CN104865002B - MEMS pressure sensor device and packaging method thereof - Google Patents
MEMS pressure sensor device and packaging method thereof Download PDFInfo
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- CN104865002B CN104865002B CN201510223436.1A CN201510223436A CN104865002B CN 104865002 B CN104865002 B CN 104865002B CN 201510223436 A CN201510223436 A CN 201510223436A CN 104865002 B CN104865002 B CN 104865002B
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Abstract
The invention provides an MEMS pressure sensor device and a packaging method thereof. The MEMS pressure sensor device comprises the components of an integrated circuit, an MEMS pressure sensor which is connected with the integrated circuit, and a packaging assembly. The packaging assembly comprises a substrate and a cover plate. The cover plate is connected with the substrate and an accommodating space is formed, wherein the MEMS pressure sensor and the integrated circuit are connected with the substrate and are arranged in the accommodating space. The substrate is provided with a ventilation hole. Outside atmosphere contacts with the MEMS pressure sensor through the ventilation hole, so that the MEMS pressure sensor is suitable for sensing the outside air pressure through the back part of the MEMS pressure sensor.
Description
Technical field
The invention belongs to microelectromechanical systems (MEMS) field, more particularly to MEMS pressure sensor device and encapsulation side
Method.
Background technology
Microelectromechanical systems (Microelectromechanical Systems, MEMS), refer to collection microsensor,
Executor and signal processing and control circuit, communication and power supply are in the Micro Electro Mechanical System of one.At present, MEMS is used as pressure
Detecting system is widely used in all trades and professions such as water conservancy, chemical industry, medical treatment, automotive electronics, consumer electronics, industrial electronic, for example, vapour
The engine oil pressure sensor of car electronic applications, automobile brake system air pressure probe, the pressure of tire pressure monitoring system
Force transducer, air intake manifold of automotive engine pressure sensor, common rail for diesel engine pressure transducer, fuel distribution tube sensor,
Seat comfort degree sensor, side impact sensor；The tire gauge of consumer electronics field, sphygomanometer, health scale, vacuum cleaner pressure
Force transducer, A/C pressure sensor, washing machine, water dispenser, dish-washing machine, solar water heater Liquid level pressure sensing
Device；The digital pressure gauge of industrial electronic field, digital stream scale etc., and with the continuous progressive and economic level of science and technology
Continuous development, the field of MEMS pressure sensor application is more and more, has become the indispensable one kind of microelectronic industry
Electronic devices and components.
Fig. 1 show traditional packaged type of MEMS pressure sensor.As shown in figure 1, a kind of MEMS pressure sensor
Device, including a upper lid 2 of the base plate for packaging 1, with passage, a MEMS chip 3 and an integrated circuit (such as asic chip)
4, wherein the MEMS chip 3 and the asic chip 4 are connected on the base plate for packaging 1, and it is located at 1 He of the base plate for packaging
In the receiving space that the upper lid 2 is formed, and the MEMS chip 3 and the asic chip 4 pass through electric wire or bonding wire connects
Together, and with the base plate for packaging 1 it is connected, and the upper lid 2 with passage is bonded in one with the base plate for packaging 1
Rise, with ensure the MEMS chip 3 and the asic chip 4 and the external world have it is certain isolate, but can pass through passage with it is outer
Boundary's air is communicated, to sense the change of ambient pressure exactly.
As can be seen here, traditional MEMS pressure sensor as passage is arranged at upper lid, and is located at institute after encapsulation
The top of MEMS chip 3 is stated, therefore the MEMS chip 3 has to air pressure be sensed from top.But it is fast with microelectric technique
Speed development, the defect of current MEMS pressure sensor also gradually come out, and are mainly shown as current MEMS package scheme
Middle passage has to sense air pressure from top on the top of MEMS chip, therefore MEMS chip, but due to current MEMS pressure
The application of sensor is more and more extensive, and the occasion of application becomes increasingly complex, it is desirable to also more and more, in some occasions, due to certain
A little to limit, system user cannot use the pressure transducer that air pressure is sensed by top.
Additionally, the varistor of current MEMS pressure sensor is exposed in air, and outside air directly contact, and
Outside air, steam and corrosive substance therein can affect the performance and stability of varistor, cause indeterminacy really, shadow
The service life of varistor is rung, thus reduces the service life of MEMS pressure sensor.And current MEMS pressure sensings
Chip is directly connected by the passage of device with the external world, not with water-proof function, is easily intake, is damaged MEMS pressure sensor.
The range of application and service life of MEMS pressure sensor in order to solve problem above, are improved, is badly in need of pressing MEMS
The encapsulation of force transducer is improved, to meet the demand of more users.
