CN104858727A - Polishing machine based on ultrasonic wave oscillator - Google Patents
Polishing machine based on ultrasonic wave oscillator Download PDFInfo
- Publication number
- CN104858727A CN104858727A CN201510287373.6A CN201510287373A CN104858727A CN 104858727 A CN104858727 A CN 104858727A CN 201510287373 A CN201510287373 A CN 201510287373A CN 104858727 A CN104858727 A CN 104858727A
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- China
- Prior art keywords
- polishing
- ultrasonic transducer
- machine based
- bistrique
- polishing machine
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B1/00—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
- B24B1/04—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes subjecting the grinding or polishing tools, the abrading or polishing medium or work to vibration, e.g. grinding with ultrasonic frequency
Abstract
The invention discloses a polishing machine based on an ultrasonic wave oscillator. The polishing machine comprises a machine tool base, a workbench and a polishing module for polishing processing. The polishing module is arranged above the workbench to be connected to a lifting device. The polishing machine further comprises a polishing control circuit. The polishing module comprises a polishing head, an ultrasonic transducer, an oscillation signal generation circuit and a piezoelectric detection circuit. The polishing head is connected to the vibration output end of the ultrasonic transducer. The oscillation signal generation circuit is electrically connected with the ultrasonic transducer to be used for generating drive signals of the ultrasonic transducer. The piezoelectric detection circuit is electrically connected with the ultrasonic transducer to be used for detecting the output voltage generated due to the piezoelectric effect of the ultrasonic transducer. The polishing control circuit is electrically connected to the piezoelectric detection circuit and the lifting device.
Description
Technical field
The present invention relates to classic furniture production technology field, particularly relate to a kind of polishing machine based on ultrasonic oscillator.
Background technology
As everyone knows, all need to carry out carving technique in classic furniture production process, and the most frequently used in prior art be exactly adopt automatic carving equipment to carry out carving, overlap and burr etc. can be produced in carving process, therefore need to carry out polishing and polishing.When polishing with polishing, the contact dynamics of grinding head or rubbing head and surface of the work is very important, if contact dynamics is less than normal, then overlap, burr cannot be ground off, if contact dynamics is bigger than normal, then will cause excessive grinding, destroys surface of the work pattern.Therefore, existing sanding and polishing equipment cannot be polished to more complicated carving and polishing, and can only by carrying out manually polishing and polishing, large, the inefficiency of the labour intensity of sanding and polishing manually, thus greatly affect the production efficiency of classic furniture.
Summary of the invention
For solving the problems of the technologies described above, the present invention is achieved in that
First aspect, a kind of polishing machine based on ultrasonic oscillator is provided, comprise lathe base, workbench and carry out the polishing module of polishing, described workbench is arranged on lathe base, described polishing module to be arranged at above workbench and to be driven can be elevated in Z-direction by lowering or hoisting gear, described polishing machine also comprises polishing control circuit, and described polishing module comprises bistrique, ultrasonic transducer, oscillating signal generating circuit and piezoelectric sensing circuitry;
Described bistrique is connected to the vibration output of ultrasonic transducer;
Described oscillating signal generating circuit is electrically connected with described ultrasonic transducer, for generation of the drive singal of ultrasonic transducer;
Described piezoelectric sensing circuitry is electrically connected with described ultrasonic transducer, the output voltage produced for detecting ultrasonic transducer piezo-electric effect;
Described polishing control circuit is electrically connected on piezoelectric sensing circuitry and described lowering or hoisting gear, and polishing control circuit controls lowering or hoisting gear according to the magnitude of voltage that piezoelectric sensing circuitry detects and drives polishing module to rise, decline or keep original position.
