multilayer ceramic capacitor, including：Multiple ceramic dielectric layers；
Multiple first and second internal electrodes in the multiple ceramic dielectric layers are alternately formed at respectively；And pass perpendicularly through described
The first kind and Equations of The Second Kind vertical vias of multiple ceramic dielectric layers, the first kind vertical vias and first internal electrode
Main electrode is connected, and the Equations of The Second Kind vertical vias is connected with the main electrode of second internal electrode；Described first
Class vertical vias leads to the bottom of the capacitor, is connected with the outer electrode of bottom, and the Equations of The Second Kind vertical vias
Lead to the top of the capacitor, be connected with the outer electrode at top.
According to the bonding multilayer ceramic capacitor of the present invention, outer electrode is located at the upper bottom of multilayer ceramic capacitor
Put, capacitor is allowed to be installed inside substrate, less fragmentation can be subjected to, and small size capacitor can be fabricated to.
In the present invention or, first internal electrode includes main electrode and auxiliary electrode, the main electrode and pair electricity
It is extremely spaced a predetermined distance from；Second internal electrode includes main electrode and auxiliary electrode, and the main electrode separates pre- spacing with auxiliary electrode
From.
According to the present invention, the main electrode and auxiliary electrode of first and second internal electrode are not contacted with each other.
In the present invention or, the first kind and Equations of The Second Kind vertical vias and the first and second internal electrodes
Connection is to be contacted by point with face.
In of the invention vertical or, each in first and second internal electrode respectively has two
Or multiple first kind and Equations of The Second Kind through hole；Wherein, first via is by described in first and second internal electrode
First kind through hole；The Equations of The Second Kind vertical vias passes through the Equations of The Second Kind through hole in first and second internal electrode；Institute
The inner periphery of the first kind and Equations of The Second Kind vertical vias respectively with the first kind and Equations of The Second Kind through hole is stated to be in contact.
In the present invention or, the first kind and Equations of The Second Kind via and first and second internal electrode
Connection is to be contacted by point with face.
In the present invention or, the electrode table of the main electrode of the first kind vertical vias and the first internal electrode
Face is contacted, and is contacted with the electrode surface of the auxiliary electrode of the second internal electrode；And Equations of The Second Kind vertical vias and the second internal electrode
The electrode surface contact of main electrode, is contacted with the electrode surface of the auxiliary electrode of the first internal electrode.This structure causes in first
The main electrode of portion's electrode is only connected with first kind vertical vias, the main electrode of the second internal electrode only with Equations of The Second Kind vertical vias
It is connected.
In the present invention or, bonding multilayer ceramic capacitor can further comprise：Upper outer electrode, that is, push up
Electrode, is formed at the top of the capacitor；And lower outer portion electrode, i.e. hearth electrode, formed in the bottom of the capacitor, its
In, the main electrode of the first internal electrode is connected by first kind vertical vias with the lower outer portion electrode, Equations of The Second Kind vertical vias
The main electrode of second internal electrode is connected with the upper outer electrode.Upper outer electrode and lower outer portion electrode are can be with gold
Silk, gold ribbon, aluminium wire or the metal level of copper wire bonding.
In the present invention or, first kind vertical vias lead to the part of lower outer portion electrode with circuit substrate
Conductive layer is connected, and Equations of The Second Kind vertical vias lead to outer electrode part can micro-group dress in be bonded or with it is embedding
The upper conductive layer of the printed circuit board (PCB) entered is connected.
Embodiments in accordance with the present invention, the thickness of bonding multilayer ceramic capacitor and the ratio of length and width should be sufficient
It is enough big, to ensure the reliability of capacitor.