The content of the invention
It is an object of the present invention to provide a kind of MEMS pressure sensor device and method for packing, by changing encapsulation
Mode, makes the MEMS pressure sensor be achieved back sensing pressure, to expand the range of application of MEMS pressure sensor.
Another object of the present invention is to a kind of MEMS pressure sensor device and method for packing are provided, by encapsulation base
The bottom of plate arranges passage so that ambient atmosphere is contacted with pressure-sensitive film and then sensing pressure so that the MEMS pressure is passed
Sensor realizes back detection pressure, is addressed user and cannot use asking for the MEMS pressure sensor by top sensing pressure
Topic.
Another object of the present invention is to a kind of MEMS pressure sensor and method for packing are provided, can be according to actual process
Situation and demand are changing set location of the passage on substrate, and then can change contact position of the ambient atmosphere with pressure-sensitive film
Put, it is more flexible and convenient.
Another object of the present invention is to a kind of MEMS pressure sensor device and method for packing are provided, by logical in gas
Overcoat is installed in road, while ensureing that ambient atmosphere is connected with pressure-sensitive film, good water resistance can be made it have again,
And additional waterproofing membrane is not needed, save material.
Another object of the present invention is to provide a kind of MEMS pressure sensor device and method for packing, varistor is sealed
Close in a vacuum chamber, no longer contact with the external world, prevent outside air, steam and other corrosive goods confrontation varistors
Performance and stability produce impact, extend its service life.
Another object of the present invention is to a kind of MEMS pressure sensor device and method for packing are provided, by passage
Place arranges a filter membrane, with the harmful substance being filtered to remove in air, prevents harmful substance from producing shadow to the performance of varistor
Ring, be able to protect varistor.
Another object of the present invention is to a kind of MEMS pressure sensor device and method for packing are provided, and compact structure, peace
Dress is convenient.
Another object of the present invention is to provide a kind of MEMS pressure sensor device and method for packing, it is not necessary to change and pass
The structure of the MEMS pressure sensor and integrated circuit of system is capable of achieving MEMS pressure sensor back sensing pressure, method for packing
Simply, cost is relatively low, and application is extensive.
To meet the object above and other objects of the present invention and advantage of the present invention, the present invention provides a kind of MEMS pressures
Force sensor device, including an integrated circuit and the MEMS pressure sensor for being connected to the integrated circuit, wherein described
MEMS pressure sensor includes a pressure-sensitive film and being connected to multiple varistors of the pressure-sensitive film, including：
One package assembling, which includes a substrate and a cover plate, and the cover plate is connected to the substrate, and it is empty to form a receiving
Between, wherein the MEMS pressure sensor and the integrated circuit are connected to the substrate and are located at the receiving space, it is described
Substrate has a passage, and ambient atmosphere is contacted with the pressure-sensitive film by the passage, obtained so that the MEMS pressure
Sensor device is suitable to by its back sense ambient pressure.
According to one embodiment of the invention, the substrate has a gas passage, wherein the gas passage and the ventilation
Hole, the MEMS pressure sensor are connected, and obtain so that ambient atmosphere sequentially passes through the passage, the gas passage and reaches
The MEMS pressure sensor.
Preferably, the gas passage is laterally located inside the substrate.
Preferably, the MEMS pressure sensor device further includes an overcoat, and the overcoat includes multiple grid
Lattice, wherein the grid in rows, at intervals, is alternately installed on inside the gas passage, are prevented liquid entrance
The MEMS pressure sensor.
Preferably, the grid distance is less than or equal to 25 μm.
According to one embodiment of the invention, the substrate of the passage below the integrated circuit, ambient atmosphere
The gas passage is entered after the passage, and then is touched with the back face of the pressure-sensitive film.
Preferably, the MEMS pressure sensor further has a vacuum chamber, wherein the varistor is closed in institute
State vacuum chamber.
Preferably, the MEMS pressure sensor device, further includes a housing, and the housing is connected to described pressure-sensitive
The front of film, wherein the pressure-sensitive film forms the vacuum chamber with the housing.
According to one embodiment of the invention, the substrate of the passage located at the integrated circuit sidepiece, ambient atmosphere
The receiving space is entered by the passage, and then is contacted with the front of the pressure-sensitive film.
According to one embodiment of the invention, the passage is located at the substrate below the MEMS pressure sensor, outward
Back face of boundary's air by the passage with the pressure-sensitive film is touched.
Preferably, the MEMS pressure sensor device, further includes a filter membrane, wherein the filter membrane is installed on
The passage, to remove the harmful substance in air.
