CN104846373A - Micro etching processing system and related equipment - Google Patents
Micro etching processing system and related equipment Download PDFInfo
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- CN104846373A CN104846373A CN201410050962.8A CN201410050962A CN104846373A CN 104846373 A CN104846373 A CN 104846373A CN 201410050962 A CN201410050962 A CN 201410050962A CN 104846373 A CN104846373 A CN 104846373A
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- microetch
- major trough
- medicament
- spray tube
- secondary groove
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Abstract
The invention discloses a micro etching processing system and related equipment, and aims to solve the technical problem of poor thickness uniformity of micro etching processing in the prior art. The micro etching processing system is used for circuit board vertical production line, the micro etching processing system includes a main groove, an auxiliary groove and a circulation device; a micro etching agent in the auxiliary groove can be pumped by a bottom circulating pipe into a jet pipe, is jetted into the main groove by a jet hole on the jet pipe, and is used for micro erosion of a plate part in the main groove; and a micro etching agent in the main tank can be flowed back to the auxiliary groove by a top circulating pipe. According to the micro etching processing system, the thickness uniformity of the micro etching processed plate part can be greatly improved, and practice shows that after micro etching processing of plate parts with a variety of the thickness by use of the micro etching processing system, surface thickness extreme difference can be conveniently controlled within 3 microns.
Description
Technical field
The present invention relates to circuit board technology field, be specifically related to a kind of microetch treatment system and relevant device.
Background technology
At present conventional horizontal microetch production line often has the restriction of panel thickness, slab more than 3.2mm circuit card not by, thus just can not produce.So, for the thicker circuit card needing microetch, just need to utilize the microetch groove in vertical production line to carry out etching and subtract thick.
But in vertical production line, the microetch degree of depth generally needs to control in 2um, if microetch depth down, the thickness evenness after just can not ensureing microetch.Practice shows, when adopting the average microetch of vertical production line to subtract copper 15um thickness, the thickness extreme difference after microetch reaches 10um, namely, when some region microetch degree of depth reaches 15um, the degree of depth of other region microetches may only have 5um, completely can not the production requirement of coincidence circuit plate.
Summary of the invention
The embodiment of the present invention provides a kind of microetch treatment system and relevant device, to solve the poor technical problem of existing microetch process thickness evenness.
A kind of microetch treatment system, for the vertical production line of circuit card, comprising:
Major trough and secondary groove and circulation device;
Described major trough treats the plate of microetch for holding, at least two bottoms near described major trough are provided with and the spray tube parallel with described plate in described major trough, the bottom of the first side wall vertical with described plate of described major trough is provided with opening, and the top of described the first side wall and the top of second sidewall relative with described the first side wall are equipped with spillway; The sidewall that two of described secondary groove are relative is equipped with influx, and the bottom of a sidewall of described secondary groove is provided with relief outlet;
Described circulation device comprises bottom cycle pipeline, the pumping be connected with described bottom cycle pipeline, and at least two top circulating lines; Described bottom cycle pipeline is through described pumping, and one end is connected with described spray tube by the opening of described major trough, and the other end is connected with the relief outlet of described secondary groove; The two ends of each top circulating line are connected with an influx of described secondary groove with a spillway of described major trough respectively;
Wherein, the microetch medicament in described secondary groove, under the effect of described pumping, enters described spray tube through described bottom cycle pipeline, and the jet hole on described spray tube sprays and enters in described major trough, for carrying out microetch to the plate in described major trough; Microetch medicament in described major trough, through described top circulating line to described secondary groove backflow.
Second aspect present invention provides a kind of circuit card vertical apparatus for production line, comprising: microetch treatment system as above.
