CN104810295A - Method for manufacturing selective electronic packaging assembly - Google Patents
Method for manufacturing selective electronic packaging assembly Download PDFInfo
- Publication number
- CN104810295A CN104810295A CN201410036750.4A CN201410036750A CN104810295A CN 104810295 A CN104810295 A CN 104810295A CN 201410036750 A CN201410036750 A CN 201410036750A CN 104810295 A CN104810295 A CN 104810295A
- Authority
- CN
- China
- Prior art keywords
- mould
- electronic
- selectivity
- component
- photosensitive resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims abstract description 30
- 238000004100 electronic packaging Methods 0.000 title claims abstract description 23
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 23
- 239000000463 material Substances 0.000 claims abstract description 73
- 239000007788 liquid Substances 0.000 claims abstract description 35
- 229920005989 resin Polymers 0.000 claims abstract description 33
- 239000011347 resin Substances 0.000 claims abstract description 33
- 238000004806 packaging method and process Methods 0.000 claims abstract description 24
- 239000000758 substrate Substances 0.000 claims abstract description 18
- 230000001678 irradiating effect Effects 0.000 claims abstract description 9
- 238000005507 spraying Methods 0.000 claims abstract description 6
- 239000007921 spray Substances 0.000 claims description 6
- 238000007711 solidification Methods 0.000 claims description 3
- 230000008023 solidification Effects 0.000 claims description 3
- 239000003566 sealing material Substances 0.000 abstract 3
- 238000005538 encapsulation Methods 0.000 description 7
- 238000009281 ultraviolet germicidal irradiation Methods 0.000 description 4
- 239000013078 crystal Substances 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 238000007789 sealing Methods 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 238000006116 polymerization reaction Methods 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000008393 encapsulating agent Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- 238000011112 process operation Methods 0.000 description 1
- 230000001235 sensitizing effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/561—Batch processing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Abstract
The invention provides a method for manufacturing a selective electronic packaging assembly, comprising the following steps: configuring a plurality of electronic components on the surface of a substrate; spraying a liquid photosensitive resin material on the surface of the substrate; irradiating ultraviolet light on the liquid photosensitive resin material to form a bund structure, wherein the bund structure surrounds at least one electronic component; filling the bund structure with a mold sealing material, wherein the mold sealing material coats at least one electronic component; and curing the mold sealing material to form a packaging body, wherein the packaging body coats at least one electronic component.
Description
Technical field
The present invention relates to a kind of selective electronic package assembling and manufacture method thereof.
Background technology
Electronic packaging component common is at present mostly the various electronic components used packaged by encapsulating material, and the function of electronic product gets more and more, so the kind of the inner electronic component integrated of electronic packaging component also gets more and more.But, when all electronic components are all coated within adhesive body, if the afunction of only portions of electronics element, then the carrying out be difficult to for the electronic component of loss of function substitutes; Or some is as photoelectric cell etc., when also not wishing to be wrapped by, then the photoelectric cell of this type also can not be coated within adhesive body.
Generally speaking, for the ease of the electronic component of replacement loss of function or the encapsulation flexibility ratio of increase electronic packaging component, usually can at the multiple different packaging body of electronic packaging component design with the coated different electronic component of difference.
But, in order to make electronic packaging component have multiple different packaging body, in the processing procedure operation making electronic packaging component, design must organize mould to distinguish different electronic components more, so may increase manufacture difficulty and cost.
Summary of the invention
The embodiment of the present invention provides a kind of manufacture method of selective electronic package assembling, in order to improve the processing procedure to existing selective electronic package assembling.
The embodiment of the present invention provides a kind of manufacture method of electronic packaging component, and the manufacture method of described electronic packaging component comprises the multiple electronic component of configuration in the surface of substrate.Spray liquid photosensitive resin material in the surface of substrate.Irradiating ultraviolet light is in liquid photosensitive resin material to form dyke structure, and wherein dyke structure encloses at least one electronic component.Fill mould closure material within dyke structure, wherein the coated at least one electronic component of mould closure material.Solidify mould closure material to form packaging body, wherein at least one electronic component of packaging body coats.