Another aspect provides a kind of preparation method of bonding multilayer ceramic capacitor, this method includes：
Use solvent to prepare ceramic green tape for the casting slurry of alcohol -ester mixed solvent, cut into slices, punching prepares the first kind, Equations of The Second Kind ceramics
Raw cook and the 3rd class external electrode ceramic green sheet；By forming two or more first kind and Equations of The Second Kind on first kind ceramic green sheet
Vertical vias, and form main electrode and auxiliary electrode on first kind ceramic green sheet and constitute the first internal electrode, main electrode with
Auxiliary electrode is spaced a predetermined distance from, and the first kind and Equations of The Second Kind vertical vias are respectively used to draw the main electrode and pair of the first internal electrode
Electrode；By forming two or more first kind and Equations of The Second Kind vertical vias on Equations of The Second Kind ceramic green sheet, and in Equations of The Second Kind
Main electrode and auxiliary electrode are formed on ceramic green sheet and the second internal electrode is constituted, and main electrode is spaced a predetermined distance from auxiliary electrode, the
One class and Equations of The Second Kind vertical vias are respectively used to draw the auxiliary electrode and main electrode of the second internal electrode；By in the 3rd ceramic green
Two or more first kind or Equations of The Second Kind through hole are formed on piece, the first kind via or Equations of The Second Kind for connecting internal electrode are vertical
Via；By being alternately laminated the first kind ceramic green sheet and Equations of The Second Kind ceramic green sheet, and in top layer and bottom the overlapping 3rd
Ceramic green sheet, so as to form ceramic body, and sinters ceramic wafer into.Outer electrode above and below being formed in ceramic wafer bottom and top,
It is respectively connecting to the first kind and Equations of The Second Kind vertical vias.
In the present invention or, multiple first kind and Equations of The Second Kind through hole for filling up electrode overlap shape respectively
Into the first kind and Equations of The Second Kind vertical vias.
According to the present invention, the interconnection between electrode is to be aligned by point with face, and point is compared with being aligned, and can be increased
Plus interelectrode connection function, meanwhile, two or more first and second vias can also improve interelectrode connectedness so that many
Open circuit is not susceptible to inside layer ceramic capacitor, the reliability of capacitor is improved, small size capacitor can be prepared into.In addition, this
The face electrode in bonding multilayer ceramic capacitor in invention can form a small capacitances between adjacent Inner electrodes, can be lifted
The capacitance of single capacitor.
To more it be shown with advantage by the feature with reference to the described in detail below of accompanying drawing, above and other aspect of the invention
And be clear to.
Brief description of the drawings
Fig. 1 diagrammatically illustrates the bonding multilayer ceramic capacitor according to the embodiment of the present invention in x directions, y
Side is upward through the sectional view of via；
Fig. 2 a to Fig. 2 b show the first of the bonding multilayer ceramic capacitor of the embodiment according to the present invention
With the schematic structure stereogram of the second inner electrode；
Fig. 3 a to Fig. 3 b show the top of the bonding multilayer ceramic capacitor of the embodiment according to the present invention
With the schematic structure stereogram of the outer electrode up and down of bottom.
Embodiment
That the present invention is described in detail below with reference to accompanying drawing is preferable to carry out form, more precisely, the present invention can be by
It is embodied as many multi-forms and is not limited by embodiments described herein.Throughout the specification, identical or equivalent
Element with identical reference indicate.
Fig. 1 diagrammatically illustrates the bonding multilayer ceramic capacitor according to the embodiment of the present invention in x directions, y
Side is upward through the sectional view of via；Fig. 2 a to Fig. 2 b are the bonding multilayer ceramic capacitors for schematically showing Fig. 1
First and second in electrode structure stereogram；And Fig. 3 a to Fig. 3 b are schematically show Fig. 1 bonding
The stereogram of the structure of the outer electrode up and down of the top and bottom of multilayer ceramic capacitor.
According to the embodiment of the present invention, x directions refer to the length direction of ceramic body, and y directions refer to ceramics
The width of body, z directions（The thickness direction of ceramic body）Refer to such direction internal electrode stacks, and Jie
Electric layer is between the adjacent internal electrode stacked.
Reference picture 1, Fig. 2 a- Fig. 2 b and Fig. 3 a- Fig. 3 b, according to the bonding multi-layer ceramics of the embodiment of present invention electricity
Container 100 may include dielectric layer, the first and second internal electrodes 103 and the 104, first kind and the and of Equations of The Second Kind vertical vias 113
114 and be respectively formed at capacitor 100 top and bottom external electrode up and down 101 and 102.
