CN104805439A - Super-roughening microetchant for circuit board and preparation method thereof - Google Patents
Super-roughening microetchant for circuit board and preparation method thereof Download PDFInfo
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- CN104805439A CN104805439A CN201410847345.0A CN201410847345A CN104805439A CN 104805439 A CN104805439 A CN 104805439A CN 201410847345 A CN201410847345 A CN 201410847345A CN 104805439 A CN104805439 A CN 104805439A
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Abstract
The invention relates to the technical field of metal surface treating agents, specifically to a super-roughening microetchant for a circuit board and a preparation method thereof. The super-roughening microetchant is composed of the following raw materials, by weight, 10-20% of sodium formate, 1-5% of sodium chloride, 3-25% of mixed acid, 0.1-1% of a corrosion inhibitor and the balance being deionized water, wherein the mixed acid is a mixture of an inorganic acid and an organic acid; and the corrosion inhibitor is a mixture of an inorganic corrosion inhibitor and an organic corrosion inhibitor. The super-roughening microetchant for a circuit board has stable ingredients and has long service life. The super-roughening microetchant for a circuit board can be used to effectively remove oxide on metal surface and endow metal surface with good roughness after metal surface undergoes microetching. The super-roughening microetchant for a circuit board is especially suitable for raising binding force between a copper surface and a green paint.
Description
Technical field
The present invention relates to metal conditioner technical field, super alligatoring micro-etching agent particularly relating to a kind of wiring board and preparation method thereof.
Background technology
Manufacturing in wiring board process, in order to improve the binding property of metal, being beneficial to the pressing process that technique is follow-up, before use metal, need the oxide compound removing its surface.The surface treatment agent with strong oxidizing property that adopts removes the oxide compound of metallic surface and forms coarse surface more at present.
But existing technology is coarse not to the process of metallic surface, make to be difficult to obtain good pressing effect.Especially for the preparation of some little wiring boards, if metal finishing obtains coarse not, be difficult to prepare desirable wiring board.Therefore, the developing direction that a kind of surface treatment agent with excellent etch effect is metal finishing etching technique is from now on developed.
Summary of the invention
The object of the invention is to for the deficiencies in the prior art, super alligatoring micro-etching agent providing a kind of wiring board and preparation method thereof, its stable components, not easily decompose, long service life, effectively can remove the oxide compound of metallic surface, can make again metallic surface after microetch, have good roughness.
A super alligatoring micro-etching agent for wiring board, it is made up of the raw material of following weight percent:
Sodium formiate 10%-20%
Sodium-chlor 1%-5%
Mixing acid 3%-25%
Inhibiter 0.1%-1%
Deionized water surplus,
Wherein, described mixing acid is mineral acid and organic acid mixture;
Wherein, described inhibiter is the mixture of inorganic inhibitor and organic inhibitor.
Preferably, it is made up of the raw material of following weight percent:
Sodium formiate 10%-20%
Sodium-chlor 1%-5%
Methylene-succinic acid 1%-5%
Formic acid 1%-10%
Hydrochloric acid 1%-10%
Inhibiter 0.1%-1%
Deionized water surplus.
More preferred, it is made up of the raw material of following weight percent:
Sodium formiate 10%-20%
Sodium-chlor 1%-5%
Methylene-succinic acid 1%-5%
Formic acid 1%-10%
Hydrochloric acid 1%-10%
Sodium polyphosphate 0.05%-0.5%
Benzotriazole 0.02%-0.2%
2-bromo-4-aldehyde radical thiazole 0.03%-0.3%
Deionized water surplus.
Another is preferred, and it is made up of the raw material of following weight percent:
Sodium formiate 10%-20%
Sodium-chlor 1%-5%
Acetic acid 1%-10%
Hydrochloric acid 1%-10%
Phosphatase 11 %-5%
Inhibiter 0.1%-1%
Deionized water surplus.
Another is more preferred, and it is made up of the raw material of following weight percent:
Sodium formiate 10%-20%
Sodium-chlor 1%-5%
Acetic acid 1%-10%
Hydrochloric acid 1%-10%
Phosphatase 11 %-5%
Sodium polyphosphate 0.02%-0.2%
Benzotriazole 0.05%-0.5%
4-chlorobenzenesulfonic acid 0.03%-0.3%
Deionized water surplus.