According to one embodiment of the present invention, wherein form the method for a liquid photosensitive resin material for spraying.
According to another embodiment of the invention, wherein spray the step of a liquid photosensitive resin material and the irradiating ultraviolet light step in this liquid photosensitive resin material for carry out simultaneously.
According to another embodiment of the invention, the step wherein filling a mould closure material is carried out under the environment of normal pressure.
According to another embodiment of the invention, wherein after the step filling this mould closure material, discharge this mould closure material air entrapment.
According to another embodiment of the invention, wherein comprise in the step of this mould closure material air entrapment of release: improve environment vacuum degree to remove bubble in mould closure material, wherein, vacuum pressure is between 10
-2holder (torr) is to 10
-3holder (torr).
According to another embodiment of the invention, wherein comprise in the step of this mould closure material air entrapment of release: improve ambient temperature between 90 DEG C to 110 DEG C.
According to another embodiment of the invention, wherein solidification this mould closure material step be in vacuum environment 10
-2holder (torr) is to 10
-3between holder (torr), ambient temperature is between 140 DEG C to 160 DEG C.
In sum, the embodiment of the present invention provides the manufacture method of selective electronic package assembling, the manufacture method of described selective electronic package assembling is by spraying liquid photosensitive resin material repeatedly around electronic component for package, and irradiating ultraviolet light makes it harden to form dyke structure in liquid photosensitive resin material.Subsequently, filling mould closure material within dyke structure makes it be solidified to form packaging body, thus packaging body is able to optionally coated electronic component for package.Therefore, the packaging body 140 of selective electronic package assembling 100 is able to the electronic component 120 of optionally packed part, thus selective electronic package assembling 100 can carry out coated for the electronic component 120 of required encapsulation, and then increase the flexibility ratio of selective electronic package assembling 100 in encapsulation.
In order to technology, method and effect that the present invention takes for reaching set object further can be understood, refer to following detailed description for the present invention, accompanying drawing, believe object of the present invention, feature and feature, when being goed deep into thus and concrete understanding, but appended accompanying drawing and annex only provide with reference to and use is described, be not used for the present invention's in addition limitr.
Accompanying drawing explanation
Figure 1A is the schematic top plan view of the selective electronic package assembling of the embodiment of the present invention.
Figure 1B is the generalized section that in Figure 1A, P-P section along the line illustrates.
Fig. 2 A to 2D is the generalized section that the manufacture method of the selective electronic package assembling of the embodiment of the present invention is formed in each step respectively.
[symbol description]
100 selective electronic package assemblings
110 substrates
120 electronic components
130 dyke structures
130 ' liquid photosensitive resin material
140 packaging bodies
140 ' mould closure material
D1 distributor
M1 protection zone
P1 shower nozzle
U1 ultraviolet source
Embodiment
Figure 1A is the structural representation of the selective electronic package assembling of the embodiment of the present invention, and Figure 1B is the generalized section that in Figure 1A, P-P section along the line illustrates.Refer to Figure 1A and Figure 1B, selective electronic package assembling 100 comprises substrate 110, multiple electronic component 120 and packaging body 140.Electronic component 120 and substrate 110 are electrically connected.On packaging body 140 cover part electronic component 120.
The carrier (carrier) of substrate 110 in order to configure as different electronic component 120, and substrate 110 can be a large-sized circuit yoke plate (circuit substrate panel or circuit substratestrip).Electronic component 120 can be active member or passive device, such as, be wafer, electric crystal, diode, electric capacity, inductance, photoelectric cell or other high frequency, radio-frequency (RF) component etc.
Electronic component 120 can comprise multiple all kinds, that is the kind of these electronic components 120 incomplete same.Electronic component 120 can be multiple incomplete same electronic components, and such as one of them electronic component 120 can be diode, and another electronic component 120 can be wafer.As in Figure 1A and Figure 1B illustrate, electronic component 120 can comprise different kinds, all represents with electronic component 120.But, the present invention is not limited the kind of electronic component 120.
