CN104794523B - Storage card and electronic device - Google Patents
Storage card and electronic device Download PDFInfo
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- CN104794523B CN104794523B CN201510208292.2A CN201510208292A CN104794523B CN 104794523 B CN104794523 B CN 104794523B CN 201510208292 A CN201510208292 A CN 201510208292A CN 104794523 B CN104794523 B CN 104794523B
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Abstract
A kind of storage card of present invention offer and electronic device.The storage card includes the interconnection terminals for being electrically connected with external electronic.Interconnection terminals can be separated by a distance before storage card, the distance be more than interconnection terminals length.Alternatively, storage card can the front and before interconnection terminals between include other interconnection terminals.Interconnection terminals before and interconnection terminals later can be used for being electrically connected with different types of electronic device.
Description
The application is the Chinese invention for the applying date being on December 7th, 2010 and entitled " storage card and electronic device "
The divisional application of patent application 201010576815.6.
Technical field
The disclosure herein is referred to storage card and electronic device, more particularly, to mobile memory card (removable
Memory card) and electronic device including slot, wherein mobile memory card can be inserted in the slot.
Background technology
Storage card is and such as computer, digital camera, digital camera, mobile phone and personal digital assistant (PDA)
The removable card that various electronic devices are used in combination, for storing or providing data (such as, image data and voice data).It deposits
In a variety of storage cards, such as memory stick card (memory stick card), safe digital card, compact flash card and intelligence
Media card (smart media card).Nonvolatile memory is typically used as storage card, and flash memory is most widely used non-
Volatile memory.
Invention content
The disclosure provides a kind of novel storage card.
The example embodiment of present inventive concept provides storage card.In some example embodiments, storage card may include
Front (front side), below (rear side), first side, second side, top surface, bottom surface and in top and bottom
At least one on first group of interconnection terminals, which is configured to be operatively connected with external electronic.The
Each terminal in one group of interconnection terminals can have the length for being parallel to first direction, first group of interconnection terminals along perpendicular to
The second direction of first direction and be arranged, and at least some of first group of interconnection terminals terminal can be opened with previous space respectively
More than the preset distance of its length.
In the other examples embodiment of present inventive concept, electronic device is provided.The electronic device includes slot,
In the slot include：First group of interconnection terminals is configured to connect with the first storing card operation；And second group of interconnection end
Son is configured to connect with the second storing card operation.First group of interconnection terminals is parallel to second group of interconnection terminals.
Description of the drawings
Attached drawing is included to provide being further understood from for the inventive concept to the present invention, and attached drawing is incorporated to this specification
And it forms part of this specification.Attached drawing shows example embodiments of the present invention and together with verbal description for explaining this hair
Bright example embodiment.In attached drawing：
Fig. 1 is the birds-eye perspective for the storage card for showing the example embodiment according to present inventive concept；
Fig. 2 is the face upwarding view of storage card shown in FIG. 1；
Fig. 3 is the sectional view taken along the line A-A' of Fig. 1；
Fig. 4 is the birds-eye perspective of another example embodiment for the storage card for showing Fig. 1；
Fig. 5 is the face upwarding view for the storage card for showing Fig. 4；
Fig. 6 is the birds-eye perspective of another example embodiment for the storage card for showing Fig. 1；
Fig. 7 is the face upwarding view for the storage card for showing Fig. 6；
Fig. 8 is the birds-eye perspective of another example embodiment for the storage card for showing Fig. 1；
Fig. 9 and Figure 10 is the memory chip for the storage card for showing Fig. 8 and the front view of controller chip and vertical view；
Figure 11 is the birds-eye perspective of another example embodiment for the storage card for showing Fig. 1；
Figure 12 is the face upwarding view for the storage card for showing Figure 11；
Figure 13 is the face upwarding view of another example embodiment for the storage card for showing Fig. 1；
Figure 14 is the birds-eye perspective of another example embodiment for the storage card for showing Fig. 1；
Figure 15 is the face upwarding view for the storage card for showing Figure 13；
Figure 16 and Figure 17 is the memory chip for the storage card for showing Figure 14 and the front view of controller chip and vertical view；
Figure 18 is the birds-eye perspective of another example embodiment for the storage card for showing Fig. 1；
Figure 19 is the face upwarding view for the storage card for showing Figure 18；
Figure 20 is the birds-eye perspective of another example embodiment for the storage card for showing Fig. 1；
Figure 21 is the face upwarding view for the storage card for showing Figure 20；
Figure 22 is the birds-eye perspective of another example embodiment for the storage card for showing Fig. 1；
Figure 23 is the face upwarding view for the storage card for showing Figure 22；
Figure 24 is the face upwarding view of another example embodiment for the storage card for showing Fig. 1；
Figure 25 is the face upwarding view of another example embodiment for the storage card for showing Fig. 1；
