CN104821232A

CN104821232A - Composite electronic component and board equipped with composite electronic component

Info

Publication number: CN104821232A
Application number: CN201410191017.XA
Authority: CN
Inventors: 金明基; 李京鲁; 韩镇宇; 孙受焕
Original assignee: Samsung Electro Mechanics Co Ltd
Current assignee: Samsung Electro Mechanics Co Ltd
Priority date: 2014-02-04
Filing date: 2014-05-07
Publication date: 2015-08-05
Anticipated expiration: 2034-05-07
Also published as: KR102004783B1; JP2015149466A; JP6210926B2; KR20150091853A; CN104821232B

Abstract

Provided are a composite electronic component and a board equipped with the composite electronic component. The composite electronic component comprises a composite main body, an input terminal, output terminals and grounding terminals. The composite main body comprises a combined body of a capacitor formed by a ceramic main body and an inductor formed by a magnetic main body comprising a coil unit, and a plurality of dielectric layers, a first inner electrode and a second inner electrode are stacked in the capacitor. The input terminal is formed on the first end surface of the composite main body. The output terminals comprise a first output end formed on the second end surface of the composite main body and a second output terminal formed on the second output end surface of the composite main body. The grounding terminals are formed on one or more surfaces of the upper surface, the lower surface and the first end surface of the capacitor of the composite main body. The capacitor is combined with the side surface of the inductor and a magnetic sheet layer is arranged between the inductor and the capacitor.

Description

Combined electronical assembly and the plate being provided with combined electronical assembly

This application claims the rights and interests of the 10-2014-0012594 korean patent application submitted in Korean Intellectual Property Office on February 4th, 2014, the open of this application is contained in this by reference.

Technical field

The disclosure relates to and a kind ofly comprises the combined electronical assembly of multiple passive component and a kind of plate being provided with combined electronical assembly.

Background technology

Recently, electronic installation is miniaturized its function aspects still needs diversified while, is formed gentlier, thinner, shorter and less to allow product, keeps high-caliber performance simultaneously.

In order to meet various demand for services, electronic installation has to bear and effectively controls and manage limited battery to charge the power management integrated circuits (PMIC) based on power semiconductor of function of resource.

But the configuration of various function may cause the quantity of the passive component be arranged in the power input terminals of PMIC and power output terminal being increased of the quantity of the DC/DC transducer be arranged in PMIC and needs in an electronic.

In this case, inevitably increase the region of the assembly for arranging electronic installation, this causes obstacle to the miniaturization of electronic installation.

In addition, the wiring pattern of PMIC can produce a large amount of noises with its peripheral circuit.

In order to solve the problem, have studied the combined electronical assembly comprising inductor and the capacitor combined between the higher and lower levels, to obtain reducing the assembly layout region of electronic installation and the effect of restraint speckle generation.

But when inductor setting up and down and capacitor, the magnetic flux produced by inductor may affect electrode in capacitor, to produce parasitic capacitance, makes self-resonant frequency (SRF) move towards lower frequency side.

Meanwhile, the size of combined electronical assembly reduces the thickness reduction of the inner magnetosphere in the magnetic field caused for preventing inductor, and this causes the deterioration of quality factor (Q factor).

[relate art literature]

(patent documentation 1) 2003-0014586 Korea Patent Laid is open

Summary of the invention

One side of the present disclosure can provide a kind of in driving power supply system, have the combined electronical assembly of the assembly installation region of reduction and a kind of plate for installing this combined electronical assembly.

One side of the present disclosure can also provide a kind of can the combined electronical assembly of the generation of restraint speckle in driving power supply system and a kind of plate for installing this combined electronical assembly.

According to one side of the present disclosure, a kind of combined electronical assembly can comprise: composite host, comprise the combination of the capacitor formed by ceramic main body and the inductor formed by the magnetic body comprising coil unit, wherein, in multiple dielectric layer, first electrode and the second inner electrode in the capacitor stacked, in first, electrode and the second inner electrode are arranged to facing with each other and make dielectric layer be arranged in first between electrode and the second inner electrode; Input terminal, the first end being formed in composite host is on the surface and be connected to the coil unit of inductor; Lead-out terminal, comprise be formed in composite host the second end surfaces on and on the first lead-out terminal being connected to the coil unit of inductor and the second end surfaces being formed in composite host and be connected to capacitor first in the second lead-out terminal of electrode; And earth terminal, be formed in the upper surface of the capacitor of composite host, lower surface and first end surface one or more on the surface and be connected to the second inner electrode of capacitor, wherein, capacitor is combined with the side of inductor, and magnetic sheet layer is arranged between inductor and capacitor.

Magnetic body can be constructed by stacked multiple magnetosphere it being formed with respectively conductive pattern, and conductive pattern can form coil unit.

Inductor can be that magnetic body comprises dielectric base and is formed in the film-type inductor of the coil at least one surface of dielectric base.

Magnetic body can comprise iron core and the winding coil around coiling iron core.

Magnetic sheet layer can comprise the Magnaglo of one or more types selected from the group be made up of ferrite particles and metallic magnetic powder, and ferrite particles has 15 μm or less average grain diameter.

Adhesion layer can be formed on the both sides of magnetic sheet layer further.

According to another aspect of the present disclosure, a kind of combined electronical assembly can comprise: composite host, comprise the first capacitor formed by ceramic main body, second capacitor and the combination of inductor formed by the magnetic body comprising coil unit, wherein, multiple dielectric layer, in first, electrode and the second inner electrode are layered in the first capacitor, in first, electrode and the second inner electrode are arranged to facing with each other and make dielectric layer be arranged in first between electrode and the second inner electrode, multiple dielectric layer, in 3rd, electrode and the 4th inner electrode layer are stacked in the second capacitor, in 3rd, in electrode and the 4th, electrode is arranged to facing with each other and makes dielectric layer be arranged in the 3rd in electrode and the 4th between electrode, input terminal, comprise be formed in composite host first end on the surface and first input end being connected to the coil unit of inductor and be formed in composite host first end on the surface and be connected to the first capacitor first in the second input terminal of electrode, lead-out terminal, comprise be formed in composite host the second end surfaces on and the first lead-out terminal being connected to the coil unit of inductor and be formed in composite host first end on the surface and be connected to the second capacitor the 3rd in the second lead-out terminal of electrode, earth terminal, comprise be formed in composite host the second end surfaces on and on the first earth terminal being connected to the second inner electrode of the first capacitor and the second end surfaces being formed in composite host and be connected to the second capacitor the 4th in the second earth terminal of electrode, wherein, first capacitor and the second capacitor are combined with two sides of inductor, and magnetic sheet layer is arranged between inductor and the first capacitor and between inductor and the second capacitor.

According to another aspect of the present disclosure, a kind of combined electronical assembly can comprise: composite host, comprise the combination of the capacitor formed by ceramic main body and the inductor formed by the magnetic body comprising coil unit, wherein, in multiple dielectric layer and first, electrode is folded in the capacitor to the 3rd inner electrode layer, and in first, in electrode to the 3rd, electrode is set to facing with each other and dielectric layer is arranged between which; Input terminal, comprise be formed in composite host first end on the surface and first input end being connected to the coil unit of inductor and be formed in composite host first end on the surface and be connected to capacitor first in the second input terminal of electrode; Lead-out terminal, comprise be formed in composite host the second end surfaces on and on the first lead-out terminal being connected to the coil unit of inductor and the second end surfaces being formed in composite host and be connected to capacitor the 3rd in the second lead-out terminal of electrode; And earth terminal, be formed in the upper surface of the capacitor of composite host, lower surface and the first side surface one or more on the surface and be connected to the second inner electrode of capacitor, wherein, capacitor is combined with the side of inductor, and magnetic sheet layer is arranged between inductor and capacitor.

In first, electrode can have the lead division on the first end surface being exposed to composite host respectively, the second inner electrode can have the lead division of the first side surface being exposed to composite host respectively, and in the 3rd, electrode can have the lead division being exposed to the second end surfaces respectively.

