CN102146565A - Recyclable copper surface micro etching agent - Google Patents
Recyclable copper surface micro etching agent Download PDFInfo
- Publication number
- CN102146565A CN102146565A CN2010101233299A CN201010123329A CN102146565A CN 102146565 A CN102146565 A CN 102146565A CN 2010101233299 A CN2010101233299 A CN 2010101233299A CN 201010123329 A CN201010123329 A CN 201010123329A CN 102146565 A CN102146565 A CN 102146565A
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- copper surface
- etching agent
- micro etching
- percent
- copper
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Abstract
The invention provides a recyclable copper surface micro etching agent, which can be applied to an etching process for the copper surface of a circuit board. The copper surface micro etching agent comprises the following components in percentage by weight: 1 to 20 percent of sulfuric acid or/and nitric acid, 1.5 to 35 percent of ferric sulfate or/and ferric nitrate, 0.005 to 1 percent of 3-mercapto-1-propanesulfonic sodium salt and the balance of water; and other special requirements of copper surface treatment are met by increasing different additives in the micro etching solution based on the basic components. The micro etching agent solution can be recycled, does not need to be discharged, and fulfills the purposes of environmental friendliness and green production.
Description
Technical field
The present invention relates to a kind of copper face micro-etching agent that is applied to the surface corrosion of wiring board copper.
Background technology
General in the making flow process of wiring board, often need carry out microetch with cleaning and alligatoring to the copper surface, help to improve the bonding force of copper surface and dry film, wet film, prepreg and anti-solder ink etc., and method commonly used at present is to adopt persulphate or dioxysulfate water microetch system, though these microetch methods are simple to operate, process stabilizing, but the problem that exists is: produces the about 30-40 of a large amount of cuprics to restrain/handling problem of every liter waste liquid, environmental protection is had no small pressure.
Summary of the invention
The present invention is just at the defective of present copper surface micro etching carving technology, produces that a large amount of copper-containing wastewaters can't recycle and microetch technology that the novel environment friendly developed can be recycled, reaches the purpose that cleaner production realizes zero release.
The copper face micro-etching agent that can be recycled provided by the invention comprises following component by weight percentage: sulfuric acid or/and nitric acid 1%～20%, ferric sulfate or/and iron nitrate 1.5%～35%, 3-sulfydryl-1-propanesulfonic acid sodium salt 0.005%～1%, surplus is a water.
The present invention can also be by increasing different additives in microetch liquid, to reach other special copper surface-treated requirements on the basis of above basal component.
Above-mentioned micro-etching agent is in 25 degrees centigrade to 45 degrees centigrade temperature range, can both handle the copper surface effectively, can use and soak or the sprinkling system operation under 1～2 kilogram of pressure, the treatment time can be carried out different choice according to the reality requirement from 20 seconds～5 minutes.
Treated workpiece flows to next step operation, and used micro-etching agent is along with the rising of copper content, and at this moment its corrosion efficient can regenerate by electrolytic method also along with reduction, the soup that promptly can be recycled reaches the purpose that environmental protection of the present invention can be recycled.
Compared with prior art, the present invention has following significant technical progress and outstanding characteristics: micro-etching agent of the present invention can replace traditional persulphate or dioxysulfate water microetch system, soup can be recycled, and accomplishes need not discharge, and reaches the purpose of the green production of complete environmental protection.
The effect of each component shows in this micro-etching agent: sulfuric acid is or/and nitric acid: as solvent, help dissolved copper or copper alloy; Ferric sulfate is or/and iron nitrate: as oxygenant, can increase the speed of microetch; 3-sulfydryl-1-propanesulfonic acid sodium salt: can make the copper surface uniformity of processing, etch effect is better.
Embodiment
The copper face micro-etching agent that can be recycled is calculated by weight percentage and is comprised following component, sulfuric acid or/and nitric acid 20%, ferric sulfate or/and iron nitrate 25%, 3-sulfydryl-1-propanesulfonic acid sodium salt 0.5%, surplus is a water.
The present invention is an example with ferric sulfate/sulphuric acid soln system, and reaction principle is described as follows:
2Fe
3++Cu->2Fe
2++Cu
2+
Wherein, copper or copper alloy are in ferric sulfate/sulphuric acid soln system, be as the ferric iron institute oxidation of strong oxidizer, and be dissolved in the solution and constantly be corroded, and a spot of 3-sulfydryl-1-propanesulfonic acid sodium salt helps to make the entire reaction uniformity, and the copper surface after being corroded presents the effect of even alligatoring.
Claims (1)
1. copper face micro-etching agent that can be recycled, it is characterized in that: comprise following component by weight percentage, sulfuric acid or/and nitric acid 1%～20%, ferric sulfate or/and iron nitrate 1.5%～35%, 3-sulfydryl-1-propanesulfonic acid sodium salt 0.005%～1%, surplus is a water.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010101233299A CN102146565A (en) | 2010-02-07 | 2010-02-07 | Recyclable copper surface micro etching agent |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010101233299A CN102146565A (en) | 2010-02-07 | 2010-02-07 | Recyclable copper surface micro etching agent |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102146565A true CN102146565A (en) | 2011-08-10 |
Family
ID=44421027
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010101233299A Pending CN102146565A (en) | 2010-02-07 | 2010-02-07 | Recyclable copper surface micro etching agent |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102146565A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102925893A (en) * | 2012-10-31 | 2013-02-13 | 西安空间无线电技术研究所 | Microetch process for restraining micro-discharge effect of microwave part |
| CN111117793A (en) * | 2019-12-23 | 2020-05-08 | 昆山市板明电子科技有限公司 | Copper surface cleaning agent and preparation method thereof |
| WO2024012312A1 (en) * | 2022-07-15 | 2024-01-18 | 东南大学 | Surface-reconstructed copper catalyst, preparation method therefor and use thereof in co2 electroreduction |
-
2010
- 2010-02-07 CN CN2010101233299A patent/CN102146565A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102925893A (en) * | 2012-10-31 | 2013-02-13 | 西安空间无线电技术研究所 | Microetch process for restraining micro-discharge effect of microwave part |
| CN102925893B (en) * | 2012-10-31 | 2014-10-08 | 西安空间无线电技术研究所 | Microetch process for restraining micro-discharge effect of microwave part |
| CN111117793A (en) * | 2019-12-23 | 2020-05-08 | 昆山市板明电子科技有限公司 | Copper surface cleaning agent and preparation method thereof |
| CN111117793B (en) * | 2019-12-23 | 2021-09-17 | 昆山市板明电子科技有限公司 | Copper surface cleaning agent and preparation method thereof |
| WO2024012312A1 (en) * | 2022-07-15 | 2024-01-18 | 东南大学 | Surface-reconstructed copper catalyst, preparation method therefor and use thereof in co2 electroreduction |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| DD01 | Delivery of document by public notice |
Addressee: Zhang Xiaoping Document name: Notification of Publication of the Application for Invention |
|
| DD01 | Delivery of document by public notice |
Addressee: Zhang Xiaoping Document name: Notification of before Expiration of Request of Examination as to Substance |
|
| DD01 | Delivery of document by public notice |
Addressee: Zhang Xiaoping Document name: Notification that Application Deemed to be Withdrawn |
|
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20110810 |