Beneficial effect of the present invention is: vibration output bistrique being arranged at ultrasonic transducer, vibrated by ultrasonic transducer band rotary bistrique, thus play the effect of sanding and polishing, and while sanding and polishing, the piezoelectric efficiency being detected ultrasonic transducer by described piezoelectric sensing circuitry exports induced voltage, thus the contact can retrodicted out between bistrique and workpiece, and control by polishing control circuit the contact that lowering or hoisting gear lifting adjusts bistrique and workpiece, pressure when bistrique is polished remains on zone of reasonableness, the present invention takes grinding head polishing to by ultrasonic vibration, the glossiness of polishing is high, and bistrique and absorption surface pressure can be kept in the reasonable scope, the efficiency of polishing can be ensured, workpiece can be prevented again to be excessively abraded.
In conjunction with first aspect, for improving the Oscillation Amplitude of ultrasonic transducer, make bistrique have higher polishing efficiency, described ultrasonic oscillator is sandwich composite transducer, comprises front shroud, back shroud, even number sheet piezoelectric ceramic wafer, studs and nut;
Described back shroud, even number sheet piezoelectric ceramic wafer, front shroud are cascading, and described studs runs through described piezoelectric ceramic wafer and back shroud, and the threaded one end of studs is connected in the middle part of front shroud, and described nut is connected to the other end of studs.
In conjunction with first aspect, for expanding the polishing efficiency of bistrique, second aspect, by increasing the contact area of bistrique and workpiece, and improve effective exposure level of bistrique surface and workpiece, described bistrique is made up of connecting rod, flat board, elastic insert and emery cloth, and described slab normal is arranged at one end of connecting rod, and described elastic insert and emery cloth are set in turn in planar surface.Wherein, the area of described elastic insert and emery cloth is suitable with dull and stereotyped area, elasticity is thrown layer and then when bistrique top pressure surface of the work, deformation is occurred, emery cloth is fully contacted with the embossing pattern surface of surface of the work convex-concave surface, therefore, disposablely can complete large-area embossing pattern surface polishing, and also can obtain abundant polishing in carving groove.
In conjunction with described second aspect, described elastic insert is layer of silica gel.
In conjunction with described first aspect, described oscillating signal generating circuit comprises oscillator, driver and the power amplifier of connecting successively, and the output of described power amplifier is connected to the driving signal input of ultrasonic transducer.
In conjunction with described first aspect, described piezoelectric sensing circuitry comprises the high frequency filter and signal amplifier of connecting successively, and the input of described high frequency filter connects described ultrasonic transducer, and the output of signal amplifier connects described polishing control circuit.
In conjunction with described first aspect, the frequency of oscillation of described ultrasonic transducer is 20 ~ 40kHz.
In conjunction with described first aspect, for improving the polishing efficiency of polishing machine, in a third aspect, described polishing module also comprises polishing motor, and described bistrique and polishing motor are in transmission connection.Wherein, polishing is carried out in the vibration of ultrasonic transducer band rotary bistrique, and meanwhile, described polishing motor is also with rotary bistrique to rotate polishing, thus from multi-angle, multi-facetedly carry out polishing, substantially increase polishing efficiency.
In conjunction with the described third aspect, described bistrique is in transmission connection by driving belt and polishing motor.
In conjunction with first aspect, for improving polishing machine auto-control, improve polishing machine operating efficiency, between workbench and lathe base, be provided with mobile device, described mobile device can drive workbench to move along X, Y, Z axis.
Accompanying drawing explanation
Fig. 1 is the structural representation of embodiment of the present invention based on the polishing machine of ultrasonic oscillator;
Fig. 2 is sandwich composite transducer structural representation in an embodiment of the present invention;
Fig. 3 is the circuit connection diagram of embodiment of the present invention based on ultrasonic oscillator;
Fig. 4 is the cross section view of bistrique in an embodiment of the present invention;
Fig. 5 is the annexation schematic diagram of polishing motor and bistrique in an embodiment of the present invention;
Fig. 6 is the circuit block diagram of oscillating signal generating circuit in an embodiment of the present invention.
