CN104889190A - Preparation method of superfine noble metal extrusion flat die - Google Patents
Preparation method of superfine noble metal extrusion flat die Download PDFInfo
- Publication number
- CN104889190A CN104889190A CN201510278318.0A CN201510278318A CN104889190A CN 104889190 A CN104889190 A CN 104889190A CN 201510278318 A CN201510278318 A CN 201510278318A CN 104889190 A CN104889190 A CN 104889190A
- Authority
- CN
- China
- Prior art keywords
- die
- processed
- finished product
- noble metal
- raw material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
- B21C—MANUFACTURE OF METAL SHEETS, WIRE, RODS, TUBES OR PROFILES, OTHERWISE THAN BY ROLLING; AUXILIARY OPERATIONS USED IN CONNECTION WITH METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL
- B21C25/00—Profiling tools for metal extruding
- B21C25/10—Making tools by operations not covered by a single other subclass
Abstract
The invention discloses a preparation method of a superfine noble metal extrusion flat die and relates to the technical field of die production. The die is prepared in a metal workshop by taking natural diamond as a core and pure stainless steel as a housing. The method has the benefits that the method is concise in process flow and reasonable in raw material ratio, the pure stainless steel is taken as the housing and the natural diamond is taken as the core; internal refinement of the die is ensured; and the die can prepare a refined lead wire easily, is a metal extrusion flat die irreplaceable by other dies, can be widely used for manufacturing various flat ribands made of noble metals such as gold, silver, a platinum-rhodium wire, an aluminum-silicon alloy and single crystal copper, and is convenient to popularize and use.
Description
Technical field
The present invention relates to mould production technical field, be specifically related to the flat molded Preparation Method of a kind of super thin noble metal extruding.
Background technology
Bonding wire is widely used on LED, semiconductor integrated circuit, and as civilian consumer goods IC: computer, mobile phone, on the chips such as television set.Industry IC: large server, motor, intelligence instrument instrument, holder, the chips such as medical apparatus and instruments, and photovoltaic, the Electronic Packaging such as diode triode.
Along with the development of market and technology, chip functions constantly strengthens, lead-in wire is more and more, and volume is more and more less, pad area ratio shared in whole chip is caused constantly to rise, therefore, Studies of The Superfine spacing bonding techniques solves the miniaturized key technology that must solve of chip, but the performance of this kind produced in the market and thin bonding wire still compares poor, basic reason is that the design of mould is reasonable not, cannot complete operation, mold material selection and material mixture ratio thereof all can not obtain rationally simultaneously.
Summary of the invention:
It is reasonable that technical problem to be solved by this invention is to provide a kind of methodological science, the flat molded Preparation Method of preparation technology's super thin noble metal extruding simply and easily.
Technical problem to be solved by this invention realizes by the following technical solutions:
The flat molded Preparation Method of a kind of super thin noble metal extruding, is characterized in that, comprise following processing step:
A, select high-quality rough diamond to be raw material, the rough diamond raw material chosen are had openning hole through micropore laser machine specification as required, for subsequent use;
B, take stainless steel compound, comprise in compound nickel, titanium, chromium, Tong, ?, the interior nickel of compound, titanium, chromium, Tong, ? proportion be 18:9:1:12:8, be then processed into overcoat base by metalworking workshop, for subsequent use;
C, the rough diamond had openning hole through micropore laser machine specification as required handled well by step a adopt adhesive glue maxxaedium as inner core, then after bushing welding powder, in the overcoat base prepared by the progressive rapid b of high pressure bushing machine edge;
D, be then processed into coarse semi-finished product with ultrasonic wave and draw point after, carry out refine, coarse semi-finished product ultrasonic wave selected diamond mould powder carried out retrofit to required specification;
After e, steps d process terminate, adopt polishing machine be processed into further high accuracy semi-finished product then further in-depth be processed into finished product, pack after oil surface.
The invention has the beneficial effects as follows: present invention process flow process is succinct, reasonable raw material proportioning, with pure stainless steel for shell and rough diamond are for heart, ensure that its internal fine, can prepare easily for meticulous lead-in wire, the flat moulds of other irreplaceable extruding metals, the manufacture of various noble metal flat filament band can be widely used in, e.g., gold, other noble metals such as silver, platinum-rhodium wire, aluminium silicon, single crystal Cu, are convenient to promote and use.
