CN107966236A - Pressure sensor, sphygmomanometer and pressure sensor manufacture method - Google Patents

Pressure sensor, sphygmomanometer and pressure sensor manufacture method Download PDF

Info

Publication number
CN107966236A
CN107966236A CN201810048535.4A CN201810048535A CN107966236A CN 107966236 A CN107966236 A CN 107966236A CN 201810048535 A CN201810048535 A CN 201810048535A CN 107966236 A CN107966236 A CN 107966236A
Authority
CN
China
Prior art keywords
pressure
chip
temperature
pressure sensor
sensitives
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201810048535.4A
Other languages
Chinese (zh)
Other versions
CN107966236A8 (en
Inventor
杨胜周
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shenzhen Yongmeng Electronic Technology Co ltd
Original Assignee
Shenzhen Yongmeng Electronic Technology Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shenzhen Yongmeng Electronic Technology Co ltd filed Critical Shenzhen Yongmeng Electronic Technology Co ltd
Priority to CN201810048535.4A priority Critical patent/CN107966236A/en
Publication of CN107966236A publication Critical patent/CN107966236A/en
Publication of CN107966236A8 publication Critical patent/CN107966236A8/en
Pending legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01LMEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/04Means for compensating for effects of changes of temperature, i.e. other than electric compensation
    • AHUMAN NECESSITIES
    • A61MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61BDIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B5/00Measuring for diagnostic purposes; Identification of persons
    • A61B5/02Detecting, measuring or recording pulse, heart rate, blood pressure or blood flow; Combined pulse/heart-rate/blood pressure determination; Evaluating a cardiovascular condition not otherwise provided for, e.g. using combinations of techniques provided for in this group with electrocardiography or electroauscultation; Heart catheters for measuring blood pressure
    • A61B5/021Measuring pressure in heart or blood vessels
    • A61B5/02141Details of apparatus construction, e.g. pump units or housings therefor, cuff pressurising systems, arrangements of fluid conduits or circuits
    • AHUMAN NECESSITIES
    • A61MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61BDIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B5/00Measuring for diagnostic purposes; Identification of persons
    • A61B5/02Detecting, measuring or recording pulse, heart rate, blood pressure or blood flow; Combined pulse/heart-rate/blood pressure determination; Evaluating a cardiovascular condition not otherwise provided for, e.g. using combinations of techniques provided for in this group with electrocardiography or electroauscultation; Heart catheters for measuring blood pressure
    • A61B5/021Measuring pressure in heart or blood vessels
    • A61B5/022Measuring pressure in heart or blood vessels by applying pressure to close blood vessels, e.g. against the skin; Ophthalmodynamometers
    • AHUMAN NECESSITIES
    • A61MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61BDIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B2562/00Details of sensors; Constructional details of sensor housings or probes; Accessories for sensors
    • A61B2562/02Details of sensors specially adapted for in-vivo measurements
    • A61B2562/0247Pressure sensors

Landscapes

  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Cardiology (AREA)
  • Physics & Mathematics (AREA)
  • Vascular Medicine (AREA)
  • Biomedical Technology (AREA)
  • Medical Informatics (AREA)
  • Biophysics (AREA)
  • Pathology (AREA)
  • Engineering & Computer Science (AREA)
  • Veterinary Medicine (AREA)
  • Heart & Thoracic Surgery (AREA)
  • Physiology (AREA)
  • Molecular Biology (AREA)
  • Surgery (AREA)
  • Animal Behavior & Ethology (AREA)
  • General Health & Medical Sciences (AREA)
  • Public Health (AREA)
  • General Physics & Mathematics (AREA)
  • Ophthalmology & Optometry (AREA)
  • Measuring Pulse, Heart Rate, Blood Pressure Or Blood Flow (AREA)

Abstract

A kind of pressure sensor, including a substrate, two pressure sensitive chips and a temperature sense chip are packaged with the substrate, each pressure sensitive chip is used to individually sense extraneous gas air pressure, the circuit of the two pressure sensitives chip on the substrate is independent mutually, the circuit of the temperature sense chip and the two pressure sensitives chip is separate, and for sensing the gas temperature angle value of the two pressure sensitives chip circumference, when the air pressure of external object gas described in two pressure sensitive chip senses, the temperature sense chip can sense the temperature value of the external object gas, to be compensated to atmospheric pressure value of the two pressure sensitives chip senses to the external object gas.Manufacture method and a kind of sphygmomanometer the invention further relates to a kind of pressure sensor.