According to another aspect of the present disclosure, a kind of combined electronical assembly can comprise: composite host, comprise the first capacitor formed by ceramic main body, the second capacitor formed by ceramic main body and the combination of inductor formed by the magnetic body comprising coil unit, wherein, in multiple dielectric layer and first, electrode is stacked in the first capacitor to the 3rd inner electrode layer, in first, in electrode to the 3rd, electrode is arranged to facing with each other and dielectric layer is arranged between which, in multiple dielectric layer and the 4th, electrode is stacked in the second capacitor to the 6th inner electrode layer, in 4th, in electrode to the 6th, electrode is arranged to facing with each other and dielectric layer is arranged between which, input terminal, comprise be formed in composite host first end on the surface and first input end being connected to the coil unit of the first inductor, be formed in composite host first end on the surface and the second input terminal being connected to the coil unit of the second inductor, be formed in composite host first end on the surface and be connected to the first capacitor first in electrode the 3rd input terminal and be formed in composite host first end on the surface and be connected to the second capacitor the 4th in four-input terminal of electrode, lead-out terminal, comprise be formed in composite host the second end surfaces on and the first lead-out terminal being connected to the coil unit of the first inductor, be formed in composite host the second end surfaces on and the second lead-out terminal being connected to the coil unit of the second inductor, be formed in composite host the second end surfaces on and be connected to the first capacitor the 3rd in electrode the 3rd lead-out terminal and be formed in composite host the second end surfaces on and be connected to the second capacitor the 6th in the 4th lead-out terminal of electrode, and earth terminal, comprise the first earth terminal and the second earth terminal, wherein, first earth terminal is formed in the upper surface of the first capacitor of composite host, in lower surface and the first side surface one or more on the surface and be connected to the second inner electrode of the first capacitor, second earth terminal is formed in the upper surface of the second capacitor of composite host, in lower surface and the second side surface one or more on the surface and be connected to the second capacitor the 5th in electrode, wherein, first inductor and the second inductor are continuous print, first capacitor is combined with the side of the first inductor, second capacitor is combined with the side of the second inductor, magnetic sheet layer is arranged between the first inductor and the first capacitor and between the second inductor and the second capacitor.

According to another aspect of the present disclosure, a kind of combined electronical assembly can comprise: input terminal, receives the power after from the conversion of power management block; The steady unit of power, make power steadily and comprise composite host, composite host comprises the combination of the capacitor formed by ceramic main body and the inductor formed by the magnetic body comprising coil unit, wherein, in multiple dielectric layer, first electrode and the second inner electrode in the capacitor stacked, in first, electrode and the second inner electrode are arranged to facing with each other and make dielectric layer be arranged in first between electrode and the second inner electrode, capacitor is combined with the side of inductor, and magnetic sheet layer is arranged between inductor and capacitor; Lead-out terminal, the power after supply steadily; And earth terminal, for ground connection.

Input terminal can be formed in the first end of composite host on the surface, lead-out terminal can comprise be formed in composite host the second end surfaces on and on the first lead-out terminal being connected to the coil unit of inductor and the second end surfaces being formed in composite host and be connected to capacitor first in the second lead-out terminal of electrode, earth terminal can be formed in the upper surface of the capacitor of composite host, lower surface and first end surface one or more on the surface and be connected to the second inner electrode of capacitor.

Adhesion layer can be formed on the both sides of magnetic sheet layer further.

According to another aspect of the present disclosure, a kind of plate it being provided with combined electronical assembly can comprise: printed circuit board (PCB) (PCB), the upper surface of printed circuit board (PCB) is formed and has three or more electrode pads; Be arranged on the combined electronical assembly on PCB; And solder, connecting electrode pad and combined electronical assembly.

Accompanying drawing explanation

By the detailed description of carrying out below in conjunction with accompanying drawing, above and other aspect of the present disclosure, other advantages of characteristic sum will more be clearly understood, in the accompanying drawings:

Fig. 1 is the perspective view of the combined electronical assembly schematically shown according to exemplary embodiment of the present disclosure;

Fig. 2 is the perspective view of the inside of the combined electronical assembly of the Fig. 1 schematically shown according to the first exemplary embodiment of the present disclosure;

Fig. 3 is the perspective view of the inside of the combined electronical assembly of the Fig. 1 schematically shown according to the second exemplary embodiment of the present disclosure;

Fig. 4 is the perspective view of the inside of the combined electronical assembly of the Fig. 1 schematically shown according to the 3rd exemplary embodiment of the present disclosure;

Fig. 5 is the plane graph that the interior electrode that can be used in multilayer ceramic capacitor is shown, multilayer ceramic capacitor is included in combined electronical assembly shown in Figure 1;

Fig. 6 is the equivalent circuit diagram of combined electronical assembly shown in Figure 1;

Fig. 7 is the perspective view of the combined electronical assembly schematically shown according to another exemplary embodiment of the present disclosure;

Fig. 8 is the plane graph that the interior electrode that can be used in multilayer ceramic capacitor is shown, multilayer ceramic capacitor is included in combined electronical assembly shown in Figure 7;

Fig. 9 is the equivalent circuit diagram of combined electronical assembly shown in Figure 7;

Figure 10 is the perspective view of the combined electronical assembly schematically shown according to another exemplary embodiment of the present disclosure;

Figure 11 is the plane graph that the interior electrode that can be used in multilayer ceramic capacitor is shown, multilayer ceramic capacitor is included in combined electronical assembly shown in Figure 10;

Figure 12 is the equivalent circuit diagram of combined electronical assembly shown in Figure 9;

Figure 13 is the perspective view of the combined electronical assembly schematically shown according to another exemplary embodiment of the present disclosure;

Figure 14 is the plane graph that the interior electrode that can be used in multilayer ceramic capacitor is shown, multilayer ceramic capacitor is included in combined electronical assembly shown in Figure 13;

Figure 15 is the equivalent circuit diagram of combined electronical assembly shown in Figure 13;

Figure 16 be illustrate according to exemplary embodiment of the present disclosure by battery and power management block to the diagram of driving power supply system of predetermined terminal supply driving power needing driving power;

Figure 17 is the diagram of the layout patterns that driving power supply system is shown;

Figure 18 is the circuit diagram of the combined electronical assembly according to exemplary embodiment of the present disclosure;

Figure 19 is the diagram of the layout patterns of the driving power supply system of the application combined electronical assembly illustrated according to exemplary embodiment of the present disclosure;

Figure 20 is the perspective view of the installation combined electronical assembly on a printed circuit that Fig. 1 is shown;

Figure 21 is the curve chart of the change of the self-resonant frequency (SRF) illustrated according to embodiment example and comparative examples; And

Figure 22 is the curve chart of the change of the quality factor (Q factor) illustrated according to embodiment example and comparative examples.

Embodiment

Hereinafter, exemplary embodiment of the present disclosure is described with reference to the accompanying drawings in detail.

But the disclosure can illustrate in many different forms, and should not be interpreted as being limited to the specific embodiment of setting forth here.On the contrary, provide these embodiments to make the disclosure to be thoroughly with complete, and these embodiments will pass on the scope of the present disclosure fully to those skilled in the art.

In the accompanying drawings, for clarity sake can exaggerate the shape and size of element, identical Reference numeral will be used for representing same or analogous element all the time.

combined electronical assembly

Hereinafter, with reference to the accompanying drawings exemplary embodiment of the present disclosure is described.

Fig. 1 is the perspective view of the combined electronical assembly schematically shown according to exemplary embodiment of the present disclosure.

Fig. 2 is the perspective view of the inside of the combined electronical assembly of the Fig. 1 schematically shown according to the first exemplary embodiment of the present disclosure.

Fig. 3 is the perspective view of the inside of the combined electronical assembly of the Fig. 1 schematically shown according to the second exemplary embodiment of the present disclosure.

Fig. 4 is the perspective view of the inside of the combined electronical assembly of the Fig. 1 schematically shown according to the 3rd exemplary embodiment of the present disclosure.

Fig. 5 is the plane graph that the interior electrode that can be used in multilayer ceramic capacitor is shown, multilayer ceramic capacitor is included in combined electronical assembly shown in Figure 1.

With reference to Fig. 1, according in the combined electronical assembly of exemplary embodiment of the present disclosure, as depicted in figure 1, " length direction " is defined as " L ", " Width " is defined as " W ", " thickness direction " is defined as " T ".Here, " thickness direction " can as having the implication identical with " stacked direction " on the dielectric layer of capacitor stacked institute edge.

Meanwhile, as described below, define, length direction, the Width of the length direction of combined electronical assembly, Width and thickness direction and capacitor and inductor are identical with thickness direction.

