CN104867903B - Electronic module - Google Patents
Electronic module Download PDFInfo
- Publication number
- CN104867903B CN104867903B CN201510084078.0A CN201510084078A CN104867903B CN 104867903 B CN104867903 B CN 104867903B CN 201510084078 A CN201510084078 A CN 201510084078A CN 104867903 B CN104867903 B CN 104867903B
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- Prior art keywords
- circuit board
- subregion
- building brick
- electronic building
- line construction
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
- H01L23/5386—Geometry or layout of the interconnection structure
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3735—Laminates or multilayers, e.g. direct bond copper ceramic substrates
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/145—Arrangements wherein electric components are disposed between and simultaneously connected to two planar printed circuit boards, e.g. Cordwood modules
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0254—High voltage adaptations; Electrical insulation details; Overvoltage or electrostatic discharge protection ; Arrangements for regulating voltages or for using plural voltages
- H05K1/0262—Arrangements for regulating voltages or for using plural voltages
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0263—High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
- H05K2201/2036—Permanent spacer or stand-off in a printed circuit or printed circuit assembly
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical & Material Sciences (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Ceramic Engineering (AREA)
- Materials Engineering (AREA)
- Geometry (AREA)
- Combinations Of Printed Boards (AREA)
Abstract
The present invention relates to a kind of electronic module (1), with at least one can on it (10) and its downside (9) at contact electronic building brick (8,12), the downside (9) at least partly flatly sticks on the line construction (4) of first circuit board (2), and the upside (10) at least partly flatly sticks on the line construction (16) of second circuit board (14).Method of the one kind for manufacturing electronic module (1) includes being mounted at least one electronic building brick (8,12) on the line construction (16) of second circuit board (14) using its upside (10)；At least one spacing holder (13) is mounted at the line construction (16) of second circuit board (14)；And the line construction of first circuit board (2) (4) is installed on the upside (9) and at least one spacing holder (13) of at least one electronic building brick (8,12).The present invention can especially be applied to especially wherein to have and be integrated on the power electronics modules of half-bridge.
Description
Technical field
The present invention relates to a kind of electronic module, at least one can on it with its downside place contact electronics group
Part, the downside at least partly flatly stick on the line construction of first circuit board.The invention further relates to a kind of manufactures should
The method of electronic module.The present invention can be especially applied on the power electronics modules especially wherein with integrated half-bridge.
Background technique
In power (electronics) module, lead to two link positions of power semiconductor assembly or power semiconductor chip
It is required.These link positions are commonly referred to as chip upside and chip underside.Typically, electrical connection is established simultaneously on the upside of chip
And generate the contact to module or the electric current to the contact surface on insulating layer.The prior art for establishing electrical connection is aluminum
Thick line is bonded on chip in side and is bonded on joint face in the other side.It is also well known that passing through copper line bonding
(such as with thick line or thin line), short strip are bonded and are bonded foundation electrical connection with alloy wire.In addition other connection solution party
Case is made of plastic film be sintered, metallization, such as according to so-called " SKiN " technology of Semikron company.SKiN skill
Art is characterized in, replaces bonding line by the film of structuring flexible, and flat being sintered to of the film, which has, is fixed on it
On power electronics assemblies circuit board on.Furthermore it is known that the busbar connector of the welding made of thin copper.Additionally known west
So-called " SiPLIT " interconnection technique of door subsidiary.
In well known interconnection technique disadvantageously, the upper routing planes being connected with chip surface are applying nonplanar company
It is difficult to cool down when connection technology (such as by line bonding).During fabrication, using the interconnection technique of plane, such as " SKiN " or
" SiPLIT " interconnection technique then expend it is bigger, especially not only based on expend big production stage such as structuring or metallization but also
It is more expensive.
Summary of the invention
It is an object of the present invention at least partly overcome defect in the prior art and especially propose that one kind is used for
The interconnection technique that can be simply implemented and can efficiently cool down of electronic module, the especially connection for the upside of electronic module
Technology, the electronic module have at least one electronic building brick, especially power electronics assemblies, especially power semiconductor chip
Piece.
The purpose is realized according to the feature of independent claims.Preferred embodiment particularly can dependent claims
In obtain.
