CN102866451A - Light guide plate structure and manufacturing method thereof - Google Patents
Light guide plate structure and manufacturing method thereof Download PDFInfo
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- CN102866451A CN102866451A CN2011101904688A CN201110190468A CN102866451A CN 102866451 A CN102866451 A CN 102866451A CN 2011101904688 A CN2011101904688 A CN 2011101904688A CN 201110190468 A CN201110190468 A CN 201110190468A CN 102866451 A CN102866451 A CN 102866451A
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- optical waveguide
- waveguide layer
- conducting plate
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- light conducting
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Abstract
The invention relates to a light guide plate structure and a manufacturing method thereof. The light guide plate structure comprises a light guide layer and at least one barrier line. The barrier line comprises ink, is positioned in the light guide layer and is used for obstructing the light guide layer to guide light so as to ensure the light guide layer to sectionally guide light or prevent light leakage. The invention also relates to manufacturing of the light guide plate structure, wherein the light guide layer is subjected to surface modification processing. The ink is printed on the surface of the light guide layer subjected to surface modification processing, so that the ink permeates or erodes into the light guide layer to form the barrier line.
Description
Technical field
The present invention relates to a kind of light conducting plate structure, particularly relate to a kind of light conducting plate structure of press-key structure.
Background technology
Press-key structure often needs the setting of light source and light guide plate, to replenish light in the dark place, for the identification button.For conservation of power or for subregion shows different colours, the existing way that proposes divisional light emission.But existing divisional light emission light guide plate is the multiple-piece assembling or rushes a plurality of holes to intercept the light conduction, and its light conduction rejection rate is limited, and rear manufacture craft assembling is complicated, thereby reduces production capacity, causes with high costs.Other has existing light guide structure, as following.
TOHKEMY discloses a kind of light guide plate 2010-073317 number, is to be attached to separately closed circular light absorption department on the base material as the luminous means in zone with a plurality of, makes each light guide plate collocation side light source and reach the zone luminous.The ring-shaped light absorbent portion is attached on the base material by sticker.
TOHKEMY discloses a kind of light guide plate 2010-153361 number, and it forms groove in light guide plate, utilizes cutting head that light absorption department is die-cut in the groove, in order to intercept the leaded light of light guide plate, reaches the purpose of divisional light emission.Therefore, at different light-emitting zones, all need in light guide plate, to form groove, insert again the prior light absorption department of having made appropriate size, light guide plate must have certain thickness, or must with light guide plate elder generation liner one deck base material, for example utilize the shell fragment film as base material, and the light guide plate of zones of different be to cut off fully mutually when making groove.
TOHKEMY discloses a kind of light guide plate 2010-212123 number, and it cuts light guide plate, is formed with the slope, then on the slope and intermediate gap seal be coated with an ink to form light absorption department.Therefore, the light guide plate of different light-emitting zones is to cut off each other, must for example utilize the shell fragment film as base material light guide plate elder generation liner one deck base material after the incision, light absorption department is inserted again.
TOHKEMY discloses a kind of method that prevents light guide plate edge light leak 2010-212173 number, and its surrounding edge end face in light guide plate attaches a dark adhesive tape, in order to prevent light leak.
Therefore, the light guide plate that is applied to divisional light emission for novelty still has demand, reaches with facility to make cheaply.
Summary of the invention
A purpose of the present invention is to provide a kind of light conducting plate structure and method for making thereof, and it can have Partitioned light-guiding or leakproof effect of light.
For reaching above-mentioned purpose, in one aspect of the invention, comprise an optical waveguide layer and at least one barrier line according to light conducting plate structure of the present invention.Barrier line comprises printing ink, and it is arranged in optical waveguide layer, in order to intercepting the leaded light of optical waveguide layer, and makes the optical waveguide layer Partitioned light-guiding or prevents light leak.
In another aspect of this invention, the method according to manufacturing light conducting plate structure of the present invention comprises the following steps.One optical waveguide layer is provided.Optical waveguide layer is carried out a surfaction to be processed.Printed a printing ink on the optical waveguide layer surface of processing through surfaction, in optical waveguide layer, formed a barrier line to infiltrate or to corrode.
In the present invention, utilize printing ink (for example photoresist is every black ink) to be printed in optical waveguide layer and infiltrate or corrode in the inner, form a barrier line, can effectively intercept and limit the light conduction zone, and then reach divisional light emission or prevent the effect of light leak.More can allow backlight module utilize the function of divisional light emission, (for example light emitting diode (light-emitting diode, LED) electrical source consumption improves the battery stand-by time, improves thus the product surcharge with competitive to lower light source.Moreover, because optical waveguide layer keeps monolithic in the manufacture craft, therefore make facility and cost is low.
