CN104797077B - A kind of circuit board radiating device of downhole water flow regulator - Google Patents
A kind of circuit board radiating device of downhole water flow regulator Download PDFInfo
- Publication number
- CN104797077B CN104797077B CN201510166535.0A CN201510166535A CN104797077B CN 104797077 B CN104797077 B CN 104797077B CN 201510166535 A CN201510166535 A CN 201510166535A CN 104797077 B CN104797077 B CN 104797077B
- Authority
- CN
- China
- Prior art keywords
- poles
- guide bar
- flow guide
- semiconductor
- metal flow
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 title claims abstract description 14
- 239000004065 semiconductor Substances 0.000 claims abstract description 61
- 239000002184 metal Substances 0.000 claims abstract description 44
- 229910052751 metal Inorganic materials 0.000 claims abstract description 44
- 238000002347 injection Methods 0.000 claims abstract description 14
- 239000007924 injection Substances 0.000 claims abstract description 14
- 239000004020 conductor Substances 0.000 claims description 9
- 238000010521 absorption reaction Methods 0.000 claims description 2
- 230000005619 thermoelectricity Effects 0.000 claims 1
- 230000005679 Peltier effect Effects 0.000 abstract description 4
- 238000010276 construction Methods 0.000 abstract description 3
- 230000005611 electricity Effects 0.000 abstract description 2
- 239000000463 material Substances 0.000 abstract description 2
- 230000000694 effects Effects 0.000 description 8
- 238000005516 engineering process Methods 0.000 description 4
- 230000017525 heat dissipation Effects 0.000 description 4
- 230000005678 Seebeck effect Effects 0.000 description 3
- 238000001816 cooling Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 230000005680 Thomson effect Effects 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000033228 biological regulation Effects 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000011084 recovery Methods 0.000 description 1
- 238000005057 refrigeration Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/021—Components thermally connected to metal substrates or heat-sinks by insert mounting
Abstract
The present invention is to provide a kind of circuit board radiating device of downhole water flow regulator, including N poles semi-conductor electricity even summation P poles semiconductor galvanic, metal flow guide bar, wire, fin etc..When radiator is installed in injection well downhole flow regulator, planar fins are close to circuit board, curved surface fin is close to injection well downhole flow regulator inwall, direct current is passed through to the semi-conducting material of radiator during work, electric current is flowed into from N poles semiconductor galvanic, the outflow of P poles semiconductor galvanic, according to Peltier effect, when two kinds of different materials constitute loop, the one end in loop absorbs heat, and the other end then releases heat.It is cold end wherein close to circuit board side, absorbs heat, is hot junction close to injection well downhole flow regulator inwall one end, releases heat.The present invention solves downhole water flow regulator narrow space, the problem of common radiator is difficult to install, and simple in construction, principle novelty, can with the shape be designed according to actual conditions, effectively overcome the problem of radiating of electric circuit in well plate is difficult.
Description
Technical field
The present invention relates to a kind of circuit board radiating device, more particularly to a kind of circuit board radiating device of downhole water flow regulator.
Background technology
Displacement of reservoir oil by filling water is the important oil recovery means of oil field middle and later periods, it is necessary to the moment pair in seperated layer water injection control valve operation
The monitoring and control of underground state in oilfield.By the analysis to these measurement data, processing, and then timely and effectively enter
Control command is simultaneously sent to downhole measurement adjusting equipment by row comprehensive regulation, correctly could effectively be improved and be surveyed tune process.Therefore, underground
The safety of control system work and reliability are the keys for realizing seperated layer water injection.
Due to underground narrow space, injection well downhole flow regulator sealing is tight, and general heat dissipation for circuit board device is difficult to apply.The present invention is in well
Thermoelectric cooling technology is used in lower circuit board radiating device.Thermoelectric cooling is to build on Seebeck effect, Peltier effect, Tom
The new refrigeration technologies of inferior effect, Joule effect, Fourier Effect on the basis of totally five kinds of pyroelectric effects.Seebeck effect：With two kinds
In different conductor composition closed-loop path, when two tie point temperature are different, conductor circuit will produce electromotive force.Peltier is imitated
Should：Peltier effect is the inverse process of Seebeck effect.When constituting loop by two kinds of different materials, the one end in loop absorbs heat
Amount, the other end then releases heat.Thomson effect：If electric current crosses the conductor of thermograde, conductor and surrounding environment it
Between will carry out energy exchange.Joule effect：The heat produced in unit interval by stabling current is equal to conductor resistance and electric current is put down
The product of side.Fourier Effect：The heat conducted in unit interval by uniform dielectric along a direction and this vertical direction
Area and the product of direction thermograde be directly proportional.