The purpose realized by a kind of electronic module, at least one can on it with its downside place contact
Electronic building brick, the downside at least partly flatly stick on the line construction of first circuit board, and the upside at least portion
Ground is divided flatly to stick on the line construction of second circuit board.Therefore, at least one electronic building brick is specifically arranged at two
Between circuit board, such as arranged with so-called " sandwich " structure.
The advantages of this electronic module is, can produce simply and inexpensively circuit board and circuit board can be simply
And it is connect in many ways with electronic building brick.For this purpose, the side far from least one electronic building brick of circuit board can be in large area
Cooling, this realizes at least one electronic building brick, particularly on two sides particularly effective heat extraction.
Improved cooling produces other advantages, such as implicit preferably making full use of, using more to electronic building brick
The cooling medium such as cold water etc. of heat.
Electronic building brick is particularly capable of being component existing for chip type, which has the group at its downside on it
The electric contact of part.Component for example can be semiconductor chip, such as " unpackaged chip (Naked Chip) " or " naked core
Piece (Bare Die) " and exist.Electric contact can have a for example, at least contact area and/or at least one contact outstanding
Element (a for example, at least contact plug).The electronic building brick for being able to use encapsulation additionally or alternatively.
Particularly, first circuit board and/or second circuit board can have ceramic substrate.The ceramic substrate can be in side
Or two sides are provided with corresponding metal layer.Metal layer is at least in the side towards at least one electronic building brick of circuit board
Structuring, and therefore form line construction or routing planes.Particularly, line construction can have one or more
Printed wiring and/or contact zone and/or the contact element of stretching.
Particularly, the metal layer on the side towards at least one electronic building brick can be made of copper.
Particularly, first circuit board and second circuit board are arranged parallel to each other.
A kind of design scheme is that at least one electronic building brick is power electronics assemblies.For this purpose, realized according to the present invention
Efficiently cooling is particularly advantageous, because the thermal output from power electronics assemblies is especially high.
A kind of improvement project is that at least one power electronics assemblies is IGBT, power MOSFET, power diode, brilliant lock
Pipe, triacs (Triac).Particularly, at least one power electronics assemblies is as (unencapsulated) function
Rate semiconductor chip exists.
It is that first circuit board and/or second circuit board are at it far from least one electronic building brick there are also a kind of design scheme
Side have metal layer.The metal layer can be it is non-structured, it is especially completely flat.It is thus achieved that especially good
Cooling feasibility and high frequency characteristics.
A kind of improvement project is, at the separate side existing for metal layer be layers of copper.It is base there are also a kind of improvement project
Matter is ceramic substrate and is both provided with layers of copper in two sides.A kind of special improvement project is first circuit board and/or the second electricity
Road plate is that (direct copper-clad plate " Direct Bonded Cooper ", also makees DBC, " Direct Cooper to DCB circuit board
Bonded").First circuit board and/or second circuit board can have aluminium layer in separate side
IMS circuit board (" insulated metallic substrate " Insulated Metal Substrate).But first and/or second circuit board
DAB circuit board (direct covering aluminum plate " Direct Aluminium Bonded "), at least AMB circuit board (activity can be at least
Solder bonding metal " Active Metal Brazing ") and/or at least conventional FR4 circuit board.
Other design schemes are that at least one electronic building brick, particularly semiconductor chip are located to have between two parties on it
Or central electric contact, and second circuit board has the plated-through hole of the electric contact in contact center.This is significantly improved
Flexibility about applicable components, because this component with center contact can also be used at this time.
It can have one or more contact at upside and/or downside.Such as electronic switch, particularly breaker,
Such as place not only with load contacts (typically transmitter contact) but also can have auxiliary to igbt chip on it
Contact (such as central fence or fence contact).
Design alternatives for identical purpose are, at least one electronic building brick locate on it with placed in the middle or
The electric contact in center, and second circuit board has corresponding gap.This can be particularly advantageous for following situations, i.e., in
The electric contact of centre does not have flat contact zone, but for example stretches out upwards.
The electric contact in center does not need accurately to be centrally disposed on component, but can be for example slight with accurate center
It arranges with being staggered.