Figure 26 is the face upwarding view of another example embodiment for the storage card for showing Fig. 1；
Figure 27 is the face upwarding view of another example embodiment for the storage card for showing Fig. 1；
Figure 28 is the signal for the electronic device according to example embodiment for showing to be used together with the storage card of Figure 26
Property perspective view；
Figure 29 is the face upwarding view of another example embodiment for the storage card for showing Fig. 1；
Figure 30 is the birds-eye perspective of another example embodiment for the storage card for showing Fig. 1；
Figure 31 is the face upwarding view for the storage card for showing Figure 30；
Figure 32 is the signal for the electronic device according to example embodiment for showing to be used together with the storage card of Figure 30
Property perspective view；
Figure 33 is the birds-eye perspective of another example embodiment for the storage card for showing Fig. 1；
Figure 34 is the face upwarding view for the storage card for showing Figure 33；
Figure 35 is the decomposition perspective view of another example embodiment for the storage card for showing Fig. 1；
Figure 36 is the perspective schematic view for showing the electronic device according to illustrated embodiments of the invention；
Figure 37 is the perspective for the storage card according to example embodiment for showing to be used together with the electronic device of Figure 36
Figure；
Figure 38 is the perspective schematic view of another example embodiment for the electronic device for showing Figure 36；
Figure 39 is the perspective for the electronic device according to example embodiment for showing to be used together with the storage card of Fig. 8
Figure；
Figure 40 is the perspective for the electronic device according to example embodiment for showing to be used together with the storage card of Figure 14
Figure；
Figure 41 and Figure 42 is the view for the memory chip according to example embodiment for showing to can be used for said memory card；
Figure 43 is the schematic diagram for the storage card according to example embodiment for being shown provided with protector；
Figure 44 is the schematic diagram for the storage card for being shown provided with accessory power supply；
Figure 45 is the upward view for showing the storage card including bypass weld pad according to example embodiment；
Figure 46 is the view for showing the storage card when removing protective cover from the storage card of Figure 45；
Figure 47 is the sectional view taken along the line B-B' of Figure 45；And
Figure 48 is shown for selectively using one of two groups of interconnection terminals of storage card according to example embodiment
The view of structure.
Specific implementation mode
With reference to the attached drawing of the example embodiment for showing present inventive concept, to obtain to inventive concept, inventive concept
The advantages of and by carry out an invention design by realize target sufficient understanding.
Below, example embodiment will be explained by referring to accompanying drawing to describe present inventive concept in detail.In attached drawing, in order to
Clearly, the length of layer and region and size can be exaggerated.Identical reference numeral refers to identical element in attached drawing.
It will be appreciated that though term first, second, and third etc. may be used here to describe various elements, but these
Element should not be so limited to these terms.These terms are for differentiating an element with another element.Therefore, discussed below
First element can be referred to as second element, without departing from the introduction of present inventive concept.
It should be appreciated that when claiming another element "upper" of an element such as layer, region or substrate " ", " being connected to " or " coupling
To " another element when, it can directly on another element, be directly connected to or be couple to another element, or may exist
Insertion element.On the contrary, when claim an element directly on another element or layer, " being directly connected to " or " being directly coupled to " it is another
When one element or layer, then the element or layer being inserted into is not present.Similar reference numeral refers to similar element always.Such as institute here
With term "and/or" includes the arbitrary and all combination of relevant item listed by one or more.
Terminology used here is not intended to limit structure of the present invention just for the sake of the purpose of description specific example embodiments
Think.As used herein, clearly state unless the context otherwise, otherwise singulative " one " and "the" be intended to simultaneously include
Plural form.It is also understood that term " include " and or " include " specifies the spy when used in this manual
Sign, entirety, step, operation, the presence of element and/or component, but be not precluded one or more of the other feature, entirety, step,
Operation, the presence or increase of element, component and/or a combination thereof.
Unless otherwise defined, all terms (including technical terms and scientific terms) used herein all have institute of the present invention
The normally understood same meaning of those of ordinary skill institute in category field.It is also understood that defined in such as universaling dictionary
Term, explicitly defined, otherwise should be interpreted as having and their containing in the context of related field except not here
The consistent meaning of justice, and it is not necessarily to be construed as Utopian or over formalization meaning.
Fig. 1 and Fig. 2 is the perspective view for showing the storage card 200 according to the example embodiment of present inventive concept.Fig. 3 is along figure
The sectional view that 1 line A-A' takes.Fig. 1 is the birds-eye perspective for showing storage card 200, and Fig. 2 is to show looking up for storage card 200
Perspective view.In current example embodiment, nonvolatile memory may be used in storage card 200.For example, non-volatile memories
Device can be flash memory.