Packaging body 140 is a mould sealing, in order to avoid producing the situations such as unnecessary electric connection or short circuit between electronic component 120.Packaging body 130 can be formed through solidification by the liquid mould sealing (LiquidEncapsulant) being a kind of tool viscosity, such as, be the materials such as epoxy resin (Epoxy resin).What deserves to be explained is, the packaging body 140 of selective electronic package assembling 100 is able to the electronic component 120 of optionally packed part, thus selective electronic package assembling 100 can carry out coated for the electronic component 120 of required encapsulation, and then increase the flexibility ratio of selective electronic package assembling 100 in encapsulation.
In the present embodiment, selective electronic package assembling 100 comprises dyke structure 130, and dyke structure 130 contacts and around packaging body 140.Dyke structure 130 surrounds a protection zone M1 for package, and wherein protection zone M1 is defined as the region that institute encapsulates for selectivity, and packed electronic component 120 is configured in the M1 of protection zone.The material of dyke structure 130 is a liquid photosensitive resin material, and under the UV-irradiation through certain wavelength, liquid photosensitive resin material can produce polymerization reaction to be solidified into dyke structure 130.
What deserves to be explained is, dyke structure 130 is a structure required in the manufacture method process of selective electronic package assembling 100, but, selective electronic package assembling 100 can be selected depending on product demand remove in successive process operation or leave dyke structure 130.Therefore, in other inventive embodiments, selective electronic package assembling 100 can not also comprise dyke structure 130.In addition, selectivity mould envelope electronic packaging component 100 can also continue according to the ELECTROMAGNETIC OBSCURANT demand of product to make ELECTROMAGNETIC OBSCURANT structure (not illustrating).
Fig. 2 A to 2D is the schematic diagram that the manufacture method of the selective electronic package assembling of the embodiment of the present invention is formed in each step respectively.Please sequentially coordinate with reference to Fig. 2 A to 2D.
First, refer to Fig. 2 A, configure multiple electronic component 120 in the surface of substrate 100.In practice, substrate 110 can be a large-sized circuit yoke plate, and electronic component 120 can be wafer, electric crystal, diode, electric capacity, inductance, photoelectric cell or other high frequency, radio-frequency (RF) component etc.Electronic component 120 can install (mount) in the surface of substrate 100 through various ways, such as, be routing mode, cover crystal type or utilize the modes such as surface adhering technical (Surface Mount Technology, SMT).But, the present invention is not limited the configuration mode between electronic component 120 and substrate 100..
Refer to Fig. 2 B, spray a liquid photosensitive resin material 130 ' in the surface of substrate 100, and irradiating ultraviolet light is in liquid photosensitive resin material 130 '.Specifically, first, make by moving of shower nozzle P1 liquid photosensitive resin material 130 ' around at least one electronic component 120 with first define the protection zone M1 for enclosing.Protection zone M1 is the region that in selective electronic package assembling 100, packed body 140 is coated.Shower nozzle P1 sprays out liquid photosensitive resin material 130 ' from level to level, and liquid photosensitive resin material 130 ' is upwards stacking layer by layer.
While shower nozzle P1 sprays out liquid photosensitive resin material 130 ' from level to level, carry out UV-irradiation through ultraviolet source U1, liquid photosensitive resin material 130 ' is irradiated to ultraviolet light and immediately sclerous reaction occurs.What deserves to be explained is, liquid photosensitive resin material 130 ' is a kind of resin material be made up of polymer monomer and performed polymer (prepolymer), is wherein added with sensitising agent.Under the UV-irradiation of certain wavelength, liquid photosensitive resin material 130 ' can produce polymerization reaction and solidify.
Refer to Fig. 2 C, liquid photosensitive resin material 130 ' with UV-irradiation, hardens to make liquid photosensitive resin material 130 ' while upwards stacking layer by layer.In the process spraying liquid photosensitive resin material 130 ' and irradiating ultraviolet light repeatedly, form one around the dyke structure 130 around at least one electronic component 120, wherein dyke structure 130 is round region M1.What deserves to be explained is, in order to the configuration of the height and different electronic components 120 of taking electronic component 120 into account designs, the height of dyke structure 130 and shape can have multiple change, such as, be rectangle frame, polygon frame or arbitrary shape framework.That is; liquid photosensitive resin material 130 ' first can be defined the shape of protection zone M1 by dyke structure 130 through the movement of shower nozzle P1, then adjust the height of dyke structure 130 again according to the height of electronic component 120 or follow-up considering of product processed.