Preferably another, it is made up of the raw material of following weight percent:
Sodium formiate 10%-20%
Sodium-chlor 1%-5%
Methylene-succinic acid 1%-5%
Acetic acid 1%-10%
Hydrochloric acid 1%-10%
Inhibiter 0.1%-1%
Deionized water surplus.
Another more preferred, it is made up of the raw material of following weight percent:
Sodium formiate 10%-20%
Sodium-chlor 1%-5%
Methylene-succinic acid 1%-5%
Acetic acid 1%-10%
Hydrochloric acid 1%-10%
Sodium polyphosphate 0.02%-0.2%
3-thiazole-2-formyl chloride 0.05%-0.5%
4-chlorobenzenesulfonic acid 0.03%-0.3%
Deionized water surplus.
The mass percent concentration of described hydrochloric acid is 37%.
The mass percent concentration of described phosphoric acid is 86%.
Formic acid of the present invention and acetic acid all adopt commercially available technical grade.
A preparation method for the super alligatoring micro-etching agent of wiring board, adds sodium formiate, sodium-chlor, mixing acid, inhibiter, water stirs, obtain a kind of super alligatoring micro-etching agent of wiring board in reactor.
Sodium-chlor mainly provides chlorion, the dissolving of auxiliary copper, avoids the formation of copper sludge precipitation.
Mixing acid is for reducing or the oxide compound on stripping metal surface, and mixing acid mineral acid and organic acid cooperatively interact, and can provide the sour environment of steady operation for micro-etching agent.
Inhibiter can form the close and film of reality of one deck on the metal surface, and prevent etching speed too fast, inorganic inhibitor and organic inhibitor cooperatively interact, and can learn from other's strong points to offset one's weaknesses, effective and lasting performance slow releasing function.
Beneficial effect of the present invention is: compared with the prior art comparatively, beneficial effect is in the present invention:
1) the super alligatoring micro-etching agent stable components of wiring board provided by the invention, work-ing life is longer.
2) the super alligatoring micro-etching agent of wiring board provided by the invention effectively can remove the oxide compound of metallic surface, can make again metallic surface after microetch, have good roughness.
3) the super alligatoring micro-etching agent of wiring board provided by the invention is specially adapted to the bonding force improving copper face and green paint.
Accompanying drawing explanation
Fig. 1 is the scanning electron microscope (SEM) photograph obtained after the super alligatoring micro-etching agent process metal surfaces of the wiring board that the present invention utilizes embodiment 1 to obtain.
Fig. 2 is the scanning electron microscope (SEM) photograph obtained after the super alligatoring micro-etching agent process metal surfaces of the wiring board that the present invention utilizes embodiment 2 to obtain.
Fig. 3 is the scanning electron microscope (SEM) photograph obtained after the super alligatoring micro-etching agent process metal surfaces of the wiring board that the present invention utilizes embodiment 3 to obtain.
Fig. 4 is the scanning electron microscope (SEM) photograph obtained after the super alligatoring micro-etching agent process metal surfaces of the wiring board that the present invention utilizes embodiment 4 to obtain.
Fig. 5 is the scanning electron microscope (SEM) photograph obtained after the super alligatoring micro-etching agent process metal surfaces of the wiring board that the present invention utilizes embodiment 5 to obtain.
Fig. 6 is the scanning electron microscope (SEM) photograph obtained after the super alligatoring micro-etching agent process metal surfaces of the wiring board that the present invention utilizes embodiment 6 to obtain.
Embodiment
Below by embodiment, the invention will be further described, but practical range of the present invention is not limited to this.
Embodiment 1.
A super alligatoring micro-etching agent for wiring board, it is made up of the raw material of following weight percent:
Sodium formiate 12%
Sodium-chlor 2%
Methylene-succinic acid 2%
Formic acid 9%
Hydrochloric acid 5%
Sodium polyphosphate 0.05%
Benzotriazole 0.02%
2-bromo-4-aldehyde radical thiazole 0.3%
Deionized water surplus.
The mass percent concentration of described hydrochloric acid is 37%.
The mass percent concentration of described phosphoric acid is 86%.
In reactor, add sodium formiate, sodium-chlor, mixing acid, inhibiter, water stirs, obtain a kind of super alligatoring micro-etching agent of wiring board.
