CN104810313B - Semiconductor component potting process week rotating tooling - Google Patents
Semiconductor component potting process week rotating tooling Download PDFInfo
- Publication number
- CN104810313B CN104810313B CN201510225963.6A CN201510225963A CN104810313B CN 104810313 B CN104810313 B CN 104810313B CN 201510225963 A CN201510225963 A CN 201510225963A CN 104810313 B CN104810313 B CN 104810313B
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- sedimentation
- semiconductor component
- pedestal
- work top
- raised line
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67706—Mechanical details, e.g. roller, belt
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/67303—Vertical boat type carrier whereby the substrates are horizontally supported, e.g. comprising rod-shaped elements
- H01L21/67309—Vertical boat type carrier whereby the substrates are horizontally supported, e.g. comprising rod-shaped elements characterized by the substrate support
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/67313—Horizontal boat type carrier whereby the substrates are vertically supported, e.g. comprising rod-shaped elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67715—Changing the direction of the conveying path
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/6875—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of individual support members, e.g. support posts or protrusions
Abstract
The present invention relates to a kind of semiconductor component potting process week rotating tooling, including：Pedestal；Sedimentation component；Sedimentation assembly lift mechanism；For clamping semiconductor component sliver；Under operating mode, drive knob order sedimentation component rises, and sedimentation raised line is maintained an equal level with work top through the sedimentation slotted eye and its top surface of work top；When the graphite boat for being mounted with semiconductor component is erected on pedestal, and several semiconductor components of same row one end lead, it is alternate stagger support on work top and sedimentation raised line top surface on；Reverse drive knob；Sedimentation raised line then declines along the sedimentation slotted eye set by work top, it is in longitudinal height interlaced arrangement so as to make laterally rows of semiconductor component, thereafter, transversely arranged contour semiconductor component is taken out from graphite boat and is transferred in the frock of lower road packaging process by sliver order.The present invention has can reduce operation difficulty, and the advantages of reduce workpiece and sustain damage.
Description
Technical field
The present invention relates to a kind of all rotating toolings, and in particular to a kind of semiconductor component potting process week rotating tooling,
Belong to the technical field of the auxiliary mould for semiconductor manufacturing.
Background technology
Existing axial diode has several procedures to need conversion operation in process of production：By diode semi-finished product in the past
It is transferred on the carrier of one procedure on the carrier of latter procedure.In this process, because diode semi-finished product are in carrier
Upper arrangement is tight, and chip part does not have corresponding protection also, therefore operation also has certain difficulty, the chip part of product
Easily sustain damage.
The content of the invention
The purpose of the present invention is：There is provided one kind can reduce operation difficulty, and reduce the semiconductor that workpiece sustains damage
Component encapsulating technical process week rotating tooling, to overcome the deficiencies in the prior art.
In order to achieve the above object, the technical scheme is that：A kind of semiconductor component potting process turnover
Frock, including：
One pedestal；The work top of the pedestal has the sedimentation slotted eye that several are separately arranged in parallel, and is provided with matrix form
The graphite boat of the semiconductor component placement hole of arrangement is erected at the top of pedestal, and one end lead of semiconductor component passes through graphite boat
Placement hole be supported on work top；
One sedimentation component；The sedimentation component includes sedimentation plate, and the sedimentation plate has the heavy of several separate parallel arrangements
Drop raised line, corresponding pair of the sedimentation slotted eye of the sedimentation raised line and pedestal and is equipped with dynamic；
One sedimentation assembly lift mechanism；The sedimentation assembly lift mechanism, including the two-sided rack, driving gear, 2 it is driven
Gear, 4 flat heart secter pats, knobs, 2 support bars and 2 rotating shafts；The two-sided rack has spacing to separate cloth by being located at it
2 support bars in the long slot bore put and make somebody a mere figurehead in pedestal；2 rotating shafts just intersecting with the two-sided rack through long slot bore arrange and
Its two ends and pedestal are dynamic to be connected, in rotating shaft axially spaced arrangement and it is concentric be fixedly connected with 2 flat heart secter pats,
Driven gear is concentric with rotating shaft to be fixedly connected, and driven gear is meshed with the one side of the two-sided rack；And driving gear with it is double
The another side of face tooth bar is meshed, and the main shaft being fixedly connected concentric with driving gear and pedestal are dynamic to be connected, knob and the master
Axle shaft end is fixedly connected；
One sliver for being used for clamping semiconductor component, the sliver is separated including substrate and two along zig direction
The sideboard of arrangement, has some correspondences for supporting the groove of semiconductor component two ends lead at the top of two sideboards；
Under operating mode, drive knob order sedimentation component rises, and makes sedimentation raised line through the sedimentation slotted eye of work top
And its top surface maintains an equal level with work top；When the graphite boat for being mounted with semiconductor component is erected on pedestal, and if same row
Dry one end lead of semiconductor component, it is alternate stagger support on work top and sedimentation raised line top surface on；Reverse drive is revolved
Button；Sedimentation raised line then declines along the sedimentation slotted eye set by work top, so that it is in longitudinal direction to make laterally rows of semiconductor component
Height interlaced arrangement, thereafter, by sliver order by transversely arranged contour semiconductor component, takes out from graphite boat
And be transferred in the frock of lower road packaging process.
