CN104827778A - Backlight liquid crystal module marking method and device - Google Patents
Backlight liquid crystal module marking method and device Download PDFInfo
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- CN104827778A CN104827778A CN201510154662.9A CN201510154662A CN104827778A CN 104827778 A CN104827778 A CN 104827778A CN 201510154662 A CN201510154662 A CN 201510154662A CN 104827778 A CN104827778 A CN 104827778A
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- liquid crystal
- crystal module
- backlight liquid
- marking
- laser beam
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Abstract
The invention discloses a backlight liquid crystal module marking method and device. The backlight liquid crystal module marking method comprises a step S1 of initializing parameters of a laser and a marking control system, and inputting a preset marking lettering label through the marking control system; a step S2 of adjusting the laser to generate a laser beam which is reflected by an X-axis vibrating mirror and a Y-axis vibrating mirror and is focused by a condensing lens with the focused laser beam penetrating a transparent protective film of the backlight liquid crystal module and irradiating a surface positioned on the backlight liquid crystal module; and a step S3 of controlling the laser beam or the backlight liquid crystal module to move through the marking control system, and printing the preset marking lettering label on the surface of the backlight liquid crystal module. By employing the backlight liquid crystal module marking method and device, the film changing process is omitted, the production efficiency is improved, the yield is risen, the appearance and quality of the backlight liquid crystal module are guaranteed, and the material cost and the manpower cost are saved.
Description
Technical field
The present invention relates to technical field of liquid crystal display, particularly a kind of backlight liquid crystal module marking method and device.
Background technology
Liquid crystal display module or backlight module are very high to the purity requirements of environment in manufacturing process; the operation of one lettering mark is had in production process; existing method is first emptied by the PET film assigned address of backlight module; again the diaphragm of backlight module is torn; the PET film emptied on exchangining cards containing all personal details and become sworn brothers; finally spray ink emptying on position of PET film, thus form lettering mark.But the method has the following disadvantages: one be exchange cards containing all personal details and become sworn brothers may to produce in PET film process that bubble is bad, dirty, scuffing etc., thus affect outward appearance and the quality of product; Two are
Ink spraying is easy to cause product surface dirty, thus causes liquid crystal display module or backlight module to scrap, and the mode efficiency of oil spout ink is low.
Summary of the invention
The present invention proposes a kind of backlight liquid crystal module marking method and device, can enhance productivity and yields, ensures outward appearance and the quality of product, saves Material Cost and human cost.
For achieving the above object, the present invention adopts following technical scheme:
A kind of backlight liquid crystal module marking method, said method comprising the steps of:
Step S1: the parameter of laser instrument and marking control system is initialized, and input default mark lettering mark by marking control system;
Step S2: adjustment laser instrument produces laser beam, described laser beam through X-axis galvanometer and Y-axis galvanometer reflection and assembled by collector lens, the transparent protective film that the laser beam of described convergence penetrates backlight liquid crystal module irradiates the surface being positioned backlight liquid crystal module;
Step S3: moved by described marking control system control laser beam or backlight liquid crystal module, thus go out default mark lettering mark at the printout surface of backlight liquid crystal module.
Further, in above-mentioned backlight liquid crystal module marking method, the wavelength of described laser beam is preferably 355nm, and the power output of described laser instrument is preferably the rated power of 51% ~ 55%.
Further, in above-mentioned backlight liquid crystal module marking method, the laser frequency of described laser instrument is preferably 30KHz ~ 200KHz, and the line speed of described laser beam is preferably 100 ~ 4500 mm/s.
Further, in above-mentioned backlight liquid crystal module marking method, the laser frequency of described laser instrument is preferably 200KHz, and the line speed of described laser beam is preferably 2600 mm/s.
Separately, the present invention also provides a kind of LCD backlight module marking device, for at the backlight liquid crystal module surface mark lettering mark with transparent protective film, described device comprises: be located at the laser instrument above backlight liquid crystal module, galvanometer assembly, focusing lens group and marking control system, described marking control system produces laser beam by controlling described laser instrument, after the reflection of galvanometer assembly, the surface in backlight liquid crystal module is irradiated by the transmission of focusing lens group and the transparent protective film that penetrates backlight liquid crystal module, described control system is moved by control backlight liquid crystal module or laser instrument, thus go out default mark lettering mark at the printout surface of backlight liquid crystal module.