The content of the invention
A kind of heat dissipation for circuit board of downhole water flow regulator is provided the invention aims to solve the problems, such as heat dissipation for circuit board
Device.
The object of the present invention is achieved like this：Pasted including the curved surface fin fitted with injection well downhole flow regulator inwall and circuit board
The semiconductor galvanic of the planar fins of conjunction and at least six rows being arranged between curved surface fin and planar fins, and half
Total line number of conductor galvanic couple is even number, and odd-numbered line sets N poles semiconductor galvanic, even number line to set P poles semiconductor galvanic, Mei Geqi
Connected between several rows of N poles semiconductor galvanic with N poles metal flow guide bar, P poles are used between the P poles semiconductor galvanic of each even number line
Metal flow guide bar is connected, and N poles semiconductor galvanic and the P poles semiconductor galvanic of adjacent rows from top to bottom is corresponding each
Connected to form a thermocouple group with heat absorbing end metal flow guide bar between row N pole semiconductors and P poles semiconductor, each N poles metal
Flow guide bar, each P poles metal flow guide bar are to coordinate curved-surface structure with curved surface fin, and each heat absorbing end metal flow guide bar is
The planar structure coordinated with planar fins, and each N poles metal flow guide bar, each P poles metal flow guide bar and curved surface fin
It is fixedly connected, each heat absorbing end metal flow guide bar is fixedly connected with planar fins.
Present invention additionally comprises some such architectural features：
1. each N poles metal flow guide bar, each P poles metal flow guide bar and curved surface fin gemel connection, each heat absorbing end
Metal flow guide bar and planar fins gemel connection.
2. there is the semiconductor galvanic of six rows, three row N pole semiconductor galvanics are alternately distributed with three row P poles semiconductor galvanics.
Compared with prior art, the beneficial effects of the invention are as follows：The present invention solves electric circuit in well using thermoelectric cooling technology
The heat dissipation problem of plate, the present invention can effectively solve downhole water flow regulator narrow space, the problem of common radiator is not easy to install, and
The curved surface fin of the present invention is close to injection well downhole flow regulator inwall, and planar heat spreader is close to circuit board.Radiator can be designed with the shape, can be with
Corresponding size is changed according to the dimensional structure of injection well downhole flow regulator.Simple in construction, principle, modern design of the invention, can also be according to reality
Need to carry out size design.
Brief description of the drawings
Fig. 1 is the structural representation of the present invention；
Fig. 2 is the detailed construction analysis diagram of the present invention；
Fig. 3 is the fundamental diagram of the present invention；
Fig. 4 is schematic view of the mounting position one of the present invention in injection well downhole flow regulator；
Fig. 5 is schematic view of the mounting position two of the present invention in injection well downhole flow regulator.
Embodiment
The present invention is described in further detail with embodiment below in conjunction with the accompanying drawings.
With reference to Fig. 1 to Fig. 5, curved surface fin 1 that the present invention includes fitting with the inwall of injection well downhole flow regulator 10, fit with circuit board 8
Planar fins 7 and at least six rows being arranged between curved surface fin 1 and planar fins 7 semiconductor galvanic, often
Row semiconductor galvanic can have an at least two corresponding semi-conducting material, and total line number of semiconductor galvanic is even number, can be with
The line number and columns to the semiconductor of the present invention are adjusted as needed, as long as ensureing that total line number is that even number just can be with；Odd number
Row sets N poles semiconductor galvanic 4, even number line to set between P poles semiconductor galvanic 5, the N poles semiconductor galvanic of each odd-numbered line and used
N poles metal flow guide bar 2 is connected, and is connected between the P poles semiconductor galvanic of each even number line with P poles metal flow guide bar 3, and by up to
Under each row N poles semiconductors corresponding with P poles semiconductor galvanic 5 of N poles semiconductor galvanic 4 of adjacent rows partly led with P poles
Between body a thermocouple group, each N poles metal flow guide bar 2, each P poles metal are formed with the connection of heat absorbing end metal flow guide bar 6
Flow guide bar 3 is all to coordinate curved-surface structure with curved surface fin 1, and each heat absorbing end metal flow guide bar 6 is matched somebody with somebody with planar fins 7
The planar structure of conjunction, and each N poles metal flow guide bar 2, each P poles metal flow guide bar 3 are fixedly connected with curved surface fin 1, often
Individual heat absorbing end metal flow guide bar 6 is fixedly connected with planar fins 7.Each N poles metal flow guide bar 2, each P poles metal flow guide bar
3 use gemel connection, namely connection side with the gemel connection of curved surface fin 1, each heat absorbing end metal flow guide bar 6 with planar fins 7
Formula is gluing.What the Figure of description of the present invention was provided is the semiconductor galvanic for having six rows, three row N poles semiconductor galvanics 4 and three
Row P poles semiconductor galvanic 5 is alternately distributed.