In the above-mentioned technical solutions, the bottom of the graphite boat is provided with supporting leg, is set respectively on two side walls of the pedestal
There is the fagging for setting up the supporting leg of graphite boat.
In the above-mentioned technical solutions, there are supporting platen, the two ends support of the sedimentation plate on the inwall at the pedestal two ends
In supporting platen.
The good effect that has of the present invention is：After using all rotating toolings of the invention, under operating mode, drive knob order is heavy
Part of coming down to a lower group rises, and sedimentation raised line is maintained an equal level with work top through the sedimentation slotted eye and its top surface of work top；Work as placement
The graphite boat for having semiconductor component is erected on pedestal, and several semiconductor components of same row one end lead, it is alternate
Stagger and support on work top and settle on raised line top surface；Reverse drive knob；Sedimentation raised line is then along set by work top
Sedimentation slotted eye decline so that it is in longitudinal height interlaced arrangement to make laterally rows of semiconductor component, thereafter, by the sliver
Transversely arranged contour semiconductor component is taken out and is transferred in the frock of lower road packaging process by order from graphite boat.This
Sample, workpiece is during turnover in longitudinal height interlaced arrangement so that longitudinal pitch increases, and is easy to operating personnel to operate, and drops
Low operation difficulty, and reduce workpiece and sustain damage, realize the purpose of the present invention.
Brief description of the drawings
Fig. 1 is a kind of structural representation of specific embodiment of the invention；
Fig. 2 is the A-A schematic cross-sectional views of Fig. 1；
Fig. 3 is the B-B schematic cross-sectional views of Fig. 2；
Fig. 4 is the C-C half section schematic diagrames of Fig. 1；
Fig. 5 is the dimensional structure diagram of sliver of the present invention；
Fig. 6 is the dimensional structure diagram of complete section of the present invention.
Specific embodiment
Below in conjunction with accompanying drawing and the embodiment for being given, the present invention is further illustrated, but is not limited thereto.
As shown in Fig. 1,2,3,4,5,6, a kind of semiconductor component potting process week rotating tooling, including：
One pedestal 1；The work top 1-1 of the pedestal 1 has the sedimentation slotted eye 1-1-1 that several are separately arranged in parallel, if
The graphite boat 4 for having the placement hole 4-1 of semiconductor component 5 arranged in matrix form is erected at the top of pedestal 1, semiconductor component 5
One end lead is supported on work top 1-1 through the placement hole 4-1 of graphite boat 4；
One sedimentation component 2；The sedimentation component 2 includes sedimentation plate 2-1, and it is parallel that the sedimentation plate 2-1 has several to separate
Sedimentation the raised line 2-1-1, the sedimentation raised line 2-1-1 of arrangement are tackled and in dynamic equipped with the sedimentation slotted eye 1-1-1 phases of pedestal 1；
One sedimentation assembly lift mechanism 3；The sedimentation assembly lift mechanism 3, including the two-sided rack 3-1, driving gear 3-
2nd, 2 driven gear 3-3,4 flat heart secter pat 3-4, knob 3-5,2 support bar 3-6 and 2 rotating shaft 3-7；The double cog
Bar 3-1 has 2 support bar 3-6 in spacing long slot bore 3-1-1 arranged apart by being located at it and makes somebody a mere figurehead in pedestal 1；2
