CN201285768Y - Process rotary board of LED electrode rack - Google Patents
Process rotary board of LED electrode rack Download PDFInfo
- Publication number
- CN201285768Y CN201285768Y CNU2008201404318U CN200820140431U CN201285768Y CN 201285768 Y CN201285768 Y CN 201285768Y CN U2008201404318 U CNU2008201404318 U CN U2008201404318U CN 200820140431 U CN200820140431 U CN 200820140431U CN 201285768 Y CN201285768 Y CN 201285768Y
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- CN
- China
- Prior art keywords
- electrode
- flap
- led
- magnetic force
- suppor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
An LED electrode jib working procedure transferring plate is used for transferring and feeding physical composite material electrodes manufactured by an LED jib and has the advantages that a blank take-out mechanism on a thread guide mechanism is placed in every tank after the physical composite material electrodes are taken down, the magnetic absorption bracket and an electrode transferring plate can be conveniently assembled and disassembled; and after insulation partition beads with electrodes are formed by pouring in an insulation bead die cavity, the insulation partition beads are integrated on the a die carrier, and the transferring efficiency between working procedures is greatly improved. The LED electrode jib working procedure transferring plate is characterized in that the magnetic absorption bracket is provided with an electrode transferring plate which can be conveniently disassembled and embedded, and the electrode transferring plate is provided with magnets for absorbing external electrodes with respect to each electrode.
Description
Technical field:
The utility model relates to a kind of all flaps that are used for feeding between the led support manufacturing procedure, especially a kind ofly is used for non-plate frame structure support, and is separate between support, at die mould, and the LED electrode suppor operation flap that use in each operation framed integrated back.
Background technology:
Present led support is in encapsulation process operation transfer feeding, adopt be manually or automatic feed mechanism the support commonly used of plate frame structure is fed to corresponding processing stations, realize the processing of each operation, can't realize feeding with existing pay-off for the LED electrode suppor that the support of non-plate frame structure is separate.Chinese patent " light-emitting diode " patent No. 2005100221490 that Patent Office of the People's Republic of China is authorized, patent publication No.: CN100392880C, use separate led support between support, can't realize the technological requirement of patented product because of existing LED electrode suppor feeding method.The Chinese patent " seal wire operation flap " that I authorize through Patent Office of the People's Republic of China, the patent No. 2006200342673 patent publication No. CN201020486Y, though solved electrode by groove location and electrode transfer problem at inter process, but prove through production practices, displacement after electrode has vibrations when inter process is transported, make and to realize in support left and right sides electrode tip end face and the following process that framed integrated requirement can't realize, therefore be difficult to improve the efficient of subsequent handling, must brand-new design LED electrode suppor operation flap finish the feeding of inter process.
Summary of the invention:
The purpose of this utility model, be the framed integrated technological requirement concordant of LED electrode suppor separate between support with left and right sides electrode end surface at non-plate frame structure, the V-type mouth of accepting on physics composite electrode and the operation flap is one-to-one relationship during rewinding on guiding machine, thereby finish storing of physics composite electrode by groove, and under the situation of not having extraneous powerful vibrations, relative position on electrode operation flap is maintained fixed, the accurate of LED electrode suppor located to such an extent that realize in the manufacturing procedure of assurance back, and conveniently in the following process operation realize conveniently splitting out and embedding of magnetic force absorption carriage and electrode flap, with the cast molding of the insulation spacer ball of realizing physics composite electrode pole following process and in draw the pole end surface grinding.