In addition, in an exemplary embodiment of the disclosure, combined electronical assembly can have upper surface respect to one another and lower surface and be connected the first side surface of upper surface and lower surface and the second side surface and first end surface and the second end surfaces.The shape of combined electronical assembly is not particularly limited, and as shown, combined electronical assembly can have hexahedral shape.

In addition, the first side surface and second side surface of combined electronical assembly and first end surface and the second end surfaces by be defined as in a same direction with the first side surface of capacitor and inductor and the second side surface and first end surperficial identical with the second end surfaces.

Simultaneously, combined electronical assembly is the combination of capacitor and inductor, on the top that capacitor is combined in inductor, the upper surface of combined electronical assembly can be defined as the upper surface of capacitor, and the lower surface of combined electronical assembly can be defined as the lower surface of inductor.

On the contrary, on the top that inductor is combined in capacitor, the upper surface of combined electronical assembly can be defined as the upper surface of inductor, and the lower surface of combined electronical assembly can be defined as the lower surface of capacitor.

In addition, first side surface and the second side surface correspond to the surfaces opposite to each other in the direction of the width of combined electronical assembly, first end surface and the second end surfaces correspond to the surfaces opposite to each other in the longitudinal direction of combined electronical assembly, and upper surface and lower surface correspond to the surfaces opposite to each other in a thickness direction of combined electronical assembly.

Referring to figs. 1 through Fig. 3, combined electronical assembly 100 according to exemplary embodiment of the present disclosure comprises: composite host 130, comprise the combination of capacitor 110 and inductor 120, wherein, capacitor 110 is layered in wherein by electrode 31 and the second inner electrode 32 in multiple dielectric layer 11 and first, make interior electrode be set to facing with each other and make dielectric layer 11 be arranged on ceramic main body between interior electrode to be formed, inductor 120 is formed by the magnetic body comprising coil unit 140.

In the present example embodiment, composite host 130 has upper surface respect to one another and lower surface and is connected the first side surface of upper surface and lower surface and the second side surface and first end surface and the second end surfaces.

Composite host 130 can have hexahedral shape as shown, but the disclosure is not limited thereto.

According to exemplary embodiment of the present disclosure, capacitor 110 can be combined with the side of inductor 120.But the disclosure is not limited thereto, capacitor 110 and inductor 120 can be set differently.

In addition, according to exemplary embodiment of the present disclosure, magnetic sheet layer 121 can be arranged between inductor 120 and capacitor 110.

Magnetic sheet layer 121 can comprise the Magnaglo of one or more types selected from the group be made up of ferrite particles and metallic magnetic powder, and wherein, ferrite particles has 15 μm or less average grain diameter.

Adhesion layer 121 ' can be formed on the both sides of magnetic sheet layer 121 further.

Composite host 130 can be formed by making capacitor 110 and inductor 120 combine, and the method forming composite host 130 is not particularly limited.

Such as, in the step forming composite host 130, magnetic sheet layer 121 can be arranged on manufacture separately between capacitor 110 and inductor 120, to make capacitor 110 and inductor 120 combine on the both sides that adhesion layer 121 ' can be formed in magnetic sheet layer 121.

Particularly, attachment of polymers agent can be comprised for the adhesion layer 121 ' making capacitor 110 and inductor 120 combine, such as, epoxy resin, but the disclosure is not limited thereto.

Magnaglo can be select from the group be made up of ferrite and metallic magnetic powder one or more of, but the disclosure is not limited thereto, and can use any material, as long as it has magnetic.

Such as, the average grain diameter of Magnaglo can be 15 μm or less, but the present invention is not limited thereto.

According to exemplary embodiment of the present disclosure, capacitor 110 can be combined with the side of inductor 120, because magnetic sheet layer 121 is arranged between inductor 120 and capacitor 110, therefore can interrupt the impact of outside terminal because of screen effect, thus prevent the deterioration of the electrical characteristics of combined electronical assembly.

In detail, capacitor 110 can be combined with the side of inductor 120, and inductor can minimize the impact of electrode in capacitor, thus prevents self-resonant frequency (SRF) from changing and prevent the deterioration of the Q factor of assembly.

In addition, because magnetic sheet layer is arranged between inductor 120 and capacitor 110, therefore can interrupt the impact of outside terminal because of screen effect, thus prevent the deterioration of the electrical characteristics of combined electronical assembly.

If the average grain diameter of magnetic powder particles is more than 15 μm, then the particle diameter of magnetic powder particles is too large, the density of Magnaglo is reduced, thus reduces screen effect.

The method utilizing adhesion layer 121 ' that capacitor 110 and inductor 120 are combined is not particularly limited, and adhesion layer 121 ' can be formed on the both sides of magnetic sheet layer 121, and is made them combine by heating to solidify.

Capacitor 110 can be combined with the side of inductor 120, by being described through in more detail, magnetic sheet layer 121 is arranged on the effect obtained between inductor 120 and capacitor 110 hereinafter.

Hereinafter, the capacitor 110 and inductor 120 that form composite host 130 will be described in detail.

According to this exemplary embodiment, the magnetic body forming inductor 120 can comprise coil unit 140.

Such as, inductor 120 can be cascade type inductor, film-type inductor or convoluted inductor, and is not particularly limited.In addition, laser engraving type inductor (laser helixing-typeinductor) etc. can also be used.

Cascade type inductor refers to the inductor by following manufacture technics, that is, by printing thick electrode on thin ferrite or glass ceramics sheet, its of stacking some layers being printed with the sheet of coil pattern, and connecting inside conductor by through hole.

Film-type inductor refers to and forms winding wire on a ceramic substrate by thin film sputtering or plating, and utilizes ferrite material to fill the inner inductor manufactured.

Convoluted inductor refers to the inductor by manufacturing around coiling iron core wire material (winding wire).

Laser engraving type inductor refers to the inductor by following manufacture technics, that is, form electrode layer by sputtering or be plated on ceramic skeleton, form coil shape by laser engraving, then coil is processed into the terminal with outer protection film resin.

With reference to Fig. 2, according in the combined electronical assembly of the first exemplary embodiment of the present disclosure, inductor 120 can be cascade type inductor.

Particularly, magnetic body can have and is wherein laminated with multiple structure respectively with the magnetosphere 21 of the conductive pattern be formed thereon, and conductive pattern forms coil unit 140.

With reference to Fig. 3, according in the combined electronical assembly of the second exemplary embodiment of the present disclosure, inductor 120 can be film-type inductor.

Particularly, inductor 120 can be that wherein magnetic body comprises dielectric base 123 and is formed in the film-type inductor of the coil at least one surface of dielectric base 123.

Magnetic body can be formed by the upper and lower being formed with coil at least one surface thereof utilizing magnet 122 to fill dielectric base 123.

With reference to Fig. 4, according in the combined electronical assembly of the 3rd exemplary embodiment of the present disclosure, inductor 120 can be convoluted inductor.

Particularly, the magnetic body of inductor 120 can comprise iron core 124 and the coil around iron core 24 winding.

With reference to Fig. 2 to Fig. 4, capacitor 110 first in electrode 31 be laminated into vertical relative to mounting surface with the second inner electrode 32, but the disclosure is not limited thereto, in first, electrode 31 and the second inner electrode 32 can be laminated into relative to mounting surface is level.

Magnetosphere 21 and magnet 122 are formed by Ni-Cu-Zn sill, Ni-Cu-Zn-Mg sill, Mn-Zn sill or ferrite base material, but the disclosure is not limited thereto.

According to exemplary embodiment, inductor 120 can be the power inductor being applicable to high electric current.

Power inductor is that the inductance change when applying DC to it changes little efficient electric sensor than the inductance of common inductor.That is, power inductor can be considered to the inductor also except the function with normal inductor with DC biasing characteristic (when applying DC voltage to it inductance change).

Namely, highly efficient power inductor (its inductance changes little highly efficient power inductor when applying DC voltage to it) can be comprised according to the combined electronical assembly be used in power management integrated circuits (PMIC) of exemplary embodiment of the present disclosure, instead of normal inductor.

Simultaneously, the ceramic main body forming capacitor 110 can be formed by stacked multiple dielectric layer 11, multiple interior electrode 31 and 32 (being sequentially electrode and the second inner electrode in first) can be arranged in ceramic main body individually, and dielectric layer to be arranged in first between electrode and the second inner electrode.

Dielectric layer 11 can be formed by sintering the ceramic green sheet comprising ceramic powders, organic solvent and organic bond.As the material of permittivity (dielectric constant) with high level, ceramic powders can by barium titanate (BaTiO ₃) sill, strontium titanates (SrTiO ₃) sill is formed, but the disclosure is not limited thereto.