A kind of method for packing of MEMS pressure sensor, is packaged to a MEMS pressure sensor, and it is integrated to connect one
Circuit, forms a MEMS pressure sensor device, wherein the MEMS pressure sensor includes a pressure-sensitive film and multiple pressure-sensitive electricity
Resistance, the varistor are connected to the pressure-sensitive film, it is characterised in that the method comprising the steps of：
(A) passage is set on a substrate；
(B) integrated circuit and the MEMS pressure sensor are connected to into the substrate；
(C) cover plate is connected to into the substrate, a receiving space is formed between the substrate, to accommodate the MEMS
Pressure transducer and the integrated circuit；With
(D) gas is able to contact with the MEMS pressure sensor by the passage so that the MEMS pressure
Sensor device is suitable to sense ambient pressure by its back.
According to one embodiment of the invention, in the step (A), a gas passage is set on the substrate, wherein institute
State gas passage to be connected with the passage, obtain so that ambient atmosphere pass sequentially through the passage and the gas passage with
The back face of the pressure-sensitive film is touched.
Preferably, an overcoat is installed in the gas passage, wherein the overcoat includes multiple grids, it is each described
Grid in rows, at intervals, is alternately arranged, to prevent liquid from entering the MEMS pressure sensor.
According to one embodiment of the invention, the passage is located on the substrate below the MEMS pressure sensor,
Back face of the ambient atmosphere by the passage with the pressure-sensitive film is touched.
Preferably, a housing is installed in the MEMS pressure sensor so that the housing is formed with the pressure-sensitive film
One vacuum chamber, wherein the varistor is closed in the vacuum chamber.
According to one embodiment of the invention, the substrate of the passage located at the integrated circuit sidepiece, obtain so that outer
Boundary's air enters the receiving space by the passage, and then contacts with the front of the pressure-sensitive film.
Preferably, a filter membrane is further set, wherein the filter membrane is installed in the passage, is able to remove greatly
Harmful substance in gas.
Description of the drawings
Fig. 1 is a kind of generalized section of traditional encapsulating structure of MEMS pressure sensor.
Fig. 2 is that a kind of section of MEMS pressure sensor device of first preferred embodiment of the invention is illustrated
Figure.
Fig. 3 be a kind of MEMS pressure sensor device of above-mentioned first preferred embodiment of the invention include it is anti-
The arrangement schematic diagram of sheath.
Fig. 4 is a kind of a kind of MEMS pressure sensor of deformation implementation of above-mentioned first preferred embodiment of the invention
The generalized section of device.
Fig. 5 is that a kind of section of MEMS pressure sensor device of second preferred embodiment of the invention is illustrated
Figure.
Fig. 6 is that a kind of section of MEMS pressure sensor device of the 3rd preferred embodiment of the invention is illustrated
Figure.
Fig. 7 is a kind of a kind of change of MEMS pressure sensor device of above-mentioned 3rd preferred embodiment of the invention
Shape is implemented.
Specific embodiment
Hereinafter describe for disclosing the present invention so that those skilled in the art can realize the present invention.It is excellent in below describing
Embodiment is selected to be only used as citing, it may occur to persons skilled in the art that other obvious modifications.Define in the following description
The present invention ultimate principle can apply to other embodiments, deformation program, improvement project, equivalent and without carry on the back
From the other technologies scheme of the spirit and scope of the present invention.
Fig. 2 is a kind of first preferred embodiment of MEMS pressure sensor device that the present invention is provided.As shown in Fig. 2
A kind of MEMS pressure sensor device, including a MEMS pressure sensor 10, a package assembling 20 and an integrated circuit are (for example
Asic chip) 30, wherein the MEMS pressure sensor 10 is connected to the asic chip 30, it is mounted on the package assembling
In 20, to sense air pressure change.
The package assembling 20 includes a substrate 21 and a cover plate 22, wherein the cover plate 22 is connected to the substrate 21
Form a receiving space 23 together and at middle part, be able to accommodate the MEMS pressure sensor 10 and the asic chip 30.
The MEMS pressure sensor 10 is installed on the substrate 21 at intervals with the asic chip 30, by weldering
The MEMS pressure sensor 10 is linked together by line or electric wire with the asic chip 30, and is connected with the substrate 21,
It is able to sense, detects, processes, transmitting air pressure and its situation of change.