The utility model---LED electrode suppor operation flap has magnetic force absorption carriage and electrode flap, on the magnetic force absorption carriage V-type material receiving port of accepting the LED electrode suppor is arranged, under the automatic sheet feeder structure on the guiding machine promotes.Longitudinally move and pursue groove and accept physics composite wire material electrode by the groove stepping.On magnetic force absorption carriage, be embedded with the electrode flap that can conveniently split out and embed, and the bottom of every electrode storage tank is provided with the magnet of the outer electrode that is used to adsorb the LED electrode suppor on the electrode flap, it is characterized in that: LED electrode suppor flap is made up of magnetic force absorption carriage and electrode flap, and be embedded with the electrode flap that can conveniently split out and embed on the magnetic force absorption carriage, the electrode flap is provided with and the corresponding outer electrode absorption of every single LED electrode magnet, and the opposing surface of LED electrode suppor material stock groove is provided with seal wire operation flap longitudinally guiding reinforcement tooth when folded high.Its beneficial effect is: because the employing of LED electrode suppor flap, make LED electrode suppor separate between support (relatively have Chinese patent " Miniature Light Source Electrode-carrying Superstructure " patent No. of high performance-price ratio with existing support: ZL200620034663.6 patent publication No.: CN20100440Y, utilization product in LED encapsulation) by framed integrated after, its each operation transhipment amount increases greatly, make the transfer of inter process get convenient and high efficiency realization, the manufacturing of aforementioned patent light-emitting diode is achieved.
Description of drawings:
Fig. 1 is the front view of LED electrode suppor operation flap shown in figure Fig. 1~3, and Fig. 2 is a LED electrode suppor vertical view, and Fig. 3 is a LED electrode suppor cutaway view.
Embodiment:
The technical solution of the utility model is to realize like this, in the caulking groove on the embedding of the electrode flap in the LED electrode suppor operation flap magnetic force absorption carriage, reinstall on the guiding machine charge frame, all become the vertical pile shape to put into bin between LED electrode suppor operation flap, with pushing away tooth on the opposing surface, be provided with the groove of longitudinally arranging, adorn the mutual location that pushes away tooth and realize the operation flap in order to be full of, two ends are provided with engaging tooth, cam on the guiding machine promotes corresponding mechanism and drives and push away tooth direction step motion in accordance with regulations on the LED electrode suppor operation flap, and is one-to-one relationship with the action of seal wire material fetching mechanism on the guiding machine.Physics composite electrode after butt joint is finished, put into the V-type access port by material fetching mechanism, finish stepping by the flat feed mechanism of LED electrode suppor operation flap and move placing of back realization physics composite electrode by groove, and finish outer electrode absorption by absorption magnet, the relative position of physics composite electrode on LED electrode suppor operation flap fixed.Realize no gap overlap joint with pushing away tooth between two LED electrode suppor operation flaps, and at assigned position disengaging back automatic stacking, then with the electrode flap that embeds on the absorption of the magnetic force in the LED electrode suppor operation flap carriage, after from caulking groove, ejecting, the pole that draws electrode in allowing stretches out the end face that electrode changes the utmost point, and its insulation spacer ball become in the casting die cavity on the machine, on special isolation pearl generation machine, insulator is injected in the storagetank, (if use then cooling curing of glass melt into, send into baking oven again and be heating and curing if inject with colloid) wait to solidify on the mould bases of the framed LED of being integrated into electrode suppor operation flap after finishing and compress (usually 600 independent racks being integrated into a module), draw the electrode end surface grinding on grinding machine, inciting somebody to action, make and draw electrode end surface in all and flush, send into again after silver-plated and carry out a glue in the subsequent processing, Gu it is brilliant, routing and embedding, thereby the purpose of realization efficient encapsulation LED.
Content of the present utility model is described further with the following Examples, but content of the present utility model is not limited only to relate among the embodiment content.
