CN104779229B - A kind of chip radiator based on thermoelectric cooling principle - Google Patents
A kind of chip radiator based on thermoelectric cooling principle Download PDFInfo
- Publication number
- CN104779229B CN104779229B CN201510172410.9A CN201510172410A CN104779229B CN 104779229 B CN104779229 B CN 104779229B CN 201510172410 A CN201510172410 A CN 201510172410A CN 104779229 B CN104779229 B CN 104779229B
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- Prior art keywords
- poles
- semiconductor
- chip
- flow deflector
- metal flow
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- 238000001816 cooling Methods 0.000 title claims abstract description 10
- 239000004065 semiconductor Substances 0.000 claims abstract description 40
- 239000002184 metal Substances 0.000 claims abstract description 28
- 239000007788 liquid Substances 0.000 claims abstract description 21
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims abstract description 11
- 239000000919 ceramic Substances 0.000 claims abstract description 7
- FAPWRFPIFSIZLT-UHFFFAOYSA-M Sodium chloride Chemical compound [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 claims abstract description 6
- 239000004020 conductor Substances 0.000 claims description 8
- 230000005679 Peltier effect Effects 0.000 abstract description 7
- 238000012546 transfer Methods 0.000 description 5
- 230000005678 Seebeck effect Effects 0.000 description 3
- 229910010293 ceramic material Inorganic materials 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- 230000005680 Thomson effect Effects 0.000 description 2
- 230000010354 integration Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000005057 refrigeration Methods 0.000 description 2
- 230000005619 thermoelectricity Effects 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
Abstract
It is an object of the invention to provide a kind of chip radiator based on thermoelectric cooling principle, including pedestal, flow channel for liquids, P poles semiconductor, N poles semiconductor, ceramic radiating fin, chip is arranged in pedestal, the flow channel for liquids of saline solution is passed through to be arranged on above pedestal, P poles semiconductor, N poles semiconductor is each led into flow channel for liquids, P poles semiconductor, negative metal flow deflector is set respectively above the semiconductor of N poles, cathode metal flow deflector, negative metal flow deflector connects power cathode wire, cathode metal flow deflector connects positive source wire, ceramic radiating fin is arranged on above negative metal flow deflector and cathode metal flow deflector.Radiator designed by the present invention absorbs the heat that a part of chip is distributed by Peltier effect, and another part heat is taken away by liquid flowing, and radiating effect is notable.
Description
Technical field
The present invention relates to a kind of radiator, specifically chip radiator.
Background technology
With the development of science and technology the size of electronic device is less and less, integration degree more and more higher；Rubbed according to famous
That law：When price is constant, open ended electric crystal number, will about be doubled every 18 months on IC, property
Also one times will can be lifted.The continuous improvement of the integration density of chip, packaging density and working frequency, makes the heat flow density of chip not
It is disconnected to improve.Research shows that the reliability of electronic equipment is closely related with temperature.There is data to show, the failure of electronic equipment has 55%
It is as caused by temperature.And, famous " 10 DEG C of rules " is also indicated that:The temperature of semiconductor devices often raises 10 DEG C, and its is reliable
Property will reduce by 50%.
Thermoelectric cooling is the material with thermoelectric energy transfer characteristic, has refrigerating function when by direct current, due to
Semi-conducting material has optimal thermoelectric energy conversion performance characteristic, so thermoelectric cooling is called semiconductor refrigerating by people.Heat
Electricity refrigeration is to build on Seebeck effect, Peltier effect, Thomson effect, Joule effect, Fourier Effect totally five kinds of thermoelectricity
New refrigeration technologies on the basis of effect.Seebeck effect：Constituted with two kinds of different conductors in closed-loop path, when two tie point temperature
When spending different, conductor circuit will produce electromotive force.Peltier effect：Peltier effect is the inverse process of Seebeck effect.By
When two kinds of different materials constitute loop, the one end in loop absorbs heat, and the other end then releases heat.Thomson effect：If electric current
The conductor of thermograde is crossed, then energy exchange will be carried out between conductor and surrounding environment.Joule effect：In unit interval by
The heat that stabling current is produced is equal to the product of conductor resistance and current squaring.Fourier Effect：By uniform in unit interval
The heat that medium conducts along a direction is directly proportional to the area in this vertical direction and the product of direction thermograde.