Therefore the microetch treatment system that the embodiment of the present invention provides comprises major trough and secondary groove and circulation device, achieves following technique effect:
Because microetch medicament ejects from the spray tube bottom major trough, therefore, the microetch medicament bottom major trough can be driven to circulate upwards, the microetch medicament flow velocity of major trough internal upper part and bottom is reached unanimity;
Because the spray tube in major trough is parallel with plate, and spray tube has two at least, therefore, the microetch medicament flow velocity of two sides parallel with plate in major trough can be made to reach unanimity;
At least two spillways due to major trough are located at the top of two sidewalls vertical with plate respectively, the microetch medicament of major trough internal upper part flows respectively at least two spillways, therefore, the microetch medicament flow velocity of two sides vertical with plate in major trough can be made to reach unanimity;
To sum up, microetch medicament in the major trough of microetch treatment system of the present invention can fully circulate, and the flow velocity of the microetch medicament of its various piece all reaches unanimity, therefore, can ensure unanimously to the etch depth of the regional of plate in major trough, substantially increase the thickness evenness of plate after microetch process.Practice shows, for the plate of various thickness, after adopting microetch treatment system microetch of the present invention process, is conducive to the extreme difference of its surface thickness to control within 3 microns.In addition, microetch treatment system of the present invention is used for vertical production line, and the plate of processing is vertically placed in groove, therefore, is applicable to the plate of any thickness of slab.
Accompanying drawing explanation
In order to be illustrated more clearly in embodiment of the present invention technical scheme, be briefly described to the accompanying drawing used required in embodiment and description of the prior art below, apparently, accompanying drawing in the following describes is only some embodiments of the present invention, for those of ordinary skill in the art, under the prerequisite not paying creative work, other accompanying drawing can also be obtained according to these accompanying drawings.
Fig. 1 is the schematic diagram that the embodiment of the present invention provides a kind of microetch treatment system.
Embodiment
The embodiment of the present invention provides the embodiment of the present invention to provide a kind of microetch treatment system and relevant device, to solve the poor technical problem of existing microetch process thickness evenness.
The present invention program is understood better in order to make those skilled in the art person, below in conjunction with the accompanying drawing in the embodiment of the present invention, technical scheme in the embodiment of the present invention is clearly and completely described, obviously, described embodiment is only the embodiment of a part of the present invention, instead of whole embodiments.Based on the embodiment in the present invention, those of ordinary skill in the art, not making the every other embodiment obtained under creative work prerequisite, should belong to the scope of protection of the invention.
Below by specific embodiment, be described in detail respectively.
Embodiment one,
Please refer to Fig. 1, the embodiment of the present invention provides a kind of microetch treatment system, can comprise:
Major trough 10 and secondary groove 20 and circulation device;
Described major trough 10 is for holding the plate treating microetch, at least two bottoms near described major trough 10 are provided with and the spray tube 30 parallel with described plate in described major trough 10, the bottom of the first side wall 11 vertical with described plate of described major trough 10 is provided with opening 15, and the top of described the first side wall 11 and the top of second sidewall 12 relative with described the first side wall 11 are equipped with spillway 16; The sidewall that two of described secondary groove 20 are relative is equipped with influx 26, and the bottom of a sidewall of described secondary groove 20 is provided with relief outlet 25;
Described circulation device comprises bottom cycle pipeline 40, the pumping 50 be connected with described bottom cycle pipeline 40, and at least two top circulating lines 60; Described bottom cycle pipeline 40 is through described pumping 50, and one end is connected with described spray tube 30 by the opening 15 of described major trough 10, and the other end is connected with the relief outlet 25 of described secondary groove 20; The two ends of each top circulating line 60 are connected with an influx 26 of described secondary groove 20 with a spillway 16 of described major trough 10 respectively;
Wherein, microetch medicament in described secondary groove 20, under the effect of described pumping 50, can enter described spray tube 30 through described bottom cycle pipeline 40, jet hole 31 on described spray tube 30 sprays and enters in described major trough 10, for carrying out microetch to the plate in described major trough 10; Microetch medicament in described major trough 10, can reflux to described secondary groove 20 through described top circulating line 60.
In the microetch treatment system of the embodiment of the present invention, major trough produces cell body, for holding plate, and such as various circuit card, and the microetch medicament held by inside carries out microetch process to plate; Secondary groove is auxiliary cell body, for the circulation coordinating major trough to carry out microetch medicament.