Description of drawings
Fig. 1 is the floor map of the light conducting plate structure of a specific embodiment of the present invention;
Fig. 2 is a cross section enlarged diagram of the light conducting plate structure of a specific embodiment of the present invention;
Fig. 3 is the cross section signal enlarged drawing of the light conducting plate structure of another specific embodiment of the present invention;
Fig. 4 is the floor map of the light conducting plate structure of another specific embodiment of the present invention;
Fig. 5 is the cross section signal enlarged drawing of the light conducting plate structure of another specific embodiment of the present invention;
Fig. 6 is the process flow diagram of method of the manufacturing light conducting plate structure of a specific embodiment of the present invention.
The main element symbol description
10 light conducting plate structures, 12 optical waveguide layers
14 barrier line 16,18,20 light sources
21 metal clips, 22 microstructures
23 printed circuit board (PCB)s 24,26,28 light
25 circuits, 27 shell fragment films
29 button cap structures, 30 convex bodys
32 light sources, 34 through holes
36 anti-dazzling screens, 40 light conducting plate structures
101,102,103,104,105,106 steps
Embodiment
Fig. 1 shows the floor map according to a specific embodiment of light conducting plate structure of the present invention.Light conducting plate structure 10 comprises an optical waveguide layer 12, and a barrier line 14.Barrier line 14 is arranged in optical waveguide layer 12, in order to intercepting the leaded light of optical waveguide layer 12, and makes optical waveguide layer 12 Partitioned light-guidings.Therefore, can become an one chip divisional light emission light guide plate.As shown in the figure, barrier line 14 intercepts the leaded light of optical waveguide layer 12, and is divided into A, B and C three district's leaded lights.For example, the light that light source 16 sends is owing to have stopping of barrier line 14, therefore only conduction in the A district; In like manner, the light that light source 18 sends, only conduction in the B district; The light that light source 20 sends, then only conduction in the C district.So take full advantage of the light of respectively distinguishing light source, concentrate on this divisional light emission, respectively distinguish brightness or reduce the light source consumption and can improve, can reach the purpose of the electrical source consumption that reduces light source.When barrier line 14 centers on whole optical waveguide layer 12, then can form shaded effect, avoid light leak to extraneous, and be a light guide plate anti-light leakage structure.
In Fig. 1, be shown in optical waveguide layer 12 surfaces and be provided with a plurality of microstructures 22, in order to change the opticpath in the optical waveguide layer 12.
Fig. 2 shows the cross section enlarged diagram according to the light conducting plate structure of a specific embodiment of the present invention.The light that light source 20 sends enters optical waveguide layer 12, becomes light 24, and its a part of light 26 can be changed travel path by microstructure 22, and penetrate from the surface, top of optical waveguide layer 12, the light 28 of some moves in addition, to barrier line 14 places, is blocked line 14 and intercepts.
The material of optical waveguide layer can be can accept printing ink infiltration or erosion person, for example silica resin (silicone), thermoplastic poly amido formate (thermoplastic polyurethane, TPU) or other soft light guides.Optical waveguide layer thickness can be decided according to need, is not particularly limited.When for example being applied to thin keypressing structure, its thickness can be for example 0.125mm.
Barrier line comprises a printing ink, is arranged in optical waveguide layer, to intercept leaded light.Better, barrier line is had be higher than 80% stop rate (or claim shading rate, it is relative with transmittance).Printing ink can have the character that absorbs light or reflection ray, dark ink for example, and it can be again for example black, mazarine etc. printing ink.Can select suitable printing ink according to attachment (that is, optical waveguide layer) attribute, for example for the optical waveguide layer of TPU material, can select for example polyurethane (polyurethane, PU) black ink.Can further add bleeding agent in printing ink to strengthen seepage force.Ink printing is on the optical waveguide layer and infiltrate in or corrode to optical waveguide layer, so optical waveguide layer is to keep single sheet.Can form barrier line by arbitrary of optical waveguide layer.There is no particular restriction for live width, and barrier line also is not limited to identical with optical waveguide layer thickness in the degree of depth of optical waveguide layer, can be not as good as optical waveguide layer thickness, as long as can obtain the desired rate that stops.To be barrier line 14 formed by the one side of optical waveguide layer 12 specific embodiment that Fig. 2 shows, and microstructure 22 is formed at the situation of the another side of optical waveguide layer 12.