Detailed description of the invention
The technological means realized to make the present invention, creation characteristic, reaching object and effect is easy to understand, below in conjunction with specific embodiment, setting forth the present invention further.
Embodiment 1
The flat molded Preparation Method of a kind of super thin noble metal extruding, comprises following processing step:
A, select high-quality rough diamond to be raw material, the rough diamond raw material chosen are had openning hole through micropore laser machine specification as required, for subsequent use;
B, take stainless steel compound, comprise in compound nickel, titanium, chromium, Tong, ?, the interior nickel of compound, titanium, chromium, Tong, ? proportion be 18:9:1:12:8, be then processed into overcoat base by metalworking workshop, for subsequent use;
C, the rough diamond had openning hole through micropore laser machine specification as required handled well by step a adopt adhesive glue maxxaedium as inner core, then after bushing welding powder, in the overcoat base prepared by the progressive rapid b of high pressure bushing machine edge;
D, be then processed into coarse semi-finished product with ultrasonic wave and draw point after, carry out refine, coarse semi-finished product ultrasonic wave selected diamond mould powder carried out retrofit to required specification;
After e, steps d process terminate, adopt polishing machine be processed into further high accuracy semi-finished product then further in-depth be processed into finished product, pack after oil surface.
More than show and describe general principle of the present invention and principal character and advantage of the present invention.The technical staff of the industry should understand; the present invention is not restricted to the described embodiments; what describe in above-described embodiment and description just illustrates principle of the present invention; without departing from the spirit and scope of the present invention; the present invention also has various changes and modifications, and these changes and improvements all fall in the claimed scope of the invention.Application claims protection domain is defined by appending claims and equivalent thereof.
Claims (1)
1. the flat molded Preparation Method of super thin noble metal extruding, is characterized in that, comprise following processing step:
A, select high-quality rough diamond to be raw material, the rough diamond raw material chosen are had openning hole through micropore laser machine specification as required, for subsequent use;
B, take stainless steel compound, comprise in compound nickel, titanium, chromium, Tong, ?, the interior nickel of compound, titanium, chromium, Tong, ? proportion be 18:9:1:12:8, be then processed into overcoat base by metalworking workshop, for subsequent use;
C, the rough diamond had openning hole through micropore laser machine specification as required handled well by step a adopt adhesive glue maxxaedium as inner core, then after bushing welding powder, in the overcoat base prepared by the progressive rapid b of high pressure bushing machine edge;
D, be then processed into coarse semi-finished product with ultrasonic wave and draw point after, carry out refine, coarse semi-finished product ultrasonic wave selected diamond mould powder carried out retrofit to required specification;
After e, steps d process terminate, adopt polishing machine be processed into further high accuracy semi-finished product then further in-depth be processed into finished product, pack after oil surface.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201510278318.0A CN104889190B (en) | 2015-05-27 | 2015-05-27 | A kind of thin noble metal of super extrudes flat molding Preparation Method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201510278318.0A CN104889190B (en) | 2015-05-27 | 2015-05-27 | A kind of thin noble metal of super extrudes flat molding Preparation Method |
Publications (2)
Publication Number | Publication Date |
---|---|
CN104889190A true CN104889190A (en) | 2015-09-09 |
CN104889190B CN104889190B (en) | 2017-08-15 |
Family
ID=54022386
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201510278318.0A Active CN104889190B (en) | 2015-05-27 | 2015-05-27 | A kind of thin noble metal of super extrudes flat molding Preparation Method |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN104889190B (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107552582A (en) * | 2017-08-15 | 2018-01-09 | 安徽捷澳电子有限公司 | A kind of Bidirectional power metallic bond plying wire drawing die preparation method |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4144739A (en) * | 1977-10-13 | 1979-03-20 | Fort Wayne Wire Die, Inc. | Wire drawing die and method of making the same |