The shape and size of capacitor 100 have no particular limits, and can make the bonding multi-layer ceramics electricity of high power capacity
Container.
Capacitor 100 has the multiple dielectric layers stacked（With reference to the accompanying drawing in Fig. 1, Fig. 2 a- Fig. 2 b and Fig. 3 a- Fig. 3 b
Mark 41,42,51 and 52）, stacked dielectric layer is sintered to form capacitor body.Dielectric layer 41,42,51 and 52 can lead to
The ceramic green sheet that oversintering includes ceramic powders, alcohol -ester mixed solvent and organic adhesive is formed, and the adoptable present invention is tool
There are the ceramic powders of X7R or X8R equitemperature characteristics.
As shown in Fig. 1, the first internal electrode 103 and the second internal electrode 104 are respectively formed at dielectric layer 41 and 42
On, and be alternately stacked, so as to form capacitor body.First internal electrode 103 and the second internal electrode 104 have phase
Anti- polarity.
According to the embodiment of the present invention, the first internal electrode 103 and the second internal electrode 104 can include conduction
Metal, and the conducting metal can be silver-colored palladium electrode, nickel electrode etc..
As shown in Figure 2 a, the first internal electrode 103 includes main electrode 103a and auxiliary electrode 103b, as shown in Figure 2 b, the
Two internal electrodes 104 include main electrode 104a and auxiliary electrode 104b.In addition, the first kind and the He of Equations of The Second Kind vertical vias 113
114 vertically extend in capacitor body 105.The main electrode of the internal electrode 103 of first kind vertical vias 113 and first
The auxiliary electrode 104b of 103a and the second internal electrode 104 is connected, the internal electrode of Equations of The Second Kind vertical vias 114 and first
The main electrode 104a of 103 auxiliary electrode 103b and the second internal electrode 104 is connected.
The first kind and Equations of The Second Kind vertical vias 113 and 114 can be conductive, and conducting metal can be silver-colored palladium electrode.The first kind
Vertical vias 113 leads to the bottom of capacitor 100, is connected with lower outer portion electrode 102, and Equations of The Second Kind vertical vias 114 is led to
To the bottom of capacitor 100, it is connected with upper outer electrode 101.
Fig. 2 a to Fig. 2 b are inside the first and second of the bonding multilayer ceramic capacitor for schematically showing Fig. 1
The stereogram of the structure of electrode.With reference to Fig. 2 a to Fig. 2 b, the first internal electrode 103 and the second internal electrode 104 are formed respectively
There are two first kind vertical on dielectric layer 41 and 42, and on the first internal electrode 103 and the second internal electrode 104
Via 113 and Equations of The Second Kind vertical vias 114.
As shown in Fig. 2 a, dash area is the first internal electrode 103.First internal electrode 103 is divided into size not
Deng two parts, area larger portion be main electrode 103a, another part be auxiliary electrode 103b, auxiliary electrode 103b and master
Electrode 103a is spaced a predetermined distance from, and first kind vertical vias 113 is connected to the auxiliary electrode of first internal electrode 103
103b, Equations of The Second Kind vertical vias 114 is connected to the main electrode 103a of the first internal electrode 103 so that in the first internal electrode
On 103, Equations of The Second Kind vertical vias 114 is not connected with first kind vertical vias 113.
As shown in Fig. 2 b, dash area is the second internal electrode 104.Second internal electrode 104 is divided into size not
Deng two parts, area larger portion be main electrode 104a, another part be auxiliary electrode 104b, auxiliary electrode 104b and master
Electrode 104a is spaced a predetermined distance from, and first kind vertical vias 113 is connected to the main electrode 104a of the second internal electrode 104, the
Two class vertical vias 114 are connected to the auxiliary electrode 104b of the second internal electrode 104 so that on the second internal electrode 104,
Equations of The Second Kind vertical vias 114 is not connected with first kind vertical vias 113.