Therefore, in the microetch treatment system that the embodiment of the present invention provides:
Because microetch medicament ejects from the spray tube bottom major trough, therefore, the microetch medicament bottom major trough can be driven to circulate upwards, the microetch medicament flow velocity of major trough internal upper part and bottom is reached unanimity;
Because the spray tube in major trough is parallel with plate, and spray tube has two at least, therefore, the microetch medicament flow velocity of two sides parallel with plate in major trough can be made to reach unanimity;
At least two spillways due to major trough are located at the top of two sidewalls vertical with plate respectively, the microetch medicament of major trough internal upper part flows respectively at least two spillways, therefore, the microetch medicament flow velocity of two sides vertical with plate in major trough can be made to reach unanimity;
To sum up, microetch treatment system of the present invention, its each assembly is as far as possible symmetrical, microetch medicament in its major trough can fully circulate, the flow velocity of the microetch medicament of its various piece all reaches unanimity, therefore, can ensure unanimously to the etch depth of the regional of plate in major trough, greatly improve the thickness evenness of plate after microetch process.Practice shows, for the plate of various thickness, after adopting microetch treatment system microetch of the present invention process, is conducive to the extreme difference of its surface thickness to control within 3 microns.In addition, microetch treatment system of the present invention is used for vertical production line, and the plate of processing is vertically placed in groove, therefore, is applicable to the plate of any thickness of slab.
In some embodiments of the invention, described spray tube adopts end spray mode to spray microetch medicament.In a kind of embodiment, the jet orifice direction on described spray tube can down, and the microetch medicament in described spray tube is ejected into backward upper reflection bottom major trough by described jet hole, the microetch medicament bottom described major trough circulated and upwards flows; In another kind of embodiment, the jet orifice direction on described spray tube also can upward, and the microetch medicament in described spray tube directly to upper injection by described jet hole, is made the microetch medicament bottom described major trough circulate and upwards flows.
In embody rule, due to major trough is back to the density of original microetch medicament in microetch medicament in secondary groove and secondary groove and composition etc. may be variant, in order to accelerate both fused, make the character of the microetch medicament in whole secondary groove consistent; In some embodiments of the invention, be also provided with the blowing line for accelerating the circulation of microetch medicament in described secondary groove, described blowing line is connected with outside air-blast device.Utilize blowing line to blow in secondary groove, the flow circuit of the microetch medicament in secondary groove can be accelerated, accelerate fused.Described blowing line can be metal tube or the plastics tubing of hollow, it offers multiple blowing holes.
In some embodiments of the invention, in described secondary groove, also can be provided with the heating unit for heating microetch medicament, to tackle the microetch liquid medicine with temperature requirement.In the embodiment of the present invention, by heating unit is located at secondary groove, flows into major trough again after being heated by microetch medicament, the temperature consistency of the microetch medicament of major trough can be ensured; Avoid heating unit to be located at major trough and the too high problem of the major trough local temperature caused.Preferably, near the outlet that heating unit can be arranged on secondary groove, ensure the temperature consistency of microetch medicament further.
In some embodiments of the invention, three spray tubes be parallel to each other are provided with in described major trough, lay respectively at centre and both sides, namely, wherein spray tube is positioned at the central authorities of described major trough 10, and another two articles of spray tubes 30 are respectively near three sidewall 13 parallel with described plate and the 4th sidewall 14 of major trough 10.Thus, ensure that the microetch medicament flow velocity of two sides parallel with plate in major trough reaches unanimity.In other embodiment, the quantity of spray tube also can be two or four or more.Described spray tube can be metal tube or the plastics tubing of hollow, it offers multiple jet hole.
In some embodiments of the invention, the spillway on the spillway on described the first side wall 11 and described second sidewall 12, to be centrosymmetric distribution with the center of place major trough plane.Such as, when the spillway on the first side wall 11 is near the 3rd sidewall 13, the spillway on the second sidewall is near the 4th sidewall 14; Or when the spillway on the first side wall 11 is near the 4th sidewall 14, the spillway on the second sidewall is near the 3rd sidewall 13; Like this, after the microetch medicament circulation upwards bottom major trough, then respectively to two spillway flowings, on the whole in " ellipse " circumferential motion, can further improve the consistence of the flow velocity of the microetch medicament of two sides vertical with plate in major trough.