Refer to Fig. 2 D, fill a mould closure material 140 ' within dyke structure 130, wherein the coated at least one electronic component 120 of mould closure material 140 '.Specifically, mould closure material 140 ' is liquid mould sealing (Liquid Encapsulant), and has good mobility and flatness.Mould closure material 140 ' inserted within the protection zone M1 that dyke structure 130 encloses by distributor (dispenser) D1, make mould closure material 140 ' cover the surface of substrate 110 and the coated electronic component 120 be positioned within the M1 of protection zone.In addition, the height inserting mould closure material 140 ' can be rough identical with the height of dyke structure 130, and but, the present invention is not limited this.It should be noted that the step filling mould closure material 140 ' is carried out at normal pressure and the environment of heating, be easy to flow fill up to carry enclose interior space in order to filling mould closure material 140 '.
Can be involved in air or produce bubble in the process filling mould closure material 140 ', and these bubbles can cause inside or outside hole and have influence on the encapsulation quality of product.So after the step filling mould closure material 140 ', will by raising environment vacuum degree and ambient temperature, and maintain this environment vacuum degree and ambient temperature about 1 hour, to discharge the bubble of mould closure material 140 ' inside, wherein vacuum pressure is between 10
-2holder (torr) is to 10
-3between holder (torr), and ambient temperature is between 90 DEG C to 110 DEG C, thus is able to loss at the bubble that mould closure material 140 ' is inner and goes out.
Please again consult Figure 1B, solidify mould closure material 140 ' to form packaging body 140, the wherein coated at least one electronic component 120 of packaging body 140.Specifically, being cured in program process, is also in vacuum environment 10
-2holder (torr) is to 10
-3between holder (torr), improve ambient temperature once again and maintain about 3 hours, wherein ambient temperature is between 140 DEG C to 160 DEG C, solidify to form packaging body 140 to make mould closure material 140 '.In this, selectivity mould envelope electronic packaging component 100 completes haply.What deserves to be explained is, in order to considering of product, dyke structure 130 can be removed or stay by selectivity mould envelope electronic packaging component 100.In addition, selectivity mould envelope electronic packaging component 100 can also continue according to the ELECTROMAGNETIC OBSCURANT demand of product to make ELECTROMAGNETIC OBSCURANT structure.
In sum, the embodiment of the present invention provides the manufacture method of selective electronic package assembling, the manufacture method of described selective electronic package assembling is by spraying liquid photosensitive resin material repeatedly around electronic component for package, and irradiating ultraviolet light makes it harden to form dyke structure in liquid photosensitive resin material simultaneously.Subsequently, filling mould closure material within dyke structure makes it be solidified to form packaging body, thus packaging body is able to optionally coated electronic component for package.Therefore, the packaging body 140 of selective electronic package assembling 100 is able to the electronic component 120 of optionally packed part, thus selective electronic package assembling 100 can carry out coated for the electronic component 120 of required encapsulation, and then increase selective electronic package assembling 100 in product design and application elasticity.
The foregoing is only embodiments of the invention, it is also not used to limit scope of patent protection of the present invention.Those skilled in the art are not departing from spirit of the present invention and scope, and the equivalence of the change done and retouching is replaced, and is still in scope of patent protection of the present invention.
Claims (8)
1. a manufacture method for selectivity mould envelope electronic packaging component, is characterized in that this selectivity mould envelope electronic packaging component comprises:
Configure multiple electronic component in the surface of a substrate;
Form a liquid photosensitive resin material in the surface of this substrate;
Irradiating ultraviolet light is in this liquid photosensitive resin material to form a dyke structure, and wherein this dyke structure encloses this at least one electronic component;
Fill a mould closure material within this dyke structure, wherein this mould closure material is coated on this at least one electronic component; And
Solidify this mould closure material to form a packaging body, wherein this at least one electronic component of this packaging body coats.
2. the manufacture method of selectivity mould envelope electronic packaging component as claimed in claim 1, wherein forms the method for a liquid photosensitive resin material for spraying.