The MEMS pressure sensor 10 includes a pressure-sensitive film 11, multiple varistors 12 and an at least substrate 13, wherein
The varistor 12 is installed in the pressure-sensitive film 11, and each varistor 12 is according to the mode phase for forming Wheatstone bridge
Connection, the back side of the pressure-sensitive film 11 is connected on the substrate 13, and the substrate 13 is connected to the substrate 21, described
Multiple connecting keys 14 are respectively provided with the front of pressure-sensitive film 11, the substrate 21 and the asic chip 30, are able to by WB (Wire
Bond) connect each connecting key 14, and then the MEMS pressure sensor 10 is connected with the asic chip 30, and with
The substrate 21 is connected, and forms path, is able to sense, transmits air pressure.
Further, a passage 15 is set in the middle part of the substrate 13, for gaseous exchange, wherein the varistor
12 are located in the pressure-sensitive film 11 on 15 top of the passage, when being under pressure, stress that the pressure-sensitive film 11 is subject to or
The distance between front and back of the pressure-sensitive film 11 can change, and then be able to measure the intensity of variation of ambient pressure.
Preferably, a passage 24 and a gas passage 25 be set on the substrate 21, the two of the gas passage 25
End is connected with the passage 15 and the passage 24 respectively, and then the MEMS pressure sensor 10 is connected with the external world
It is logical so that the back side of the pressure-sensitive film 11 can be contacted with ambient atmosphere, and then it is logical to be able to sensing ambient pressure, i.e. ambient atmosphere
The passage 24 is crossed into the gas passage 25, subsequently into the passage 15, the back face with the pressure-sensitive film 11
Touch, and then act on the pressure-sensitive film 11, be able to sense ambient pressure.
It is noted that the gas passage 25 is laterally located at the substrate 21, inside the substrate 21, make
Hollow structure is formed in the middle part of the part for obtaining the substrate 21, it is in the case where 21 processing technology of the substrate can be realized, described
Gas passage 21 can be arranged to corresponding size according to actual needs, and the gas passage can for circular, rectangle with
And other irregular shapes, as long as enable to ambient atmosphere by behind the passage 24 and the gas passage 25 with institute
The back face for stating pressure-sensitive film 11 is touched.
Preferably, an overcoat 40 is set inside the gas passage 25, so that MEMS pressure sensor dress
Put with water-proof function, extend its service life, and expand its application scenario.Wherein described MEMS pressure sensor device it is anti-
Water is to realize that the overcoat 40 may be embodied as including multiple grids 41 by the overcoat 40, by by multiple grid
Lattice 41 in rows, at intervals, are alternately installed on the gas passage 25 to implement, can be real in the technique of the substrate 21
Under conditions of existing, the distance between each described grid 41 often arranged can be designed as less than 25 μm, the grid by rows
41 are alternately arranged in the gas passage 25, only allow gas to pass through, while can prevent other liquid such as water from entering described
MEMS pressure sensor 10.That is, in the preferred embodiment, the arrangement mode of the grid 41 is may be embodied as such as figure
Shape shown in 3, so can be while ensureing that ambient atmosphere is connected with the MEMS pressure sensor 10, it is also possible to anti-
Other liquid such as sealing can effectively extend described into the MEMS pressure sensor 10 with good water resistance
The service life of MEMS pressure sensor device, it is also possible to increase its application scenario.
Preferably, the passage 24 is located on the substrate 21 of 30 bottom of the asic chip, and the gas is logical
Road 25 is extended towards the lower section of the MEMS pressure sensor 10 by the lower section of the asic chip 30, i.e. the gas passage 25
The passage 24 is connected with the MEMS pressure sensor 10, is obtained so that the back side of the pressure-sensitive film 11 can be with the external world
Atmosphere, to sense ambient pressure.It should be noted that the passage 24 is described below the asic chip 30
On substrate 21, space can be reserved to arrange the gas passage 25, then by installing the grid 41 so that the MEMS
Pressure sensor apparatus have water-proof function.
Further, on the basis of the MEMS pressure sensor device shown in Fig. 2 to Fig. 3, increase by a vacuum chamber
50, i.e., described MEMS pressure sensor device has the vacuum chamber 50, wherein the vacuum chamber 50 is located at the pressure-sensitive film 11
Positive top, is able to the varistor 12 is contained in the vacuum chamber 50, will the varistor 12 be closed in
In the vacuum chamber 50, to protect the varistor 12, make the varistor 12 no longer with extraneous air contact, can be with
Effectively prevent outside air, steam and other corrosive substances from affecting the performance and stability of the varistor 12, extend institute
The service life of varistor 12 is stated, and then extends the service life of the MEMS pressure sensor 10.