Rotating shaft 3-7 just intersects arrangement and its two ends and the dynamic mating connection of pedestal 1 through long slot bore 3-1-1 and the two-sided rack 3-1, in rotating shaft
3-7 it is upper it is axially spaced arrangement and it is concentric be fixedly connected with 2 flat heart secter pat 3-4, driven gear 3-3 is same with rotating shaft 3-7
Axle center is fixedly connected, and driven gear 3-3 is meshed with the one side of the two-sided rack 3-1；And driving gear 3-2 and the two-sided rack 3-
1 another side is meshed, and the main shaft 3-2-1 that is fixedly connected concentric with driving gear 3-2 and pedestal 1 are dynamic be connected, knob 3-5 and
The main shaft 3-2-1 shaft ends are fixedly connected；
One sliver 6 for being used for clamping semiconductor component, the sliver 6 is including substrate 6-1 and two along substrate 6-1 length
Direction sideboard 6-2 arranged apart, has some correspondences for supporting 5 liang of semiconductor component at the top of two sideboard 6-2
Hold the groove 6-2-1 of lead；
Under operating mode, drive knob 3-5 order sedimentation components 2 rise, and sedimentation raised line 2-1-1 is passed through work top 1-1
Sedimentation slotted eye 1-1-1 and also its top surface and work top 1-1 maintain an equal level；When the graphite boat 4 for being mounted with semiconductor component 5 is erected at
On pedestal 1, and several semiconductor components 5 of same row one end lead, it is alternate stagger support on work top 1-1 and
On sedimentation raised line 2-1-1 top surfaces；Reverse drive knob 3-5；Raised line 2-1-1 is then along the sedimentation set by work top 1-1 for sedimentation
Slotted eye 1-1-1 declines, so that it is in longitudinal height interlaced arrangement to make laterally rows of semiconductor component 5, thereafter, by the sliver
Transversely arranged contour semiconductor component 5 is taken out and is transferred in the frock of lower road packaging process by 6 orders from graphite boat 4.
As shown in Figure 1, 2, for the ease of erection graphite boat 4 so that structure of the present invention is more reasonable, compact, the graphite
The bottom of boat 4 is provided with supporting leg 4-2, is respectively equipped with supporting leg 4-2's for setting up graphite boat 4 on two side walls of the pedestal 1
Fagging 1-2.
As shown in figure 3, the stationarity in order to ensure the sedimentation plate 2-1 sedimentations, has branch on the inwall at the two ends of the pedestal 1
Support platen 1-3, the two ends of the sedimentation plate 2-1 are supported on supporting platen 1-3.
Under operating mode, drive knob 3-5 order sedimentation components 2 rise the present invention, and sedimentation raised line 2-1-1 is passed through workbench
The sedimentation slotted eye 1-1-1 and its top surface of face 1-1 and work top 1-1 maintain an equal level；When the graphite boat 4 for being mounted with semiconductor component 5
Be erected at that pedestal 1 is on duty, and several semiconductor components 5 of same row one end lead, it is alternate stagger support in workbench
On the 1-1 of face and on sedimentation raised line 2-1-1 top surfaces；Reverse drive knob 3-5；Raised line 2-1-1 is then along work top 1-1 institutes for sedimentation
If sedimentation slotted eye 1-1-1 decline so that it is in longitudinal height interlaced arrangement to make laterally rows of semiconductor component 5, thereafter, pass through
Transversely arranged contour semiconductor component 5 is taken out from graphite boat 4 and is transferred to lower road packaging process by the order of the sliver 4
Frock on.
The present invention can reduce operation difficulty, and reduce workpiece and sustain damage.
