CN104894425A - Ultrathin silver flat ribbon and preparation method thereof - Google Patents

Ultrathin silver flat ribbon and preparation method thereof Download PDF

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Publication number
CN104894425A
CN104894425A CN201510278222.4A CN201510278222A CN104894425A CN 104894425 A CN104894425 A CN 104894425A CN 201510278222 A CN201510278222 A CN 201510278222A CN 104894425 A CN104894425 A CN 104894425A
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China
Prior art keywords
silver
parts
auxiliary
raw
super
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CN201510278222.4A
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Chinese (zh)
Inventor
范国伟
范长云
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安徽捷澳电子有限公司
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Priority to CN201510278222.4A priority Critical patent/CN104894425A/en
Publication of CN104894425A publication Critical patent/CN104894425A/en

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    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42Wire connectors; Manufacturing methods related thereto
    • H01L24/44Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L24/45Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L24/00Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42Wire connectors; Manufacturing methods related thereto
    • H01L24/43Manufacturing methods
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/43Manufacturing methods
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/44Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/44Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001Core members of the connector
    • H01L2224/4501Shape
    • H01L2224/45012Cross-sectional shape
    • H01L2224/45014Ribbon connectors, e.g. rectangular cross-section
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/44Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001Core members of the connector
    • H01L2224/45099Material
    • H01L2224/451Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45139Silver (Ag) as principal constituent
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/00011Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group

Abstract

The invention discloses an ultrathin silver flat ribbon, and relates to the technical field of production of bonding leads. The ultrathin silver flat ribbon is mainly manufactured from silver and an accessory, wherein the ratio of the silver to the accessory is 99.99: 0.01; and the accessory comprises the following raw materials in parts by weight: 1-3 parts of iron, 3-5 parts of copper, 1-3 parts of manganese, 2-3 parts of magnesium, 1-4 parts of chrome, 3-4 parts of titanium, 2-5 parts of beryllium, and 1-4 parts of aluminum. The ultrathin silver flat ribbon has the following beneficial effects: the process flow is simple; the raw material batching is reasonable; and as the silver and other mixed accessories are reasonably matched, and scientific and ordered steps are used for processing, prepared bonding wires are excellent in product quality and finer in fineness, are suitable for the present demands of the electronic industry, are applicable to various precise electronic devices, are excellent in use effect, and are convenient for promotion and application.

Description

Thin silver-colored flat filament band of a kind of super and preparation method thereof

Technical field

The present invention relates to bonding wire production technical field, be specifically related to thin silver-colored flat filament band of a kind of super and preparation method thereof.

Background technology

Bonding wire is widely used in LED, semiconductor integrated circuit, and as civilian consumer's goods IC: computer, mobile phone, on the chips such as televisor.Industry IC: large server, motor, intelligent instrument instrument, holder, the chips such as medical apparatus and instruments, and photovoltaic, the Electronic Packaging such as diode triode.

Along with the development of market and technology, chip functions constantly strengthens, lead-in wire is more and more, and volume is more and more less, pad area ratio shared in whole chip is caused constantly to rise, therefore, Studies of The Superfine spacing bonding techniques is the gordian technique that the miniaturization of solution chip must solve, but the performance of the bonding wire produced in the market still compares poor, and it is when preparation, selected batching is also unreasonable, the mode of simultaneously processing is short of, be easy to cause lead-in wire even not, result of use is also not obvious, the demand of people can not be met.

Summary of the invention:

It is reasonable that technical problem to be solved by this invention is to provide a kind of formulation ratio, and preparation technology is thin silver-colored flat filament band of super and preparation method thereof simply and easily.

Technical problem to be solved by this invention realizes by the following technical solutions:

The thin silver-colored flat filament band of a kind of super, is characterized in that: make primarily of silver and auxiliary material, described silver and the ratio of auxiliary material are 99.99:0.01;

Described auxiliary material comprises the raw material of following weight part: iron 1-3 part, copper 3-5 part, manganese 1-3 part, magnesium 2-3 part, chromium 1-4 part, titanium 3-4 part, beryllium 2-5 part, aluminium 1-4 part.

The preferred weight part of described auxiliary material is: iron 2 parts, copper 4 parts, 2 parts, manganese, 2.5 parts, magnesium, chromium 2.5 parts, titanium 3.5 parts, beryllium 3.5 parts, 2.5 parts, aluminium.