Preferably, in this embodiment, by a housing 60 is set at the top of the front of the pressure-sensitive film 11 come
Form the vacuum chamber 50, that is to say, that the surrounding of the housing 60 is connected to the pressure-sensitive film 11, obtain so that the pressure-sensitive film
11 bottoms for sealing the housing 60, and then be able to the vacuum chamber is formed between the housing 60 and the pressure-sensitive film 11
50, it is able to close the varistor 12, which is protected, prevent the erosion of ambient atmosphere and corrosive substance, protects institute
The performance and stability for stating varistor 12 is unaffected.
When MEMS pressure sensor 10 are manufactured, by the housing 60 is pasted or institute can be welded in
State in pressure-sensitive film 11, form the vacuum chamber 50 so that the housing 60 becomes a part for the MEMS pressure sensor 10,
To manufacture both as an entirety, and then entirety will be packaged, and be installed on the package assembling 20, form the MEMS pressures
Force sensor device.
The installation of the housing 60 can also be implemented during the MEMS pressure sensor 10 is encapsulated, you can with
The MEMS pressure sensor 10 is connected to into the substrate 21, then the housing 60 is installed in the pressure-sensitive film 11,
The vacuum chamber 50 is formed, then the cover plate 22 is connected to into the substrate 21, form the MEMS pressure sensor device.
It is noted that in this embodiment, by 24 He of the passage is arranged on the substrate 21
The gas passage 25 so that the back of the MEMS pressure sensor can sense air pressure；In the presence of the grid 41,
So that the MEMS pressure sensor device has water-proof function, prevent water and its his liquid from entering the MEMS pressure sensings
Device, to increase the range of application of the MEMS pressure sensor device；Meanwhile, in the presence of the vacuum chamber 50, be able to by
The varistor 12 and outside air isolation, prevent the performance of varistor 12 described in extraneous steam, pollutant effect and steady
It is qualitative, extend the service life of the MEMS pressure sensor.
In the preferred embodiment, the MEMS pressure sensor 10 be by the back side sense pressure come work, this with
Traditional is different by front sensing pressure, and the MEMS pressure sensor that can solve traditional front sensing pressure cannot
Meet the problem of some application scenarios, increase the range of application of the MEMS pressure sensor, to meet the demand of more conglomerate.
Fig. 4 is that a kind of a kind of deformation of first preferred embodiment of MEMS pressure sensor device that the present invention is provided is real
Apply.As shown in figure 4, a kind of MEMS pressure sensor device, on the basis of the MEMS pressure sensor device shown in Fig. 4
On, the grid 41 is deleted, the passage 24 is similarly provided on the substrate 21 so that the MEMS pressure sensor
10 back sensing pressure, so that the MEMS pressure sensor device disclosure satisfy that user cannot use front to sense pressure
MEMS pressure sensor demand, expand the range of application of MEMS pressure sensor.
Fig. 5 is a kind of second preferred embodiment of MEMS pressure sensor device that the present invention is provided.As shown in figure 5,
A kind of MEMS pressure sensor, on the basis of above-mentioned first preferred embodiment, is improved to the package assembling 20,
In the preferred embodiment, a package assembling 20A includes a substrate 21A, a cover plate 22A, wherein the substrate 21A and the lid
Plate 22A is interconnected to form receiving space 23A, is able to accommodate the MEMS pressure sensor 10 and the asic chip 30.
It is noted that one passage 24A is set in the bottom of the substrate 21A, wherein the passage 24A is located at
On the substrate 21A below the MEMS pressure sensor 10, i.e., described passage 24A is direct to be connected with the passage 15
Logical, extraneous air directly can enter the passage 15, and then the back side with the pressure-sensitive film 11 by the passage 24A
Contact, act on the back side of the pressure-sensitive film 11 so that the MEMS pressure sensor realizes back sensing pressure, increases which
Range of application.
With second of first preferred embodiment, the third specific embodiment it is identical, in 11 front of the pressure-sensitive film
Top forms the vacuum chamber 50 by the housing 60, closes the varistor 12, to protect the varistor 12, prolongs
Long its service life.
Fig. 6 is a kind of the 3rd preferred embodiment of MEMS pressure sensor device that the present invention is provided.As shown in fig. 6,
A kind of MEMS pressure sensor device, including MEMS pressure sensor 10B, a package assembling 20B and an asic chip 30B,
Wherein described package assembling 20B includes that an a substrate 21B and cover plate 22B, the cover plate 22B are connected to the substrate 21B, the two
Between form receiving space 23B, be able to accommodate MEMS pressure sensor 10B and the asic chip 30B, further
Ground, is connected by WB between MEMS pressure sensor 10B and the asic chip 30B, and is connected with the substrate 21B
Connect.