The surface treatment agent etch-rate that the present embodiment obtains is fast, stable components, long service life, and the surface treatment agent using the present embodiment to obtain soaks metal substrate, and surface treatment agent temperature is 35 DEG C, and soak time is 1min.Then utilize scanning electron microscope observe the metallic surface handled well and take pictures, can be observed metallic surface and there is good surfaceness.
Embodiment 2.
A super alligatoring micro-etching agent for wiring board, it is made up of the raw material of following weight percent:
Sodium formiate 18%
Sodium-chlor 4%
Methylene-succinic acid 3%
Formic acid 8%
Hydrochloric acid 2%
Sodium polyphosphate 0.4%
Benzotriazole 0.1%
2-bromo-4-aldehyde radical thiazole 0.2%
Deionized water surplus.
The mass percent concentration of described hydrochloric acid is 37%.
The mass percent concentration of described phosphoric acid is 86%.
In reactor, add sodium formiate, sodium-chlor, mixing acid, inhibiter, water stirs, obtain a kind of super alligatoring micro-etching agent of wiring board.
The surface treatment agent etch-rate that the present embodiment obtains is fast, stable components, long service life, and the surface treatment agent using the present embodiment to obtain soaks metal substrate, and surface treatment agent temperature is 38 DEG C, and soak time is 2min.Then utilize scanning electron microscope observe the metallic surface handled well and take pictures, can be observed metallic surface and there is good surfaceness.
Embodiment 3.
A super alligatoring micro-etching agent for wiring board, it is made up of the raw material of following weight percent:
Sodium formiate 15%
Sodium-chlor 3%
Acetic acid 2%
Hydrochloric acid 9%
Phosphoric acid 2%
Sodium polyphosphate 0.1%
Benzotriazole 0.3%
4-chlorobenzenesulfonic acid 0.09%
Deionized water surplus.
The mass percent concentration of described hydrochloric acid is 37%.
The mass percent concentration of described phosphoric acid is 86%.
In reactor, add sodium formiate, sodium-chlor, mixing acid, inhibiter, water stirs, obtain a kind of super alligatoring micro-etching agent of wiring board.
The surface treatment agent etch-rate that the present embodiment obtains is fast, stable components, long service life, and the surface treatment agent using the present embodiment to obtain soaks metal substrate, and surface treatment agent temperature is 40 DEG C, and soak time is 1min.Then utilize scanning electron microscope observe the metallic surface handled well and take pictures, can be observed metallic surface and there is good surfaceness.
Embodiment 4.
A super alligatoring micro-etching agent for wiring board, it is made up of the raw material of following weight percent:
Sodium formiate 18%
Sodium-chlor 4%
Acetic acid 6%
Hydrochloric acid 4%
Phosphoric acid 5%
Sodium polyphosphate 0.2%
Benzotriazole 0.05%
4-chlorobenzenesulfonic acid 0.3%
Deionized water surplus.
The mass percent concentration of described hydrochloric acid is 37%.
The mass percent concentration of described phosphoric acid is 86%.
In reactor, add sodium formiate, sodium-chlor, mixing acid, inhibiter, water stirs, obtain a kind of super alligatoring micro-etching agent of wiring board.
The surface treatment agent etch-rate that the present embodiment obtains is fast, stable components, long service life, and the surface treatment agent using the present embodiment to obtain soaks metal substrate, and surface treatment agent temperature is 40 DEG C, and soak time is 1min.Then utilize scanning electron microscope observe the metallic surface handled well and take pictures, can be observed metallic surface and there is good surfaceness.
Embodiment 5.
A super alligatoring micro-etching agent for wiring board, it is made up of the raw material of following weight percent:
Sodium formiate 10%
Sodium-chlor 1%
Methylene-succinic acid 5%
Acetic acid 8%
Hydrochloric acid 4%
Sodium polyphosphate 0.2%
3-thiazole-2-formyl chloride 0.05%
4-chlorobenzenesulfonic acid 0.3%
Deionized water surplus.
The mass percent concentration of described hydrochloric acid is 37%.
The mass percent concentration of described phosphoric acid is 86%.
In reactor, add sodium formiate, sodium-chlor, mixing acid, inhibiter, water stirs, obtain a kind of super alligatoring micro-etching agent of wiring board.