Further, in above-mentioned backlight liquid crystal module marking device, the wavelength of described laser beam is preferably 355nm, and the power output of described laser instrument is preferably the rated power of 51% ~ 55%.
Further, in above-mentioned backlight liquid crystal module marking device, the laser frequency of described laser instrument is preferably 30KHz ~ 200KHz, and the line speed of described laser beam is preferably 100 ~ 4500 mm/s.
Further, in above-mentioned backlight liquid crystal module marking device, the laser frequency of described laser instrument is preferably 200KHz, and the line speed of described laser beam is preferably 2600 mm/s.
Further, in above-mentioned backlight liquid crystal module marking device, described galvanometer assembly at least comprises the X-axis galvanometer and Y-axis galvanometer that cooperatively interact, described marking control system by controlling incidence and the deflection angle of X-axis galvanometer and Y-axis galvanometer relative laser bundle, thus makes laser beam vertical incidence focusing lens group.
Backlight liquid crystal module marking method of the present invention and device eliminate and change membrane process, not only increase production efficiency and yields, ensure that outward appearance and the quality of product, and have saved Material Cost and human cost.
Accompanying drawing explanation
Fig. 1 is the schematic flow sheet of backlight liquid crystal module marking method of the present invention;
Fig. 2 is the structural representation of backlight liquid crystal module marking device of the present invention preferred embodiment.
Detailed description of the invention
In order to make object of the present invention, technical scheme and advantage clearly understand, below in conjunction with drawings and Examples, the present invention is further elaborated.Should be appreciated that specific embodiment described herein only in order to explain the present invention, be not intended to limit the present invention.
Laser is the powerful light beam of one being subject to external stimulation when " ray " and exciting under increasing energy, and its mid-infrared light and visible ray have heat energy, and ultraviolet light separately has optics energy.Three kinds of phenomenons can be there are and reflect, absorb and penetrate in the light of this type when being mapped to workpiece surperficial.The Main Function of laser marking or boring is exactly can remove baseplate material to be processed soon, and it mainly leans on photo-thermal ablation and photochemical ablation or is referred to as meaning excision.
1, photo-thermal ablation: refer to that processed material absorbs high-octane laser, is heated in the extremely short time and melts and the principle be evaporated.This kind of process, under baseplate material is subject to high-octane effect, the hole wall formed has and burns black carbonization residue.
2, photochemical ablation: refer to high photon energy (more than 2eV electron-volt) that ultraviolet range has, result that optical maser wavelength works more than the high-energy photons of 400 nanometers.And this high-octane photon energy destroys the long strand of organic material, become less particulate, its energy is greater than original molecule, does one's utmost therefrom to overflow, and pinching under suction situation in external force, makes baseplate material be formed micropore by removing fast.Therefore the process of type, does not burn containing heat, also would not produce charing phenomenon.
Action of ultraviolet light is in metal surface, metal is inorganic matter, generation photochemically reactive product be metal oxide mostly, time laser energy is little, metal oxide can remain in the gap of laser ablation or slot edge, metal oxide regelation again after being vaporized when laser energy is large, become tiny dust granules to fly away, so metal was spill phenomenon after being beaten by Ultra-Violet Laser.
Time on the organic matter of action of ultraviolet light in nonmetal, laser energy is absorbed by material, the chemical bond of material can be interrupted restructuring, generate new organic matter and be attached to raw material surface, when laser energy strengthens, the chemical bond that can interrupt is more, when energy is enough strong, is exactly the carbonization of organic material.The laser that energy is little can only make it generate new organic matter, and nonmetal in organic matter generation photochemical reaction be organic sex change, organic matter sex change is exactly that molecular chain rupture restructuring becomes new organic matter, and the new raw-material volume of organic volume ratio is large, so produce protruding phenomenon.