Label declaration:
1, lathe base; 2, workbench; 3, lowering or hoisting gear; 4, polishing module;
5, workpiece; 11, portal frame; 12, horizontal slip device;
41, oscillating signal generating circuit; 42, ultrasonic transducer; 43, piezoelectric sensing circuitry;
44, polishing control circuit; 45, bistrique; 46, polishing motor;
47, driving belt; 421, back shroud; 422, piezoelectric ceramic wafer;
423, front shroud; 424, electrode; 425, studs; 426, nut;
451, connecting rod; 452, dull and stereotyped; 453, elastic insert; 454, emery cloth.
Detailed description of the invention
By describing technology contents of the present invention, structural feature in detail, realized object and effect, accompanying drawing is coordinated to be explained in detail below in conjunction with embodiment.
Refer to Fig. 1 and Fig. 3, a kind of polishing machine based on ultrasonic oscillator of the present invention, comprise lathe base 1, workbench 2 and carry out the polishing module 4 of polishing, described workbench 2 is arranged on lathe base 1, described polishing module 4 to be arranged at above workbench 2 and to be driven can be elevated in Z-direction by lowering or hoisting gear 3, wherein, can move horizontally for making polishing module 4, described lowering or hoisting gear 3 is arranged on horizontally moving device 12, and horizontally moving device 12 is arranged on the portal frame 11 of lathe base 1.
The described polishing machine based on ultrasonic oscillator also comprises polishing control circuit 44, and polishing module 4 comprises bistrique 45, ultrasonic transducer 42, oscillating signal generating circuit 41 and piezoelectric sensing circuitry 43;
Described bistrique 45 is connected to the vibration output of ultrasonic transducer 42;
Described oscillating signal generating circuit 41 is electrically connected with described ultrasonic transducer 42, for generation of the drive singal of ultrasonic transducer;
Described piezoelectric sensing circuitry 43 is electrically connected with described ultrasonic transducer 42, the output voltage produced for detecting ultrasonic transducer piezo-electric effect, wherein, described piezo-electric effect is pressed workpiece by bistrique top during polishing and acts on the pressure generation of ultrasonic transducer;
Described polishing control circuit 44 is electrically connected on piezoelectric sensing circuitry 41 and described lowering or hoisting gear 3, and polishing control circuit 44 controls lowering or hoisting gear according to the magnitude of voltage that piezoelectric sensing circuitry detects and drives polishing module to rise, decline or keep original position.
Refer to Fig. 6, described oscillating signal generating circuit comprises oscillator, driver and the power amplifier of connecting successively, and the output of described power amplifier is connected to the driving signal input of ultrasonic transducer.
Described piezoelectric sensing circuitry comprises the high frequency filter and signal amplifier of connecting successively, and the input of described high frequency filter connects described ultrasonic transducer, and the output of signal amplifier connects described polishing control circuit.Described high frequency filter can the high frequency spurs that receives of filtering ultrasonic transducer.
Wherein, described ultrasonic transducer 42 is a kind of devices with piezo-electric effect or inverse piezoelectric effect, electrical power can be converted to mechanical oscillation (i.e. ultrasonic wave), also mechanical energy can be converted to electrical power, described inverse piezoelectric effect refers to and applies to crystal the phenomenon that alternating electric field causes crystal mechanically deform, namely apply the pulse voltage of certain frequency at the crystal two ends of ultrasonic transducer, then ultrasonic transducer will produce mechanical oscillation (i.e. ultrasonic wave); Described pressure effect for some dielectric (crystal of ultrasonic transducer) be subject to the effect of external force in a certain direction and be out of shape time, its inside can produce polarization phenomena, on its two apparent surfaces, there is positive and negative contrary electric charge simultaneously, after external force is removed, it can return to uncharged state again.