The surface treatment agent etch-rate that the present embodiment obtains is fast, stable components, long service life, and the surface treatment agent using the present embodiment to obtain soaks metal substrate, and surface treatment agent temperature is 38 DEG C, and soak time is 2min.Then utilize scanning electron microscope observe the metallic surface handled well and take pictures, can be observed metallic surface and there is good surfaceness.
Embodiment 6.
A super alligatoring micro-etching agent for wiring board, it is made up of the raw material of following weight percent:
Sodium formiate 17%
Sodium-chlor 3%
Methylene-succinic acid 3%
Acetic acid 5%
Hydrochloric acid 6%
Sodium polyphosphate 0.2%
3-thiazole-2-formyl chloride 0.3%
4-chlorobenzenesulfonic acid 0.2%
Deionized water surplus.
The mass percent concentration of described hydrochloric acid is 37%.
The mass percent concentration of described phosphoric acid is 86%.
In reactor, add sodium formiate, sodium-chlor, mixing acid, inhibiter, water stirs, obtain a kind of super alligatoring micro-etching agent of wiring board.
The surface treatment agent etch-rate that the present embodiment obtains is fast, stable components, long service life, and the surface treatment agent using the present embodiment to obtain soaks metal substrate, and surface treatment agent temperature is 36 DEG C, and soak time is 2min.Then utilize scanning electron microscope observe the metallic surface handled well and take pictures, can be observed metallic surface and there is good surfaceness.
Finally should be noted that; above embodiment is only in order to illustrate technical scheme of the present invention; but not limiting the scope of the invention; although done to explain to the present invention with reference to preferred embodiment; those of ordinary skill in the art is to be understood that; can modify to technical scheme of the present invention or equivalent replacement, and not depart from essence and the scope of technical solution of the present invention.
Claims (10)
1. a super alligatoring micro-etching agent for wiring board, is characterized in that: it is made up of the raw material of following weight percent:
Sodium formiate 10%-20%
Sodium-chlor 1%-5%
Mixing acid 3%-25%
Inhibiter 0.1%-1%
Deionized water surplus,
Wherein, described mixing acid is mineral acid and organic acid mixture;
Wherein, described inhibiter is the mixture of inorganic inhibitor and organic inhibitor.
2. the super alligatoring micro-etching agent of a kind of wiring board according to claim 1, is characterized in that: it is made up of the raw material of following weight percent:
Sodium formiate 10%-20%
Sodium-chlor 1%-5%
Methylene-succinic acid 1%-5%
Formic acid 1%-10%
Hydrochloric acid 1%-10%
Inhibiter 0.1%-1%
Deionized water surplus.
3. the super alligatoring micro-etching agent of a kind of wiring board according to claim 2, is characterized in that: it is made up of the raw material of following weight percent:
Sodium formiate 10%-20%
Sodium-chlor 1%-5%
Methylene-succinic acid 1%-5%
Formic acid 1%-10%
Hydrochloric acid 1%-10%
Sodium polyphosphate 0.05%-0.5%
Benzotriazole 0.02%-0.2%
2-bromo-4-aldehyde radical thiazole 0.03%-0.3%
Deionized water surplus.
4. the super alligatoring micro-etching agent of a kind of wiring board according to claim 1, is characterized in that: it is made up of the raw material of following weight percent:
Sodium formiate 10%-20%
Sodium-chlor 1%-5%
Acetic acid 1%-10%
Hydrochloric acid 1%-10%
Phosphatase 11 %-5%
Inhibiter 0.1%-1%
Deionized water surplus.
5. the super alligatoring micro-etching agent of a kind of wiring board according to claim 4, is characterized in that: it is made up of the raw material of following weight percent:
Sodium formiate 10%-20%
Sodium-chlor 1%-5%
Acetic acid 1%-10%
Hydrochloric acid 1%-10%
Phosphatase 11 %-5%
Sodium polyphosphate 0.02%-0.2%
Benzotriazole 0.05%-0.5%
4-chlorobenzenesulfonic acid 0.03%-0.3%
Deionized water surplus.
6. the super alligatoring micro-etching agent of a kind of wiring board according to claim 1, is characterized in that: it is made up of the raw material of following weight percent:
Sodium formiate 10%-20%
Sodium-chlor 1%-5%
Methylene-succinic acid 1%-5%
Acetic acid 1%-10%
Hydrochloric acid 1%-10%
Inhibiter 0.1%-1%
Deionized water surplus.