Meanwhile, according to exemplary embodiment of the present disclosure, in first, electrode 31 can be exposed to the first end surface of composite host 130, and the second inner electrode 32 can be exposed to the second end surfaces of composite host 130, but the disclosure is not limited thereto.

According to exemplary embodiment of the present disclosure, in first, electrode 31 and the second inner electrode 32 can be formed by the electroconductive paste comprising conducting metal.

Conducting metal can be nickel (Ni), copper (Cu), palladium (Pd) or their alloy, but the disclosure is not limited thereto.

In first, electrode 31 and the second inner electrode 32 can be formed as follows: on each ceramic green sheet forming dielectric layer 11, print electroconductive paste by the print process of such as silk screen print method or woodburytype.

Interior electrode print ceramic green sheet thereon can be alternately stacked and fired to form ceramic main body.

In Figure 5, show the pattern form of electrode 31 and the second inner electrode 32 in first, but the disclosure is not limited thereto, in first, the pattern form of electrode 31 and the second inner electrode 32 can differently change.

Capacitor may be used for adjusting the voltage supplied by power management block (or PMIC).

Combined electronical assembly 100 according to exemplary embodiment of the present disclosure can comprise: input terminal 151, and the first end being formed in ceramic main body 130 on the surface and be connected to the coil unit 140 of inductor 120; Lead-out terminal 152, comprise be formed in composite host 130 the second end surfaces on and on the first lead-out terminal 152a being connected to the coil unit 140 of inductor 120 and the second end surfaces being formed in composite host 130 and be connected to capacitor 110 first in the second lead-out terminal 152b of electrode 31; Earth terminal 153, is formed in the upper surface of the capacitor 110 of composite host 130, lower surface and first end surface on one or more and is connected to the second inner electrode 32 of capacitor 110.

Input terminal 151 and lead-out terminal 152a can be connected to the coil unit 140 of inductor 120, to be used as the inductor in combined electronical assembly.

In addition, another lead-out terminal 152b can be connected to capacitor 110 first in electrode 31, the second inner electrode 32 of capacitor 110 can be connected to earth terminal 153 to be used as the capacitor in combined electronical assembly.

Input terminal 151, lead-out terminal 152 and earth terminal 153 can be formed by the electroconductive paste comprising conducting metal.

Conducting metal can be nickel (Ni), copper (Cu), tin (Sn) or their alloy, but the disclosure is not limited thereto.

Electroconductive paste can also comprise insulating material, and here, insulating material can be such as glass, but the disclosure is not limited thereto.

The method forming input terminal 151, lead-out terminal 152 and earth terminal 153 is not specifically limited.That is, input terminal 151, lead-out terminal 152 and earth terminal 153 can by infused ceramic main bodys or by utilizing the additive method of such as plating etc. to be formed.

Fig. 6 is the equivalent circuit diagram of combined electronical assembly shown in Figure 1.

With reference to Fig. 6, different from correlation technique, according in the combined electronical assembly of exemplary embodiment of the present disclosure, inductor 120 and capacitor 110 combine, make inductor 120 and capacitor 110 can be designed to make the distance between them the shortest, therefore noise decrease.

In addition, because inductor 120 and capacitor 110 combine, the installation region in power management block therefore can be made to minimize, thus advantageously guarantee installing space.

In addition, installation cost can be reduced.

Meanwhile, owing to being provided with various function in an electronic, the quantity being therefore arranged on the DC/DC transducer in PMIC increases, and the quantity needing to be arranged on the passive component in the power input terminals of PMIC and power output terminal also increases.

In addition, the wiring pattern of PMIC and peripheral circuit thereof produce a large amount of noises.

In order to solve the problem, have studied the combined electronical assembly of combine between the higher and lower levels inductor and capacitor, and obtain the layout area of the assembly reducing electronic installation and the effect of restraint speckle generation.

But when inductor setting up and down and capacitor as described above, the magnetic flux that inductor produces may affect the interior electrode of capacitor and produce parasitic capacitance, makes self-resonant frequency (SRF) move towards low frequency.

When self-resonant frequency (SRF) moves towards low frequency as described above, the available frequency range of inductor may narrow in an exemplary embodiment of the disclosure.

That is, the function of inductor can not be performed in the high-frequency range higher than self-resonant frequency (SRF), therefore, if SRF moves towards low frequency, then may limit available frequency range.

But, according to exemplary embodiment of the present disclosure, because the side of capacitor 110 with inductor 120 is combined, the magnetic flux produced by inductor therefore can be made to minimize the impact of electrode in capacitor, change to prevent self-resonant frequency (SRF).

That is, according to exemplary embodiment of the present disclosure, inductor 120 and capacitor 110 can be designed in the shortest distance, thus are not limited the effect of the scope of the inductor that can use in low frequency and the effect of noise decrease by preventing SRF from changing.

Meanwhile, minimized combined electronical assembly makes to prevent the inner magnetosphere in the magnetic field of inductor thinner, causes quality factor (Q factor) deterioration.

Q factor is the deterioration of finger device loss or efficiency, when Q factor is higher, can mean that loss is little and efficiency is high.

That is, according to exemplary embodiment of the present disclosure, because capacitor 110 is attached to the side of inductor 120, each assembly therefore can be made to minimize impact each other, therefore prevent the Q factor deterioration of assembly.

In the step forming composite host 130, between the capacitor 110 that magnetic sheet layer 121 can be arranged on manufacture separately and inductor 120, to make capacitor 110 and inductor 120 combine on two sides that adhesion layer 121 ' can be formed in magnetic sheet layer 121, but the disclosure is not limited thereto.

According to exemplary embodiment of the present disclosure, capacitor 110 can be combined with the side of inductor 120, because magnetic sheet layer 121 is arranged between inductor 120 and capacitor 110, therefore the interference of outside terminal can be interrupted because of screen effect, thus prevents the deterioration of the electrical characteristics of combined electronical assembly.

Particularly, because magnetic sheet layer 121 is arranged between inductor 120 and capacitor 110, therefore obtain the magnetic flux that prevents from being produced by the inductor screen effect to the outside terminal of capacitor and interior electrode, thus prevent the deterioration of the electrical characteristics of combined electronical assembly.

That is, the magnetic flux produced by inductor can be made to minimize the impact of electrode in capacitor, to obtain the excellent effect preventing self-resonant frequency (SRF) from changing.

In addition, the outside terminal due to inductor can be prevented to be set to be close to the outside terminal of capacitor and interior electrode and the deterioration of issuable electrical characteristics, to make each assembly minimize impact each other, thus reliably prevent the deterioration of the Q factor of assembly further.

Fig. 7 is the perspective view of the combined electronical assembly schematically shown according to another exemplary embodiment of the present disclosure.

Fig. 8 is the plane graph that the interior electrode that can be used in multilayer ceramic capacitor is shown, multilayer ceramic capacitor is included in combined electronical assembly shown in Figure 7.

Fig. 9 is the equivalent circuit diagram of combined electronical assembly shown in Figure 7.

With reference to Fig. 7 to Fig. 9, combined electronical assembly according to another exemplary embodiment of the present disclosure can comprise: composite host 230, comprise the first capacitor 210a formed by ceramic main body, second capacitor 210b and the combination of inductor 220 formed by the magnetic body comprising coil unit, wherein, multiple dielectric layer 211, in first, electrode 231 and the second inner electrode 232 are layered in the first capacitor 210a, in first, electrode 231 and the second inner electrode 232 are arranged to facing with each other and make dielectric layer 211 be arranged in first between electrode 231 and the second inner electrode 232, multiple dielectric layer 211, in 3rd, in electrode 233 and the 4th, electrode 234 is layered in the second capacitor 210b, in 3rd, in electrode 233 and the 4th, electrode 234 is arranged to facing with each other and makes dielectric layer 211 be arranged in the 3rd in electrode 233 and the 4th between electrode 234, input terminal 251, comprise be formed in composite host 230 first end on the surface and the sub-251a of first input end being connected to the coil unit of inductor 220 and be formed in composite host 230 first end on the surface and be connected to the first capacitor 210a first in the second input terminal 251b of electrode 231, lead-out terminal 252, comprise be formed in composite host 230 the second end surfaces on and the first lead-out terminal 252a being connected to the coil unit of inductor 220 and be formed in composite host 230 first end on the surface and be connected to the second capacitor 210b the 3rd in the second lead-out terminal 252b of electrode 233, earth terminal 253, comprise be formed in composite host 230 the second end surfaces on and on the first earth terminal 253a being connected to the second inner electrode 232 of the first capacitor 210a and the second end surfaces being formed in composite host 230 and be connected to the second capacitor 210b the 4th in the second earth terminal 253b of electrode 234, wherein, first capacitor 210a and the second capacitor 210b is combined with two sides of inductor 220, and magnetic sheet layer 221 can be arranged between inductor 220 and the first capacitor 210a and between inductor 220 and the second capacitor 210b.