In some embodiments of the invention, the diameter of preferred described spray tube is 1-1.5 inch, 5-10 centimetre bottom preferred described spray tube distance major trough.
In some embodiments of the invention, the diameter of preferred described jet hole is 5-10 millimeter, and the spacing of preferred adjacent jet hole is 5-10 centimetre.
In some embodiments of the invention, the jet hole on spray tube can be aligned, also can on the pipeline mid-line of spray tube symmetry arrangement.
In some embodiments of the invention, the diameter of preferred described top circulating line is 1-3 inch, and the spillway of described major trough is a little more than liquid level when microetch medicament balances in described major trough and described secondary groove.In like manner, the influx of secondary groove is also a little more than liquid level when microetch medicament balances in described major trough and described secondary groove.
The embodiment of the present invention also subtracts the homogeneity after copper by test copper-clad plate microetch, checks microetch treatment system of the present invention.If microetch medicament circulating effect is inconsistent, in major trough, the etch depth of different sites will be different, and circulating effect is poorer, and the thick difference of copper after copper-clad plate different sites microetch is larger, and what show is that the plate face thick difference of copper is larger.Experiment proves: for being of a size of 18 × 24inch(inch), copper is thick is 35um(micron) copper-clad plate, employing present system respectively microetch subtracts copper 5 minutes, 10 minutes, 15 minutes, on average subtract copper 7.87um, 16.67um, 23.49um, the extreme difference of copper-clad plate copper face thickness all can be controlled within 3um.
Visible, microetch treatment system of the present invention, its each assembly is as far as possible symmetrical, microetch medicament in its major trough can fully circulate, the flow velocity of the microetch medicament of its various piece all reaches unanimity, therefore, can ensure unanimously to the etch depth of the regional of plate in major trough, greatly improve the thickness evenness of plate after microetch process.Further, microetch treatment system of the present invention is used for vertical production line, and the plate of processing is vertically placed in groove, therefore, is applicable to the plate of any thickness of slab.
Embodiment two,
The embodiment of the present invention also provides a kind of circuit card vertical apparatus for production line, comprising: the microetch treatment system as described in embodiment one.
The vertical apparatus for production line of circuit card of the present invention, improves the thickness evenness of plate after microetch process greatly.Practice shows, for the plate of various thickness, after adopting microetch treatment system microetch of the present invention process, the extreme difference of its surface thickness all can be controlled within 3 microns.Further, present device is applicable to the plate of any thickness of slab.
In the above-described embodiments, the description of each embodiment is all emphasized particularly on different fields, in certain embodiment, there is no the part described in detail, can see the associated description of other embodiment.
The microetch treatment system provided the embodiment of the present invention above and equipment are described in detail, but the explanation of above embodiment just understands method of the present invention and core concept thereof for helping, and should not be construed as limitation of the present invention.Those skilled in the art, according to thought of the present invention, in the technical scope that the present invention discloses, the change that can expect easily or replacement, all should be encompassed within protection scope of the present invention.
Claims (10)
1. a microetch treatment system, is characterized in that, for the vertical production line of circuit card, comprising:
Major trough and secondary groove and circulation device;
Described major trough treats the plate of microetch for holding, at least two bottoms near described major trough are provided with and the spray tube parallel with described plate in described major trough, the bottom of the first side wall vertical with described plate of described major trough is provided with opening, and the top of described the first side wall and the top of second sidewall relative with described the first side wall are equipped with spillway; The sidewall that two of described secondary groove are relative is equipped with influx, and the bottom of a sidewall of described secondary groove is provided with relief outlet;
Described circulation device comprises bottom cycle pipeline, the pumping be connected with described bottom cycle pipeline, and at least two top circulating lines; Described bottom cycle pipeline is through described pumping, and one end is connected with described spray tube by the opening of described major trough, and the other end is connected with the relief outlet of described secondary groove; The two ends of each top circulating line are connected with an influx of described secondary groove with a spillway of described major trough respectively;
Wherein, the microetch medicament in described secondary groove, under the effect of described pumping, enters described spray tube through described bottom cycle pipeline, and the jet hole on described spray tube sprays and enters in described major trough, for carrying out microetch to the plate in described major trough; Microetch medicament in described major trough refluxes to described secondary groove through described top circulating line.