1, falls into mouth for LED electrode suppor operation flap V-type, lay respectively on magnetic force absorption carriage 2 and the electrode flap 3, be used for physics composite electrode conveniently falling into when getting material.2, be magnetic force absorption carriage, electrode flap 3 is embedded in the caulking groove, 3, the electrode flap, carrying in order to the physics composite electrode in the support of finishing the LED electrode suppor when module is integrated, 4, reinforcement holds groove, be used for the guiding that level contains reinforcement and stepping lengthwise movement, 5, magnet, be used to adsorb physics composite material outer electrode, 6, stepping pushes away tooth, be arranged on the magnetic force absorption carriage 2 and with the opposing side of electrode flap 3, vertically promote magnetic force absorption carriage in order to finish equidistant stepping, 7, for preceding mentioning, be arranged on the magnetic force absorption carriage 2 and push away the relative side of tooth 6, in order to realize the no gap overlap joint of magnetic force absorption tray chamber, 8 with stepping, for after mention, be arranged on the magnetic force absorption carriage 2 and push away the identical side of tooth 6, in order to realize the no gap overlap joint of magnetic force absorption tray chamber with stepping.When cam follower promotes 6 steppings and pushes away the horizontal lengthwise movement of tooth, by material fetching mechanism the physics composite electrode is put into 1, LED electrode suppor operation flap V-type falls into mouth, and this moment, 5 magnet were adsorbed onto bottom land fixed electrode position with the physics composite electrode.Because the continuous motion of motor is equidistantly advanced 2 magnetic force carriage steppings, by mention before 7 and 8 after mention the no gap overlap joint of realizing the magnetic force tray chamber.4 reinforcements hold groove, the motion guide when realizing the lengthwise movement guiding of 2 magnetic force absorption carriage and pile.After assigned position is finished heap, 2 magnetic force are adsorbed carriage and 3 electrode flaps and physics composite electrode to eject from caulking groove together, and draw the end face that electrode stretches out electrode flap 3 in making, and put it into the special isolation spacer ball and become in the casting die cavity on the machine, treat that it solidifies the back and electrode flap 3 takes out together, the 3 electrode flaps that the LED electrode suppor will be housed are again packed on the mould bases successively, side direction compresses to enter successively plays glue, Gu after crystalline substance, routing, the embedding operation, detect back class wrapping finished product, so far whole technical process is finished.
If when pouring into insulator,, then on the electrode flap, set up electrode flap cover plate, then form new embodiment for preventing glue at the pole axial dispersion with colloid.
Claims (2)
1, a kind of LED electrode suppor operation flap, be provided with magnetic force absorption carriage, the electrode flap, the physics composite electrode imports the V-type mouth, reinforcement holds groove, magnet, stepping push away tooth, precedingly mention, after mention that it is characterized in that: magnetic force absorption carriage is provided with the caulking groove that can conveniently split out with the intercalation electrode flap, LED electrode suppor operation flap is formed by magnetic force absorption carriage and electrode flap combination back.
2, LED electrode suppor operation flap as claimed in claim 1 is characterized in that: holding of the physics composite electrode of electrode flap is provided with the magnet that adsorbs outer electrode in the groove.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNU2008201404318U CN201285768Y (en) | 2008-09-22 | 2008-09-22 | Process rotary board of LED electrode rack |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNU2008201404318U CN201285768Y (en) | 2008-09-22 | 2008-09-22 | Process rotary board of LED electrode rack |
Publications (1)
Publication Number | Publication Date |
---|---|
CN201285768Y true CN201285768Y (en) | 2009-08-05 |
Family
ID=40950749
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNU2008201404318U Expired - Fee Related CN201285768Y (en) | 2008-09-22 | 2008-09-22 | Process rotary board of LED electrode rack |
Country Status (1)
Country | Link |
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CN (1) | CN201285768Y (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104810313A (en) * | 2015-05-06 | 2015-07-29 | 常州银河电器有限公司 | Transfer tool for semiconductor member packaging process |
-
2008
- 2008-09-22 CN CNU2008201404318U patent/CN201285768Y/en not_active Expired - Fee Related
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104810313A (en) * | 2015-05-06 | 2015-07-29 | 常州银河电器有限公司 | Transfer tool for semiconductor member packaging process |
CN104810313B (en) * | 2015-05-06 | 2017-06-27 | 常州银河电器有限公司 | Semiconductor component potting process week rotating tooling |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C17 | Cessation of patent right | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20090805 Termination date: 20130922 |