3. the manufacture method of selectivity mould envelope electronic packaging component as claimed in claim 2, wherein sprays the step of a liquid photosensitive resin material and the irradiating ultraviolet light step in this liquid photosensitive resin material for carry out simultaneously.
4. the manufacture method of selectivity mould envelope electronic packaging component as claimed in claim 1, the step wherein filling a mould closure material is carried out under the environment of normal pressure.
5. the manufacture method of selectivity mould envelope electronic packaging component as claimed in claim 1, wherein after the step filling this mould closure material, discharges this mould closure material air entrapment.
6. the manufacture method of selectivity mould envelope electronic packaging component as claimed in claim 5, wherein comprises in the step of this mould closure material air entrapment of release:
Improve environment vacuum degree to remove bubble in mould closure material, wherein, vacuum pressure is between 10
-2holder is to 10
-3holder.
7. the manufacture method of selectivity mould envelope electronic packaging component as claimed in claim 5, wherein comprises in the step of this mould closure material air entrapment of release:
Improve ambient temperature between 90 DEG C to 110 DEG C.
8. the manufacture method of selectivity mould envelope electronic packaging component as claimed in claim 1 is wherein in vacuum environment 10 in the step of this mould closure material of solidification
-2holder is to 10
-3between holder, ambient temperature is between 140 DEG C to 160 DEG C.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410036750.4A CN104810295A (en) | 2014-01-24 | 2014-01-24 | Method for manufacturing selective electronic packaging assembly |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410036750.4A CN104810295A (en) | 2014-01-24 | 2014-01-24 | Method for manufacturing selective electronic packaging assembly |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104810295A true CN104810295A (en) | 2015-07-29 |
Family
ID=53695025
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410036750.4A Pending CN104810295A (en) | 2014-01-24 | 2014-01-24 | Method for manufacturing selective electronic packaging assembly |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104810295A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112867223A (en) * | 2019-11-27 | 2021-05-28 | 启碁科技股份有限公司 | Package structure and method for manufacturing the same |
| US11851379B2 (en) | 2018-07-03 | 2023-12-26 | Corning Incorporated | Selective masking and plugging of honeycomb bodies |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1462013A (en) * | 2002-05-30 | 2003-12-17 | 上海长丰智能卡有限公司 | Method for packaging CPU module for intelligent card with UV glue sticking chip |
| JP2009259977A (en) * | 2008-04-15 | 2009-11-05 | Yaskawa Electric Corp | Underfill equipment and underfill method using the same |
| CN101604639A (en) * | 2009-07-07 | 2009-12-16 | 诺得卡（上海）微电子有限公司 | A kind of method of new UV glue sticking chip packaged chip module |
| DE102010028815A1 (en) * | 2010-05-10 | 2011-11-10 | Nedcard B.V. | Method for encapsulating chip on substrate of chip module, involves hardening filling material and dam material, and adjusting partial hardening of dam material during laying dam materials on radiation device of applicator |
-
2014
- 2014-01-24 CN CN201410036750.4A patent/CN104810295A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1462013A (en) * | 2002-05-30 | 2003-12-17 | 上海长丰智能卡有限公司 | Method for packaging CPU module for intelligent card with UV glue sticking chip |
| JP2009259977A (en) * | 2008-04-15 | 2009-11-05 | Yaskawa Electric Corp | Underfill equipment and underfill method using the same |
| CN101604639A (en) * | 2009-07-07 | 2009-12-16 | 诺得卡（上海）微电子有限公司 | A kind of method of new UV glue sticking chip packaged chip module |
| DE102010028815A1 (en) * | 2010-05-10 | 2011-11-10 | Nedcard B.V. | Method for encapsulating chip on substrate of chip module, involves hardening filling material and dam material, and adjusting partial hardening of dam material during laying dam materials on radiation device of applicator |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11851379B2 (en) | 2018-07-03 | 2023-12-26 | Corning Incorporated | Selective masking and plugging of honeycomb bodies |
| CN112867223A (en) * | 2019-11-27 | 2021-05-28 | 启碁科技股份有限公司 | Package structure and method for manufacturing the same |
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Application publication date: 20150729 |
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