First internal electrode 103 and the second internal electrode 104 can be formed on the dielectric layer using silk-screen printing.
Fig. 3 a to Fig. 3 b are the outer electrodes up and down for the bonding multilayer ceramic capacitor for schematically showing Fig. 1
The stereogram of structure, dash area is outer electrode.The formation of external electrode 101 and 102 is on dielectric layer 51 and 52 up and down.
As shown in Fig. 3 a, upper outer electrode 101 is connected with Equations of The Second Kind vertical vias 114, not with first kind vertically passing
Hole 113 is connected.
As shown in Fig. 3 b, lower outer portion electrode 102 is connected with first kind vertical vias 113, not with Equations of The Second Kind vertically passing
Hole 114 is connected.
Up and down external electrode 101 and 102 can include conducting metal, and the conducting metal can be silver-colored palladium electrode,
Gold electrode etc. can meet the metal of bonding needs.
Another aspect of the present invention provides the preparation method of above-mentioned embedded bonding multilayer ceramic capacitor.
Ceramic green tape is prepared using the casting slurry for being mixed with ceramic powders, alcohol -ester mixed solvent and organic adhesive, ceramics
Powder may include the barium titanate with X7R or X8R equitemperature characteristics（BaTiO3）Or calcium titanate（CaTiO3）It is situated between etc. all ceramic electricals
Material.
Ceramic green tape is cut into slices, ceramic green sheet punched by Mechanical Method or laser method, the first kind, the is prepared
Two class ceramic green sheets and the 3rd class external electrode ceramic green sheet.
Electricity is formed on ceramic green sheet using methods such as silk-screen printing, plating, physical vapour deposition (PVD), chemical vapor depositions
Pole, and electrode material may include silver-colored palladium electrode, nickel electrode, one kind or some in the conductive metallic material such as copper electrode, gold electrode
The combination planted.
Main electrode and auxiliary electrode are formed on first kind ceramic green sheet and constitute the first internal electrode 103, main electrode and pair
Electrode is spaced a predetermined distance from, and the first kind and Equations of The Second Kind vertical vias are respectively used to draw the main electrode of the first internal electrode 103
103a and auxiliary electrode 103b；Main electrode and auxiliary electrode are formed on Equations of The Second Kind ceramic green sheet and constitute the second internal electrode 104,
Main electrode is spaced a predetermined distance from auxiliary electrode, and the first kind and Equations of The Second Kind vertical vias are respectively used to draw the pair of the second internal electrode
Electrode 104b and main electrode 104a.
By being alternately laminated the first kind ceramic green sheet and Equations of The Second Kind ceramic green sheet, and in top layer and bottom overlapping
Three ceramic green sheets, so as to form ceramic body, and sinter ceramic wafer into.External electrical above and below being formed in ceramic wafer bottom and top
Pole, is respectively connecting to the first kind and Equations of The Second Kind vertical vias.
Multiple first kind and Equations of The Second Kind through hole for filling up electrode overlap to form the first kind and Equations of The Second Kind respectively
Vertical vias.
Citing embodiment is to describe the present invention in detail further below, it will similarly be understood that following examples are served only for this
Invention is further described, it is impossible to be interpreted as limiting the scope of the invention, those skilled in the art is according to this hair
Some nonessential modifications and adaptations that bright the above is made belong to protection scope of the present invention.
As embodiment 1, it may comprise steps of.
（1）By each matched in casting slurry system, the commercialized barium titanate with X7R temperature characterisitics is weighed
（BaTiO3）Ceramic powders, addition alcohol -ester mixed solvent, dispersant, binding agent and plasticizer carry out disposable ball milling, through vacuum
After deaeration, flow casting molding obtains the LTCC green tape material of the embedded multi-layer ceramic capacitor.
（2）Using coiled LTCC green tape surfacings made from the preparation method of the present invention, thickness is uniform.
（3）The coiled LTCC green tape material prepared is cut into size identical individual layer LTCC raw cooks, and punched,
Prepare first kind ceramic green sheet, Equations of The Second Kind ceramic green sheet, the 3rd class external electrode ceramic green sheet.
