CN104893370A - Micro-electronic-surface anti-ultraviolet-radiation coating and preparation method thereof - Google Patents
Micro-electronic-surface anti-ultraviolet-radiation coating and preparation method thereof Download PDFInfo
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- CN104893370A CN104893370A CN201510264110.3A CN201510264110A CN104893370A CN 104893370 A CN104893370 A CN 104893370A CN 201510264110 A CN201510264110 A CN 201510264110A CN 104893370 A CN104893370 A CN 104893370A
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Abstract
The invention discloses a micro-electronic-surface anti-ultraviolet-radiation coating and a preparation method thereof. The anti-ultraviolet-radiation coating is prepared from the following raw materials in parts by weight: 12-40 parts of quartz sand, 13-38 parts of petroleum coke, 11-24 parts of wood flour, 9-18 parts of sodium chloride, 2-11 parts of acrylic acid, 3-18 parts of indium tin oxide, 12-33 parts of ethanol and 32-60 parts of water. Compared with the prior art, by virtue of the technical scheme, the anti-ultraviolet-radiation coating has the technical effects that firstly, the micro-electronic-surface anti-ultraviolet-radiation coating can be directly sprayed to the surface of a product, the operation is simple and convenient, and the coating is harmless and non-toxic to the environment and is easy to clean; secondly, beside a waterproof function, the micro-electronic-surface anti-ultraviolet-radiation coating can well resist ultraviolet radiation, so that the rapid aging of the micro-electronic product is prevented, and the service life of the micro-electronic product is prolonged.
Description
Technical field
The present invention relates to chemical coating field, particularly relate to a kind of microelectronics surface ultra-violet radiation resisting coating and preparation method thereof.
Background technology
Microelectronics is the core technology of high-tech and information industry.Microelectronic industry is infrastructural industries, why develops so fast, and except technology itself is to except the tremendous contribution of national economy, also extremely strong with it perviousness is relevant.In addition, modern war by be take unicircuit as gordian technique, the high-tech war that is feature with electronic warfare and information war.
The seventies, microelectronics enters the new stage centered by large-scale integrated circuit.Along with integration density improves day by day, unicircuit forward integrated system develops, and the design of circuit is also day by day complicated, time-consuming and expensive.If in fact do not have the auxiliary of computer, the design of more complicated large-scale integrated circuit is impossible.Since the seventies, what unicircuit utilized computer is designed with very large progress.The computer assisted design supervisor of the computer aided design (CAD) of making a plate, device simulation, electric circuit analogy, logical simulation, placement-and-routing, all successively study successfully, and develop into the hybrid computer aided design comprising check, optimize scheduling algorithm, and even the computer aided design system of whole plant.
Summary of the invention
The technical problem solved: the invention provides a kind of microelectronics surface ultra-violet radiation resisting coating and preparation method thereof, by the method becoming aqua to spray Raw material processing, prepare one and can be sprayed directly on microelectronic product surface, form the ultra-violet radiation resisting coating of one deck densification, consolidation.
To achieve these goals, the present invention is by the following technical solutions:
A kind of microelectronics surface ultra-violet radiation resisting coating, makes primarily of following raw materials by weight portion proportioning: quartz sand 12 ~ 40 parts, refinery coke 13 ~ 38 parts, wood chip 11 ~ 24 parts, 9 ~ 18 parts, sodium-chlor, 2 ~ 11 parts, vinylformic acid, tin indium oxide 3 ~ 18 parts, ethanol 12 ~ 33 parts, 32 ~ 60 parts, water.
As a modification of the present invention, make primarily of following raw materials by weight portion proportioning: quartz sand 35 parts, refinery coke 28 parts, wood chip 21 parts, 16 parts, sodium-chlor, 7 parts, vinylformic acid, tin indium oxide 15 parts, ethanol 28 parts, 55 parts, water.
A preparation method for microelectronics surface ultra-violet radiation resisting coating, comprises following steps:
(1) quartz sand, refinery coke and wood chip are pulverized, powder diameter is 500 ~ 800 orders;
(2) add in high temperature resistance furnace by powder, sodium chloride powder and indium-tin oxide powder that step (1) obtains, radiation heating, temperature maintains 1150 ~ 1400 DEG C, 0.5 ~ 1 hour;
(3) vinylformic acid being mixed with ethanol, and the powdered mixture obtained in step (2) is added wherein, add water while stirring, microelectronics surface ultra-violet radiation resisting coating can be obtained to all dissolving.