Description

Pressure sensor, sphygmomanometer and pressure sensor manufacture method
Technical field
The present invention relates to a kind of pressure sensor, sphygmomanometer and pressure sensor manufacture method.
Background technology
Pressure sensor is mainly used in electronic sphygmomanometer in medical health field, for sensing human blood-pressure.Pressure Itself quality of sensor directly determines the service life of sphygmomanometer, and the precision of pressure sensor also directly determines blood pressure measurement Resultant error size.Conditional electronic sphygmomanometer uses the pressure sensor of single pressure sensitive chip, and testing result is directly by this The quality of pressure sensor determines, in long-time in use, the error of such pressure sensor generation is larger, and sphygmomanometer control Device processed can not detect deviation caused by sensor itself drift, while when pressure sensor damages, sphygmomanometer was using Pressure protection will not be carried out in journey, or even the air pressure that can produce sphygmomanometer inflation hurts user.
The content of the invention
Present invention seek to address that the above problem, and a kind of accuracy of detection height is provided, pressure sensor, the blood pressure of safety durable Meter and pressure sensor manufacture method.
A kind of pressure sensor, including a substrate, are packaged with two pressure sensitive chips and a temperature sense on the substrate Chip, each pressure sensitive chip are used for the air pressure for individually sensing extraneous gas, and the two pressure sensitives chip is in the substrate On circuit it is independent mutually, the circuit of the temperature sense chip and the two pressure sensitives chip is separate, and is used to feel The gas temperature angle value of the two pressure sensitives chip circumference is surveyed, when the gas of external object gas described in two pressure sensitive chip senses During pressure, the temperature sense chip can sense the temperature value of the external object gas, with to the two pressure sensitives chip sense The atmospheric pressure value for measuring the external object gas compensates.
A kind of sphygmomanometer, the sphygmomanometer include controller, and the controller connects the two pressure sensitives chip and institute Temperature sense chip is stated, the controller can read atmospheric pressure value and the reading of the object gas of the two pressure sensitives chip senses The actual temperature value of object gas described in the temperature sense chip senses, the controller can be according to the two pressure sensitives cores Piece sensing the object gas atmospheric pressure value whether default error range judge the two pressure sensitives chip whether work Make normally, the controller can be according to the actual temperature value of the object gas of the temperature sense chip senses relative to mark Temperature gap at quasi- temperature, the gas of the object gas sensed to the two pressure sensitives chip under the actual temperature Pressure value compensates.
A kind of manufacture method of pressure sensor comprises the following steps:
Some pressure sensitive chips are separated out on same wafer;
Choose the pressure sensitive chip of two bridge resistances within a preset range and pressure sensitive chip is made;And
By the two pressure sensitives chip and a temperature sense chip package to same substrate.
Further, the two pressure sensitives chip and the temperature sense chip are encapsulated to described by micro-electromechanical technology Substrate forms surface-adhered type sensor module.
Further, the two pressure sensitives chip and the temperature sense chip are encapsulated to described by micro-electromechanical technology Substrate forms dual inline type sensor module.
Further, two pressure sensor chip is encapsulated as gauge pressure pattern.
Further, stomata is offered on the substrate, the stomata connects two pressure sensitive chip bottoms.
Further, two pressure sensor chip is encapsulated as absolute pressure pattern.
The positive effect of the present invention is that double pressure sensitive chips of monomer encapsulation can substantially reduce pressure sensor mistake The risk brought is imitated, prevents sphygmomanometer in single pressure sensitive chip failure, arm band, which continues to shrink, causes asking for user's injury Topic.Meanwhile double pressure sensitive chips of monomer encapsulation can effectively improve the accuracy of detection of blood pressure, prevent sensor itself fail, The compensation effect of temperature sense chip is equipped with, expands the Applicable temperature scope of sensor, makes the use environment temperature model of sphygmomanometer Increase is enclosed, ensures that pressure measurements are reliable and stable, makes to be really achieved using the product of the sensor and is safely and effectively expected mesh Mark.
Brief description of the drawings
Fig. 1 is the schematic top plan view of sensor in embodiment of the present invention.
Fig. 2 is to do section view at the schematic elevation view of sensor in Fig. 1, wherein substrate and pressure sensitive chip.