Further the shape of included microstructure can be the shape of protrusion or the shape of depression in the present invention, comprising sphere for example, hemispherical, circular cone, tetragonal pyramid, 90 degree tapers etc. shape, can be positioned at two of optical waveguide layer arbitrary.The distribution of microstructure can be the block distribution mode, for example be scattered in a plurality of blocks, these blocks correspond respectively to predetermined a plurality of key positions, the light of light source enters after the optical waveguide layer, have strong and weak different light intensities at the diverse location of optical waveguide layer, the better light intensity that makes is than the microstructure distribution density of the strength microstructure distribution density less than the weak place of light intensity.
Fig. 3 shows the cross section enlarged diagram according to the light conducting plate structure of another specific embodiment of the present invention, and shows that it is arranged in the situation of a press-key structure.Wherein, optical waveguide layer 12 has at least one convex body 30, and convex body 30 is pressing force to metal clips 21 that transmit the user, so that the circuit 25 on the metal clips 21 contact print circuit boards 23 is with turning circuit.Metal clips 21 can utilize a shell fragment film 27 to be fixed on the printed circuit board (PCB) 23.29 of button cap structures are positioned at optical waveguide layer 12 tops, corresponding to the position of convex body 30.
What Fig. 1 to Fig. 3 showed is the situation that is applied to the lateral emitting light source according to light conducting plate structure of the present invention.Also can be applicable to the front illuminating source according to light conducting plate structure of the present invention, for example Fig. 4 and situation shown in Figure 5.Light conducting plate structure 40 comprises optical waveguide layer 12 described above and barrier line described above 14.As shown in the figure, barrier line 14 is divided into two leaded light subregions around optical waveguide layer 12 and with optical waveguide layer 12.Optical waveguide layer 12 also can have a plurality of microstructure 22 described above.The light that light source 32 (for example LED) sends can enter in the optical waveguide layer 12 via the through hole 34 of optical waveguide layer 12.Through hole 34 tops then shut out the light with anti-dazzling screen 36.
Fig. 6 shows a process flow diagram according to the method for the manufacturing light conducting plate structure of a specific embodiment of the present invention.And see also Fig. 2.At first, carry out step 101, an optical waveguide layer 12 is provided.Optical waveguide layer 12 as above-mentioned.Then carry out step 102, optical waveguide layer 12 is carried out a surfaction process.Surfaction is processed and is wanted to make follow-up barrier line 14 materials that are formed in the optical waveguide layer 12 easily to infiltrate or corrode in optical waveguide layer 12.Surfaction is processed can be and for example can be made the optical waveguide layer surface increase tack, and this for example can utilize medium agent and reach; For example can make the optical waveguide layer surface roughening again, this can utilize methods such as corona (corona) processing, ultraviolet plasma (UV plasma) processing or plasma (plasma) processing to reach.
Then carry out step 103, printed a printing ink on optical waveguide layer 12 surfaces of processing through surfaction.Since optical waveguide layer 12 surfaces upgrading, this printing ink can be good infiltration or corrode and in optical waveguide layer 12, form a barrier line 14.The two is proportional to infiltrate ratio and light resistance rate, and when infiltrating than increase, light resistance rate also increases thereupon.The mode of printing can be for example screen painting etc.The benefit of screen painting is to exert pressure to optical waveguide layer 12, and this pressure just can be used to promote the infiltration of printing ink.Then, optionally carry out the ink setting that makes of step 104.Carry out the die-cut of step 105, obtain the profile of monolithic light guide plate and the through hole that depends on the needs.Carry out at last step 106 to finish the making of light guide plate, make the light conducting plate structure finished product.
Moreover the formation of microstructure 22 can be before or after the printing of carrying out step 103, and microstructure 22 can be utilized Laser Processing or form with 12 while of optical waveguide layer molding.Microstructure 22 forms can be at the same face of optical waveguide layer 12 or coplanar not with printing.Also can be further that convex body 30 and optical waveguide layer 12 is integrally formed.
The above only is preferred embodiment of the present invention, and all equalizations of doing according to claim of the present invention change and modify, and all should belong to covering scope of the present invention.
Claims (14)
1. light conducting plate structure comprises:
Optical waveguide layer; And
At least one barrier line, it comprises a printing ink, this printing ink is arranged in this optical waveguide layer, in order to intercepting the leaded light of this optical waveguide layer, and makes this optical waveguide layer Partitioned light-guiding or prevents light leak.
2. light conducting plate structure as claimed in claim 1, wherein, this printing ink has the character that absorbs light or reflection ray.