As a preferred embodiment of the present invention, quartz sand, refinery coke and wood chip are pulverized in (1) by step, and powder diameter is 600 orders.
As a preferred embodiment of the present invention, add in high temperature resistance furnace by powder, sodium chloride powder and indium-tin oxide powder that step (1) obtains in step (2), radiation heating, temperature maintains 1300 DEG C, 1 hour.
beneficial effect
Compared with prior art, following technique effect can be brought after the present invention adopts above technical scheme:
First, microelectronics prepared by the present invention surface ultra-violet radiation resisting coating directly can be sprayed to product surface, easy and simple to handle and environmental sound, nontoxic, easy cleaning;
Secondly, microelectronics surface ultra-violet radiation resisting coating prepared by the present invention is except except waterproof, can be good at resisting ultraviolet radiation, thus prevent microelectronic product rapid ageing, extend its work-ing life.
Embodiment
Embodiment 1:
A kind of microelectronics surface ultra-violet radiation resisting coating, makes primarily of following raw materials by weight portion proportioning: quartz sand 12 parts, refinery coke 13 parts, wood chip 11 parts, 9 parts, sodium-chlor, 2 parts, vinylformic acid, tin indium oxide 3 parts, ethanol 12 parts, 32 parts, water.
A preparation method for microelectronics surface ultra-violet radiation resisting coating, comprises following steps:
(1) quartz sand, refinery coke and wood chip are pulverized, powder diameter is 500 orders;
(2) add in high temperature resistance furnace by powder, sodium chloride powder and indium-tin oxide powder that step (1) obtains, radiation heating, temperature maintains 1150 DEG C, 0.5 hour;
(3) vinylformic acid being mixed with ethanol, and the powdered mixture obtained in step (2) is added wherein, add water while stirring, microelectronics surface ultra-violet radiation resisting coating can be obtained to all dissolving.
Embodiment 2:
A kind of microelectronics surface ultra-violet radiation resisting coating, makes primarily of following raw materials by weight portion proportioning: quartz sand 35 parts, refinery coke 28 parts, wood chip 21 parts, 16 parts, sodium-chlor, 7 parts, vinylformic acid, tin indium oxide 15 parts, ethanol 28 parts, 55 parts, water.
A preparation method for microelectronics surface ultra-violet radiation resisting coating, comprises following steps:
(1) quartz sand, refinery coke and wood chip are pulverized, powder diameter is 600 orders;
(2) add in high temperature resistance furnace by powder, sodium chloride powder and indium-tin oxide powder that step (1) obtains, radiation heating, temperature maintains 1300 DEG C, 1 hour;
(3) vinylformic acid being mixed with ethanol, and the powdered mixture obtained in step (2) is added wherein, add water while stirring, microelectronics surface ultra-violet radiation resisting coating can be obtained to all dissolving.
Embodiment 3:
A kind of microelectronics surface ultra-violet radiation resisting coating, makes primarily of following raw materials by weight portion proportioning: quartz sand 40 parts, refinery coke 38 parts, wood chip 24 parts, 18 parts, sodium-chlor, 11 parts, vinylformic acid, tin indium oxide 18 parts, ethanol 33 parts, 60 parts, water.
A preparation method for microelectronics surface ultra-violet radiation resisting coating, comprises following steps:
(1) quartz sand, refinery coke and wood chip are pulverized, powder diameter is 800 orders;
(2) add in high temperature resistance furnace by powder, sodium chloride powder and indium-tin oxide powder that step (1) obtains, radiation heating, temperature maintains 1400 DEG C, 1 hour;
(3) vinylformic acid being mixed with ethanol, and the powdered mixture obtained in step (2) is added wherein, add water while stirring, microelectronics surface ultra-violet radiation resisting coating can be obtained to all dissolving.