Fig. 3 is to do section view at the left view schematic diagram of sensor in Fig. 1, wherein substrate and pressure sensitive chip.
Fig. 4 is the bridge circuit schematic diagram of a chip in embodiment of the present invention.
Fig. 5 is the schematic diagram that sensor carries pin in Fig. 1.
Fig. 6 is the high-level schematic functional block diagram of a sphygmomanometer in embodiment of the present invention.
Fig. 7 is the flow chart of a pressure sensor manufacture method in embodiment of the present invention.
Embodiment
Below in conjunction with the attached drawing in the embodiment of the present invention, the technical solution in the embodiment of the present invention is carried out clear, complete Site preparation describes, it is clear that described embodiment is only part of the embodiment of the present invention, instead of all the embodiments.Based on this Embodiment in invention, the every other reality that those of ordinary skill in the art are obtained without making creative work Example is applied, belongs to the scope of protection of the invention.
It should be noted that when an element is considered as " connection " another element, it can be directly to separately One element may be simultaneously present the element being centrally located.When an element is considered as " being arranged at " another element, It can be set directly on another element or may be simultaneously present the element being centrally located.
Unless otherwise defined, all of technologies and scientific terms used here by the article is with belonging to technical field of the invention The normally understood implication of technical staff is identical.Term used in the description of the invention herein is intended merely to description tool The purpose of the embodiment of body, it is not intended that in the limitation present invention.Term as used herein " and/or " include one or more phases The arbitrary and all combination of the Listed Items of pass.
An embodiment of the present invention is related to a kind of pressure sensor, sphygmomanometer and pressure sensor manufacture method.
Please refer to Fig.1 to Fig.3, in an embodiment, a pressure sensor 10 includes a substrate 11, a first pressure senses Chip 13, a second pressure induction chip 14 and a temperature sense chip 15.First pressure induction chip 13, second pressure sensing Chip 14 and temperature sense chip 15 are once encapsulated to substrate 11.Substrate 11 sets off bottom plate for one.Substrate 11 offers at the same time Connect the stomata 111 of first pressure induction chip 13 and second pressure induction chip 14.First pressure induction chip 13 and second The circuit of pressure sensitive chip 14 on the substrate 11 is independent mutually and can individually sense external pressure, wherein a pressure sensitive chip Pressure sensing capabilities will not be lost because of the failure of another pressure sensitive chip to the sensing of exterior object gas, ensure that pressure The expection ability to work of sensor.Temperature sense chip 15 can sense the ambient temperature value of the two pressure sensitives chip circumference, Temperature sense chip 15 and the circuit of two pressure sensors are separate, and will not be because of the circuit malfunction of any pressure sensitive chip And lose expected ability to work.
In the present embodiment, first pressure induction chip 13 selects same wafer to cut with second pressure induction chip 14 Cut, and the bridge resistance of first pressure induction chip 13 and second pressure induction chip 14 is within a preset range.In this way, can be Keep first pressure induction chip 13 to show with the one of second pressure induction chip 14 on physical features and realize pressure-sensing effect Uniformity.
First pressure induction chip 13, second pressure induction chip 14 and temperature sense chip 15 can pass through micro-electromechanical technology (MEMS) mode encapsulates to substrate 11 and forms surface-adhered type (SMT) sensor module, can also pass through MEMS package to substrate 11 are formed as dual inline type (DIP) sensor module.
First pressure induction chip 13 can be encapsulated as gauge pressure pattern or absolute pressure pattern with second pressure induction chip 14.Envelope Fill for gauge pressure pattern when, refer to Fig. 2 and Fig. 3, external pressure enters pressure sensor annular seal space, atmospheric pressure by pressure catheter Pressure sensor bottom is entered by stomata 111 naturally, carries out the measurement of target air pressure.When being encapsulated as absolute pressure pattern, exterior gas Pressure enters pressure sensor annular seal space, sensor base sealing by pressure catheter, and atmospheric pressure cannot then enter.
Please continue to refer to Fig. 4 and Fig. 5, in the present embodiment, first pressure induction chip 13 includes a bridge circuit, should Bridge circuit includes pin 1-5.Second pressure induction chip 14 has identical structure with first pressure induction chip 13, including draws Foot 6-10.First pressure induction chip 13 is encapsulated with second pressure induction chip 14 afterwards there is identical pin to arrange on the substrate 11 Column direction.