Referring to figs. 1 to Fig. 3, storage card 200 includes circuit board 230, semiconductor chip 232 and molded components (mold
member)220.Semiconductor chip 232 includes memory chip 234 and controller chip 236.Memory chip 234 and control
Device chip 236 can have stacked structure.For example, memory chip 234 can be stacked on top of each other, controller chip 236 can be set
In on uppermost memory chip 234.In another example, a memory chip 234 can be used only.In another example
In, memory chip 234 can be spaced apart with controller chip 236.Controller chip 236 can be less than memory chip 234.
Circuit board 230 includes passive block (for example, passive block 739 shown in Figure 17).Passive block may include
Capacitor or register.Interconnection terminals 238 are formed on the outer surface of circuit board 230, for external electrical device (for example,
Electronic device 5100 shown in Figure 36) electrical connection.Near first side 245 (will describe later) in interconnection terminals 238
One can be power (power) interconnection terminals for being used for input/output (I/O).In addition, conductive trace (conductive
Trace) (not shown) is formed on circuit board 230, to be electrically connected chip 234 and 236, interconnection terminals 238 and passive block.
Molded components 220 are provided so that the top surface of semiconductor chip 232 and circuit board 230 is completely covered.
When from external observation, storage card 200 includes top surface 241, bottom surface 242, front 243, back 244, first side
245 and second side 246.243 and below 244 is generally parallel to each other before storage card 200.In addition, the top surface of storage card 200
241 and bottom surface 242 it is generally parallel to each other, top surface 241 and front 243 are substantially perpendicular to each other.The first side 245 of storage card 200
It is generally parallel to each other with second side 246.First side 245 is approximately perpendicular to top surface 241 and front 243.It is, storage card
200 substantially have thin parallelepiped shape.When from top surface, being parallel to the direction of first side 245 will be referred to as
First direction 12, second direction 14 will be referred to as by being parallel to the direction of front 243.In addition, perpendicular to first direction 12 and second
The direction in direction 14 will be referred to as third direction 16.
Label (label) (not shown) can be arranged on top surface 241.Label can be bur or is printed with ink.
In the bottom surface of storage card 200 242, interconnection terminals 238 are exposed.Interconnection terminals 238 can be arranged in bottom surface 242 close to front
At 243 region.Interconnection terminals 238 can be in a second direction 14 arrangements.In addition, interconnection terminals 238 can be parallel to first party
To 12.
Interconnection terminals 238 can be spaced apart preset distance with front 243.The preset distance may be determined such that interconnection
Terminal 238 can not be stacked in interconnection terminals (such as, the storage of Figure 37 of size different storing card similar with storage card 200
The interconnection terminals 5162 of card 5160) on.For example, different storing card 5160 can be micro- safe digital card, in the close of its bottom surface
There are interconnection terminals on the region of the front.In addition, the preset distance can be more than the length of interconnection terminals 238.Interconnection terminals
238 length can be equal.Interconnection terminals 238 can be in alignment with each other.Alternatively, some interconnection terminals 238 can be longer than other
Interconnection terminals 238.In this case, interconnection terminals 238 in face of below 244 end can be in alignment with each other.For example, compared with
Long interconnection terminals 238 can be power terminal.
Fig. 4 and Fig. 5 shows storage card 300.Fig. 4 is the birds-eye perspective for showing storage card 300, and Fig. 5 is to show to store
The face upwarding view of card 300.Storage card 300 has thin parallelepiped similar with storage card shown in Fig. 1 to Fig. 3 200
Shape.It the position of the interconnection terminals 338 of storage card 300 can be with the interconnection terminals 238 of storage card shown in Fig. 1 to Fig. 3 200
Position it is similar.Prominent 312 are arranged on the top surface of storage card 300 341.Protrusion 312 can be arranged deposits in the close of top surface 341
Behind card storage 300 in 344 region.Prominent 312 extend to first side 345 and second side 346.In addition, prominent
312 can rounded (rounded) and forwardly 343 protrusion.Alternatively, when from top surface, prominent 312 can have square
Shape shape.Due to prominent 312, user can easily hold storage card 300.Relatively thick device can be arranged in storage card
On 300 circuit board below prominent 312.
Fig. 6 and Fig. 7 shows storage card 400.Fig. 6 is the birds-eye perspective for showing storage card 400, and Fig. 7 is to show to store
The face upwarding view of card 400.Storage card 400 can have Boping row similar with storage card shown in Fig. 1 to Fig. 3 200 six
Face shape.It the position of the interconnection terminals 438 of storage card 400 can be with the interconnection end of storage card shown in Fig. 1 to Fig. 3 200
The position of son 238 is similar.Protrusion similar with the protrusion 312 of storage card 300 of Fig. 4 412 can be arranged on the top of storage card 400
On face 441.In addition, storage card 400 is included in the chamfering (chamfer) 461 between front 443 and second side 446, and chamfering
461 become far from first side 445 with second side 446 is advanced to from front 443.Chamfering 461 can prolong from top surface 441
Reach bottom surface 442.