With being additional to or substitute the contact in center, electronic building brick can be located on it at least one edge side
Contact (such as edge fence) and/or at least one be arranged in the contact (such as angle fence) of edge.
Particularly, the electronic building brick equipped with the contact in center can be electronic switch, particularly breaker, such as
IGBT.Particularly, central electric contact can be control contact, particularly fence contact or " central fence ".
It is that first circuit board and second circuit board are by least one spacing holder there are also a kind of other design schemes
(especially by multiple spacing holders) is separated from each other.This realizes the particularly accurate positioning of two circuit boards to each other.
Thus a kind of improvement project is that at least one spacing holder is can be conductive.Therefore, can be used as simultaneously
Electrical connecting element between the conductor structure of two circuit boards.
Spacing holder can for example be configured to the tool in cross section, and there are two the rodlike, for example rectangular of parallel contact surface
Body shape.Also it is able to use the spacing holder of each or its line construction from the two circuit boards, these
Corresponding lesser height is respectively provided with away from holder and is for example contacted in couples.
In addition, a kind of design scheme is, first circuit board is mounted with that the line construction of at least one electronic building brick has
At least one first subregion and at least one second subregion separated with the first subregion electricity, and the of first circuit board
The line construction electrical connection for being mounted at least one electronic building brick that one subregion and the second subregion pass through second circuit board.This
Realize the energy simple realization of at least one electronic building brick and diversified electrical wiring.Therefore, first and second circuit boards
Line construction constitutes the wiring for the first electronic building brick.
A kind of improvement project is, in the different subregions of first circuit board, at least two subregions are in different from each other
Current potential.This can for example be realized by applying DC voltage or alternating voltage.
The line construction of second circuit board can also have multiple separate subregion.A kind of improvement project is, second
In the different subregions of circuit board, at least two subregions are in current potential different from each other.
Corresponding contact (such as load or forceful electric power contact, such as transmitter contact and/or collector contact and/or auxiliary
Adjuvant grafting point such as controls contact or fence contact), especially first circuit board and/or the second electricity can be arranged in load contacts
On the plate of road.
Contact, particularly load contacts can for example be present in that one in two circuit boards upper or line construction on,
It is especially in the presence of on bigger one of the area in two circuit boards, is specifically present at this and is not covered by other circuit board
At the region of lid.Alternatively, such as can also be present between two circuit boards and then for example protruding from side.
It is that the line construction for being mounted at least one electronic building brick of first circuit board is additionally there are also a kind of design scheme
With at least one the third subregion separated with other subregions, and at least one third subregion and other subregions
In at least one subregion by second circuit board be especially mounted at least one electronic building brick line construction electrical connection.
In addition, a kind of design scheme is, DC voltage can be applied between the first subregion and third subregion, and
The electric signal of high frequency, such as alternating voltage can be applied at the second subregion.Therefore, it particularly supports as at least one function
Rate component supplies high frequency electrical signal.Particularly, the first subregion of first circuit board and the second subregion or its line construction
It can be connected to each other by the subregion of the line construction of second circuit board, and the second subregion and third of first circuit board
Subregion or its line construction can be connected to each other by other subregions of second circuit board.Particularly, at least one
One region, at least one second area and at least one third region can connect by this order.
In addition, a kind of design scheme is, it is half-bridge that electronic module, which is with half-bridge or electronic module,.
The purpose also can realize that wherein this method at least has following step by the method for manufacturing electronic module
Rapid: at least one electronic building brick is mounted at the line construction of second circuit board by (i) using its upside；(ii) by least one
Spacing holder is mounted at the line construction of second circuit board；And the line construction of first circuit board is installed to (iii)
On the downside of at least one electronic building brick and at least one spacing holder.
The advantages of this method is, considers, at least one electronic building brick second circuit board route knot
For positioning at structure, it may be necessary to extra high accuracy, especially if at least one electronic building brick is located to have on it
There is the contact in center.For this purpose, can especially come by known flip chip technology (fct) (Flip-Chip-Technologie) real
The installation of at least one electronic building brick of row.Requirement to positioning accuracy is significantly lower than in step (i) in step (iii), such as
Because the area for the plated-through hole being located on each other and the area of center contact are significantly less than for example in first circuit board
Line construction on electronic building brick possible contact surface.