Tectonomagnetism main body can be carried out by stacked multiple magnetosphere it respectively with conductive pattern.

Inductor 220 can be that magnetic body comprises dielectric base and is formed in the film-type inductor of the coil at least one surface of dielectric base.

Magnetic sheet layer 221 can comprise the Magnaglo of one or more types selected from the group be made up of ferrite particles and metallic magnetic powder, and wherein, ferrite particles has 15 μm or less average grain diameter.

Adhesion layer 221 ' can be formed on the both sides of magnetic sheet layer 221 further.

With reference to Fig. 9, according to another exemplary embodiment of the present disclosure, the first capacitor 210a can be formed in the capacitor between the splicing ear of battery and power management block (or PMIC) and ground.

Capacitor 210a can reduce to be included in the noise in the first power.

In addition, capacitor 210a can be filled with electric charge.When a large amount of electric current of power management block (or PMIC) instantaneous consumption, capacitor 210a can discharge charged electric charge to suppress the voltage fluctuation in power management block.

Simultaneously, similar to the capacitor 110 of the combined electronical assembly according to exemplary embodiment above as above, the second capacitor 210b can be formed in the capacitor between the splicing ear of power management block (or PMIC) and lead-out terminal Vdd and ground.

Second capacitor 210b can reduce to be included in the noise the second power exported from power management block (or PMIC).

When composite host 230 is installed onboard, on the first earth terminal 253a being connected to the second inner electrode of the first capacitor 210a and the second end surfaces being formed in composite host 230 and be connected to the second capacitor 210b the 4th in the second earth terminal 253b of electrode can be connected to electrode pad, thus as described below along a direction ground connection.

Other features of this exemplary embodiment are identical with the feature of the combined electronical assembly according to exemplary embodiment above, therefore will omit its description to avoid redundancy.

Figure 10 is the perspective view of the combined electronical assembly schematically shown according to another exemplary embodiment of the present disclosure.

Figure 11 is the plane graph that the interior electrode that can be used in multilayer ceramic capacitor is shown, multilayer ceramic capacitor is included in combined electronical assembly shown in Figure 10.

Figure 12 is the equivalent circuit diagram of combined electronical assembly shown in Figure 9.

With reference to Figure 10 to Figure 12, combined electronical assembly according to another exemplary embodiment of the present disclosure can comprise: composite host 330, comprise the combination of the capacitor 310 formed by ceramic main body and the inductor 320 formed by the magnetic body comprising coil unit, wherein, in multiple dielectric layer 311 and first, in electrode 331, the second inner electrode 332 and the 3rd, electrode 333 is layered in capacitor 310, and in first, in electrode 331, the second inner electrode 332 and the 3rd, electrode 333 is set to facing with each other and makes dielectric layer 311 arrange between which; Input terminal 351, comprise be formed in composite host 330 first end on the surface and the sub-351a of first input end being connected to the coil unit of inductor 320 and be formed in composite host 330 first end on the surface and be connected to capacitor 310 first in the second input terminal 351b of electrode 331; Lead-out terminal 352, comprise be formed in composite host 330 the second end surfaces on and on the first lead-out terminal 352a being connected to the coil unit of inductor 320 and the second end surfaces being formed in composite host 330 and be connected to capacitor 310 the 3rd in the second lead-out terminal 352b of electrode; And earth terminal 353, be formed in the upper surface of the capacitor 310 of composite host, lower surface and the first side surface one or more on the surface and be connected to the second inner electrode 332 of capacitor 310, wherein, capacitor 310 can be combined with the side of inductor 320, and magnetic sheet layer 321 can be arranged between inductor 320 and capacitor 310.

Can carry out tectonomagnetism main body by stacked multiple magnetosphere it being formed with respectively conductive pattern, conductive pattern can form coil unit.

Magnetic sheet layer 321 can comprise the Magnaglo of one or more types selected from the group be made up of ferrite particles and metallic magnetic powder, and wherein, ferrite particles has 15 μm or less average grain diameter.

Adhesion layer 321' can be formed on the both sides of magnetic sheet layer 321 further.

With reference to Figure 11, in first, electrode 331 can have the lead division 331a on the first end surface being exposed to composite host 330, the second inner electrode 332 can have the lead division 332a of the first side surface being exposed to composite host 330, and in the 3rd, electrode 333 can have the lead division 333a of the second end surfaces being exposed to composite host 330.

With reference to Figure 11, according to this exemplary embodiment, in capacitor 310, in first, electrode 331 and the second inner electrode 332 can form the first capacitor unit, as described hereinafter, the first capacitor unit can be formed in the capacitor between the splicing ear of battery and power management block (or PMIC) and ground.

That is, the first capacitor unit can reduce to be included in the noise in the first power.

In addition, the first capacitor unit can be filled with electric charge.When a large amount of electric current of power management block (or PMIC) instantaneous consumption, the first capacitor unit can discharge charged electric charge to suppress the voltage fluctuation in power management block.

Simultaneously, in capacitor 310, in the second inner electrode 332 and the 3rd, electrode 333 can form the second capacitor unit, here, the capacitor 110 of the combined electronical assembly of the exemplary embodiment before as above with basis is identical, and the second capacitor unit can be formed in the capacitor between the splicing ear of lead-out terminal Vdd and power management block (or PMIC) and ground.

Second capacitor unit can reduce to be included in the noise the second power exported from power management block (or PMIC).

The second inner electrode 332 can form the first capacitor unit and the second capacitor unit respectively, and can be connected to the earth terminal 353 be formed on the first side surface of composite host 330, thus along a direction ground connection.

Figure 13 is the perspective view of the combined electronical assembly schematically shown according to another exemplary embodiment of the present disclosure.

Figure 14 is the plane graph that the interior electrode that can be used in multilayer ceramic capacitor is shown, multilayer ceramic capacitor is included in combined electronical assembly shown in Figure 13.

Figure 15 is the equivalent circuit diagram of combined electronical assembly shown in Figure 13.

With reference to Figure 13 to Figure 15, combined electronical assembly according to another exemplary embodiment of the present disclosure can comprise: composite host 430, comprise the first capacitor 410a formed by ceramic main body, the combination of the second capacitor 410b formed by ceramic main body and the first inductor 420a formed by the magnetic body comprising coil unit and the second inductor 420b, wherein, electrode 431 in multiple dielectric layer 411 and first, in the second inner electrode 432 and the 3rd, electrode 433 is layered in the first capacitor 410a, in first, in electrode 431 to the 3rd, electrode 433 is arranged to facing with each other, and dielectric layer 411 arranges between which, electrode 434 in multiple dielectric layer 411 and the 4th, in 5th, in electrode 435 and the 6th, electrode 436 is layered in the second capacitor 410b, in 4th, in electrode 434 to the 6th, electrode 436 is arranged to facing with each other, and dielectric layer is arranged between which, input terminal 451, comprise be formed in composite host 430 first end on the surface and be connected to the sub-451a of first input end of the coil unit of the first inductor 420a, the first end being formed in composite host 430 on the surface and be connected to the second input terminal 451b of the coil unit of the second inductor 420b, the first end being formed in composite host 430 on the surface and be connected to the first capacitor 410a first in the 3rd input terminal 451c of electrode 431, and the first end being formed in composite host 430 on the surface and be connected to the second capacitor 410b the 4th in the sub-451d of four-input terminal of electrode 434, lead-out terminal 452, comprise be formed in composite host 430 the second end surfaces on and be connected to the first lead-out terminal 452a of the coil unit of the first inductor 420a, on the second end surfaces being formed in composite host 430 and the second lead-out terminal 452b being connected to the coil unit of the second inductor 420b be formed in composite host 430 the second end surfaces on and be connected to the first capacitor 410a the 3rd in electrode 433 the 3rd lead-out terminal 452c and be formed in composite host 430 the second end surfaces on and be connected to the second capacitor 410b the 6th in the 4th lead-out terminal 452d of electrode 436, earth terminal 453, comprise the first earth terminal 453a and the second earth terminal 453b, wherein, first earth terminal 453a is formed in the upper surface of the first capacitor 410a of composite host 430, in lower surface and the first side surface one or more on the surface and be connected to the second inner electrode 432 of the first capacitor 410a, second earth terminal 453b is formed in the upper surface of the second capacitor 410b of composite host 430, in lower surface and the second side surface one or more on the surface and be connected to the second capacitor 410b the 5th in electrode 435, wherein, first inductor 420a and the second inductor 420b is continuous print, first capacitor 410a is combined with the side of the first inductor 420a, second capacitor 410b is combined with the side of the second inductor 420b, magnetic sheet layer 421 can be arranged between the first inductor 420a and the first capacitor 410a and between the second inductor 420b and the second capacitor 410b.