Claims (3)
1. a kind of semiconductor component potting process is with all rotating toolings, it is characterised in that including：
One pedestal（1）；The pedestal（1）Work top（1-1）There are several sedimentation slotted eyes being separately arranged in parallel（1-1-
1）, it is provided with the semiconductor component arranged in matrix form（5）Placement hole（4-1）Graphite boat（4）It is erected at pedestal（1）Top,
Semiconductor component（5）One end lead pass through graphite boat（4）Placement hole（4-1）It is supported on work top（1-1）On；
One sedimentation component（2）；The sedimentation component（2）Including sedimentation plate（2-1）, the sedimentation plate（2-1）There are several to separate
The sedimentation raised line of parallel arrangement（2-1-1）, the sedimentation raised line（2-1-1）With pedestal（1）Sedimentation slotted eye（1-1-1）Mutually tackle
And in dynamic equipped；
One sedimentation assembly lift mechanism（3）；The sedimentation assembly lift mechanism（3）, including the two-sided rack（3-1）, driving gear
（3-2）, 2 driven gears（3-3）, 4 flat heart secter pats（3-4）, knob（3-5）, 2 pieces support bars（3-6）With 2 rotating shafts
（3-7）；The two-sided rack（3-1）There is spacing long slot bore arranged apart by being located at it（3-1-1）2 interior support bars
（3-6）And make somebody a mere figurehead in pedestal（1）It is interior；2 rotating shafts（3-7）Through long slot bore（3-1-1）With the two-sided rack（3-1）Just intersect arrangement
And its two ends and pedestal（1）It is dynamic to be connected, in rotating shaft（3-7）Upper axially spaced arrangement and concentric it is fixedly connected with 2
Flat heart secter pat（3-4）, driven gear（3-3）With rotating shaft（3-7）It is concentric to be fixedly connected, and driven gear（3-3）With it is two-sided
Tooth bar（3-1）One side be meshed；And driving gear（3-2）With the two-sided rack（3-1）Another side be meshed, with driving gear
（3-2）The concentric main shaft being fixedly connected（3-2-1）With pedestal（1）Dynamic connection, knob（3-5）With the main shaft（3-2-1）Axle
End is fixedly connected；
One sliver for being used for clamping semiconductor component（6）, the sliver（6）Including substrate（6-1）With two along substrate（6-1）
Length direction sideboard arranged apart（6-2）, two sideboards（6-2）Top have some correspondences for supporting semiconductor
Component（5）The groove of two ends lead（6-2-1）；
Under operating mode, drive knob（3-5）Order sedimentation component（2）Rise, and make sedimentation raised line（2-1-1）Through work top
（1-1）Sedimentation slotted eye（1-1-1）And its top surface and work top（1-1）Maintain an equal level；When being mounted with semiconductor component（5）Stone
Mo Zhou（4）It is erected at pedestal（1）On, and same row several semiconductor components（5）One end lead, it is alternate stagger support
In work top（1-1）Upper and sedimentation raised line（2-1-1）On top surface；Reverse drive knob（3-5）；Sedimentation raised line（2-1-1）Then
Along work top（1-1）Set sedimentation slotted eye（1-1-1）Decline, so as to make laterally rows of semiconductor component（5）In vertical
To height interlaced arrangement, thereafter, by the sliver（6）Sequentially by transversely arranged contour semiconductor component（5）, from graphite boat
（4）In take out and be transferred in the frock of lower road packaging process.
2. semiconductor component potting process according to claim 1 is with all rotating toolings, it is characterised in that：The graphite
Boat（4）Bottom be provided with supporting leg（4-2）, the pedestal（1）Two side walls on be respectively equipped with for setting up graphite boat（4）Branch
Leg（4-2）Fagging（1-2）.
3. semiconductor component potting process according to claim 1 is with all rotating toolings, it is characterised in that：The pedestal
（1）There is supporting platen on the inwall at two ends（1-3）, the sedimentation plate（2-1）Two ends be supported on supporting platen（1-3）On.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510225963.6A CN104810313B (en) | 2015-05-06 | 2015-05-06 | Semiconductor component potting process week rotating tooling |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510225963.6A CN104810313B (en) | 2015-05-06 | 2015-05-06 | Semiconductor component potting process week rotating tooling |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104810313A CN104810313A (en) | 2015-07-29 |
| CN104810313B true CN104810313B (en) | 2017-06-27 |
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| CN201510225963.6A Active CN104810313B (en) | 2015-05-06 | 2015-05-06 | Semiconductor component potting process week rotating tooling |
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Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105977193A (en) * | 2016-06-20 | 2016-09-28 | 刘玉忠 | Diode sliver |
| CN109256354B (en) * | 2017-07-14 | 2021-01-12 | 财团法人工业技术研究院 | Transfer support and transfer module |
| CN111128808B (en) * | 2019-12-30 | 2023-07-21 | 广安市嘉乐电子科技有限公司 | Turnover tool for axial diode packaging process |
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| CN101920247A (en) * | 2009-06-11 | 2010-12-22 | 泰克元有限公司 | Pick-and-place module for test handler |
| CN202034360U (en) * | 2011-03-31 | 2011-11-09 | 茂迪(苏州)新能源有限公司 | Auxiliary wafer inserting tooling of loading device |
| CN104241177A (en) * | 2013-06-08 | 2014-12-24 | 常州广达电子有限公司 | Full-automatic diode carding machine |
| CN204696091U (en) * | 2015-05-06 | 2015-10-07 | 常州银河电器有限公司 | The all rotating toolings of a kind of semiconductor component potting process |
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| CN104810313A (en) | 2015-07-29 |
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