CN104869775A - Electronic device and method for forming logo of electronic device - Google Patents
Electronic device and method for forming logo of electronic device Download PDFInfo
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- CN104869775A CN104869775A CN201510229801.XA CN201510229801A CN104869775A CN 104869775 A CN104869775 A CN 104869775A CN 201510229801 A CN201510229801 A CN 201510229801A CN 104869775 A CN104869775 A CN 104869775A
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- logo
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Abstract
The invention discloses an electronic device and a method for forming the logo of the electronic device. The method includes the following steps that: a logo is engraved on the metal shell of the electronic device; and a plurality of perforated holes are formed in a groove area of the engraved logo through laser micro perforation. The logo of the electronic device of the invention will not affect the appearance of the electronic device, and the logo can be lit when an internal light source of the electronic device emits light, and therefore, a luminous logo can be formed.
Description
Technical field
The present invention relates to electronic installation, particularly a kind of formation method of Logo of electronic installation.
Background technology
The Logo of traditional electronic equipment such as communication terminal, normally formed by printing one deck silk-screen at plastic casing outer surface, this manufacture method is simple.But along with the development of electronic equipment, the requirement of user to the Logo of electronic equipment is more and more higher, can see Logo under not being only required in well-lighted situation, also requirement also can see Logo under the environment of dark or dark.Therefore, can the answering the demand of user and produce by luminous Logo of electronic equipment.
In prior art, in order to make Logo on electronic installation can be luminous, common way makes transparent or semitransparent Logo housing, then Logo housing is embedded in the hollow out position of electronic installation separately.When the internal light source of electronic installation is luminous, Logo is lit, thus realization can luminous Logo.The shortcoming of this way is what the Logo on electronic installation normally protruded, have impact on the outward appearance of electronic installation.
Summary of the invention
The embodiment of the invention discloses formation method and the electronic installation of a kind of Logo of electronic installation, namely the Logo on electronic installation can not affect the outward appearance of electronic installation, can be lit again, and realization can luminous Logo.
Embodiment of the present invention first aspect discloses a kind of formation method of Logo of electronic installation, comprising:
The metal shell of electronic installation carves Logo; And
Multiple perforation is formed by laser microperforation in the groove region of the Logo of described engraving.
In one embodiment, described Logo is carved by laser radium carving radium on described metal shell.
In one embodiment, the pore diameter range of described perforation is 0.03mm-0.04mm.
In one embodiment, described multiple perforation is uniformly distributed.
In one embodiment, the scope at the shortest interval between described adjacent two edges of boring a hole is 0.04-0.06mm.
Embodiment of the present invention second aspect discloses a kind of electronic installation, and described electronic installation comprises metal shell, and described electronic installation also comprises the Logo formed by the formation method of the Logo of above-described electronic installation.
In one embodiment, described electronic installation also comprises the heavy stand being formed at described metal shell inner surface, and described heavy stand is positioned at the below of described Logo.
In one embodiment, described heavy stand position is provided with glue.
In one embodiment, described glue is UV glue.
In one embodiment, the size of described heavy stand is greater than the Outside Dimensions in described Logo region.
Compared with prior art, the embodiment of the present invention has following beneficial effect:
The Logo of electronic installation of the present invention, not only can not affect the outward appearance of electronic installation, and when the internal light source of electronic installation is luminous, Logo can be lit, thus realization can luminous Logo.
Accompanying drawing explanation
In order to be illustrated more clearly in the technical scheme in the embodiment of the present invention, be briefly described to the accompanying drawing used required in embodiment below, apparently, accompanying drawing in the following describes is only some embodiments of the present invention, for those of ordinary skill in the art, under the prerequisite not paying creative work, other accompanying drawing can also be obtained according to these accompanying drawings.
Fig. 1 is the flow chart of the formation method of the Logo of a kind of electronic installation disclosed in the embodiment of the present invention;
Fig. 2 and Fig. 3 is the schematic cross-section in the formation method manufacturing process of the Logo of electronic installation disclosed in Fig. 1;
Fig. 4 is the schematic perspective view of a kind of electronic installation disclosed in the embodiment of the present invention, the Logo that the formation method metal shell of described electronic installation comprising the Logo of electronic installation disclosed in Fig. 1 is formed;
Fig. 5 is the partial cross section schematic diagram of electronic installation disclosed in Fig. 4; And
Fig. 6 is the partial cross section schematic diagram of electronic installation disclosed in Fig. 4, and the inner surface being the metal shell of electronic installation disclosed in Fig. 6 with Fig. 5 difference is formed with heavy stand.
Embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present invention, be clearly and completely described the technical scheme in the embodiment of the present invention, obviously, described embodiment is only the present invention's part embodiment, instead of whole embodiments.Based on the embodiment in the present invention, those of ordinary skill in the art, not making the every other embodiment obtained under creative work prerequisite, belong to the scope of protection of the invention.
With reference to figure 1 and Fig. 2, the formation method of the Logo of a kind of electronic installation disclosed in the embodiment of the present invention, comprising:
Step 101, the metal shell 11 of electronic installation carves Logo12.
Wherein, electronic installation can be the electronic installations such as mobile phone, panel computer, personal computer.
Wherein, on the metal shell 11 of electronic installation, carve Logo12 by the mode such as laser radium carving, CNC (CNC, computer numerical control (CNC)) engraving, etching, these engraving technologies all belong to prior art, do not repeat them here.
Wherein, in order to better appearance, make Logo seem do not have step, the Logo degree of depth should be as far as possible shallow, and laser radium carving can be accomplished several silk and easily control, and therefore, preferably, carves logo12 by laser radium carving on metal shell 11.
Wherein, Logo12 can be made up of one or more letter, or is numeral and alphabetical combination, or is pattern etc.
In the lump with reference to figure 3, step 102, forms multiple perforation 13 in the groove region of the Logo12 of engraving by laser microperforation.
Wherein, in order to ensure that the perforation 13 that is invisible to the naked eye of people, the aperture of perforation 13 should be very little when electronic installation internal light source is not luminous.The pore diameter range of perforation 13 can be 0.03-0.04mm.Preferably, pore diameter range is 0.03mm.The aperture of the perforation 13 formed by laser microperforation can meet the requirement of above-mentioned aperture.The technology being formed perforation 13 by laser microperforation belongs to prior art, does not repeat them here.
Wherein, in order to make uniform light penetrate, multiple perforation 13 is uniformly distributed.The scope at the shortest interval between the edge of adjacent two perforation 13 is 0.04-0.06mm, such as, can be 0.04mm, 0.05mm or 0.06mm.
The formation method of the Logo of electronic installation disclosed in the embodiment of the present invention, the metal shell 11 of electronic installation carves Logo12, and multiple perforation 13 of laser microperforation formation are provided with in the groove region of Logo12, so, by the Logo12 that method disclosed in the embodiment of the present invention is formed, the outward appearance of electronic installation not only can not be affected, and when the internal light source of electronic installation is luminous, Logo12 can be lit, thus realization can luminous Logo12.
With reference to figure 4, the metal shell 11 of electronic installation disclosed in the embodiment of the present invention is provided with Logo12, Logo12 is formed on metal shell 11 by the formation method of the Logo of electronic installation disclosed in Fig. 1.
With reference to figure 5, electronic installation disclosed in the embodiment of the present invention also comprises the light source module 14 be arranged in electronic installation.Light source module 14 is arranged at the below of Logo12, to ensure that light that light source module 14 sends is by 13 injections of boring a hole, thus lights Logo12.
With reference to figure 6, in one embodiment, the inner surface of metal shell 11 is provided with heavy stand 15.The modes such as etching, CNC engraving, radium carving can be adopted to process heavy stand 15.The technology of processing heavy stand belongs to prior art, does not repeat them here.Heavy stand 15 is arranged on the below of Logo12, and the size of heavy stand 15 is greater than the Outside Dimensions in Logo region.Usually, the size of heavy stand 15 0.5mm more than larger than the Outside Dimensions in Logo region.After processing heavy stand 15, at heavy stand 15 location point glue.Because need solidification after some glue, and utilize photocuring comparatively suitable in the present embodiment, therefore, preferably, the glue that the present embodiment utilizes is UV glue.Certainly, the glue that also other can be adopted suitable according to actual conditions carries out a glue.
When the inner surface of metal shell 11 arranges heavy stand 15, light source module 14 is arranged at the below of heavy stand 15.
Wherein, heavy stand 15 be set at the inner surface of metal shell 11 and at heavy stand 15 location point glue, there is following effect: the light that light source module 14 is sent penetrates by which better perforation 13; The effect of waterproof can be played at heavy stand 15 location point glue.When utilizing UV glue to carry out glue, the light that light source module 14 can also be made to send evenly penetrates.
Above disclosedly be only a kind of preferred embodiment of the present invention, certainly the interest field of the present invention can not be limited with this, one of ordinary skill in the art will appreciate that all or part of flow process realizing above-described embodiment, and according to the equivalent variations that the claims in the present invention are done, still belong to the scope that invention is contained.