However, setting spacing holder is essentially that can select, so that this method can not also execute step (ii)
And execute the step of accordingly having adjusted (iii).
Step (i) and step (ii) can in any order, also can be executed in identical process steps.
It is between electronic building brick and line construction, between spacing holder and line construction and/or in contact and
Connection between line construction can be realized particularly by sintering process.
Detailed description of the invention
Above-mentioned attribute, feature and advantage and the methods for how realizing these of the invention, in conjunction with following by attached
What figure elaborated becomes apparent from schematically illustrating for embodiment understandable.Here, for clarity, identical or effect
Identical element is equipped with identical reference label.
Fig. 1 is opened the part shown using two and shows electronic module according to the present invention to overlook；
Fig. 2 shows electronic module according to the present invention with the side elevational cross-section along the first section Q1；With
Fig. 3 shows electronic module according to the present invention with the side elevational cross-section along the second section Q2.
Specific embodiment
Fig. 1 shows electronic module 1 to overlook, and is shown with opening with two parts.One in the two parts,
I.e. " following " is partially first circuit board 2, the ceramic substrate 3 with plate, which has the line for being mounted on side
Line structure 4.Line construction 4 almost covers ceramic substrate 3.Line construction 4 be divided into coupling the first subregion 5 and its
Second subregion 6 of the coupling opened by clearance gap and the third subregion 7 for the coupling opened with it by clearance gap.Route
Structure 4 or subregion 5 to 7 are configured to layers of copper.
There are three the power electronics assemblies of 8 form of igbt chip for the assembly of first subregion 5.Igbt chip 8 utilizes it thus
Downside 9 (see Fig. 3) is flatly mounted on the first subregion 5.Igbt chip 89 on the downside of it at there is collector contact, the collection
Electrode contact is connected electrically and being flatly fixed at the first subregion 5.Igbt chip 8 is at the upside 10 shown in it
There are two other contacts, the i.e. auxiliary contact 11 (fence contact) of transmitter contact and center for tool.
For this purpose, there are three other electronic building bricks 12 for the assembly of the first subregion 5, such as it is equipped with power diode.
Second subregion 6 and the first subregion 5 are similarly fitted with three igbt chips 8 and three other electronic building bricks
12.Additionally, spacing holder 13 that the second subregion 6 is equipped with rectangular-shape, that energy is conductive.The spacing holder 13 can
Such as it is made of copper.
Finally, third subregion 7 is equipped with (in addition) spacing holder 13.
Another in the two parts, that is, " above " partially illustrate second circuit board 14, equally have
The ceramic substrate 15 of plate, the ceramic substrate have the line construction 16 for being mounted on side.Line construction 16 is divided into the first son
Region 17 and the second subregion 18 opened with it by clearance gap.First subregion and the second sub-district domain construction are identical.Route
Structure 16 or subregion 17 and 18 are designed to layers of copper.
Two sub-regions 17 and 18 are respectively provided with the perforation (Vias) separated with remaining region electricity or plated-through hole
19, and there is spacing identical with the central auxiliary contact 11 of three igbt chips 8.The two subregions 17 and 18 can divide
Not Ju You spacing holder 13, and instead of or be additional to the spacing holder 13 of first circuit board 2.
In its mounted state, the two regions 2 to 13 and 13 to 19 be assembling.One kind is for reliable group
Preferred improvement project is that igbt chip 8 and spacing holder 13 are installed to second circuit board 14 or its line first for dress
On line structure 16, and then second circuit board 2 or its line construction 4 are attached thereto.
In the present embodiment, the first subregion 5 is in the first DC voltage and third subregion 7 is in by comparison
Lower second voltage is horizontal.Ac voltage signal can be applied at the second subregion 6.
Fig. 2 shows assembled electronic module 1 with the side elevational cross-section along the first section Q1 shown in Fig. 1.It cuts open
The first subregion 5 that face Q1 passes through first line structure 4 from left to right extends, and is staggered with the midpoint of three igbt chips 8.
Therefore, the first subregion 17 that section Q1 also passes through second circuit board 14 extends, and is staggered with midpoint and is located at three in turn
Except plated-through hole 19.