As Figure 1-Figure 2, two fin (curved surface fin 1 and the plane radiating of radiator provided by the present invention
Piece 7) between multiple semiconductor galvanics by rows are set, same type of semiconductor galvanic, N poles, P poles half are set per a line
Conductor is alternately arranged.N, P pole semiconductor galvanic per a line is connected in parallel by N, P pole metal flow guide bar respectively, Mei Yilie
One group of N, P pole semiconductor linked together by heat absorbing end metal flow guide bar 6.Semiconductor galvanic lateral ends connect curved surface radiating
Piece, a termination planar fins.
Specific work process is as follows：During present invention work, direct current is passed through to radiator.Wherein, it is the N of odd row is extremely golden
Category flow guide bar 2 is cascaded, and connects the positive pole of power supply；P poles metal flow guide bar 3 is cascaded, and connects the negative pole of power supply.Each row
A pair of semiconductor galvanics formation a pair of thermocouples.According to Peltier effect, temperature and heat can be produced at thermocouple junction
Transfer.Heat absorbing end metal flow guide bar one end is the cold end of radiator, and the sense of current is that N poles semiconductor galvanic 4 flows to P poles and partly led
Body galvanic couple 5, temperature drop and absorbs heat.And one end of N, P pole metal flow guide bar is radiator hot junction, the sense of current is P poles half
Conductor galvanic couple 5 flows to N poles semiconductor galvanic 4, and temperature rises and heat release.It is close to circuit in one end of planar fins 7 of radiator
Plate 8, absorbs heat；The inwall of injection well downhole flow regulator 10 is close in the one end of curved surface fin 1, is release end of heat.Present invention application bohr patch effect, is adopted
Designed with profile-followed, radiating effect is notable.As shown in Figure 3：Right side arrow represents heat absorption, and left arrow represents radiating.Fig. 4 and Fig. 5
Give the present invention schematic diagram of the installation site in downhole water flow regulator.
Curved surface fin 1 that the heat spreader structures of the present invention include being oppositely arranged, planar fins 7 and it is arranged on two
The semiconductor galvanic of multiple arranged in sequence between fin, wherein, in multiple semiconductor galvanics a part for N-type semiconductor 4,
Another part is P-type semiconductor 5.Semi-conductor electricity even permutation is in multirow, and same type of semiconductor galvanic is set in often going.Wherein
N-type semiconductor galvanic couple and P-type semiconductor are alternately arranged.The semiconductor galvanic of each row sets a metal flow guide bar.Every two row
In a pair of N, P-type semiconductor galvanic couple formation one galvanic couple group, linked together with heat absorbing end metal flow guide bar 6.Radiator gold
Category flow guide bar side is provided with curved surface fin, and the side of heat absorbing end metal flow guide bar 6 is provided with planar fins 7, of the invention
Bonded together between all kinds of flow guide bars and fin using adhesive means.
Claims (3)
1. a kind of circuit board radiating device of downhole water flow regulator, it is characterised in that：Curved surface including being fitted with injection well downhole flow regulator inwall dissipates
Backing, the planar fins fitted with circuit board and at least six rows that are arranged between curved surface fin and planar fins
Semiconductor galvanic, and total line number of semiconductor galvanic is even number, odd-numbered line sets N poles semiconductor galvanic, even number line to set P poles half
Connected between conductor galvanic couple, the N poles semiconductor galvanic of each odd-numbered line with N poles metal flow guide bar, the P poles of each even number line are partly led
Connected between body galvanic couple with P poles metal flow guide bar, and the N poles semiconductor galvanic and P poles semiconductor of adjacent rows from top to bottom
Connected to form a thermoelectricity with heat absorbing end metal flow guide bar between corresponding each the row N poles semiconductor and P poles semiconductor of galvanic couple
Even group, each N poles metal flow guide bar, each P poles metal flow guide bar are to coordinate curved-surface structure, each heat absorption with curved surface fin
End metal flow guide bar is all the planar structure coordinated with planar fins, and each N poles metal flow guide bar, each P poles metal are led
Stream bar is fixedly connected with curved surface fin, and each heat absorbing end metal flow guide bar is fixedly connected with planar fins.
2. a kind of circuit board radiating device of downhole water flow regulator according to claim 1, it is characterised in that：Each N is extremely golden
Belong to flow guide bar, each P poles metal flow guide bar and curved surface fin gemel connection, each heat absorbing end metal flow guide bar radiates with plane
Piece gemel connection.