3. light conducting plate structure as claimed in claim 1, wherein, this printing ink infiltrates in this optical waveguide layer.
4. light conducting plate structure as claimed in claim 1, wherein, this printing ink corrodes to this optical waveguide layer.
5. light conducting plate structure as claimed in claim 1, wherein, this optical waveguide layer has a plurality of microstructures, in order to change the opticpath in this optical waveguide layer.
6. light conducting plate structure as claimed in claim 1, wherein this optical waveguide layer has at least one convex body, and this convex body is pressing force to the button metal clips that transmits a user.
7. method of making light conducting plate structure comprises:
One optical waveguide layer is provided;
This optical waveguide layer is carried out a surfaction to be processed; And
Printed a printing ink on this optical waveguide layer surface of processing through this surfaction, in this optical waveguide layer, formed a barrier line to infiltrate.
8. method of making light conducting plate structure comprises:
One optical waveguide layer is provided;
This optical waveguide layer is carried out a surfaction to be processed; And
Printed a printing ink on this optical waveguide layer surface of processing through this surfaction, in this optical waveguide layer, formed a barrier line to corrode.
9. such as the method for claim 7 or 8 described manufacturing light conducting plate structures, wherein, this surfaction is processed and is comprised roughening.
10. such as the method for claim 7 or 8 described manufacturing light conducting plate structures, wherein, this surfaction is processed and is comprised corona treatment, ultraviolet plasma processing or Cement Composite Treated by Plasma.
11. the method such as claim 7 or 8 described manufacturing light conducting plate structures further comprises:
This optical waveguide layer is die-cut, to form this light conducting plate structure finished product.
12. the method such as claim 7 or 8 described manufacturing light conducting plate structures further comprises:
Form microstructure at this optical waveguide layer.
13. such as the method for claim 7 or 8 described manufacturing light conducting plate structures, further, after forming this barrier line, comprising to infiltrate or to corrode in this optical waveguide layer at this printing ink of printing:
Make this ink setting.
14. such as the method for claim 7 or 8 described manufacturing light conducting plate structures, wherein this printing comprises screen painting.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011101904688A CN102866451A (en) | 2011-07-08 | 2011-07-08 | Light guide plate structure and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011101904688A CN102866451A (en) | 2011-07-08 | 2011-07-08 | Light guide plate structure and manufacturing method thereof |
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| Publication Number | Publication Date |
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| CN102866451A true CN102866451A (en) | 2013-01-09 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN2011101904688A Pending CN102866451A (en) | 2011-07-08 | 2011-07-08 | Light guide plate structure and manufacturing method thereof |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104347299A (en) * | 2013-08-05 | 2015-02-11 | 致伸科技股份有限公司 | Light emitting keyboard and light guide plate module thereof |
| CN109148196A (en) * | 2018-08-24 | 2019-01-04 | 惠州Tcl移动通信有限公司 | A kind of key device |
| CN111489906A (en) * | 2019-06-18 | 2020-08-04 | 光宝电子(广州)有限公司 | Key backlight module and application thereof |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20080060197A (en) * | 2008-04-04 | 2008-07-01 | 주식회사 두성테크 | Shading device for key panel |
| JP2011065970A (en) * | 2009-09-18 | 2011-03-31 | Fujikura Ltd | Light guide plate and method of manufacturing the same |
| CN201946478U (en) * | 2011-01-04 | 2011-08-24 | 东莞市康德五金电子有限公司 | Light guide plate module |
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2011
- 2011-07-08 CN CN2011101904688A patent/CN102866451A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20080060197A (en) * | 2008-04-04 | 2008-07-01 | 주식회사 두성테크 | Shading device for key panel |
| JP2011065970A (en) * | 2009-09-18 | 2011-03-31 | Fujikura Ltd | Light guide plate and method of manufacturing the same |
| CN201946478U (en) * | 2011-01-04 | 2011-08-24 | 东莞市康德五金电子有限公司 | Light guide plate module |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104347299A (en) * | 2013-08-05 | 2015-02-11 | 致伸科技股份有限公司 | Light emitting keyboard and light guide plate module thereof |
| CN104347299B (en) * | 2013-08-05 | 2017-04-12 | 致伸科技股份有限公司 | Light emitting keyboard and light guide plate module thereof |
| CN109148196A (en) * | 2018-08-24 | 2019-01-04 | 惠州Tcl移动通信有限公司 | A kind of key device |
| CN111489906A (en) * | 2019-06-18 | 2020-08-04 | 光宝电子(广州)有限公司 | Key backlight module and application thereof |
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Application publication date: 20130109 |