MEMS pressure sensor 10B include pressure-sensitive film 11B, a multiple varistor 12B, at least substrate 13B and
Multiple connecting key 14B, wherein the varistor 12B is located at pressure-sensitive film 11B, each varistor 12B is with favour stone
The mode of electric bridge is connected, and the connecting key 14B is respectively arranged on pressure-sensitive film 11B, the asic chip 30B and the substrate
21B, is able to MEMS pressure sensor 10B, the asic chip 30B and the substrate 21B are linked together by WB,
Form connection circuit.
It is noted that a passage 15B is formed between pressure-sensitive film 11B and the substrate 13B, for gas
Convection current, wherein the back side of pressure-sensitive film 11B is able to receiving and is under pressure and becomes towards the passage 15B, and the passage 15B
Pressure-sensitive film 11B of shape, and then be able to be convenient for measuring ambient pressure.
Further, the substrate 21B has a passage 24B, obtains so that ambient atmosphere enters the receiving space
23B, and then ambient pressure is sensed by MEMS pressure sensor 10B, wherein the passage 24B is located at described
On the substrate 21B of asic chip 30B positions sidepiece, when ambient atmosphere enters the appearance by the passage 24B
Receive after the 23B of space, further contact with the front of pressure-sensitive film 11B, and then cause the MEMS pressure sensor
10B is able to sense ambient pressure.
It should be noted that in the preferred embodiment, as the passage 24B is on the substrate 21B, i.e. institute
Passage 24B is stated positioned at the back of the MEMS pressure sensor device, is obtained so that the back of the body of the MEMS pressure sensor device
Portion senses air pressure, obtains so that the MEMS pressure sensor device disclosure satisfy that the MEMS pressure of traditional front sensing pressure is passed
Sensor arrangement cannot meet the demand of some application scenarios, increased the range of application of the MEMS pressure sensor device.
Fig. 7 is a kind of a kind of deformation implementation of MEMS pressure sensor device of above-mentioned 3rd preferred embodiment.Such as Fig. 7
It is shown, on the basis of the MEMS pressure sensor device shown in Fig. 6, increase by a filter membrane 70, wherein the filter membrane
70 are installed in the passage 24B, when outside air by the passage 24B enter receiving space 23B with it is described
Before the contact of pressure-sensitive film 11B, need to first pass through the filter membrane 70 and filtered, to remove the harmful substance in air, prevent right
The varistor 12B being placed in pressure-sensitive film 11B produces impact, protects the performance of the varistor 12B and stablizes
Property will not be affected by harmful substance in air.The material of the filter membrane 70, size etc. can be concrete according to practical situation
Select, as long as reach being filtered to the harmful substance in air.
In this embodiment, the front of pressure-sensitive film 11B and air directly contact, are able to sense extraneous gas
Pressure, but as the passage 24B is on the substrate 21B, positioned at the back of the MEMS pressure sensor device, be able to
The MEMS pressure sensor device is made to realize back sensing pressure, can be installed on traditional MEMS pressure sensor cannot lead to
The occasion that front senses pressure is crossed, the range of application of the MEMS pressure sensor device is increased；Meanwhile, the filter membrane 70
The harmful substance that can be filtered to remove in air, is able to protect the varistor 12B, prevents which from being corroded by harmful substance, prolongs
The service life of the varistor 12B is grown.
By various embodiments above, the method for packing of the MEMS pressure sensor is concluded, the MEMS pressure
The method for packing of sensor is comprised the following steps：
(A) passage is set on the substrate；
(B) integrated circuit and the MEMS pressure sensor are connected to into the substrate；
(C) cover plate is connected to into the substrate, the receiving space is formed between the substrate, it is described to accommodate
MEMS pressure sensor and the integrated circuit；With
(D) gas is able to contact with the MEMS pressure sensor by the passage so that the MEMS pressure
Sensor device is suitable to sense ambient pressure by its back.
The order of wherein described step (A), the step (B) and the step (C) is intended only as citing, is not intended to limit this
The step of method, those skilled in the art, can be adjusted according to actual process situation, for example, can be by the step
(B) before being adjusted to the step (A).
It is noted that by the MEMS pressure sensor and the integrated circuit (such as in the various embodiments described above
Asic chip) it is attached, and after being packaged with the package assembling, the MEMS pressure sensor device is formed, wherein
The MEMS pressure sensor device carries out sensing ambient pressure in can be mounted directly to each system, for example, the MEMS
Pressure sensor apparatus can apply to the tire system of automobile, brake system, oil tank system, sphygomanometer, air-conditioning etc., for
Pressure monitoring.