Claims (10)
1. a formation method of the Logo of electronic installation, comprising:
The metal shell of electronic installation carves Logo; And
Multiple perforation is formed by laser microperforation in the groove region of the Logo of described engraving.
2. the formation method of the Logo of electronic installation as claimed in claim 1, is characterized in that, carves described Logo by laser radium carving radium on described metal shell.
3. the formation method of the Logo of electronic installation as claimed in claim 1 or 2, it is characterized in that, the pore diameter range of described perforation is 0.03mm-0.04mm.
4. the formation method of the Logo of the electronic installation as described in claims 1 to 3 any one, is characterized in that, described multiple perforation is uniformly distributed.
5. the formation method of the Logo of the electronic installation as described in claims 1 to 3 any one, is characterized in that, the scope at the shortest interval between the edge of described adjacent two perforation is 0.04-0.06mm.
6. an electronic installation, described electronic installation comprises metal shell, it is characterized in that, described electronic installation also comprises the Logo formed by the formation method of the Logo of the electronic installation as described in claim 1-5 any one.
7. electronic installation as claimed in claim 6, it is characterized in that, described electronic installation also comprises the heavy stand being formed at described metal shell inner surface, and described heavy stand is positioned at the below of described Logo.
8. electronic installation as claimed in claim 7, it is characterized in that, described heavy stand position is provided with glue.
9. electronic installation as claimed in claim 8, it is characterized in that, described glue is UV glue.
10. the electronic installation as described in claim 7 to 9 any one, is characterized in that, the size of described heavy stand is greater than the Outside Dimensions in described Logo region.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510229801.XA CN104869775A (en) | 2015-05-07 | 2015-05-07 | Electronic device and method for forming logo of electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510229801.XA CN104869775A (en) | 2015-05-07 | 2015-05-07 | Electronic device and method for forming logo of electronic device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104869775A true CN104869775A (en) | 2015-08-26 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510229801.XA Pending CN104869775A (en) | 2015-05-07 | 2015-05-07 | Electronic device and method for forming logo of electronic device |
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| CN (1) | CN104869775A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105722347A (en) * | 2016-04-05 | 2016-06-29 | 东莞劲胜精密组件股份有限公司 | Electronic product shell with built-in antenna and production method of electronic product shell |
| CN106763042A (en) * | 2017-01-20 | 2017-05-31 | 维沃移动通信有限公司 | A kind of bond and adhering method |
| CN108538664A (en) * | 2018-04-27 | 2018-09-14 | 立烽电子科技(厦门)有限公司 | A kind of manufacturing method of panel-switch metal decking |
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| CN101662907A (en) * | 2008-08-29 | 2010-03-03 | 比亚迪股份有限公司 | Metal plate with decorative pattern |
| CN201448749U (en) * | 2009-06-25 | 2010-05-05 | 广东金朗电子科技有限公司 | Diffusing type big power LED optical lens |
| CN101877950A (en) * | 2009-04-29 | 2010-11-03 | 崴宇雷射科技有限公司 | Transparent micropore arrangement structure and manufacturing method thereof |
| CN201655215U (en) * | 2010-03-17 | 2010-11-24 | 中兴通讯股份有限公司 | LOGO light-emitting device of electronic equipment |
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- 2015-05-07 CN CN201510229801.XA patent/CN104869775A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101662907A (en) * | 2008-08-29 | 2010-03-03 | 比亚迪股份有限公司 | Metal plate with decorative pattern |
| CN101877950A (en) * | 2009-04-29 | 2010-11-03 | 崴宇雷射科技有限公司 | Transparent micropore arrangement structure and manufacturing method thereof |
| CN201448749U (en) * | 2009-06-25 | 2010-05-05 | 广东金朗电子科技有限公司 | Diffusing type big power LED optical lens |
| CN201655215U (en) * | 2010-03-17 | 2010-11-24 | 中兴通讯股份有限公司 | LOGO light-emitting device of electronic equipment |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105722347A (en) * | 2016-04-05 | 2016-06-29 | 东莞劲胜精密组件股份有限公司 | Electronic product shell with built-in antenna and production method of electronic product shell |
| CN106763042A (en) * | 2017-01-20 | 2017-05-31 | 维沃移动通信有限公司 | A kind of bond and adhering method |
| CN108538664A (en) * | 2018-04-27 | 2018-09-14 | 立烽电子科技(厦门)有限公司 | A kind of manufacturing method of panel-switch metal decking |
| CN108538664B (en) * | 2018-04-27 | 2019-08-20 | 立烽电子科技(厦门)有限公司 | A kind of manufacturing method of panel-switch metal decking |
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Application publication date: 20150826 |
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