Magnetic sheet layer 421 can comprise the Magnaglo of one or more types selected from the group be made up of ferrite particles and metallic magnetic powder, and wherein, ferrite particles has 15 μm or less average grain diameter.

Adhesion layer 421 ' can be formed on the both sides of magnetic sheet layer 421 further.

With reference to Figure 14, in first, electrode 431 can have the lead division 431a on the first end surface being exposed to composite host 430, the second inner electrode 432 can have the lead division 432a of the first side surface being exposed to composite host 430, and in the 3rd, electrode 433 can have the lead division 433a of the second end surfaces being exposed to composite host 430.

Similarly, in 4th, electrode 434 can have the lead division 434a on the first end surface being exposed to composite host 430, in 5th, electrode 435 can have the lead division 435a of the second side surface being exposed to composite host 430, and in the 6th, electrode 436 can have the lead division 436a of the second end surfaces being exposed to composite host 430.

With reference to Figure 15, according to this exemplary embodiment, in the first capacitor 410a, in first, electrode 431 and the second inner electrode 432 can form the first capacitor unit, as described below, the first capacitor unit can be formed in the capacitor between the splicing ear of battery and power management block (or PMIC) and ground.

Simultaneously, in the first capacitor 410a, in the second inner electrode 432 and the 3rd, electrode 433 can form the second capacitor unit, here, the capacitor 110 of the combined electronical assembly of the exemplary embodiment before as above with basis is identical, and the second capacitor unit can be formed in the capacitor between the splicing ear of lead-out terminal Vdd and power management block (or PMIC) and ground.

In the first capacitor 410a, the second inner electrode 432 can form the first capacitor unit and the second capacitor unit respectively, and can be connected to the first earth terminal 453a be formed on the first side surface of composite host 430, thus along a direction ground connection.

In the second capacitor 410b, in the 4th, in electrode to the 6th, electrode 434,435 is identical with 433 roles with electrode 431,432 in electrode in first to the 3rd with 436 roles, therefore will omit the description to it.

Figure 16 be illustrate according to exemplary embodiment of the present disclosure by battery and power management block to the diagram of driving power supply system of predetermined terminal supply driving power needing driving power.

With reference to Figure 16, driving power supply system can comprise the steady unit of battery 300, first power 400, power management block 500 (power management integrated circuits (PMIC)) and the steady unit 600 of the second power.

Power can be supplied to power management block 500 by battery 300.Here, the power being fed to power management block 500 by battery 300 is defined as the first power V1.

The steady unit 400 of first power can make the first power V1 steady, and the first power is steadily supplied to power management block 500.Particularly, the steady unit 400 of the first power can comprise the capacitor C1 between splicing ear and ground being formed in and connecting battery 300 and power management block 500.Capacitor C1 can reduce to be included in the noise in the first power.

In addition, capacitor C1 can be filled with electric charge.When a large amount of electric current of the instantaneous consumption of power management block 500, capacitor C1 can make charged electric charge be released, thus suppresses the voltage fluctuation in power management block 500.

Capacitor C1 can be the capacitor having high capacitance and comprise 300 or more dielectric layers.

Power management block 500 for becoming to be suitable for the form of this electronic installation by the power transfer being incorporated into electronic installation, and is distributed power, is filled with power and controls power.Therefore, usually, power management block 500 can comprise DC/DC transducer.

In addition, power management block 500 can be implemented as power management integrated circuits (PMIC).

First power V1 can be converted to the second power V2 by power management block 500.Second power V2 can be the lead-out terminal that is connected to power management block 500 with the power needed for the active element receiving the such as IC of driving power etc.

The steady unit 600 of second power can make the second power V2 steady, and the second power after steadily can be supplied to lead-out terminal Vdd.The active element providing the such as IC of the driving power from power management block 500 etc. can be connected to lead-out terminal Vdd.

Particularly, the steady unit 600 of the second power can comprise the inductor L1 be connected in series between power management block 500 and lead-out terminal Vdd.In addition, the steady unit 600 of the second power can comprise the capacitor C2 between splicing ear and ground being formed in power management block 500 and lead-out terminal Vdd.

The steady unit 600 of second power can reduce to be included in the noise in the second power V2.

In addition, power stability can be supplied to lead-out terminal Vdd by the steady unit 600 of the second power.

Inductor L1 can be the power inductor being applicable to high electric current.

Power inductor can be that its inductance changes ground and changes few efficient electric sensor than the inductance of normal inductor when applying DC voltage to it.That is, power inductor can be considered to the inductor also except the function of normal inductor with DC biasing characteristic (being included in inductance change when applying DC voltage).

In addition, capacitor C2 can be the capacitor (or high capacitance capacitors) with high capacitance.

Figure 17 is the diagram of the layout patterns that driving power supply system is shown.

With reference to Figure 17, the layout patterns of power management block 500, power inductor L1 and the second capacitor C2 can be identified.

Usually, power management block 500 (or PMIC) can have several to tens DC/DC transducers.In addition, in order to realize the function of DC/DC transducer, each DC/DC transducer required power inductor and high capacitance capacitors.

With reference to Figure 17, power management block 500 can comprise predetermined terminal N1 and N2.Power management block 500 can receive the power from battery and utilize DC/DC transducer to change this power.In addition, power management block 500 can supply the power after conversion by the first terminal N1.Second terminal N2 can be earth terminal.

Here, the first power inductor L1 and the second capacitor C2 can from the first terminal N1 received power, makes the power that receives steady, and supplies driving power by the 3rd terminal N3, thus perform the function of the steady unit of the second power.

The function that the 4th terminal N4 shown in Figure 17 to the 6th terminal N6 performs is identical to the function of the 3rd terminal N3 with the first terminal N1, so the detailed description that will omit them.

The important thing considered when the pattern of design driven power supply system is that power management block, power inductor and high capacitance capacitors need to be set to close as much as possible.In addition, the wiring of power line needs to be designed to short and thick.

This be due to can reduce assembly layout region when meeting such demand and can restraint speckle produce the fact.

When the quantity of the lead-out terminal of power management block 500 is few, power inductor and high capacitance capacitors are set to closer to each other and no problem.But, if multiple outputs of power management block 500 will be used, then due to assembly closeness, can not power inductor and high capacitance capacitors may be suitably set.In addition, according to the priority of power, power inductor and high capacitance capacitors may be set to not preferred state.

Such as, because power inductor and high capacitance capacitors have large scale, so when arranging these elements practically, power line and holding wire may inevitably be extended.

Under the state that power inductor and high capacitance capacitors are set to not preferred state, the interval between respective element and power line is extended, and generation can have dysgenic noise to power supply system.

Figure 18 is the circuit diagram of the combined electronical assembly according to exemplary embodiment of the present disclosure.

With reference to Figure 18, combined electronical assembly 700 can comprise input terminal A, the steady unit of power, lead-out terminal B and earth terminal C.

The steady unit of power can comprise power inductor L1 and the second capacitor C2.

Combined electronical assembly 700 can be the element being used as the steady unit of the second power as above.

Input terminal A can receive by power that power management block 500 is changed.

The steady unit of power can make from the power of input terminal A reception steady.

Power after steadily can be fed to lead-out terminal Vdd by lead-out terminal B.

Earth terminal C can make the steady unit of power be connected to ground.

Meanwhile, the steady unit of power comprises the power inductor L1 be connected between input terminal A and lead-out terminal B and the second capacitor C2 be connected between earth terminal C and lead-out terminal B.