Another object of the present invention is to provide a kind of method preparing the thin silver-colored flat filament band of super of the present invention, it is characterized in that comprising the following steps:

A, select a vacuum melting furnace, put in vacuum melting furnace by the silver in raw material, adjustment in-furnace temperature is 700-1200 DEG C, carries out high melt, in fusion process, pour nitrogen and argon gas is protected;

B, after silver completely melting, added successively by auxiliary material in raw material and enter smelting furnace, controlling rotating speed is that the speed of 2500-3000r/min carries out high-speed stirring, after stirring, leaves standstill 45 minutes;

C, by the raw material in above-mentioned steps b by casting die, cast out the silver-colored bar that diameter is 8mm, then naturally cooling;

D, the silver-colored bar mould of 8mm is drawn into thick 3mm filamentary silver material, by thick for 3mm filamentary silver with the high temperature annealing 65 minutes of 500-900 DEG C, after then carrying out cold extrusion 8-10 time, obtains the filamentary silver material of required fineness;

E, by the filamentary silver after steps d process with the high temperature annealing 45 minutes of 400-600 DEG C to eliminate machining stress, furnace cooling, be then cold drawn to required diameter;

F, by the filamentary silver in step e after the flat mould heart is worked into required specification, finally namely can be made into the thin silver-colored flat filament band of super after naturally cooling again.

The invention has the beneficial effects as follows: present invention process flow process is succinct, reasonable raw material proportioning, after carrying out rational proportion by silver and other mixed accessories, processed by the step of scientific order, the bonding wire of making not only quality product is excellent, the fineness of making more refinement, be applicable to the demand of present stage electron trade, be applicable to various sophisticated electronics, result of use is good, is convenient to promote and use.

Embodiment

The technique means realized to make the present invention, creation characteristic, reaching object and effect is easy to understand, below in conjunction with specific embodiment, setting forth the present invention further.

Embodiment 1

Take the silver of 99.99g and the auxiliary material of 0.01g, (auxiliary material is configured according to the component of iron 1 part, copper 3 parts, 1 part, manganese, 2 parts, magnesium, chromium 1 part, titanium 3 parts, beryllium 2 parts, 1 part, aluminium), then a vacuum melting furnace is selected, silver in raw material is put in vacuum melting furnace, in-furnace temperature is regulated to be 700 DEG C, carry out high melt, in fusion process, nitrogen be poured and argon gas is protected, after silver completely melting, auxiliary material in raw material is added successively and enters smelting furnace, control rotating speed is that the speed of 2500r/min carries out high-speed stirring, after stirring, leave standstill and pass through casting die after 45 minutes, cast out the silver-colored bar that diameter is 8mm, then naturally cooling, thick 3mm filamentary silver material is drawn into again with mould, by thick for 3mm filamentary silver with the high temperature annealing 65 minutes of 500 DEG C, then the filamentary silver material of required fineness is obtained after carrying out cold extrusion 8-10 time, filamentary silver with the high temperature annealing 45 minutes of 400 DEG C to eliminate machining stress, furnace cooling, then required diameter is cold drawn to after the flat mould heart is worked into required specification, namely the thin silver-colored flat filament band of super is can be made into after last naturally cooling again.

Embodiment 2

Take the silver of 999.9g and the auxiliary material of 0.1g, (auxiliary material is configured according to the component of iron 2 parts, copper 4 parts, 2 parts, manganese, 2.5 parts, magnesium, chromium 2.5 parts, titanium 3.5 parts, beryllium 3.5 parts, 2.5 parts, aluminium), then a vacuum melting furnace is selected, silver in raw material is put in vacuum melting furnace, in-furnace temperature is regulated to be 950 DEG C, carry out high melt, in fusion process, nitrogen be poured and argon gas is protected, after silver completely melting, auxiliary material in raw material is added successively and enters smelting furnace, control rotating speed is that the speed of 2750r/min carries out high-speed stirring, after stirring, leave standstill and pass through casting die after 45 minutes, cast out the silver-colored bar that diameter is 8mm, then naturally cooling, thick 3mm filamentary silver material is drawn into again with mould, by thick for 3mm filamentary silver with the high temperature annealing 65 minutes of 750 DEG C, then the filamentary silver material of required fineness is obtained after carrying out cold extrusion 8-10 time, filamentary silver with the high temperature annealing 45 minutes of 500 DEG C to eliminate machining stress, furnace cooling, then required diameter is cold drawn to after the flat mould heart is worked into required specification, namely the thin silver-colored flat filament band of super is can be made into after last naturally cooling again.