Please continue to refer to Fig. 6, in present embodiment, a sphygmomanometer 100 includes 10 and one controller 30 of pressure sensor.Control Device 30 processed connects first pressure induction chip 13, second pressure induction chip 14 and temperature sense on pressure sensor 10 at the same time Chip 15.Controller 30 can control first pressure induction chip 13 and second pressure induction chip 14 to carry out blood pressure measurement at the same time, Controller 30 can obtain the testing result of first pressure induction chip 13 and second pressure induction chip 14.Controller 30 can basis Whether the atmospheric pressure value for the external object gas that first pressure induction chip 13 and second pressure induction chip 14 sense is default Whether error range is working properly to judge first pressure induction chip 13 and second pressure induction chip 14.
Under normal circumstances, work when sphygmomanometer 100 is in normal temperature, such as 20 degree Celsius, pressure sensor passes through continuous Supercharging measures to form pressure-voltage curve to export different voltage, and at this time, pressure-voltage curve is standard value.Work as blood Pressure meter 100 is different from normal temperature under the same conditions, and such as 10 degree Celsius or 25 degree Celsius when works, the actual production of pressure sensor Raw pressure-voltage curve can and normal temperature under pressure-voltage curve produce deviation, thus need according to temperature gap Compensate.
The atmospheric pressure value that controller 30 can be sensed in first pressure induction chip 13 and second pressure induction chip 14 it is same When obtain the actual temperature value of the sensing of temperature sense chip 15, obtain relative to the temperature gap under normal temperature, and then to two The atmospheric pressure value of pressure sensitive chip senses compensates, and pressure-voltage curve is tended to standard value.In this way, expand sensor Applicable temperature scope, increases the use environment temperature range of sphygmomanometer, ensures that pressure measurements are reliable and stable, makes to apply and is somebody's turn to do The product of sensor is really achieved safely and effectively target.
It is independent of each other since first pressure induction chip 13 independently works with second pressure induction chip 14, when wherein During one pressure sensitive chip failure, another pressure sensitive chip can work on, and controller 30 can be based on single pressure sensitive core The result of piece is exported.The use of the double pressure sensitive chips singly encapsulated can greatly reduce the risk of blood pressure detecting, prevent Only for sphygmomanometer in single pressure sensitive chip failure, arm band continues the problem of contraction causes user to injure.Meanwhile singly encapsulate Double pressure sensitive chips can effectively improve the accuracy of detection of blood pressure, be equipped with the compensation effect of temperature sense chip 15, measurement result It is more reliable and more stable.On the other hand, sphygmomanometer can be according to the atmospheric pressure value of double pressure sensitive chips of acquisition to the reliable of sphygmomanometer Property carry out self-test, for example, as the differences of two atmospheric pressure values be more than a preset value when, can quickly judge an at least pressure sensitive chip Failure, controller allow blood pressure to be stopped, ensure the reliability of blood pressure measurement and the security that user uses accordingly.During maintenance, It can also allow businessman's specific aim to replace pressure sensitive chip, reduce maintenance cost.
Referring to Fig. 7, in an embodiment, a kind of manufacture method of pressure sensor, comprises the following steps:
Step 71:Some pressure sensitive chips are separated out on same wafer.
Step 73:Choose the pressure sensitive chip of two bridge resistances within a preset range and pressure sensitive chip is made, In present embodiment, the immediate two pressure sensitives chip of two bridge resistances is selected in default scope.
Step 75:By two pressure sensitive chips and temperature sense chip package to same substrate.
In the above method, two pressure sensitive chips and temperature sense chip are encapsulated to the substrate shape by micro-electromechanical technology Into surface-adhered type sensor module or dual inline type sensor module.Two pressure sensor chips are encapsulated as gauge pressure pattern Or absolute pressure pattern.
In another embodiment, pressure sensor can once encapsulate 3 or more pressure sensitive chips, or once encapsulate 2 or more temperature sense chips, to realize similar technique effect.
Embodiment described above only expresses the several embodiments of the present invention, its description is more specific and detailed, but simultaneously Therefore the limitation to the scope of the claims of the present invention cannot be interpreted as.It should be pointed out that for those of ordinary skill in the art For, without departing from the inventive concept of the premise, various modifications and improvements can be made, these belong to the guarantor of the present invention Protect scope.Therefore, the protection domain of patent of the present invention should be determined by the appended claims.