With reference to Figure 18, due to power inductor L1 and the sub-B of the second capacitor C2 common output, thus the space between power inductor L1 and capacitor C2 can be reduced.

By this way, in combined electronical assembly 700, be arranged on power inductor in the power output end of power management block 500 and high capacitance capacitors is embodied as single component.Therefore, combined electronical assembly 700 has the element integrated level enhanced.

Figure 19 is the diagram of the layout patterns of the driving power supply system of the application combined electronical assembly illustrated according to exemplary embodiment of the present disclosure.

With reference to Figure 19, can see, the second capacitor C2 shown in Figure 17 and power inductor L1 substitute by the combined electronical assembly according to exemplary embodiment of the present disclosure.

As previously mentioned, combined electronical assembly can be used as the steady unit of the second power.

In addition, substituting the second capacitor C2 and power inductor L1 by utilizing according to the combined electronical assembly of exemplary embodiment of the present disclosure, the length of wiring can be made to minimize.In addition, because the quantity of the element arranged reduces, optimum component placement can therefore be completed.

That is, according to exemplary embodiment of the present disclosure, power management block, power inductor and high capacitance capacitors can be set to close to each other as much as possible, and the wiring due to power line is configured to short and thick, therefore can noise decrease.

Meanwhile, Electronic device manufacturers reduces the size of the PCB arranged in an electronic hardy to satisfy the demands of consumers.Therefore, the integrated level strengthening the IC be arranged on PCB is needed.In an exemplary embodiment of the disclosure, because multiple combination of elements becomes single composite component (such as combined electronical assembly), therefore such demand can be met.

In addition, according to exemplary embodiment of the present disclosure, because two assemblies (the second capacitor and power inductor) are embodied as single combined electronical assembly, therefore PCB erection space can be reduced.According to exemplary embodiment of the present disclosure, compared with existing layout patterns, erection space can reduce about 10% to 30%.

In addition, according to exemplary embodiment of the present disclosure, power can be supplied to IC by the shortest wiring by power management block 500, to receive driving power.

In addition, according in the combined electronical assembly of exemplary embodiment of the present disclosure, because capacitor is arranged on the side of inductor 120, the magnetic flux produced by inductor therefore can be made to minimize the impact of electrode in capacitor, change to prevent self-resonant frequency (SRF).

In addition, according in the combined electronical assembly of exemplary embodiment of the present disclosure, because capacitor is arranged on the side of inductor, the deterioration of the Q factor of assembly can therefore be prevented.

In addition, because magnetic sheet layer is arranged between inductor 120 and capacitor 110, therefore screen effect can interrupt the interference of outside terminal, thus prevents the deterioration of the electrical characteristics of combined electronical assembly.

it is provided with the plate of multilayer ceramic capacitor

Figure 20 is the perspective view of the combined electronical assembly that the Fig. 1 be arranged on printed circuit board (PCB) (PCB) is shown.

With reference to Figure 20, the mounting panel 800 according to the combined electronical assembly 100 of this exemplary embodiment comprises: printed circuit board (PCB) (PCB) 810, it is provided with combined electronical assembly 100; Three or more electrode pads 821,822 and 823, are formed on the upper surface of PCB810.

Electrode pad 821,822 and 823 can be formed as being connected respectively to the first electrode pad 821, second electrode pad 822 and third electrode pad 823 of the input terminal 151 of combined electronical assembly 100, lead-out terminal 152 and earth terminal 153.

Here, be arranged under the state contacted with third electrode pad 823 with the first electrode pad 821, second electrode pad 822 with earth terminal 153 at the input terminal 151 of combined electronical assembly 100, lead-out terminal 152, combined electronical assembly 100 can be electrically connected to PCB810 by solder 830.

In addition, the combined electronical assembly be arranged on PCB can be the combined electronical assembly according to another exemplary embodiment of the present disclosure, will omit its description to avoid redundancy.

Table 1 shows the change of inductance (Ls), Q factor and SRF according to the frequency of embodiment example, comparative examples 1 and comparative examples 2.

In Table 1, embodiment example is the combined electronical assembly by making inductor and capacitor horizontal integration be formed, and comparative examples 1 is the power inductor be used alone, and comparative examples 2 is by making inductor and capacitor vertically in conjunction with the combined electronical assembly of formation.

[table 1]

With reference to table 1, when the embodiment example for the combined electronical assembly by making inductor and capacitor horizontal integration be formed, can see, the change of the inductance (Ls) of frequency, Q factor and SRF from represent that the change of the inductance (Ls), Q factor and the SRF that are used alone the frequency of the comparative examples 1 of power inductor is significantly not different.

On the contrary, when as by make inductor and capacitor vertically in conjunction with the combined electronical assembly of formation comparative examples 2, be that combined electronical assembly by making inductor and capacitor horizontal integration be formed is compared with the comparative examples 1 as the power inductor be used alone with embodiment example, can see, Q factor deterioration, SRF moves to low-frequency range, limits the use coverage rate of inductor.

Figure 21 is the curve chart of the change of the self-resonant frequency (SRF) illustrated according to embodiment example and comparative examples.

With reference to Figure 21, embodiment example 1 is the combined electronical assembly by making inductor and capacitor horizontal integration be formed, in combined electronical assembly, ferrite lamella is arranged between capacitor and inductor, embodiment example 2 is combined electronical assemblies that metal plate layer is arranged between capacitor and inductor, comparative examples 1 is the power inductor be used alone, and comparative examples 2 is by making inductor and capacitor vertically in conjunction with the combined electronical assembly of formation.

With reference to curve chart, when ferrite lamella or metal plate layer are arranged on embodiment example 1 between capacitor and inductor and embodiment example 2, can see, SRF equals the SRF of the comparative examples 1 as the power inductor be used alone substantially.

In addition, can see, the inductance of embodiment example 1 and 2 is greater than the inductance of comparative examples 1.

With reference to Figure 22, embodiment example 1 is the combined electronical assembly by making inductor and capacitor horizontal integration be formed, in combined electronical assembly, ferrite lamella is arranged between capacitor and inductor, embodiment example 2 is combined electronical assemblies that metal plate layer is arranged between capacitor and inductor, comparative examples 1 is the power inductor be used alone, and comparative examples 2 is by making inductor and capacitor vertically in conjunction with the combined electronical assembly of formation.

With reference to curve chart, when ferrite lamella or metal plate layer are arranged on embodiment example 1 between capacitor and inductor and embodiment example 2, can see, the Q factor of embodiment example 1 and embodiment example 2 is better than the Q factor as the Q factor of the comparative examples 1 of the power inductor be used alone and the comparative examples 2 of combine between the higher and lower levels inductor and capacitor.

As mentioned above, according to exemplary embodiment of the present disclosure, can the combined electronical assembly that can reduce the area for installation component be set in driving power supply system.

In addition, can arrange in driving power supply system can the combined electronical assembly of generation of restraint speckle.

In addition, according in the combined electronical assembly of exemplary embodiment of the present disclosure, because capacitor is arranged on the side of inductor 120, inductor therefore can be made to minimize the impact of electrode in capacitor, change to prevent self-resonant frequency (SRF).

In addition, because magnetic sheet layer is arranged between inductor and capacitor, therefore can be interrupted the interference of outside terminal by screen effect, thus prevent the deterioration of the electrical characteristics of combined electronical assembly.

Although illustrate and describe exemplary embodiment above, for those skilled in the art it will be clear that, when not departing from spirit and scope of the present disclosure as defined in the claims, can modify and be out of shape.

Claims

1. a combined electronical assembly, described combined electronical assembly comprises:

Composite host, comprise the combination of the capacitor formed by ceramic main body and the inductor formed by the magnetic body comprising coil unit, wherein, in multiple dielectric layer, first electrode and the second inner electrode in the capacitor stacked, in first, electrode and the second inner electrode are arranged to facing with each other and make dielectric layer be arranged in first between electrode and the second inner electrode;

Input terminal, the first end being formed in composite host is on the surface and be connected to the coil unit of inductor;

Lead-out terminal, comprise be formed in composite host the second end surfaces on and on the first lead-out terminal being connected to the coil unit of inductor and the second end surfaces being formed in composite host and be connected to capacitor first in the second lead-out terminal of electrode; And

Earth terminal, be formed in the upper surface of the capacitor of composite host, lower surface and first end surface one or more on the surface and be connected to the second inner electrode of capacitor,

Wherein, capacitor is combined with the side of inductor, and magnetic sheet layer is arranged between inductor and capacitor.

