CN104877400A - Micro-electronic surface anti-acid coating and preparation method of micro-electronic surface anti-acid coating - Google Patents
Micro-electronic surface anti-acid coating and preparation method of micro-electronic surface anti-acid coating Download PDFInfo
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- CN104877400A CN104877400A CN201510265008.5A CN201510265008A CN104877400A CN 104877400 A CN104877400 A CN 104877400A CN 201510265008 A CN201510265008 A CN 201510265008A CN 104877400 A CN104877400 A CN 104877400A
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Abstract
The invention discloses a micro-electronic surface anti-acid coating and a preparation method of the micro-electronic surface anti-acid coating. The micro-electronic surface anti-acid coating is mainly prepared from the following raw materials in parts by weight: 13-45 parts of quartz sand, 12-40 parts of petroleum coke, 9-25 parts of saw dust, 8-20 parts of sodium chloride, 1-9 parts of titanium dioxide, 13-30 parts of ethyl alcohol and 30-55 parts of water. Compared with the prior art, the micro-electronic surface anti-acid coating has the following technical effects: firstly, the prepared micro-electronic surface anti-acid coating provided by adopting the preparation method is flexible and good in air permeability; secondly, the prepared micro-electronic surface anti-acid coating can be directly sprayed to the surfaces of products, is simple and convenient to operate, harmless to the environment, non-toxic, and easy to clean; finally, the prepared micro-electronic surface anti-acid coating is water-proof, has an extremely high acid resistance, so as to resist corrosion of the external environment.
Description
Technical field
The present invention relates to chemical coating field, particularly relate to a kind of microelectronics surface acid resistant coating and preparation method thereof.
Background technology
Microelectronics is the core technology of high-tech and information industry.Microelectronic industry is infrastructural industries, why develops so fast, and except technology itself is to except the tremendous contribution of national economy, also extremely strong with it perviousness is relevant.In addition, modern war by be take unicircuit as gordian technique, the high-tech war that is feature with electronic warfare and information war.
The seventies, microelectronics enters the new stage centered by large-scale integrated circuit.Along with integration density improves day by day, unicircuit forward integrated system develops, and the design of circuit is also day by day complicated, time-consuming and expensive.If in fact do not have the auxiliary of computer, the design of more complicated large-scale integrated circuit is impossible.Since the seventies, what unicircuit utilized computer is designed with very large progress.The computer assisted design supervisor of the computer aided design (CAD) of making a plate, device simulation, electric circuit analogy, logical simulation, placement-and-routing, all successively study successfully, and develop into the hybrid computer aided design comprising check, optimize scheduling algorithm, and even the computer aided design system of whole plant.
In production, storage and use procedure, microelectronic product is faced with the risk be corroded, and in prior art, manufacturers often adopts the method for encapsulation to protect microelectronic product.The method effectively can solve the problem that microelectronic product is corroded, but there is complicated operation equally, wastes the problem of process period.
Summary of the invention
The technical problem solved: the invention provides a kind of microelectronics surface acid resistant coating and preparation method thereof; by the method becoming aqua to spray Raw material processing; prepare one and can be sprayed directly on microelectronic product surface, form the protective layer of one deck densification, consolidation.
To achieve these goals, the present invention is by the following technical solutions:
A kind of microelectronics surface acid resistant coating, makes primarily of following raw materials by weight portion proportioning: quartz sand 13 ~ 45 parts, refinery coke 12 ~ 40 parts, wood chip 9 ~ 25 parts, 8 ~ 20 parts, sodium-chlor, titanium dioxide 1 ~ 9 part, ethanol 13 ~ 30 parts, 30 ~ 55 parts, water.
As a modification of the present invention, described microelectronics surface acid resistant coating is made primarily of following raw materials by weight portion proportioning: quartz sand 40 parts, refinery coke 32 parts, wood chip 21 parts, 13 parts, sodium-chlor, titanium dioxide 7 parts, ethanol 26 parts, 48 parts, water.