Because ultrasonic transducer has piezo-electric effect and inverse piezoelectric effect, therefore by ultrasonic transducer simultaneously
In the present invention, the high frequency mechanical oscillation mainly utilizing the inverse piezoelectric effect of ultrasonic oscillator 42 to produce drives the bistrique vibration being arranged at its vibration output, thus play grinding workpieces polishing action, the present invention do not use ultrasonic transducer produce and the ultrasonic wave outwards launched, and, the present invention also utilizes the piezo-electric effect of ultrasonic transducer to detect the contact of bistrique and surface of the work, namely when polishing, the pressure of bistrique and surface of the work can be passed to ultrasonic transducer crystal surface, therefore, will piezo-electric effect be there is in crystal, the magnitude of voltage produced by detecting piezo-electric effect can infer the interaction force bistrique and surface of the work.Therefore, polishing control circuit controls by the magnitude of voltage detected by described piezoelectric sensing circuitry the Interaction Force that lowering or hoisting gear motion can control bistrique and workpiece.Be specially: when the magnitude of voltage detected is less than setting value (illustrate bistrique and workpiece interaction force less than normal), controlling lowering or hoisting gear drives polishing module to move downward, when the magnitude of voltage detected equals setting value or is close with setting value, control lowering or hoisting gear and keep original position, when the magnitude of voltage detected is greater than setting value, controls lowering or hoisting gear and drive polishing module to rise.
The course of work of described polishing machine is as follows:
Workpiece is loaded on workbench, polishing control circuit controls lowering or hoisting gear and drives polishing module to move downward, oscillating signal generating circuit and piezoelectric sensing circuitry alternately work on power simultaneously, when oscillating signal generating circuit works on power, ultrasonic transducer is in vibrational state, the vibration of ultrasonic transducer band rotary bistrique carries out polishing to workpiece, when piezoelectric sensing circuitry works on power, ultrasonic transducer is in accepting state, piezoelectric sensing circuitry detects the interaction force (i.e. pressure) of bistrique and surface of the work, when the force value detected is by setting value, polishing control circuit controls lowering or hoisting gear and drives polishing module to rise, and travelling table, polishing is carried out to the next position.
Enough polishing times are had in polishing position for making everyone, (when piezoelectric sensing circuitry detects magnitude of voltage) speed of lowering or hoisting gear motion can be slowed down when bistrique and absorption surface, or when power detection circuit detects that magnitude of voltage equals setting value, move after making the lowering or hoisting gear pause motion a bit of time.
The inside of ultrasonic transducer comprises the energy storage original paper of an electric capacity Co or inductance L o usually, when transducer is at vibrational state, an electric oscillation signal is sent here from oscillating signal generating circuit, the electric field of its energy storage original paper or magnetic field are changed, and by certain " stress effect " in electric field or magnetic field, create the power to the mechanical vibrating system of transducer, make it to enter vibrational state.;
When transducer is in accepting state, first be that signal one acoustic pressure of sound field acts on the vibration plane of transducer, its mechanical vibrating system is made to enter vibrational state, now just cause the electric field of the circuit energy storage original paper of transducer or magnetic field that corresponding change occurs, by means of system certain " electrical effect ", just in its Circuits System, produce an electromotive force corresponding to acoustical signal or electric current.
Be exactly more than the operation principle of ultrasonic transducer when vibrating (namely launching), Received signal strength.
In the present embodiment, the frequency of oscillation of described ultrasonic transducer is 20 ~ 40kHz, but in other embodiments, the frequency of oscillation of described ultrasonic transducer can be greater than 40kHz or be less than 20kHz.
For improving polishing machine auto-control, improve polishing machine operating efficiency, between workbench and lathe base, be provided with mobile device, described mobile device can drive workbench to move along X, Y, Z axis.
In the present embodiment, described bistrique is preferably conical grinding wheel, but bistrique of the present invention is not limited in conical grinding wheel.
In one embodiment, for increasing the Oscillation Amplitude of ultrasonic transducer 42, a kind of ultrasonic transformer (amplitude transformer) is usually connected at the radiation end face of ultrasonic transducer, amplified by the micro-displacement amplitude (generally only having several micron) of transducer radiates end face, described bistrique is then arranged on described ultrasonic transformer.