Claims (8)

1. a kind of pressure sensor, including a substrate, it is characterised in that:Two pressure sensitive chips and one are packaged with the substrate Temperature sense chip, each pressure sensitive chip are used for the air pressure for individually sensing extraneous gas, and the two pressure sensitives chip exists Circuit on the substrate is independent mutually, and the circuit of the temperature sense chip and the two pressure sensitives chip is separate, And for sensing the gas temperature angle value of the two pressure sensitives chip circumference, when external object described in two pressure sensitive chip senses During the air pressure of gas, the temperature sense chip can sense the temperature value of the external object gas, with to two feeling of stress The atmospheric pressure value of chip senses to the external object gas is answered to compensate.
A kind of 2. sphygmomanometer using pressure sensor as claimed in claim 1, it is characterised in that:The sphygmomanometer includes control Device processed, the controller connect the two pressure sensitives chip and the temperature sense chip, and the controller can read described Object gas described in the atmospheric pressure value and the reading temperature sense chip senses of the object gas of two pressure sensitive chip senses Actual temperature value, the controller can according to the atmospheric pressure value of the object gas of the two pressure sensitives chip senses whether Default error range judges whether the two pressure sensitives chip is working properly, and the controller can be according to the temperature sense The actual temperature value of the object gas of chip senses is relative to the temperature gap under normal temperature, to two pressure sensitive The atmospheric pressure value for the object gas that chip senses under the actual temperature compensates.
A kind of 3. manufacture method of pressure sensor as claimed in claim 1, it is characterised in that:The described method includes following step Suddenly:
Some pressure sensitive chips are separated out on same wafer;
Choose the pressure sensitive chip of two bridge resistances within a preset range and pressure sensitive chip is made;And
By the two pressure sensitives chip and a temperature sense chip package to same substrate.
4. the manufacture method of pressure sensor as claimed in claim 3, it is characterised in that:The two pressure sensitives chip and institute Temperature sense chip is stated to encapsulate to substrate formation surface-adhered type sensor module by micro-electromechanical technology.
5. the manufacture method of pressure sensor as claimed in claim 3, it is characterised in that:The two pressure sensitives chip and institute Temperature sense chip is stated to encapsulate to substrate formation dual inline type sensor module by micro-electromechanical technology.
6. the manufacture method of pressure sensor as claimed in claim 3, it is characterised in that:The two pressure sensor chips quilt It is encapsulated as gauge pressure pattern.
7. the manufacture method of pressure sensor as claimed in claim 6, it is characterised in that:Stomata is offered on the substrate, The stomata connects two pressure sensitive chip bottoms.
8. the manufacture method of pressure sensor as claimed in claim 3, it is characterised in that:The two pressure sensor chips quilt It is encapsulated as absolute pressure pattern.
CN201810048535.4A 2018-01-18 2018-01-18 Pressure sensor, sphygmomanometer and pressure sensor manufacture method Pending CN107966236A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201810048535.4A CN107966236A (en) 2018-01-18 2018-01-18 Pressure sensor, sphygmomanometer and pressure sensor manufacture method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201810048535.4A CN107966236A (en) 2018-01-18 2018-01-18 Pressure sensor, sphygmomanometer and pressure sensor manufacture method