A preparation method for microelectronics surface acid resistant coating, comprises following steps:
(1) quartz sand, refinery coke and wood chip are pulverized, powder diameter is 400 ~ 600 orders;
(2) powder step (1) obtained and sodium chloride powder drop in high temperature resistance furnace, radiation heating, and temperature is maintained at 1000 ~ 1200 DEG C, 0.5 ~ 1 hour;
(3) powder after step (2) pyrotic smelting is added to the water after 3 ~ 6:1 mixes with titania powder, adds ethanol wherein while stirring, can obtain microelectronics surface acid resistant coating to all dissolving.
As a preferred embodiment of the present invention, powder step (1) obtained in step (2) and sodium chloride powder drop in high temperature resistance furnace, and radiation heating, temperature is maintained at 1200 DEG C, 1 hour.
As a preferred embodiment of the present invention, in step (3), powder after step (2) pyrotic smelting is added to the water after 5:1 mixes with titania powder, adds ethanol wherein while stirring, can obtain microelectronics surface acid resistant coating to all dissolving.
beneficial effect
Compared with prior art, following technique effect can be brought after the present invention adopts above technical scheme:
First, the flexible and good permeability of the microelectronics surface acid resistant coating prepared of the present invention;
Secondly, microelectronics surface acid resistant coating prepared by the present invention directly can be sprayed to product surface, easy and simple to handle and environmental sound, nontoxic, easy cleaning;
Finally, microelectronics prepared by the present invention surface acid resistant coating is except except waterproof, can having extremely strong acid resistance, thus can resist the corrosion of external environment.
Embodiment
Embodiment 1
A kind of microelectronics surface acid resistant coating, makes primarily of following raw materials by weight portion proportioning: quartz sand 13 parts, refinery coke 12 parts, wood chip 9 parts, 8 parts, sodium-chlor, titanium dioxide 1 part, ethanol 13 parts, 30 parts, water.
A preparation method for microelectronics surface acid resistant coating, comprises following steps:
(1) quartz sand, refinery coke and wood chip are pulverized, powder diameter is 400 orders;
(2) powder step (1) obtained and sodium chloride powder drop in high temperature resistance furnace, radiation heating, and temperature is maintained at 1000 DEG C, 0.5 hour;
(3) powder after step (2) pyrotic smelting is added to the water after 3:1 mixes with titania powder, adds ethanol wherein while stirring, can obtain microelectronics surface acid resistant coating to all dissolving.
Embodiment 2
A kind of microelectronics surface acid resistant coating, makes primarily of following raw materials by weight portion proportioning: quartz sand 40 parts, refinery coke 32 parts, wood chip 21 parts, 13 parts, sodium-chlor, titanium dioxide 7 parts, ethanol 26 parts, 48 parts, water.
A preparation method for microelectronics surface acid resistant coating, comprises following steps:
(1) quartz sand, refinery coke and wood chip are pulverized, powder diameter is 600 orders;
(2) powder step (1) obtained and sodium chloride powder drop in high temperature resistance furnace, radiation heating, and temperature is maintained at 1200 DEG C, 1 hour;
(3) powder after step (2) pyrotic smelting is added to the water after 5:1 mixes with titania powder, adds ethanol wherein while stirring, can obtain microelectronics surface acid resistant coating to all dissolving.
Embodiment 3
A kind of microelectronics surface acid resistant coating, makes primarily of following raw materials by weight portion proportioning: quartz sand 45 parts, refinery coke 40 parts, wood chip 25 parts, 20 parts, sodium-chlor, titanium dioxide 9 parts, ethanol 30 parts, 55 parts, water.
A preparation method for microelectronics surface acid resistant coating, comprises following steps:
(1) quartz sand, refinery coke and wood chip are pulverized, powder diameter is 600 orders;
(2) powder step (1) obtained and sodium chloride powder drop in high temperature resistance furnace, radiation heating, and temperature maintains 1200 DEG C, 1 hour;
(3) powder after step (2) pyrotic smelting is added to the water after 6:1 mixes with titania powder, adds ethanol wherein while stirring, can obtain microelectronics surface acid resistant coating to all dissolving.