The content of the invention
It is an object of the invention to provide a kind of chip cooling based on thermoelectric cooling principle for solving the problems, such as chip cooling
Device.
The object of the present invention is achieved like this：
A kind of chip radiator based on thermoelectric cooling principle of the present invention, it is characterized in that：Including pedestal, flow channel for liquids, P poles
Semiconductor, N poles semiconductor, ceramic radiating fin, chip are arranged in pedestal, and the flow channel for liquids for being passed through saline solution is arranged on pedestal
Side, P poles semiconductor, N poles semiconductor are each led into flow channel for liquids, set negative above P poles semiconductor, N poles semiconductor respectively
Pole metal deflector, cathode metal flow deflector, negative metal flow deflector connection power cathode wire, the connection of cathode metal flow deflector
Positive source wire, ceramic radiating fin is arranged on above negative metal flow deflector and cathode metal flow deflector.
Advantage of the invention is that：The present invention replaces connection P, N poles with the saline solution of flowing using the electric conductivity of saline solution
Metal deflector, radiator work when be passed through direct current, will produce the temperature difference and heat transfer.Wherein it is close to chip-side
Cold end, absorbs heat, is hot junction away from chip one end, releases heat.Compared with traditional chip heat pipe radiator, institute of the present invention
The radiator of design absorbs the heat that a part of chip is distributed by Peltier effect, and another part heat is by liquid fluxion strap
Walk, radiating effect is notable.
Brief description of the drawings
Fig. 1 is structural representation of the invention；
Fig. 2 is profile of the invention；
Fig. 3 is partial enlarged drawing of the invention.
Embodiment
Illustrate below in conjunction with the accompanying drawings and the present invention is described in more detail：
With reference to Fig. 1~3, the present invention includes：Ceramic radiating fin 1, positive source wire 2, N-type semiconductor 3, flow channel for liquids 4,
Chip package 5, pedestal 6, P-type semiconductor 7, power cathode wire 8, cathode metal flow guide bar 9, negative metal flow guide bar 10, core
Piece 11；Chip 11 and chip package are arranged on chip base 6, are provided with chip package on flow channel for liquids 4, flow channel for liquids 4
P poles semiconductor 7 and N poles semiconductor 3 are provided with, two semiconductors are passed into flow channel for liquids 4.N poles semiconductor 3 and P poles are partly led
Metal deflector 9,10 is provided with body 7, the positive pole 2,8 and negative pole of power lead are connected respectively.Set on metal deflector 9,10
It is equipped with the fin 1 of ceramic material.
Specific work process is as follows：When radiator works, the saline solution of firm discharge is passed through in flow channel for liquids, chip is produced
Heat transfer to flow channel for liquids, can take away a part of heat by current.N-type semiconductor and P-type semiconductor connect to thermoelectricity
It is even, dc source is connected, using the electric conductivity formation closed-loop path of water, wherein positive source wire 2 connects positive source, and power supply is born
Polar conductor 8 connects power cathode.The sense of current is followed successively by：Positive source wire 2, cathode metal flow guide bar 9, N-type semiconductor 3, water
Stream, P-type semiconductor 7, negative metal flow guide bar 10.
According to Peltier effect, the transfer of temperature and heat can be produced at thermocouple junction.Following joint is scattered
The cold end of hot device, the sense of current is that N-type semiconductor flows to P-type semiconductor, temperature drop and is absorbed heat.And superincumbent joint
For radiator hot junction, the sense of current is that P-type semiconductor flows to N-type semiconductor, and temperature rises and heat release.In addition, the present invention exists
Radiator hot junction is provided with ceramic material fin, can accelerate the heat release in hot junction.In the course of work of radiator, chip is produced
A heat part taken away by the flowing of water, the temperature transfer that is produced by Peltier effect of a part is taken away, and radiating effect shows
Write.