7. the super alligatoring micro-etching agent of a kind of wiring board according to claim 6, is characterized in that: it is made up of the raw material of following weight percent:
Sodium formiate 10%-20%
Sodium-chlor 1%-5%
Methylene-succinic acid 1%-5%
Acetic acid 1%-10%
Hydrochloric acid 1%-10%
Sodium polyphosphate 0.02%-0.2%
3-thiazole-2-formyl chloride 0.05%-0.5%
4-chlorobenzenesulfonic acid 0.03%-0.3%
Deionized water surplus.
8. the super alligatoring micro-etching agent of a kind of wiring board according to any one of claim 2-7, is characterized in that: the mass percent concentration of described hydrochloric acid is 37%.
9. the super alligatoring micro-etching agent of a kind of wiring board according to claim 4 or 5, is characterized in that: the mass percent concentration of described phosphoric acid is 86%.
10. the preparation method of the super alligatoring micro-etching agent of a kind of wiring board described in any one of claim 1-9, it is characterized in that: in reactor, add sodium formiate, sodium-chlor, mixing acid, inhibiter, water stirs, obtain a kind of super alligatoring micro-etching agent of wiring board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410847345.0A CN104805439B (en) | 2014-12-31 | 2014-12-31 | A kind of super roughening micro-etching agent of wiring board and preparation method thereof |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410847345.0A CN104805439B (en) | 2014-12-31 | 2014-12-31 | A kind of super roughening micro-etching agent of wiring board and preparation method thereof |
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| Publication Number | Publication Date |
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| CN104805439A true CN104805439A (en) | 2015-07-29 |
| CN104805439B CN104805439B (en) | 2017-03-29 |
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| CN201410847345.0A Expired - Fee Related CN104805439B (en) | 2014-12-31 | 2014-12-31 | A kind of super roughening micro-etching agent of wiring board and preparation method thereof |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106521503A (en) * | 2016-11-23 | 2017-03-22 | 昆山尚宇电子科技有限公司 | Organic acid type super coarsening agent for copper surface |
| CN109989083A (en) * | 2019-04-28 | 2019-07-09 | 天水华洋电子科技股份有限公司 | Pretreating process is electroplated in the super roughening lead frame of one kind |
| CN114554703A (en) * | 2022-03-18 | 2022-05-27 | 深圳市板明科技股份有限公司 | Super-roughening process of printed circuit board |
| CN115354327A (en) * | 2022-08-22 | 2022-11-18 | 上海天承化学有限公司 | Micro-etching roughening solution suitable for SAP (super absorbent Polymer) manufacturing process and application thereof |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102286745A (en) * | 2011-09-02 | 2011-12-21 | 广州市天承化工有限公司 | Microetching agent for coarsing copper surface |
-
2014
- 2014-12-31 CN CN201410847345.0A patent/CN104805439B/en not_active Expired - Fee Related
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102286745A (en) * | 2011-09-02 | 2011-12-21 | 广州市天承化工有限公司 | Microetching agent for coarsing copper surface |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106521503A (en) * | 2016-11-23 | 2017-03-22 | 昆山尚宇电子科技有限公司 | Organic acid type super coarsening agent for copper surface |
| CN109989083A (en) * | 2019-04-28 | 2019-07-09 | 天水华洋电子科技股份有限公司 | Pretreating process is electroplated in the super roughening lead frame of one kind |
| CN114554703A (en) * | 2022-03-18 | 2022-05-27 | 深圳市板明科技股份有限公司 | Super-roughening process of printed circuit board |
| CN115354327A (en) * | 2022-08-22 | 2022-11-18 | 上海天承化学有限公司 | Micro-etching roughening solution suitable for SAP (super absorbent Polymer) manufacturing process and application thereof |
| CN115354327B (en) * | 2022-08-22 | 2024-01-02 | 上海天承化学有限公司 | Microetching roughening solution suitable for SAP (super absorbent polymer) process and application thereof |
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| Publication number | Publication date |
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| CN104805439B (en) | 2017-03-29 |
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Granted publication date: 20170329 Termination date: 20171231 |