3. a kind of circuit board radiating device of downhole water flow regulator according to claim 1 or 2, it is characterised in that：There are six rows
Semiconductor galvanic, three row N pole semiconductor galvanics are alternately distributed with three row P poles semiconductor galvanics.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510166535.0A CN104797077B (en) | 2015-04-09 | 2015-04-09 | A kind of circuit board radiating device of downhole water flow regulator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510166535.0A CN104797077B (en) | 2015-04-09 | 2015-04-09 | A kind of circuit board radiating device of downhole water flow regulator |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104797077A CN104797077A (en) | 2015-07-22 |
| CN104797077B true CN104797077B (en) | 2017-07-11 |
Family
ID=53561471
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510166535.0A Expired - Fee Related CN104797077B (en) | 2015-04-09 | 2015-04-09 | A kind of circuit board radiating device of downhole water flow regulator |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104797077B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR3100376B1 (en) * | 2019-09-03 | 2021-09-10 | Alstom Transp Tech | Electrical switching device and vehicle comprising such a device |
Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN86203921U (en) * | 1986-05-26 | 1987-07-15 | 王学致 | Peltier effect experimental instrument |
| CN1340866A (en) * | 2000-08-31 | 2002-03-20 | 株式会社小松制作所 | Manufacture device for powder thermoelectric material and manufacture method for powder thermoelectric material using the said device |
| CN1341280A (en) * | 1999-02-19 | 2002-03-20 | 派尔技术有限公司 | Solid state thermoelectric device |
| CN1748328A (en) * | 2003-02-07 | 2006-03-15 | Acol技术公司 | Peltier cooler integrated with electronic device(s) |
| CN2814671Y (en) * | 2004-12-06 | 2006-09-06 | 邱洁华 | Semiconductor cooling and radiating device of CPU |
| CN102106010A (en) * | 2008-07-06 | 2011-06-22 | 拉莫斯有限公司 | Split thermo-electric structure and devices and systems that utilize said structure |
| EP2375191A1 (en) * | 2008-12-11 | 2011-10-12 | Lamos Inc. | Thermo-electric structure |
| CN103000799A (en) * | 2012-12-09 | 2013-03-27 | 雍占锋 | Cold end and hot end separated type thermoelectric refrigeration semiconductor technology |
| CN103579713A (en) * | 2012-07-25 | 2014-02-12 | 通用汽车环球科技运作有限责任公司 | Battery with solid state cooling |
| CN204560010U (en) * | 2015-04-09 | 2015-08-12 | 哈尔滨工程大学 | A kind of circuit board radiating device of downhole water flow regulator |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3450318B2 (en) * | 1994-11-21 | 2003-09-22 | 株式会社ワイ・ワイ・エル | Thermoelectric cooling type power lead |
| US20060107986A1 (en) * | 2004-01-29 | 2006-05-25 | Abramov Vladimir S | Peltier cooling systems with high aspect ratio |
-
2015
- 2015-04-09 CN CN201510166535.0A patent/CN104797077B/en not_active Expired - Fee Related
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN86203921U (en) * | 1986-05-26 | 1987-07-15 | 王学致 | Peltier effect experimental instrument |
| CN1341280A (en) * | 1999-02-19 | 2002-03-20 | 派尔技术有限公司 | Solid state thermoelectric device |
| CN1340866A (en) * | 2000-08-31 | 2002-03-20 | 株式会社小松制作所 | Manufacture device for powder thermoelectric material and manufacture method for powder thermoelectric material using the said device |
| CN1748328A (en) * | 2003-02-07 | 2006-03-15 | Acol技术公司 | Peltier cooler integrated with electronic device(s) |
| CN2814671Y (en) * | 2004-12-06 | 2006-09-06 | 邱洁华 | Semiconductor cooling and radiating device of CPU |
| CN102106010A (en) * | 2008-07-06 | 2011-06-22 | 拉莫斯有限公司 | Split thermo-electric structure and devices and systems that utilize said structure |
| EP2375191A1 (en) * | 2008-12-11 | 2011-10-12 | Lamos Inc. | Thermo-electric structure |
| CN103579713A (en) * | 2012-07-25 | 2014-02-12 | 通用汽车环球科技运作有限责任公司 | Battery with solid state cooling |
| CN103000799A (en) * | 2012-12-09 | 2013-03-27 | 雍占锋 | Cold end and hot end separated type thermoelectric refrigeration semiconductor technology |
| CN204560010U (en) * | 2015-04-09 | 2015-08-12 | 哈尔滨工程大学 | A kind of circuit board radiating device of downhole water flow regulator |
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| Publication number | Publication date |
|---|---|
| CN104797077A (en) | 2015-07-22 |
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Granted publication date: 20170711 |