Refer to Fig. 1 and Fig. 2, the present invention directly carries out mark through diaphragm to liquid crystal display or backlight module by laser, and backlight liquid crystal module marking method of the present invention comprises the following steps:
Step S1: the parameter of laser instrument and marking control system is initialized, and input default mark lettering mark by marking control system;
Step S2: adjustment laser instrument produces laser beam, described laser beam through X-axis galvanometer and Y-axis galvanometer reflection and assembled by collector lens, the transparent protective film that the laser beam of described convergence penetrates backlight liquid crystal module irradiates the surface being positioned backlight liquid crystal module;
Step S3: moved by described marking control system control laser beam or backlight liquid crystal module, thus go out default mark lettering mark at the printout surface of backlight liquid crystal module.
Wherein, the wavelength of described laser beam is preferably 355nm, and the power output of described laser instrument is preferably the rated power of 51% ~ 55%; The laser frequency of described laser instrument is preferably 30KHz ~ 200KHz, and the line speed of described laser beam is preferably 100 ~ 4500mm/s.In the present embodiment, the laser frequency of described laser instrument is preferably 200KHz, and the line speed of described laser beam is preferably 2600 mm/s.
In the present invention, described laser beam is on liquid crystal display or backlight module surface, the energy of laser is absorbed by liquid crystal display or backlight module, so will the leaving a trace of liquid crystal display or backlight module surface, laser moves along the track set, the vestige that then liquid crystal display or backlight module surface stay is exactly the content of mark, the color of vestige is the true qualities of product material, after the energy that material as fruit product absorbs laser there is chemical reaction and make material generation sex change in material self, and the color of vestige that so laser stays will change.Diaphragm, cannot the energy of absorbing laser owing to being transparent substance, can not produce chemical reaction simultaneously, so print at transparent substance, can not leave any vestige.
Laser is controlled by the size of laser energy in the degree of depth that product surface is portrayed, and the size of laser energy affects by multiple factor, sums up to get up roughly to divide two classes: a class is external factor, and another kind of is internal factor.
External factor: whether product is placed on focal position mark, the laser energy of focal position is the strongest, and the laser energy departing from focal position can weaken, and this factor is uncontrollable, so require that the position of mark is smooth, product is wanted accurately to the distance of laser marking head.
Internal factor a: parameter of machine set, the laser frequency in a parameter, laser power, line speed all can affect the energy of laser, and this is controlled.
In the present invention, the more larger bright dipping of laser power (50% to 95%) numerical value is stronger; The lines of the larger mark of laser frequency (30KHz to 200KHz) numerical value are finer and smoother; The granular sensation of numerical value less mark lines is more obvious;
Line speed (100 to 4500) numerical value larger mark institute's time spent is shorter, and font effects can be more shallow.
Refer to Fig. 2, Fig. 2 is the structural representation of backlight liquid crystal module marking device of the present invention preferred embodiment.Described backlight liquid crystal module marking device, for at the backlight liquid crystal module 2 surperficial mark lettering mark with transparent protective film 1, described device comprises: be located at the laser instrument 10 above backlight liquid crystal module 2, galvanometer assembly 20, focusing lens group 30 and marking control system (not shown), described marking control system produces laser beam by controlling described laser instrument 10, after the reflection of galvanometer assembly 20, the surface in backlight liquid crystal module 2 is irradiated by focusing lens group 30 transmission and the transparent protective film that penetrates backlight liquid crystal module 20, described control system is moved by control backlight liquid crystal module 2 or laser instrument 10, thus go out default mark lettering mark at the printout surface of backlight liquid crystal module 2.
Wherein, described galvanometer assembly 20 at least comprises the X-axis galvanometer 201 and Y-axis galvanometer 202 that cooperatively interact, described marking control system by controlling incidence and the deflection angle of X-axis galvanometer 201 and Y-axis galvanometer 202 relative laser bundle, thus makes laser beam vertical incidence focusing lens group 30.
The wavelength of described laser beam is preferably 355nm, and the power output of described laser instrument is preferably the rated power of 51% ~ 55%; The laser frequency of described laser instrument is preferably 30KHz ~ 200KHz, and the line speed of described laser beam is preferably 100 ~ 4500 mm/s.In the present embodiment, the laser frequency of described laser instrument is preferably 200KHz, and the line speed of described laser beam is preferably 2600 mm/s.
Compared to prior art, backlight liquid crystal module marking method of the present invention and device eliminate and change membrane process, not only increase production efficiency and yields, ensure that outward appearance and the quality of product, and have saved Material Cost and human cost.