2. combined electronical assembly as claimed in claim 1, wherein, magnetic body is constructed by stacked multiple magnetosphere it being formed with respectively conductive pattern, and conductive pattern forms coil unit.

3. combined electronical assembly as claimed in claim 1, wherein, inductor is that magnetic body comprises dielectric base and is formed in the film-type inductor of the coil at least one surface of dielectric base.

4. combined electronical assembly as claimed in claim 1, wherein, magnetic body comprises iron core and the winding coil around coiling iron core.

5. combined electronical assembly as claimed in claim 1, wherein, magnetic sheet layer comprises the Magnaglo of one or more types selected from the group be made up of ferrite particles and metallic magnetic powder, and ferrite particles has 15 μm or less average grain diameter.

6. combined electronical assembly as claimed in claim 1, wherein, adhesion layer is formed on the both sides of magnetic sheet layer further.

7. a combined electronical assembly, described combined electronical assembly comprises:

Composite host, comprise the first capacitor formed by ceramic main body, second capacitor and the combination of inductor formed by the magnetic body comprising coil unit, wherein, multiple dielectric layer, in first, electrode and the second inner electrode are layered in the first capacitor, in first, electrode and the second inner electrode are arranged to facing with each other and make dielectric layer be arranged in first between electrode and the second inner electrode, multiple dielectric layer, in 3rd, electrode and the 4th inner electrode layer are stacked in the second capacitor, in 3rd, in electrode and the 4th, electrode is arranged to facing with each other and makes dielectric layer be arranged in the 3rd in electrode and the 4th between electrode,

Input terminal, comprise be formed in composite host first end on the surface and first input end being connected to the coil unit of inductor and be formed in composite host first end on the surface and be connected to the first capacitor first in the second input terminal of electrode;

Lead-out terminal, comprise be formed in composite host the second end surfaces on and the first lead-out terminal being connected to the coil unit of inductor and be formed in composite host first end on the surface and be connected to the second capacitor the 3rd in the second lead-out terminal of electrode;

Earth terminal, comprise be formed in composite host the second end surfaces on and on the first earth terminal being connected to the second inner electrode of the first capacitor and the second end surfaces being formed in composite host and be connected to the second capacitor the 4th in the second earth terminal of electrode

Wherein, the first capacitor and the second capacitor are combined with two sides of inductor, and magnetic sheet layer is arranged between inductor and the first capacitor and between inductor and the second capacitor.

8. a combined electronical assembly, described combined electronical assembly comprises:

Composite host, comprise the combination of the capacitor formed by ceramic main body and the inductor formed by the magnetic body comprising coil unit, wherein, in multiple dielectric layer and first, electrode is folded in the capacitor to the 3rd inner electrode layer, and in first, in electrode to the 3rd, electrode is set to facing with each other and dielectric layer is arranged between which;

Input terminal, comprise be formed in composite host first end on the surface and first input end being connected to the coil unit of inductor and be formed in composite host first end on the surface and be connected to capacitor first in the second input terminal of electrode;

Lead-out terminal, comprise be formed in composite host the second end surfaces on and on the first lead-out terminal being connected to the coil unit of inductor and the second end surfaces being formed in composite host and be connected to capacitor the 3rd in the second lead-out terminal of electrode; And

Earth terminal, be formed in the upper surface of the capacitor of composite host, lower surface and the first side surface one or more on the surface and be connected to the second inner electrode of capacitor,

9. combined electronical assembly as claimed in claim 8, wherein, in first, electrode has the lead division on the first end surface being exposed to composite host respectively, the second inner electrode has the lead division of the first side surface being exposed to composite host respectively, and in the 3rd, electrode has the lead division being exposed to the second end surfaces respectively.

10. a combined electronical assembly, described combined electronical assembly comprises:

Composite host, comprise the first capacitor formed by ceramic main body, the second capacitor formed by ceramic main body and the combination of inductor formed by the magnetic body comprising coil unit, wherein, in multiple dielectric layer and first, electrode is stacked in the first capacitor to the 3rd inner electrode layer, in first, in electrode to the 3rd, electrode is arranged to facing with each other and dielectric layer is arranged between which, in multiple dielectric layer and the 4th, electrode is stacked in the second capacitor to the 6th inner electrode layer, in 4th, in electrode to the 6th, electrode is arranged to facing with each other and dielectric layer is arranged between which,

Input terminal, comprise be formed in composite host first end on the surface and first input end being connected to the coil unit of the first inductor, be formed in composite host first end on the surface and the second input terminal being connected to the coil unit of the second inductor, be formed in composite host first end on the surface and be connected to the first capacitor first in electrode the 3rd input terminal and be formed in composite host first end on the surface and be connected to the second capacitor the 4th in four-input terminal of electrode;

Lead-out terminal, comprise be formed in composite host the second end surfaces on and the first lead-out terminal being connected to the coil unit of the first inductor, be formed in composite host the second end surfaces on and the second lead-out terminal being connected to the coil unit of the second inductor, be formed in composite host the second end surfaces on and be connected to the first capacitor the 3rd in electrode the 3rd lead-out terminal and be formed in composite host the second end surfaces on and be connected to the second capacitor the 6th in the 4th lead-out terminal of electrode; And

Earth terminal, comprise the first earth terminal and the second earth terminal, wherein, first earth terminal be formed in the upper surface of the first capacitor of composite host, lower surface and the first side surface one or more on the surface and be connected to the second inner electrode of the first capacitor, second earth terminal be formed in the upper surface of the second capacitor of composite host, lower surface and the second side surface one or more on the surface and be connected to the second capacitor the 5th in electrode

Wherein, first inductor and the second inductor are continuous print, first capacitor is combined with the side of the first inductor, and the second capacitor is combined with the side of the second inductor, and magnetic sheet layer is arranged between the first inductor and the first capacitor and between the second inductor and the second capacitor.

11. 1 kinds of combined electronical assemblies, described combined electronical assembly comprises:

Input terminal, receives the power after from the conversion of power management block;

The steady unit of power, make power steadily and comprise composite host, composite host comprises the combination of the capacitor formed by ceramic main body and the inductor formed by the magnetic body comprising coil unit, wherein, in multiple dielectric layer, first electrode and the second inner electrode in the capacitor stacked, in first, electrode and the second inner electrode are arranged to facing with each other and make dielectric layer be arranged in first between electrode and the second inner electrode, capacitor is combined with the side of inductor, and magnetic sheet layer is arranged between inductor and capacitor;

Lead-out terminal, the power after supply steadily; And

Earth terminal, for ground connection.

12. combined electronical assemblies as claimed in claim 11, wherein, input terminal is formed in the first end of composite host on the surface, lead-out terminal comprise be formed in composite host the second end surfaces on and on the first lead-out terminal being connected to the coil unit of inductor and the second end surfaces being formed in composite host and be connected to capacitor first in the second lead-out terminal of electrode, earth terminal be formed in the upper surface of the capacitor of composite host, lower surface and first end surface one or more on the surface and be connected to the second inner electrode of capacitor.

13. combined electronical assemblies as claimed in claim 11, wherein, magnetic body is constructed by stacked multiple magnetosphere it being formed with respectively conductive pattern, and conductive pattern forms coil unit.

14. combined electronical assemblies as claimed in claim 11, wherein, inductor is that magnetic body comprises dielectric base and is formed in the film-type inductor of the coil at least one surface of dielectric base.

15. combined electronical assemblies as claimed in claim 11, wherein, magnetic body comprises iron core and the winding coil around coiling iron core.

16. combined electronical assemblies as claimed in claim 11, wherein, magnetic sheet layer comprises the Magnaglo of one or more types selected from the group be made up of ferrite particles and metallic magnetic powder, and ferrite particles has 15 μm or less average grain diameter.

17. combined electronical assemblies as claimed in claim 11, wherein, adhesion layer is formed on the both sides of magnetic sheet layer further.

18. 1 kinds of plates being provided with combined electronical assembly, described plate comprises:

Printed circuit board (PCB), the upper surface of printed circuit board (PCB) is formed three or more electrode pads;

Combined electronical assembly according to any one claim in claim 1,7,8,10 and 11, installs on a printed circuit; And

Solder, connecting electrode pad and combined electronical assembly.