By above-mentioned each specific embodiment of the present invention, the MEMS pressure sensor dress that the present invention is provided
Put by passage is arranged on substrate, be achieved the function that back senses pressure, traditional MEMS pressure can be applied to
Sensor device cannot use front to sense the occasion of pressure, expand the range of application of MEMS pressure sensor device；Pass through
Overcoat is set so that MEMS pressure sensor device realizes water-proof function, extends its service life, its application is expanded
Scope；By forming vacuum chamber, varistor is enclosed so as to air exclusion, protect the performance and stability of varistor
It is unaffected, and then extend the service life of MEMS pressure sensor；By arranging corresponding filter membrane, air is filtered to remove
In harmful substance, and then be able to protect varistor, also extend the service life of MEMS pressure sensor device accordingly.
It should be understood by those skilled in the art that the embodiments of the invention shown in foregoing description and accompanying drawing are only used as citing
And it is not intended to limit the present invention.The purpose of the present invention completely and is effectively realized.The function and structural principle of the present invention exists
Show in embodiment and illustrate, under without departing from the principle, embodiments of the present invention can have any deformation or modification.
Claims (22)
1. a kind of MEMS pressure sensor device, an including integrated circuit is passed with the MEMS pressure for being connected to the integrated circuit
Sensor, wherein the MEMS pressure sensor includes a pressure-sensitive film and is connected to multiple varistors of the pressure-sensitive film, which is special
Levy and be, including：
One package assembling, which includes a substrate and a cover plate, and the cover plate is connected to the substrate, and forms a receiving space,
Wherein described MEMS pressure sensor and the integrated circuit are connected to the substrate and are located at the receiving space, the substrate
With a passage, ambient atmosphere is contacted with the pressure-sensitive film by the passage, is obtained so that the MEMS pressure sensings
Device device is suitable to by its back sense ambient pressure.
2. MEMS pressure sensor device as claimed in claim 1, the substrate have a gas passage, wherein the gas
Path is connected with the passage, the MEMS pressure sensor, is obtained so that ambient atmosphere sequentially passes through the passage, institute
State gas passage and reach the MEMS pressure sensor.
3. MEMS pressure sensor device as claimed in claim 2, the gas passage is laterally inside the substrate.
4. MEMS pressure sensor device as claimed in claim 3, further includes an overcoat, and the overcoat includes many
Individual grid, wherein the grid in rows, at intervals, is alternately installed on inside the gas passage, is prevented liquid
Into the MEMS pressure sensor.
5. MEMS pressure sensor device as claimed in claim 4, the grid distance are less than or equal to 25 μm.
6. the MEMS pressure sensor device as described in arbitrary in claim 2-5, the passage are located at the integrated circuit
The substrate of lower section, ambient atmosphere enter the gas passage, and then the back of the body with the pressure-sensitive film after the passage
Face contacts.
7. the MEMS pressure sensor device as described in arbitrary in claim 1-5, the MEMS pressure sensor further have
There is a vacuum chamber, wherein the varistor is closed in the vacuum chamber.
8. MEMS pressure sensor device as claimed in claim 6, the MEMS pressure sensor further have a vacuum
Room, wherein the varistor is closed in the vacuum chamber.
9. MEMS pressure sensor device as claimed in claim 7, further includes a housing, and the housing is connected to described
The front of pressure-sensitive film, wherein the pressure-sensitive film forms the vacuum chamber with the housing.
10. MEMS pressure sensor device as claimed in claim 8, further includes a housing, and the housing is connected to institute
The front of pressure-sensitive film is stated, wherein the pressure-sensitive film forms the vacuum chamber with the housing.
11. MEMS pressure sensor devices as claimed in claim 1, institute of the passage located at the integrated circuit sidepiece
Substrate is stated, ambient atmosphere enters the receiving space by the passage, and then contacts with the front of the pressure-sensitive film.
12. MEMS pressure sensor devices as claimed in claim 1, the passage is under the MEMS pressure sensor
The substrate of side, back face of the ambient atmosphere by the passage with the pressure-sensitive film are touched.
13. MEMS pressure sensor devices as claimed in claim 12, the MEMS pressure sensor are further true with one
Empty room, wherein the varistor is closed in the vacuum chamber.
14. MEMS pressure sensor devices as described in arbitrary in claim 11-13, further include a filter membrane, wherein
The filter membrane is installed on the passage, to remove the harmful substance in air.