The upside 10 of igbt chip 8 is flatly connect and at this with the with the first subregion 17 of second circuit board 14
The electrical connection of one subregion 17.Separatedly with its electricity, three plated-through holes 19 center auxiliary corresponding with the igbt chip 8 connects
Point 11 is in contact and (is shown in FIG. 3).Similarly, this second subregion 18 and First Line for being also applied for the second line construction 16
The igbt chip 8 of second subregion 6 of line structure 4.
Second circuit board 14 has than the smaller width of first circuit board 2, thus the second subregion 6 and the first subregion 5
Right border region be exposed above.The exposed face 20,21 can especially be had based on its simple accessible degree
It is used as the contact of electric signal sharply.However, substituting or additional it is also feasible that second circuit board 14 and its line construction 16
Also it is implemented as and is at least partly wider than first circuit board 2, and the exposed surface of line construction 16 is used as the contact of electric signal.May be used also
Capable, the two circuit boards 2,14 are also capable of especially wide (or isometric), and power supply line from side in two electricity
It is stretched out between road plate 2,14.
Fig. 3 shows assembled electronic module 1 with the side elevational cross-section along the second section Q2 shown in Fig. 1.It should
Section Q2 is perpendicular to section Q1 and continuous across the first subregion 5 of first line structure 4 or the second subregion 6 two
The igbt chip 8 of arrangement, and medially pass through the auxiliary contact 11 in center and pass through spacing holder 13 that may be present and prolong
It stretches.Its two subregion 17 and 18 for also passing through the second line construction 16 extends, and it is logical to pass through two metallization placed in the middle
Hole 19 and pass through spacing holder 13 that may be present extend.The length of first circuit board 2 and second circuit board 14 is phase herein
With.
First circuit board 2 and second circuit board 14 are spatially separated by spacing holder 13.For this purpose, spacing is protected
Gripping member 13 is for being electrically connected the first subregion 17 of the second line construction 16 with the second subregion 6 of first line structure 4.Separately
Outer spacing holder 13 is used to make the third subregion of the second subregion 18 and first line structure 4 of the second line construction 16
7 electrical connections.It is thus achieved that following electrical pathways, are passed through thereon from the first subregion 5 of first line structure 4
Igbt chip 8 and electronic building brick 12 lead to the first subregion 17 of the second line construction 16 and from this across spacing holder
13 continue to vent to the second subregion 6 of first line structure 4.Particularly, which is passed through from the second subregion 6
Igbt chip 8 and electronic building brick 12 thereon extends to the second subregion 18 of the second line construction 16, and to the from this
The third subregion 7 of one line construction 4 extends.It is logical that metallization is stretched out at the side far from igbt chip 8 and electronic building brick 12
Hole 19, so as to which correspondingly load controls signal on the outside for it.
Although not shown, ceramic substrate 3 and 15 also can be on its side far from igbt chip 8 and electronic building brick 12
It is covered with (especially non-structured) metal layer.Particularly, ceramic substrate can be that DCB circuit board (is made of copper in metal layer
When) or IMS circuit board (when metal layer is made of aluminum).
Particularly, electronic module 1 also can be half-bridge.
Although being set forth and describing in detail the present invention by the embodiment that shows, the present invention not office
It is limited to this, and thus those skilled in the art can derive other variants, and without departing from protection scope of the present invention.
In general, as long as no clearly excluding, such as by statement " just what a " etc., " one ", "one" etc. energy
Enough be interpreted as odd number perhaps plural number especially in the scope of "at least one" or " one or more " etc.,.
As long as no clearly excluding, number explanation also can include that the number provided also includes common tolerance just
Range.
Claims (11)
1. a kind of electronic module (1), has
At least one electronic building brick (8,12) that can be contacted at the upside (10) and downside (9) of the electronic module,
The downside (9) at least partly flatly sticks on the line construction (4) of first circuit board (2), and
The upside (10) at least partly flatly sticks on the line construction (16) of second circuit board (14),
At least one described electronic building brick (8,12) have at the upside (10) of the electronic building brick central electric contact (11) and
The second circuit board (14) has the plated-through hole (19) being in contact with the central electric contact (11).