In the present embodiment, the crystal of described ultrasonic transducer can be quartz crystal, barium titanate or lead zirconate titanate, and because lead zirconate titanate has higher mechanical strength and Oscillation Amplitude, described ultrasonic transducer is preferably lead zirconate titanate ultrasonic transducer.
In another embodiment, for increasing the Oscillation Amplitude of ultrasonic transducer, then select sandwich composite transducer as ultrasonic transducer, wherein, sandwich composite transducer is preferably large amplitude sandwich composite transducer.
Describedly refer to Fig. 2, described ultrasonic oscillator is that sandwich composite transducer comprises front shroud 421, back shroud 423, even number sheet piezoelectric ceramic wafer 422, studs 425 and nut 426;
Described back shroud 421, even number sheet piezoelectric ceramic wafer 422, front shroud 423 are cascading, described studs 425 runs through described piezoelectric ceramic wafer 422 and back shroud 421, the threaded one end of studs 425 is connected in the middle part of front shroud 423, described nut 426 is connected to the other end of studs 425, and 424, electrode is arranged on piezoelectric ceramic wafer 422.
As shown in Figure 4, for expanding the polishing efficiency of bistrique, in another embodiment, by increasing the contact area of bistrique and workpiece, and improve effective exposure level of bistrique surface and workpiece, described bistrique is made up of connecting rod 451, flat board 452, elastic insert 453 and emery cloth 454, and described slab normal is arranged at one end of connecting rod, and described elastic insert and emery cloth are set in turn in planar surface.
Wherein, the area of described elastic insert and emery cloth is suitable with dull and stereotyped area, elasticity is thrown layer and then when bistrique top pressure surface of the work, deformation is occurred, emery cloth is fully contacted with the embossing pattern surface of surface of the work convex-concave surface, therefore, disposablely can complete large-area embossing pattern surface polishing, and also can obtain abundant polishing in carving groove.
Wherein, described elastic insert 453 can be elastic sponge layer, rubber layer elastomeric material layer, and preferably, described elastic insert is layer of silica gel.
Refer to Fig. 5, for improving the polishing efficiency of polishing machine, in one embodiment, described polishing module also comprises polishing motor 46, and described bistrique 45 is in transmission connection with polishing motor 46.Preferably, described bistrique 45 is in transmission connection by driving belt 47 and polishing motor 46.
Wherein, polishing is carried out in the vibration of ultrasonic transducer band rotary bistrique, and meanwhile, described polishing motor is also with rotary bistrique to rotate polishing, thus from multi-angle, multi-facetedly carry out polishing, substantially increase polishing efficiency.
The foregoing is only embodiments of the invention; not thereby the scope of the claims of the present invention is limited; every utilize description of the present invention and accompanying drawing content to do equivalent structure or equivalent flow process conversion; or be directly or indirectly used in other relevant technical fields, be all in like manner included in scope of patent protection of the present invention.
Claims (10)
1. the polishing machine based on ultrasonic oscillator, comprise lathe base, workbench and carry out the polishing module of polishing, described workbench is arranged on lathe base, described polishing module to be arranged at above workbench and to be driven can be elevated in Z-direction by lowering or hoisting gear, it is characterized in that, also comprise polishing control circuit, described polishing module comprises bistrique, ultrasonic transducer, oscillating signal generating circuit and piezoelectric sensing circuitry;
Described bistrique is connected to the vibration output of ultrasonic transducer;
Described oscillating signal generating circuit is electrically connected with described ultrasonic transducer, for generation of the drive singal of ultrasonic transducer;
Described piezoelectric sensing circuitry is electrically connected with described ultrasonic transducer, the output voltage produced for detecting ultrasonic transducer piezo-electric effect;
Described polishing control circuit is electrically connected on piezoelectric sensing circuitry and described lowering or hoisting gear, and polishing control circuit controls lowering or hoisting gear according to the magnitude of voltage that piezoelectric sensing circuitry detects and drives polishing module to rise, decline or keep original position.
