CN101338435A - Reusable microetch agent for copper and copper alloy - Google Patents
Reusable microetch agent for copper and copper alloy Download PDFInfo
- Publication number
- CN101338435A CN101338435A CNA2007100310582A CN200710031058A CN101338435A CN 101338435 A CN101338435 A CN 101338435A CN A2007100310582 A CNA2007100310582 A CN A2007100310582A CN 200710031058 A CN200710031058 A CN 200710031058A CN 101338435 A CN101338435 A CN 101338435A
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- copper
- copper alloy
- microetch
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- agent
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Abstract
The invention provides recyclable copper and copper alloy micro etchant, which can be used for etching the copper surface of a circuit board. The copper and the copper alloy micro etchant provided by the invention comprise the components with weight percentage as follows: 1 to 20 percent of sulphuric acid or/and nitric acid, 1.5 to 35 percent of ferric sulfate or/and ferric nitrate and 0.005 to 1 percent of fluoric surface active agent; and the rest is water. Based on the basic components, the requirements of treating the other special copper surfaces can be met by adding different additive into micro etching solution. The copper alloy micro etchant of the invention is recyclable and does not need to be discharged, thus achieving the purpose of green production.
Description
Technical field
The present invention relates to a kind of copper of wiring board copper surface corrosion and micro-etching agent of copper alloy of being applied to.
Background technology
General in the making flow process of wiring board, often need carry out microetch with cleaning and alligatoring to the copper surface, help to improve the bonding force of copper surface and dry film, wet film, prepreg and anti-solder ink etc., and method commonly used at present is to adopt persulphate or dioxysulfate water microetch system, though these microetch methods are simple to operate, process stabilizing, but the problem that exists is: produces the about 20-30 of a large amount of cuprics to restrain/handling problem of every liter waste liquid, environmental protection is had no small pressure.
Summary of the invention
The present invention is just at the defective of present copper surface micro etching carving technology, produces that a large amount of copper-containing wastewaters can't recycle and microetch technology that the novel environment friendly developed can be recycled, reaches the purpose that cleaner production realizes zero release.
The copper and copper alloy micro-etching agent that can be recycled provided by the invention, comprise following component by weight percentage: sulfuric acid or/and nitric acid 1%～20%, ferric sulfate or/and iron nitrate 1.5%～35%, the plain tensio-active agent 0.005%～1% of fluorine, surplus is a water.
The present invention can also be by increasing different additives in microetch liquid, to reach other special copper surface-treated requirements on the basis of above basal component.
Above-mentioned micro-etching agent is in 25 degrees centigrade to 45 degrees centigrade temperature range, can both handle the surface of copper or copper alloy effectively, can use and soak or the sprinkling system operation under 1～2 kilogram of pressure, the treatment time can be carried out different choice according to the reality requirement from 20 seconds～5 minutes.
Treated workpiece flows to next step operation, and used micro-etching agent is along with the rising of copper content, and at this moment its corrosion efficient can regenerate by electrolytic method also along with reduction, the soup that promptly can be recycled reaches the purpose that environmental protection of the present invention can be recycled.
Compared with prior art, the present invention has following significant technical progress and outstanding characteristics: micro-etching agent of the present invention can replace traditional persulphate or dioxysulfate water microetch system, soup can be recycled, and accomplishes need not discharge, and reaches the purpose of the green production of complete environmental protection.
The effect of each component shows in this micro-etching agent: sulfuric acid is or/and nitric acid: as solvent, help dissolved copper or copper alloy; Ferric sulfate is or/and iron nitrate: as oxygenant, can increase the speed of microetch; The plain tensio-active agent of fluorine: can make the copper surface uniformity of processing, etch effect is better.
Embodiment
The copper and copper alloy micro-etching agent that can be recycled is calculated by weight percentage and is comprised following component, sulfuric acid or/and nitric acid 20%, ferric sulfate or/and iron nitrate 25%, the plain tensio-active agent 0.5% of fluorine, surplus is a water.