（4）Prepare filling perforation half tone, interior electrode half tone according to pattern designed by Fig. 2 a- Fig. 2 b and Fig. 3 a- Fig. 3 b.Pass through silk
Wire mark brush first carries out filling perforation, and the pattern that prints electrode to ceramic green sheet.
（5）Positioning lamination is carried out to ceramic green sheet.
（6）Top and bottom electrode is printed to ceramic green sheet.Using hip moulding, single capacitor is then cut into.Will
Ceramic green sheet hard board is put into Muffle furnace, plastic removal, sintering, you can obtain bonding multilayer ceramic capacitor.
As embodiment 2, it may comprise steps of.
（1）Slurry preparation, curtain coating, punching, silk-screen printing, lamination in the bonding multilayer ceramic capacitor preparation process
Flow is identical with preceding 5 steps in example 1.
（2）Hip moulding is used to ceramic green sheet, cut into large stretch of ceramic body, every containing multiple multilayers pottery
Porcelain condenser base substrate.Large stretch of ceramic body is put into Muffle furnace, plastic removal, sinters, calm down.
（3）Surface metalation is carried out to large stretch of ceramic sintered bodies after sintering, and cut, you can bonding multilayer pottery is obtained
Porcelain condenser.
The present invention uses LTCC（LTCC）Technology prepares bonding multilayer ceramic capacitor, product controllability
Height, reproducible, cost is relatively low, is adapted to large-scale production.Prepared bonding multilayer ceramic capacitor has Top-Bottom electricity
The small size capacitor of pole structure, bonding technology is filled available for micro-group, can also be in multilayer printed circuit board（PCB）It is middle as embedding
Enter formula capacitor to use, so as to reduce space shared on circuit board.The thickness of bonding multilayer ceramic capacitor and length and
The ratio of width should be sufficiently large, even making it in the case of printed circuit plate benging, is not also fractured.In addition, this can
Face electrode in bonding multilayer ceramic capacitor can form a small capacitances between adjacent Inner electrodes, can lift single capacitor
Capacitance.
In the case where not departing from the objective of essential characteristic of the present invention, the present invention can be presented as in diversified forms, therefore the present invention
Embodiment be to be illustrative rather than definitive thereof, be defined by the claims rather than limited by specification due to the scope of the present invention,
And all changes fallen in the scope defined in claim, or the full scope of equivalents of its scope defined are understood to include
In detail in the claims.
Claims (7)
1. a kind of bonding multilayer ceramic capacitor, including：
Multiple ceramic dielectric layers；Multiple first and second inside electricity in the multiple ceramic dielectric layers is alternately formed at respectively
Pole；And pass perpendicularly through the first kind and Equations of The Second Kind vertical vias of the multiple ceramic dielectric layers, the first kind vertical vias
It is connected with the main electrode of first internal electrode, and the Equations of The Second Kind vertical vias and the master of second internal electrode
Electrode is connected；The first kind vertical vias leads to the bottom of the capacitor, is connected with the outer electrode of bottom, and
The Equations of The Second Kind vertical vias leads to the top of the capacitor, is connected with the outer electrode at top；
First internal electrode includes main electrode and auxiliary electrode, and the main electrode and auxiliary electrode are spaced a predetermined distance from；Described second
Internal electrode includes main electrode and auxiliary electrode, and the main electrode and auxiliary electrode are spaced a predetermined distance from；
The first kind vertical vias while electrode surface with the main electrode of first internal electrode is contacted with it is described
The electrode surface contact of the auxiliary electrode of second internal electrode；
The Equations of The Second Kind vertical vias while electrode surface with the auxiliary electrode of first internal electrode is contacted with it is described
The electrode surface contact of the main electrode of second internal electrode.