Here description of the invention and application is illustrative, not wants by scope restriction of the present invention in the above-described embodiments.Distortion and the change of embodiment disclosed are here possible, are known for the replacement of embodiment those those of ordinary skill in the art and the various parts of equivalence.Those skilled in the art are noted that when not departing from spirit of the present invention or substantive characteristics, the present invention can in other forms, structure, layout, ratio, and to realize with other assembly, material and parts.When not departing from the scope of the invention and spirit, can other distortion be carried out here to disclosed embodiment and change.
Claims (9)
1. a backlight liquid crystal module marking method, is characterized in that, said method comprising the steps of:
Step S1: the parameter of laser instrument and marking control system is initialized, and input default mark lettering mark by marking control system;
Step S2: adjustment laser instrument produces laser beam, described laser beam through X-axis galvanometer and Y-axis galvanometer reflection and assembled by collector lens, the transparent protective film that the laser beam of described convergence penetrates backlight liquid crystal module irradiates the surface being positioned backlight liquid crystal module;
Step S3: moved by described marking control system control laser beam or backlight liquid crystal module, thus go out default mark lettering mark at the printout surface of backlight liquid crystal module.
2. backlight liquid crystal module marking method according to claim 1, it is characterized in that, the wavelength of described laser beam is preferably 355nm, and the power output of described laser instrument is preferably the rated power of 51% ~ 55%.
3. backlight liquid crystal module marking method according to claim 1, it is characterized in that, the laser frequency of described laser instrument is preferably 30KHz ~ 200KHz, and the line speed of described laser beam is preferably 100 ~ 4500mm/s.
4. backlight liquid crystal module marking method according to claim 3, it is characterized in that, the laser frequency of described laser instrument is preferably 200KHz, and the line speed of described laser beam is preferably 2600 mm/s.
5. a backlight liquid crystal module marking device, for at the backlight liquid crystal module surface mark lettering mark with transparent protective film, it is characterized in that, described device comprises: be located at the laser instrument above backlight liquid crystal module, galvanometer assembly, focusing lens group and marking control system, described marking control system produces laser beam by controlling described laser instrument, after the reflection of galvanometer assembly, the surface in backlight liquid crystal module is irradiated by the transmission of focusing lens group and the transparent protective film that penetrates backlight liquid crystal module, described control system is moved by control backlight liquid crystal module or laser instrument, thus go out default mark lettering mark at the printout surface of backlight liquid crystal module.
6. backlight liquid crystal module marking device according to claim 5, it is characterized in that, the wavelength of described laser beam is preferably 355nm, and the power output of described laser instrument is preferably the rated power of 51% ~ 55%.
7. backlight liquid crystal module marking device according to claim 5, it is characterized in that, the laser frequency of described laser instrument is preferably 30KHz ~ 200KHz, and the line speed of described laser beam is preferably 100 ~ 4500 mm/s.
8. backlight liquid crystal module marking device according to claim 7, it is characterized in that, the laser frequency of described laser instrument is preferably 200KHz, and the line speed of described laser beam is preferably 2600 mm/s.
9. backlight liquid crystal module marking device according to claim 5, it is characterized in that, described galvanometer assembly at least comprises the X-axis galvanometer and Y-axis galvanometer that cooperatively interact, described marking control system by controlling incidence and the deflection angle of X-axis galvanometer and Y-axis galvanometer relative laser bundle, thus makes laser beam vertical incidence focusing lens group.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201510154662.9A CN104827778B (en) | 2015-04-03 | 2015-04-03 | Backlight liquid crystal module marking method and device |
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| CN201510154662.9A CN104827778B (en) | 2015-04-03 | 2015-04-03 | Backlight liquid crystal module marking method and device |
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| CN104827778B CN104827778B (en) | 2016-10-19 |
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| CN106984903A (en) * | 2017-03-30 | 2017-07-28 | 胡金钱 | Laser machine equipment, the method for official seal of putting on record and the official seal docketing system of official seal |
| CN107042682A (en) * | 2017-03-30 | 2017-08-15 | 胡金钱 | A kind of equipment for laser machining official seal |
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| CN104827778B (en) | 2016-10-19 |
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