After the microelectronics surface acid resistant coating prepared above-described embodiment 1 ~ 3 detects, result is as follows:
| Coat-thickness | Can tolerable pH range | Water resistance | Permeability | |
| Embodiment 1 | 0.1mm | 4~7 | By force | By force |
| Embodiment 2 | 0.1mm | 1~7 | By force | By force |
| Embodiment 3 | 0.1mm | 3~7 | By force | By force |
Claims (5)
1. a microelectronics surface acid resistant coating, it is characterized in that, make primarily of following raw materials by weight portion proportioning: quartz sand 13 ~ 45 parts, refinery coke 12 ~ 40 parts, wood chip 9 ~ 25 parts, 8 ~ 20 parts, sodium-chlor, titanium dioxide 1 ~ 9 part, ethanol 13 ~ 30 parts, 30 ~ 55 parts, water.
2. a kind of microelectronics surface acid resistant coating according to claim 1, it is characterized in that, make primarily of following raw materials by weight portion proportioning: quartz sand 40 parts, refinery coke 32 parts, wood chip 21 parts, 13 parts, sodium-chlor, titanium dioxide 7 parts, ethanol 26 parts, 48 parts, water.
3. the preparation method of a kind of microelectronics surface according to claim 1 acid resistant coating, is characterized in that, comprise following steps:
(1) quartz sand, refinery coke and wood chip are pulverized, powder diameter is 400 ~ 600 orders;
(2) powder step (1) obtained and sodium chloride powder drop in high temperature resistance furnace, radiation heating, and temperature is maintained at 1000 ~ 1200 DEG C, 0.5 ~ 1 hour;
(3) powder after step (2) pyrotic smelting is added to the water after 3 ~ 6:1 mixes with titania powder, adds ethanol wherein while stirring, can obtain microelectronics surface acid resistant coating to all dissolving.
4. the preparation method of a kind of microelectronics surface acid resistant coating according to claim 3, it is characterized in that, powder step (1) obtained in step (2) and sodium chloride powder drop in high temperature resistance furnace, and radiation heating, temperature is maintained at 1200 DEG C, 1 hour.
5. the preparation method of a kind of microelectronics surface acid resistant coating according to claim 3, it is characterized in that, in step (3), powder after step (2) pyrotic smelting is added to the water after 5:1 mixes with titania powder, adding ethanol wherein while stirring, microelectronics surface acid resistant coating can be obtained to all dissolving.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201510265008.5A CN104877400A (en) | 2015-05-22 | 2015-05-22 | Micro-electronic surface anti-acid coating and preparation method of micro-electronic surface anti-acid coating |
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| CN201510265008.5A CN104877400A (en) | 2015-05-22 | 2015-05-22 | Micro-electronic surface anti-acid coating and preparation method of micro-electronic surface anti-acid coating |
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| CN201510265008.5A Pending CN104877400A (en) | 2015-05-22 | 2015-05-22 | Micro-electronic surface anti-acid coating and preparation method of micro-electronic surface anti-acid coating |
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Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101643612A (en) * | 2009-07-17 | 2010-02-10 | 华南农业大学 | Waterproof antiseptic wearproof nano paint, preparation method, use method and application thereof |
| CN103952021A (en) * | 2014-04-23 | 2014-07-30 | 苏州羽帆新材料科技有限公司 | Anti-corrosion waterproof coating and preparation method thereof |
-
2015
- 2015-05-22 CN CN201510265008.5A patent/CN104877400A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101643612A (en) * | 2009-07-17 | 2010-02-10 | 华南农业大学 | Waterproof antiseptic wearproof nano paint, preparation method, use method and application thereof |
| CN103952021A (en) * | 2014-04-23 | 2014-07-30 | 苏州羽帆新材料科技有限公司 | Anti-corrosion waterproof coating and preparation method thereof |
Non-Patent Citations (1)
| Title |
|---|
| 杨其新等: "《隧道及地下工程喷膜防水》", 28 February 2010 * |
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Application publication date: 20150902 |