The structure of the present invention includes chip and chip package, pedestal, flow channel for liquids, P poles semiconductor, N poles semiconductor, metal
Flow guide bar, wire, groups of fins into.Chip package is arranged on chip base, and flow channel for liquids, liquid are provided with chip package
P poles semiconductor and N poles semiconductor are provided with runner, two semiconductors are passed into flow channel for liquids.N poles semiconductor and P poles half
Metal deflector is provided with conductor, the positive pole and negative pole of power lead are connected respectively.Ceramic material is provided with metal deflector
The fin of material.
Claims (1)
1. a kind of chip radiator based on thermoelectric cooling principle, it is characterized in that：Including pedestal, flow channel for liquids, P poles semiconductor, N
Pole semiconductor, ceramic radiating fin, chip are arranged in pedestal, are passed through the flow channel for liquids of saline solution and are arranged on above pedestal, P poles half
Conductor, N poles semiconductor are each led into flow channel for liquids, set negative metal to lead respectively above P poles semiconductor, N poles semiconductor
Flow, cathode metal flow deflector, negative metal flow deflector connection power cathode wire, cathode metal flow deflector connection positive source
Wire, ceramic radiating fin is arranged on above negative metal flow deflector and cathode metal flow deflector.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510172410.9A CN104779229B (en) | 2015-04-13 | 2015-04-13 | A kind of chip radiator based on thermoelectric cooling principle |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510172410.9A CN104779229B (en) | 2015-04-13 | 2015-04-13 | A kind of chip radiator based on thermoelectric cooling principle |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104779229A CN104779229A (en) | 2015-07-15 |
| CN104779229B true CN104779229B (en) | 2017-10-03 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510172410.9A Expired - Fee Related CN104779229B (en) | 2015-04-13 | 2015-04-13 | A kind of chip radiator based on thermoelectric cooling principle |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104779229B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106024732B (en) * | 2016-05-31 | 2018-05-15 | 科大国盾量子技术股份有限公司 | A kind of production method of device for temperature control |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN86103390A (en) * | 1985-04-17 | 1987-06-17 | 加勒特·迈克尔·塞恩斯伯里 | Reciprocating liquid metal magnetohydrodynamic generator |
| CN103307802A (en) * | 2013-01-14 | 2013-09-18 | 贾磊 | TEC electrical-refrigeration CCD (Charge Coupled Device) Dewar with built-in water circulation system |
| CN103690352A (en) * | 2013-11-14 | 2014-04-02 | 李隆 | Efficient ice-fire water bathing device and efficient ice-fire water bathing method |
| CN103975431A (en) * | 2011-11-04 | 2014-08-06 | 富士通株式会社 | Microchannel cooling device, microchannel cooling system, and electronic instrument |
| CN104467255A (en) * | 2013-09-12 | 2015-03-25 | 西安吉帑电子科技有限公司 | Semiconductor-refrigeration-based generator |
| CN204558452U (en) * | 2015-04-13 | 2015-08-12 | 哈尔滨工程大学 | A kind of chip radiator based on thermoelectric cooling principle |
-
2015
- 2015-04-13 CN CN201510172410.9A patent/CN104779229B/en not_active Expired - Fee Related
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN86103390A (en) * | 1985-04-17 | 1987-06-17 | 加勒特·迈克尔·塞恩斯伯里 | Reciprocating liquid metal magnetohydrodynamic generator |
| CN103975431A (en) * | 2011-11-04 | 2014-08-06 | 富士通株式会社 | Microchannel cooling device, microchannel cooling system, and electronic instrument |
| CN103307802A (en) * | 2013-01-14 | 2013-09-18 | 贾磊 | TEC electrical-refrigeration CCD (Charge Coupled Device) Dewar with built-in water circulation system |
| CN104467255A (en) * | 2013-09-12 | 2015-03-25 | 西安吉帑电子科技有限公司 | Semiconductor-refrigeration-based generator |
| CN103690352A (en) * | 2013-11-14 | 2014-04-02 | 李隆 | Efficient ice-fire water bathing device and efficient ice-fire water bathing method |
| CN204558452U (en) * | 2015-04-13 | 2015-08-12 | 哈尔滨工程大学 | A kind of chip radiator based on thermoelectric cooling principle |
Also Published As
| Publication number | Publication date |
|---|---|
| CN104779229A (en) | 2015-07-15 |
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Granted publication date: 20171003 |