2. the polishing machine based on ultrasonic oscillator according to claim 1, is characterized in that, described ultrasonic oscillator is sandwich composite transducer, comprises front shroud, back shroud, even number sheet piezoelectric ceramic wafer, studs and nut;
Described back shroud, even number sheet piezoelectric ceramic wafer, front shroud are cascading, and described studs runs through described piezoelectric ceramic wafer and back shroud, and the threaded one end of studs is connected in the middle part of front shroud, and described nut is connected to the other end of studs.
3. the polishing machine based on ultrasonic oscillator according to claim 1, it is characterized in that, described bistrique is made up of connecting rod, flat board, elastic insert and emery cloth, and described slab normal is arranged at one end of connecting rod, and described elastic insert and emery cloth are set in turn in planar surface.
4. the polishing machine based on ultrasonic oscillator according to claim 3, is characterized in that, described elastic insert is layer of silica gel.
5. the polishing machine based on ultrasonic oscillator according to claim 1, it is characterized in that, described oscillating signal generating circuit comprises oscillator, driver and the power amplifier of connecting successively, and the output of described power amplifier is connected to the driving signal input of ultrasonic transducer.
6. the polishing machine based on ultrasonic oscillator according to claim 1, it is characterized in that, described piezoelectric sensing circuitry comprises the high frequency filter and signal amplifier of connecting successively, the input of described high frequency filter connects described ultrasonic transducer, and the output of signal amplifier connects described polishing control circuit.
7. the polishing machine based on ultrasonic oscillator according to claim 1, is characterized in that, the frequency of oscillation of described ultrasonic transducer is 20 ~ 40kHz.
8. the polishing machine based on ultrasonic oscillator according to claim 1, is characterized in that, polishing module also comprises polishing motor, and described bistrique and polishing motor are in transmission connection.
9. the polishing machine based on ultrasonic oscillator according to claim 8, is characterized in that, described bistrique is in transmission connection by driving belt and polishing motor.
10. the polishing machine based on ultrasonic oscillator according to claim 1, is characterized in that, be provided with mobile device between workbench and lathe base, and described mobile device can drive workbench to move along X, Y, Z axis.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510287373.6A CN104858727A (en) | 2015-05-29 | 2015-05-29 | Polishing machine based on ultrasonic wave oscillator |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510287373.6A CN104858727A (en) | 2015-05-29 | 2015-05-29 | Polishing machine based on ultrasonic wave oscillator |
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| CN104858727A true CN104858727A (en) | 2015-08-26 |
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| CN201510287373.6A Pending CN104858727A (en) | 2015-05-29 | 2015-05-29 | Polishing machine based on ultrasonic wave oscillator |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109269627A (en) * | 2018-11-16 | 2019-01-25 | 中国计量大学 | A kind of dynamic piezoelectric transducer resonant state on-line checking circuit and method |
| CN111872771A (en) * | 2020-07-13 | 2020-11-03 | 贵州工程应用技术学院 | Two-sided burring device is used in cambered surface bevel gear processing |
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| JPH01234145A (en) * | 1988-03-15 | 1989-09-19 | Nagao Saito | Ultrasonic machining method |
| CN1559752A (en) * | 2004-02-27 | 2005-01-05 | 哈尔滨工业大学 | Micromechanical parts three-dimensional processing device |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109269627A (en) * | 2018-11-16 | 2019-01-25 | 中国计量大学 | A kind of dynamic piezoelectric transducer resonant state on-line checking circuit and method |
| CN111872771A (en) * | 2020-07-13 | 2020-11-03 | 贵州工程应用技术学院 | Two-sided burring device is used in cambered surface bevel gear processing |
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