More than show and describe ultimate principle of the present invention and principal character and advantage of the present invention.The technician of the industry should understand; the present invention is not restricted to the described embodiments; what describe in above-described embodiment and specification sheets just illustrates principle of the present invention; without departing from the spirit and scope of the present invention; the present invention also has various changes and modifications, and these changes and improvements all fall in the claimed scope of the invention.Application claims protection domain is defined by appending claims and equivalent thereof.

Claims (3)

1. the thin silver-colored flat filament band of super, is characterized in that: make primarily of silver and auxiliary material, described silver and the ratio of auxiliary material are 99.99:0.01;
Described auxiliary material comprises the raw material of following weight part: iron 1-3 part, copper 3-5 part, manganese 1-3 part, magnesium 2-3 part, chromium 1-4 part, titanium 3-4 part, beryllium 2-5 part, aluminium 1-4 part.
2. the thin silver-colored flat filament band of a kind of super according to claim 1, it is characterized in that, the preferred weight part of described auxiliary material is: iron 2 parts, copper 4 parts, 2 parts, manganese, 2.5 parts, magnesium, chromium 2.5 parts, titanium 3.5 parts, beryllium 3.5 parts, 2.5 parts, aluminium.
3. prepare a method for the thin silver-colored flat filament band of a kind of super of the present invention, it is characterized in that, comprise the following steps:
A, select a vacuum melting furnace, put in vacuum melting furnace by the silver in raw material, adjustment in-furnace temperature is 700-1200 DEG C, carries out high melt, in fusion process, pour nitrogen and argon gas is protected;
B, after silver completely melting, added successively by auxiliary material in raw material and enter smelting furnace, controlling rotating speed is that the speed of 2500-3000r/min carries out high-speed stirring, after stirring, leaves standstill 45 minutes;
C, by the raw material in above-mentioned steps b by casting die, cast out the silver-colored bar that diameter is 8mm, then naturally cooling;
D, the silver-colored bar mould of 8mm is drawn into thick 3mm filamentary silver material, by thick for 3mm filamentary silver with the high temperature annealing 65 minutes of 500-900 DEG C, after then carrying out cold extrusion 8-10 time, obtains the filamentary silver material of required fineness;
E, by the filamentary silver after steps d process with the high temperature annealing 45 minutes of 400-600 DEG C to eliminate machining stress, furnace cooling, be then cold drawn to required diameter;
F, by the filamentary silver in step e after the flat mould heart is worked into required specification, finally namely can be made into the thin silver-colored flat filament band of super after naturally cooling again.
CN201510278222.4A 2015-05-27 2015-05-27 Ultrathin silver flat ribbon and preparation method thereof CN104894425A (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107653400A (en) * 2017-09-05 2018-02-02 钱友静 A kind of silver foil for painting and calligraphy incrustation
CN111411253A (en) * 2020-04-14 2020-07-14 紫金矿业集团黄金冶炼有限公司 Preparation method of high-purity silver-copper alloy special-shaped wire

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001176912A (en) * 1999-12-16 2001-06-29 Noge Denki Kogyo:Kk Silver wire bonding wire filmed with gold
US20100239456A1 (en) * 2009-03-23 2010-09-23 Lee Jun-Der Composite alloy bonding wire and manufacturing method thereof
CN102214630A (en) * 2011-05-18 2011-10-12 苏州衡业新材料科技有限公司 Silver-base microalloy bonding wire and preparation method thereof
CN103614588A (en) * 2013-11-19 2014-03-05 苏州衡业新材料科技有限公司 Preparation method of silver/silver alloy microwire

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001176912A (en) * 1999-12-16 2001-06-29 Noge Denki Kogyo:Kk Silver wire bonding wire filmed with gold
US20100239456A1 (en) * 2009-03-23 2010-09-23 Lee Jun-Der Composite alloy bonding wire and manufacturing method thereof
CN102214630A (en) * 2011-05-18 2011-10-12 苏州衡业新材料科技有限公司 Silver-base microalloy bonding wire and preparation method thereof
CN103614588A (en) * 2013-11-19 2014-03-05 苏州衡业新材料科技有限公司 Preparation method of silver/silver alloy microwire

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107653400A (en) * 2017-09-05 2018-02-02 钱友静 A kind of silver foil for painting and calligraphy incrustation
CN111411253A (en) * 2020-04-14 2020-07-14 紫金矿业集团黄金冶炼有限公司 Preparation method of high-purity silver-copper alloy special-shaped wire

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Application publication date: 20150909