2. system according to claim 1, is characterized in that:
Down, the microetch medicament in described spray tube is ejected into backward upper reflection bottom major trough by described jet hole in jet orifice direction on described spray tube, the microetch medicament bottom described major trough is circulated and upwards flows;
Or the jet orifice on described spray tube is directed upwardly, the microetch medicament in described spray tube directly to upper injection by described jet hole, is made the microetch medicament bottom described major trough circulate and upwards flows.
3. system according to claim 1, is characterized in that:
Also be provided with the blowing line for accelerating the circulation of microetch medicament in described secondary groove, described blowing line is connected with outside air-blast device.
4. system according to claim 1, is characterized in that:
The heating unit for heating microetch medicament is provided with in described secondary groove.
5. system according to claim 1, is characterized in that:
Be provided with three spray tubes be parallel to each other in described major trough, wherein spray tube is positioned at the central authorities of described major trough, and another two articles of spray tubes are respectively near three sidewall parallel with described plate and the 4th sidewall.
6. system according to claim 1, is characterized in that:
Spillway on spillway on described the first side wall and described second sidewall, to be centrosymmetric distribution with the center of place major trough plane.
7. system according to any one of claim 1 to 6, is characterized in that:
The diameter of described spray tube is 1 to 1.5 inch, bottom described spray tube distance major trough 5 to 10 centimetres.
8. system according to any one of claim 1 to 6, is characterized in that:
The diameter of described jet hole is 5 to 10 millimeters, and the spacing of adjacent jet hole is 5 to 10 centimetres.
9. system according to any one of claim 1 to 6, is characterized in that:
The diameter of described top circulating line is 1 to 3 inch, and the spillway of described major trough is a little more than liquid level when microetch medicament balances in described major trough and described secondary groove.
10. the vertical apparatus for production line of circuit card, is characterized in that, comprising:
Microetch treatment system as claimed in any one of claims 1-9 wherein.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410050962.8A CN104846373B (en) | 2014-02-13 | 2014-02-13 | Microetch processing system and relevant device |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410050962.8A CN104846373B (en) | 2014-02-13 | 2014-02-13 | Microetch processing system and relevant device |
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| CN104846373A true CN104846373A (en) | 2015-08-19 |
| CN104846373B CN104846373B (en) | 2017-12-01 |
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| CN201410050962.8A Active CN104846373B (en) | 2014-02-13 | 2014-02-13 | Microetch processing system and relevant device |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN109348622A (en) * | 2018-10-08 | 2019-02-15 | 刘宾 | One kind being based on the liftable Etaching device of LED lamp panel |
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| CN202830207U (en) * | 2012-09-18 | 2013-03-27 | 绍兴锋龙电机有限公司 | Plating tank |
| CN103305882A (en) * | 2012-03-07 | 2013-09-18 | 深南电路有限公司 | Electroplating method for PCB plate and apparatus |
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| CN201092590Y (en) * | 2007-09-26 | 2008-07-30 | 乳源瑶族自治县东阳光化成箔有限公司 | Capacitor aluminum foil etching device |
| CN201420101Y (en) * | 2009-03-24 | 2010-03-10 | 东莞市宏德电子设备有限公司 | Special electroplating bath body structure |
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| CN104846373B (en) | 2017-12-01 |
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Address after: 518053 No. 99 East Qiaocheng Road, Nanshan District, Shenzhen City, Guangdong Province Patentee after: SHENZHEN SHENNAN CIRCUIT CO., LTD. Address before: 518053 No. 99 East Qiaocheng Road, Nanshan District, Shenzhen City, Guangdong Province Patentee before: Shenzhen Shennan Circuits Co., Ltd. |