2. it is each in bonding multilayer ceramic capacitor according to claim 1, first and second internal electrode
Respectively there is two or more first kind and Equations of The Second Kind through hole；
Wherein, the first kind vertical vias passes through the first kind through hole in first and second internal electrode；It is described
Equations of The Second Kind vertical vias passes through the Equations of The Second Kind through hole in first and second internal electrode；The first kind and Equations of The Second Kind
Inner periphery of the vertical vias respectively with the first kind and Equations of The Second Kind through hole is in contact.
3. bonding multilayer ceramic capacitor according to claim 1, the first kind and Equations of The Second Kind vertical vias and institute
The connection for stating the first and second internal electrodes is to be contacted by point with face.
4. bonding multilayer ceramic capacitor according to claim 1, further comprises：
Form the upper outer electrode at the top of the capacitor；And the lower outer portion formed in the bottom of the capacitor is electric
Pole, wherein, first internal electrode is connected by the first kind vertical vias with the lower outer portion electrode, the Equations of The Second Kind
Second internal electrode is connected by vertical vias with the upper outer electrode；The upper outer electrode and lower outer portion electrode are
The metal level that can be bonded with spun gold, gold ribbon, aluminium wire or copper wire.
5. a kind of preparation method of bonding multilayer ceramic capacitor, including：
By forming two or more first kind and Equations of The Second Kind through hole on first kind ceramic green sheet, and in first kind pottery
Main electrode and auxiliary electrode are formed on porcelain raw cook and the first internal electrode is constituted, and the main electrode and auxiliary electrode are spaced a predetermined distance from, institute
State the first kind and Equations of The Second Kind through hole is respectively used to draw the main electrode and auxiliary electrode of first internal electrode；
By forming two or more first kind and Equations of The Second Kind through hole on Equations of The Second Kind ceramic green sheet, and in Equations of The Second Kind pottery
Main electrode and auxiliary electrode are formed on porcelain raw cook and the second internal electrode is constituted, and the main electrode and auxiliary electrode are spaced a predetermined distance from, institute
State the first kind and Equations of The Second Kind through hole is respectively used to draw the auxiliary electrode and main electrode of second internal electrode；
By forming two or more first kind or Equations of The Second Kind through hole on the 3rd class external electrode ceramic green sheet, for connecting inside
The first kind or Equations of The Second Kind vertical vias of electrode；
By being alternately laminated the first kind ceramic green sheet and Equations of The Second Kind ceramic green sheet, and in overlapping 3rd class of top layer and bottom
External electrode ceramic green sheet, so as to form ceramic body, and sinters ceramic wafer into；
Outer electrode above and below being formed in ceramic wafer bottom and top, is respectively connecting to the first kind and Equations of The Second Kind vertical vias,
Make the first kind vertical vias while electrode surface with the main electrode of first internal electrode is contacted and institute
State the electrode surface contact of the auxiliary electrode of the second internal electrode；
Make the Equations of The Second Kind vertical vias while electrode surface with the auxiliary electrode of first internal electrode is contacted and institute
State the electrode surface contact of the main electrode of the second internal electrode.
6. preparation method according to claim 5, multiple first kind for filling up electrode and Equations of The Second Kind through hole difference phase
Mutually overlap to form the first kind and Equations of The Second Kind vertical vias.
7. bonding multilayer ceramic capacitor according to any one of claim 1 to 4 is made in multilayer printed circuit board
Used for embedded capacitor.
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| CN107946074A (en) * | 2017-12-26 | 2018-04-20 | 广州天极电子科技有限公司 | A kind of single-layer capacitor and preparation method |
| CN114446661B (en) * | 2021-12-06 | 2023-06-23 | 中北大学 | Multilayer ceramic capacitor based on chemical mechanical polishing and preparation method thereof |
| CN114464457A (en) * | 2022-01-30 | 2022-05-10 | 华南师范大学 | Chip capacitor with broadband performance |
| CN115274319B (en) * | 2022-07-18 | 2024-05-31 | 广东风华高新科技股份有限公司 | Preparation method of multilayer ceramic capacitor |
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| CN1832070A (en) * | 2005-03-07 | 2006-09-13 | 三星电机株式会社 | Embedded multilayer chip capacitor and printed circuit board having the same |
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