Publications (2)

Publication Number Publication Date
CN107966236A true CN107966236A (en) 2018-04-27
CN107966236A8 CN107966236A8 (en) 2018-09-28

Family

ID=61993523

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201810048535.4A Pending CN107966236A (en) 2018-01-18 2018-01-18 Pressure sensor, sphygmomanometer and pressure sensor manufacture method

Country Status (1)

Country Link
CN (1) CN107966236A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019140594A1 (en) * 2018-01-18 2019-07-25 深圳市永盟电子科技限公司 Pressure sensor, sphygmomanometer, and method for manufacturing pressure sensor
CN113167662A (en) * 2018-09-17 2021-07-23 哈钦森技术股份有限公司 Integrated sensor and circuit
CN115388854A (en) * 2022-08-26 2022-11-25 南京高华科技股份有限公司 Air pressure height sensor
WO2023005847A1 (en) * 2021-07-30 2023-02-02 华为技术有限公司 Blood pressure measuring apparatus
CN116649938A (en) * 2023-07-31 2023-08-29 深圳市长坤科技有限公司 Blood pressure measurement system based on bluetooth communication

Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2859488Y (en) * 2005-09-29 2007-01-17 新晨科技股份有限公司 A pressure sensor
CN101325204A (en) * 2007-06-14 2008-12-17 财团法人工业技术研究院 Sensing chip structure with overlapping pattern layer, sensing chip encapsulation and preparation method
CN101421601A (en) * 2006-02-17 2009-04-29 霍尼韦尔国际公司 Disposable pressure sensor systems and packages therefor
CN201234977Y (en) * 2008-05-30 2009-05-13 普立思胜医疗技术(北京)有限公司 Electronic sphygmomanometer
CN101936791A (en) * 2010-07-28 2011-01-05 四川蜀谷仪表科技有限公司 Digital pressure gauge
CN102156019A (en) * 2011-03-28 2011-08-17 豪展医疗科技股份有限公司 Pressure sensor
CN102596018A (en) * 2009-11-13 2012-07-18 欧姆龙健康医疗事业株式会社 Electronic sphygmomanometer
CN104865002A (en) * 2015-05-05 2015-08-26 苏州曼普拉斯传感科技有限公司 MEMS pressure sensor device and packaging method thereof
CN105424236A (en) * 2015-11-19 2016-03-23 南京信息工程大学 Multi-range array pressure sensing chip and detection method thereof
CN205144541U (en) * 2015-11-26 2016-04-13 江苏盖睿健康科技有限公司 Electrosphygmomanometer with pressure protection
CN205981529U (en) * 2016-07-13 2017-02-22 中国船舶工业集团公司第七○八研究所 Wireless pressure measurement
CN208043313U (en) * 2018-01-18 2018-11-02 深圳市永盟电子科技有限公司 Pressure sensor and sphygmomanometer

Patent Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2859488Y (en) * 2005-09-29 2007-01-17 新晨科技股份有限公司 A pressure sensor
CN101421601A (en) * 2006-02-17 2009-04-29 霍尼韦尔国际公司 Disposable pressure sensor systems and packages therefor
CN101325204A (en) * 2007-06-14 2008-12-17 财团法人工业技术研究院 Sensing chip structure with overlapping pattern layer, sensing chip encapsulation and preparation method
CN201234977Y (en) * 2008-05-30 2009-05-13 普立思胜医疗技术(北京)有限公司 Electronic sphygmomanometer
CN102596018A (en) * 2009-11-13 2012-07-18 欧姆龙健康医疗事业株式会社 Electronic sphygmomanometer
CN101936791A (en) * 2010-07-28 2011-01-05 四川蜀谷仪表科技有限公司 Digital pressure gauge
CN102156019A (en) * 2011-03-28 2011-08-17 豪展医疗科技股份有限公司 Pressure sensor
CN104865002A (en) * 2015-05-05 2015-08-26 苏州曼普拉斯传感科技有限公司 MEMS pressure sensor device and packaging method thereof
CN105424236A (en) * 2015-11-19 2016-03-23 南京信息工程大学 Multi-range array pressure sensing chip and detection method thereof
CN205144541U (en) * 2015-11-26 2016-04-13 江苏盖睿健康科技有限公司 Electrosphygmomanometer with pressure protection
CN205981529U (en) * 2016-07-13 2017-02-22 中国船舶工业集团公司第七○八研究所 Wireless pressure measurement
CN208043313U (en) * 2018-01-18 2018-11-02 深圳市永盟电子科技有限公司 Pressure sensor and sphygmomanometer