2. electronic module (1) according to claim 1, wherein at least one described electronic building brick is power electronics assemblies
(8)。
3. electronic module (1) according to claim 1, wherein at least one described electronic building brick is power semiconductor chip
Piece.
4. electronic module (1) according to any one of claim 1 to 3, wherein the first circuit board (2) and/or institute
Second circuit board (14) is stated in the first circuit board and/or at least one separate described electronic building brick of the second circuit board
The side of (8,12) has non-structured metal layer.
5. electronic module (1) according to any one of claim 1 to 3, wherein the first circuit board (2) and described
Second circuit board (14) is separated from each other by least one spacing holder (13).
6. electronic module (1) according to claim 5, wherein the first circuit board (2) and the second circuit board
(14) it is separated from each other by the conductive spacing holder (13) of at least one energy.
7. electronic module (1) according to any one of claim 1 to 3, wherein
The first circuit board (2) is mounted with that the line construction (4) of at least one electronic building brick (8,12) has
At least one first subregion (5) and at least one second subregion (6) electrically separated with first subregion, and
The peace that the first subregion (5) and the second subregion (6) of the first circuit board (2) pass through the second circuit board (14)
The line construction (16) electrical connection of at least one electronic building brick (8,12) is filled.
8. electronic module (1) according to claim 7, wherein
The line construction (4) for being mounted at least one electronic building brick (8,12) of the first circuit board (2) is additional
The third subregion (7) that there is at least one to separate with other subregions on ground,
And at least one subregion at least one described third subregion (7) and other subregions (5,6) is logical
That crosses the second circuit board (14) is mounted with that the line construction (16) of at least one electronic building brick (8,12) is electrically connected
It connects.
9. electronic module (1) according to claim 8, wherein
DC voltage can be applied between first subregion (5) and the third subregion (7), and
Alternating voltage can be applied at second subregion (6).
10. electronic module (1) according to any one of claim 1 to 3, wherein the electronic module (1) has half-bridge
Or the electronic module is half-bridge.
11. method of the one kind for manufacturing electronic module (1), wherein the method at least includes the following steps:
At least one electronic building brick (8,12) is mounted on second circuit board (14) using the upside (10) of the electronic building brick
At line construction (16)；
At least one spacing holder (13) is mounted at the line construction (16) of the second circuit board (14)；
The line construction (4) of first circuit board (2) is installed to the downside (9) and extremely of at least one electronic building brick (8,12)
On a few spacing holder (13),
Wherein, at least one described electronic building brick (8,12) has central electric contact (11) at the upside (10) of the electronic building brick
And the second circuit board (14) has the plated-through hole (19) being in contact with the central electric contact (11).
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE102014203310.1A DE102014203310A1 (en) | 2014-02-25 | 2014-02-25 | electronic module |
| DE102014203310.1 | 2014-02-25 |
Publications (2)
| Publication Number | Publication Date |
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| CN104867903A CN104867903A (en) | 2015-08-26 |
| CN104867903B true CN104867903B (en) | 2019-03-15 |
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| CN201510084078.0A Active CN104867903B (en) | 2014-02-25 | 2015-02-16 | Electronic module |
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| DE (1) | DE102014203310A1 (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| DE102016211652A1 (en) * | 2016-06-28 | 2017-12-28 | Zf Friedrichshafen Ag | Printed circuit board assembly, inverter and motor vehicle drive system with such a printed circuit board assembly |
| EP3547360A1 (en) * | 2018-03-29 | 2019-10-02 | Siemens Aktiengesellschaft | Semiconductor module and method of manufacturing same |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| DE10231091A1 (en) * | 2002-07-10 | 2004-01-22 | Robert Bosch Gmbh | Active rectifier module for three-phase generators of vehicles |
| US8680666B2 (en) * | 2006-05-24 | 2014-03-25 | International Rectifier Corporation | Bond wireless power module with double-sided single device cooling and immersion bath cooling |
| DE102011083223B4 (en) * | 2011-09-22 | 2019-08-22 | Infineon Technologies Ag | Power semiconductor module with integrated thick-film circuit board |
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| CN104867903A (en) | 2015-08-26 |
| DE102014203310A1 (en) | 2015-08-27 |
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