After the microelectronics surface ultra-violet radiation resisting coating prepared above-described embodiment 1 ~ 3 detects, result is as follows:
| Coat-thickness | Specific refractory power | Water resistance | Permeability | |
| Embodiment 1 | 0.07mm | 96% | By force | By force |
| Embodiment 2 | 0.07mm | 99% | By force | By force |
| Embodiment 3 | 0.07mm | 98% | By force | By force |
Claims (5)
1. a microelectronics surface ultra-violet radiation resisting coating, it is characterized in that, make primarily of following raw materials by weight portion proportioning: quartz sand 12 ~ 40 parts, refinery coke 13 ~ 38 parts, wood chip 11 ~ 24 parts, 9 ~ 18 parts, sodium-chlor, 2 ~ 11 parts, vinylformic acid, tin indium oxide 3 ~ 18 parts, ethanol 12 ~ 33 parts, 32 ~ 60 parts, water.
2. a kind of microelectronics surface ultra-violet radiation resisting coating according to claim 1, it is characterized in that, make primarily of following raw materials by weight portion proportioning: quartz sand 35 parts, refinery coke 28 parts, wood chip 21 parts, 16 parts, sodium-chlor, 7 parts, vinylformic acid, tin indium oxide 15 parts, ethanol 28 parts, 55 parts, water.
3. the preparation method of a kind of microelectronics surface according to claim 1 ultra-violet radiation resisting coating, is characterized in that, comprise following steps:
(1) quartz sand, refinery coke and wood chip are pulverized, powder diameter is 500 ~ 800 orders;
(2) add in high temperature resistance furnace by powder, sodium chloride powder and indium-tin oxide powder that step (1) obtains, radiation heating, temperature maintains 1150 ~ 1400 DEG C, 0.5 ~ 1 hour;
(3) vinylformic acid being mixed with ethanol, and the powdered mixture obtained in step (2) is added wherein, add water while stirring, microelectronics surface ultra-violet radiation resisting coating can be obtained to all dissolving.
4. the preparation method of a kind of microelectronics surface ultra-violet radiation resisting coating according to claim 3, it is characterized in that, quartz sand, refinery coke and wood chip are pulverized in (1) by step, and powder diameter is 600 orders.
5. the preparation method of a kind of microelectronics surface ultra-violet radiation resisting coating according to claim 3, it is characterized in that, in step (2), powder, sodium chloride powder and indium-tin oxide powder that step (1) obtains are added in high temperature resistance furnace, radiation heating, temperature maintains 1300 DEG C, 1 hour.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510264110.3A CN104893370A (en) | 2015-05-22 | 2015-05-22 | Micro-electronic-surface anti-ultraviolet-radiation coating and preparation method thereof |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201510264110.3A CN104893370A (en) | 2015-05-22 | 2015-05-22 | Micro-electronic-surface anti-ultraviolet-radiation coating and preparation method thereof |
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| CN104893370A true CN104893370A (en) | 2015-09-09 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11411263B2 (en) | 2019-03-06 | 2022-08-09 | Laird Technologies, Inc. | Thermal management and/or EMI mitigation materials including coated fillers |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101265374A (en) * | 2008-01-24 | 2008-09-17 | 复旦大学 | Intelligent heat-insulating film and its preparing process |
| CN101362630A (en) * | 2008-06-17 | 2009-02-11 | 刘昆虎 | Insulating mold coating of transparent glass and manufacturing method thereof |
| CN102653862A (en) * | 2011-03-01 | 2012-09-05 | 国家纳米科学中心 | Preparation method of indium tin oxide nanometer coating |
-
2015
- 2015-05-22 CN CN201510264110.3A patent/CN104893370A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101265374A (en) * | 2008-01-24 | 2008-09-17 | 复旦大学 | Intelligent heat-insulating film and its preparing process |
| CN101362630A (en) * | 2008-06-17 | 2009-02-11 | 刘昆虎 | Insulating mold coating of transparent glass and manufacturing method thereof |
| CN102653862A (en) * | 2011-03-01 | 2012-09-05 | 国家纳米科学中心 | Preparation method of indium tin oxide nanometer coating |
Non-Patent Citations (1)
| Title |
|---|
| 周文英等: "《导热高分子材料》", 30 April 2014, 北京：国防工业出版社 * |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11411263B2 (en) | 2019-03-06 | 2022-08-09 | Laird Technologies, Inc. | Thermal management and/or EMI mitigation materials including coated fillers |
| US11984570B2 (en) | 2019-03-06 | 2024-05-14 | Laird Technologies, Inc. | Thermal management and/or EMI mitigation materials including coated fillers |
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Application publication date: 20150909 |
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