JPH09220610A (en) * | 1993-05-19 | 1997-08-26 | Masao Murakawa | Wire drawing die for thin wire using polycrystalline diamond synthesized by vapor deposition method |
JP2003245711A (en) * | 2001-12-21 | 2003-09-02 | Allied Material Corp | Diamond die for drawing deformed wire and method for manufacturing deformed wire rod |
CN1544170A (en) * | 2003-11-11 | 2004-11-10 | 安 张 | Diamond die production process |
CN1651161A (en) * | 2004-12-23 | 2005-08-10 | 彭彤 | Manufacturing method of diamond wire drawing mould |
CN102671986A (en) * | 2012-05-16 | 2012-09-19 | 天长市天屹模具科技发展有限公司 | Manufacturing process of wire drawing die |
-
2015
- 2015-05-27 CN CN201510278318.0A patent/CN104889190B/en active Active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4144739A (en) * | 1977-10-13 | 1979-03-20 | Fort Wayne Wire Die, Inc. | Wire drawing die and method of making the same |
JPH09220610A (en) * | 1993-05-19 | 1997-08-26 | Masao Murakawa | Wire drawing die for thin wire using polycrystalline diamond synthesized by vapor deposition method |
JP2003245711A (en) * | 2001-12-21 | 2003-09-02 | Allied Material Corp | Diamond die for drawing deformed wire and method for manufacturing deformed wire rod |
CN1544170A (en) * | 2003-11-11 | 2004-11-10 | 安 张 | Diamond die production process |
CN1651161A (en) * | 2004-12-23 | 2005-08-10 | 彭彤 | Manufacturing method of diamond wire drawing mould |
CN102671986A (en) * | 2012-05-16 | 2012-09-19 | 天长市天屹模具科技发展有限公司 | Manufacturing process of wire drawing die |
Non-Patent Citations (1)
Title |
---|
罗丽: "国外拉丝模加工方法及材料特性综述", 《稀有金属与硬质合金》 * |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN107552582A (en) * | 2017-08-15 | 2018-01-09 | 安徽捷澳电子有限公司 | A kind of Bidirectional power metallic bond plying wire drawing die preparation method |
Also Published As
Publication number | Publication date |
---|---|
CN104889190B (en) | 2017-08-15 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN103191943B (en) | Titanium alloy wire production method | |
CN105720034B (en) | Lead frame, semiconductor device | |
CN103337483B (en) | A kind of ultrathin VSOP packaging part and production method thereof | |
JP2010153825A5 (en) | ||
CN102683230A (en) | Quad flat no-lead multi-circle-arranged integrated circuit (IC) chip packaging part and production method thereof | |
CN105002391A (en) | Hyperfine gold flat silk ribbon and preparation method thereof | |
EP2610904A3 (en) | Packaging method for electronic components using a thin substrate | |
EP2610905A3 (en) | Packaging method for electronic components using a thin substrate | |
CN101524721A (en) | Method for preparing single-crystal copper bonding wire | |
CN104889190A (en) | Preparation method of superfine noble metal extrusion flat die | |
CN102637657A (en) | Single crystal copper bonding lead and preparation method thereof | |
CN104894425A (en) | Ultrathin silver flat ribbon and preparation method thereof | |
CN102222658B (en) | Multi-circle arranged IC (integrated circuit) chip packaging member and producing method thereof | |
EP2851942A3 (en) | Packaging method for electronic components using a thin substrate | |
CN101722379B (en) | Preparation process of ball grid array encapsulation lead-free tin ball | |
CN104894440A (en) | Ultra-fine silicon-aluminum flat wire strip and preparation method thereof | |
TWI628724B (en) | High-density integrated circuit package structure and integrated circuit | |
CN107552582A (en) | A kind of Bidirectional power metallic bond plying wire drawing die preparation method | |
CN106935518B (en) | Chip packaging method | |
CN201596688U (en) | Wire-drawing die for manufacturing ultrafine diameter leadless solder | |
CN104992937A (en) | Ultra-thin single crystal copper flat silk ribbon and preparation method thereof | |
CN109182826B (en) | High-strength-toughness low-resistivity silver-gold alloy bonding wire | |
CN209006685U (en) | A kind of device of the high-volume low cost production small ball of noble metal standard | |
CN102332407A (en) | Technology for manufacturing ceramic cofiring four-side lead flat package | |
CN102222624A (en) | Preparation method of single crystal copper wire |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
GR01 | Patent grant | ||
GR01 | Patent grant | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: A preparation method of ultra fine precious metal extrusion flat die Effective date of registration: 20200814 Granted publication date: 20170815 Pledgee: Jiangsu Jiangyin Rural Commercial Bank Co.,Ltd. Tianchang sub branch Pledgor: ANHUI JIEAO ELECTRONIC Co.,Ltd. Registration number: Y2020980004988 |