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2019140594A1 (en) * 2018-01-18 2019-07-25 深圳市永盟电子科技限公司 Pressure sensor, sphygmomanometer, and method for manufacturing pressure sensor
CN113167662A (en) * 2018-09-17 2021-07-23 哈钦森技术股份有限公司 Integrated sensor and circuit
US11638353B2 (en) 2018-09-17 2023-04-25 Hutchinson Technology Incorporated Apparatus and method for forming sensors with integrated electrical circuits on a substrate
WO2023005847A1 (en) * 2021-07-30 2023-02-02 华为技术有限公司 Blood pressure measuring apparatus
CN115388854A (en) * 2022-08-26 2022-11-25 南京高华科技股份有限公司 Air pressure height sensor
CN116649938A (en) * 2023-07-31 2023-08-29 深圳市长坤科技有限公司 Blood pressure measurement system based on bluetooth communication
CN116649938B (en) * 2023-07-31 2023-10-20 深圳市长坤科技有限公司 Blood pressure measurement system based on bluetooth communication

Also Published As

Publication number Publication date
CN107966236A8 (en) 2018-09-28

Similar Documents

Publication Publication Date Title
CN107966236A (en) Pressure sensor, sphygmomanometer and pressure sensor manufacture method
US9354133B2 (en) Self-heated pressure sensor assemblies
US11174153B2 (en) Package level thermal gradient sensing
US7270011B2 (en) Combined absolute-pressure and relative-pressure sensor
US10670482B2 (en) Sensor element for a pressure sensor
Lin et al. A linear wide-range textile pressure sensor integrally embedded in regular fabric
CN207798300U (en) A kind of encapsulating structure of pressure sensor
CN105241371B (en) Resistance strain gage
CN106404237A (en) Pressure sensor chip and preparation method, and absolute pressure sensor chip
CN208043313U (en) Pressure sensor and sphygmomanometer
CN107152985A (en) The pressure measxurement control device and its pressure measxurement control method of a kind of air bag
US10289508B2 (en) Sensor system and method for identifying faults related to a substrate
CN105043609A (en) Micro-mechanical silicon-pressure sensitive chip
JPH03115943A (en) Pressure or differential pressure measuring apparatus
CN104089719B (en) Manufacturing method of platinum resistor temperature sensor with I2C communication interface
CN113063826B (en) Wearable perspiration rate sensor and assembling method thereof
CN104665851A (en) Miniature pressure sensor and packaging method thereof
CN108024736A (en) The inspection method of pressure pulse wave sensor and the manufacture method of pressure pulse wave sensor
CN108937911A (en) A kind of sensor for intracranial pressure monitoring
CN205037996U (en) Sensitive chip of micromechanics silicon pressure
WO2019140594A1 (en) Pressure sensor, sphygmomanometer, and method for manufacturing pressure sensor
CN106644185A (en) High precision resonance pressure sensor chip body base
US11560302B2 (en) Micromechanical pressure sensor with two cavities and diaphragms and corresponding production method
WO2021262457A3 (en) Self-calibrating polymer nano composite (pnc) sensing element
CN108024731A (en) Pressure pulse wave sensor and biological information measurement device

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
CI02 Correction of invention patent application

Correction item: Applicant

Correct: Shenzhen yongmeng Electronic Technology Co., Ltd.

False: Shenzhen yongmeng electronic technology limited company

Number: 17-02

Page: The title page

Volume: 34

Correct: Shenzhen yongmeng Electronic Technology Co., Ltd.

False: Shenzhen yongmeng electronic technology limited company

Number: 17-02

Volume: 34

CI02 Correction of invention patent application