A kind of 15. method for packing of MEMS pressure sensor, are packaged to a MEMS pressure sensor, and connect an integrated electricity
Road, forms a MEMS pressure sensor device, wherein the MEMS pressure sensor includes a pressure-sensitive film and multiple varistors,
The varistor is connected to the pressure-sensitive film, it is characterised in that the method comprising the steps of：
(A) passage is set on a substrate；
(B) integrated circuit and the MEMS pressure sensor are connected to into the substrate；
(C) cover plate is connected to into the substrate, a receiving space is formed between the substrate, to accommodate the MEMS pressure
Sensor and the integrated circuit；With
(D) gas is able to contact with the MEMS pressure sensor by the passage so that the MEMS pressure sensings
Device device is suitable to sense ambient pressure by its back.
16. methods as claimed in claim 15, in the step (A), arrange a gas passage on the substrate, wherein
The gas passage is connected with the passage, obtains so that ambient atmosphere passes sequentially through the passage and the gas passage
Touch with the back face of the pressure-sensitive film.
17. methods as claimed in claim 16, install an overcoat in the gas passage, wherein the overcoat includes
Multiple grids, each grid in rows, at intervals, are alternately arranged, to prevent liquid from entering the MEMS pressure sensings
Device.
18. methods as claimed in claim 17, the grid distance are set smaller than equal to 25 μm.
19. methods as claimed in claim 15, the substrate of the passage below the MEMS pressure sensor
On, back face of the ambient atmosphere by the passage with the pressure-sensitive film is touched.
20. methods as described in arbitrary in claim 15-19, install a housing in the MEMS pressure sensor so that
The housing forms a vacuum chamber with the pressure-sensitive film, wherein the varistor is closed in the vacuum chamber.
21. methods as claimed in claim 15, the passage located at the integrated circuit sidepiece the substrate, obtain so that
Ambient atmosphere enters the receiving space by the passage, and then contacts with the front of the pressure-sensitive film.
22. methods as described in claim 16,19 or 21, further arrange a filter membrane, wherein the filter membrane is installed on
In the passage, it is able to remove the harmful substance in air.
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| DE102015101112B4 (en) * | 2015-01-27 | 2018-05-09 | Tdk Corporation | sensor |
| CN105203233A (en) * | 2015-10-16 | 2015-12-30 | 瑞声声学科技(深圳)有限公司 | Mems pressure sensor |
| JP6555214B2 (en) | 2016-08-25 | 2019-08-07 | 株式会社デンソー | Pressure sensor |
| US10036676B1 (en) * | 2017-03-15 | 2018-07-31 | Honeywell International Inc. | Microelectromechanical systems (MEMS) force die with buried cavity vented to the edges |
| CN107036740A (en) * | 2017-04-14 | 2017-08-11 | 苏州敏芯微电子技术股份有限公司 | A kind of microsensor encapsulating structure and its manufacture craft |
| CN107966236A (en) * | 2018-01-18 | 2018-04-27 | 深圳市永盟电子科技限公司 | Pressure sensor, sphygmomanometer and pressure sensor manufacture method |
| CN108267259A (en) * | 2018-03-19 | 2018-07-10 | 深圳瑞德感知科技有限公司 | Ceramic MEMS pressure sensor |
| WO2019183259A1 (en) * | 2018-03-20 | 2019-09-26 | Obsidian Sensors, Inc. | Capping plate for panel scale packaging of mems products |
| CN111141429A (en) * | 2019-12-23 | 2020-05-12 | 陕西电器研究所 | Vacuum-packaged sputtering film pressure sensitive element |
| CN112161738B (en) * | 2020-09-17 | 2022-04-08 | 五邑大学 | Air pressure sensor and manufacturing method thereof |
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| CN103185612B (en) * | 2011-12-27 | 2016-09-14 | 中国科学院上海微系统与信息技术研究所 | Single silicon-chip microflow sensor being suitable to surface mount package and preparation method thereof |
| DE102012210052B4 (en) * | 2012-06-14 | 2023-12-14 | Robert Bosch Gmbh | Hybrid integrated component and method for its production |
| KR101813905B1 (en) * | 2013-09-27 | 2018-01-02 | 인텔 코포레이션 | An improved arrangement of through-hole structures of a semiconductor package |
| CN103759880B (en) * | 2014-01-27 | 2016-03-02 | 中国电子科技集团公司第四十九研究所 | A kind of SOI absolute pressure Sensitive Apparatus adopting leadless packaging structure |
| CN204855077U (en) * | 2015-05-05 | 2015-12-09 | 苏州曼普拉斯传感科技有限公司 | MEMS pressure sensor device |
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