The present invention is an example with ferric sulfate/sulphuric acid soln system, and reaction principle is described as follows:
2Fe
3++Cu-＞2Fe
2++Cu
2+
Wherein, copper or copper alloy are in ferric sulfate/sulphuric acid soln system, be as the ferric iron institute oxidation of strong oxidizer, and be dissolved in the solution and constantly be corroded, and a spot of tensio-active agent helps to make the entire reaction uniformity, and copper after being corroded or copper alloy surface present the effect of even alligatoring.
Claims (1)
1, a kind of copper and copper alloy micro-etching agent that can be recycled, it is characterized in that: comprise following component by weight percentage, sulfuric acid or/and nitric acid 1%～20%, ferric sulfate or/and iron nitrate 1.5%～35%, the plain tensio-active agent 0.005%～1% of fluorine, surplus is a water.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2007100310582A CN101338435A (en) | 2007-10-25 | 2007-10-25 | Reusable microetch agent for copper and copper alloy |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2007100310582A CN101338435A (en) | 2007-10-25 | 2007-10-25 | Reusable microetch agent for copper and copper alloy |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101338435A true CN101338435A (en) | 2009-01-07 |
Family
ID=40212604
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA2007100310582A Pending CN101338435A (en) | 2007-10-25 | 2007-10-25 | Reusable microetch agent for copper and copper alloy |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101338435A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102181865A (en) * | 2011-04-29 | 2011-09-14 | 广州市天承化工有限公司 | Treating agent and treating system for micro-etching surfaces of recyclable copper and copper alloys |
| CN102925893A (en) * | 2012-10-31 | 2013-02-13 | 西安空间无线电技术研究所 | Microetch process for restraining micro-discharge effect of microwave part |
| CN104120428A (en) * | 2014-08-08 | 2014-10-29 | 苏州天承化工有限公司 | Recyclable micro etching chemical treatment agent on surface of copper/copper alloy |
| CN106618598A (en) * | 2016-11-15 | 2017-05-10 | 惠州市力道电子材料有限公司 | Tungsten alloy micro-needle electrode capable of limiting piercing depth, preparation method thereof, and blood glucose monitoring device |
| CN113337817A (en) * | 2021-06-03 | 2021-09-03 | 西安宏盾新材料科技有限公司 | Electroplating process of copper diamond |
-
2007
- 2007-10-25 CN CNA2007100310582A patent/CN101338435A/en active Pending
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102181865A (en) * | 2011-04-29 | 2011-09-14 | 广州市天承化工有限公司 | Treating agent and treating system for micro-etching surfaces of recyclable copper and copper alloys |
| CN102925893A (en) * | 2012-10-31 | 2013-02-13 | 西安空间无线电技术研究所 | Microetch process for restraining micro-discharge effect of microwave part |
| CN102925893B (en) * | 2012-10-31 | 2014-10-08 | 西安空间无线电技术研究所 | Microetch process for restraining micro-discharge effect of microwave part |
| CN104120428A (en) * | 2014-08-08 | 2014-10-29 | 苏州天承化工有限公司 | Recyclable micro etching chemical treatment agent on surface of copper/copper alloy |
| CN104120428B (en) * | 2014-08-08 | 2016-07-20 | 苏州天承化工有限公司 | A kind of capable of circulation again with the microetch chemical treatment medicament on copper and copper alloy surface |
| CN106618598A (en) * | 2016-11-15 | 2017-05-10 | 惠州市力道电子材料有限公司 | Tungsten alloy micro-needle electrode capable of limiting piercing depth, preparation method thereof, and blood glucose monitoring device |
| CN113337817A (en) * | 2021-06-03 | 2021-09-03 | 西安宏盾新材料科技有限公司 | Electroplating process of copper diamond |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C12 | Rejection of a patent application after its publication | ||
| RJ01 | Rejection of invention patent application after publication |
Open date: 20090107 |