Fig. 8 to Figure 10 shows storage card 401.Fig. 8 is the birds-eye perspective for showing storage card 401, Fig. 9 and Figure 10 difference
It is the front view and vertical view of the storage card 401 of Fig. 8, memory chip 434 and controller chip for showing storage card 401
436.Storage card 401 has shape similar with Fig. 6 and storage card shown in Fig. 7 400.However, as shown in figure 8, chamfering 461a
The predetermined depth to storage card 401 is formed from the top surface of storage card 401 441.For example, being deposited when the thickness for protruding 412 is not included in
When in the thickness of card storage 401, predetermined depth can be the half of the thickness of storage card 401.Alternatively, working as the thickness of protrusion 412 not
When being included in the thickness of storage card 401, predetermined depth can be less than the half of 401 thickness of storage card.As shown in figure 9, storage
Card 401 includes molded components 420, circuit board 430 and passive block 439.
As described above, controller chip 436 can be less than memory chip 434.In this case, when from top surface
When memory chip 434, memory chip 434 can be partly be overlapped with chamfering 461a；When the controller chip from top surface
When 436, controller chip 436 can be located at outside chamfering 461a.In addition, when the memory chip 434 from first side 445
When, memory chip 434 can be Chong Die with chamfering 461a.The memory chip 434 with relatively large size can be set as a result,
It sets in the storage card 401 including chamfering 461a and with finite size.
When storage card (400,401) is inserted into the slot of electronic device by user, chamfering (461,461a) can be to prevent
It is only reversed to be inserted into.For example, the storage card 401 of Fig. 8 can be used together with electronic device 5300 (with reference to Figure 39), the electronic device
5300 in slot 5320 include protrusion corresponding with chamfering 461a 5360 (with reference to Figure 39) (with reference to Figure 39).
Figure 11 and Figure 12 shows storage card 500.Figure 11 is the birds-eye perspective for showing storage card 500, and Figure 12 is to show
The face upwarding view of storage card 500.Storage card 500 can have Boping row similar with storage card 200 shown in Fig. 1 to 3
Hexahedral shape.It the position of the interconnection terminals 538 of storage card 500 can be with the interconnection end of storage card 200 shown in Fig. 1 to 3
The position of son 238 is similar.Protrusion similar with the protrusion 312 of storage card 300 of Fig. 4 512 can be arranged on the top of storage card 500
On face 541.However, the protrusion 512 of storage card 500 can be provided on top surface 541 from the region close to first side 545 to
Close on the region of second side 546.Chamfering similar with the chamfering 461 of storage card 400 of Fig. 6 561 can be provided in storage
The corner of card 500.In addition, storage card 500 includes the recess (notch) 562 in second side 546.Recess 562 can be substantially
It is arranged in the centre of second side 546.Recess 562 can extend to bottom surface 542 from the top surface of storage card 500 541.Alternatively,
Recess 562 can be formed in first side 545 or recess can be respectively formed at first side 545 and second side 546
In.
Figure 13 shows storage card 501.Figure 13 is the vertical view of storage card 501.The shape of storage card 501 and Figure 11 and figure
The shape of storage card 500 shown in 12 is similar.However, recess 562a forms the predetermined depth to storage card 501 from top surface 541.
For example, when prominent 512 thickness is not included in the thickness of storage card 501, predetermined depth can be 501 thickness of storage card
Half.Alternatively, when prominent 512 thickness is not included in the thickness of storage card 501, predetermined depth can be less than storage card
The half of 501 thickness.
Although being not shown in fig. 13, in storage card 501, when the memory chip from top surface, storage
Device chip can be partly be overlapped with recess 562a；When the controller chip from top surface, controller chip can be located at recessed
Outside mouth 562a.In addition, when the controller chip from second side 546 ', controller chip can be with the parts recess 562a
Ground is overlapped.
Figure 14 is to Figure 17 shows storage cards 700.Figure 14 is the birds-eye perspective for showing storage card 700, and Figure 15 is to show
The face upwarding view of storage card 700.In addition, Figure 16 and Figure 17 are the front view and vertical view of storage card 700, stored for showing
Device chip 734 and controller chip 736.Storage card 700 can have similar with storage card shown in Fig. 1 to Fig. 3 200 thin
Parallelepiped shape.The position of the interconnection terminals 738 of storage card 700 can be similar to storage card shown in Fig. 1 to Fig. 3
The position of 200 interconnection terminals 238.Protrusion similar with the protrusion 312 of storage card 300 of Fig. 4 712 can be arranged in storage card
On 700 top surface 741.First groove 763 can be formed in the region close to first side 745 of the top surface 741 of storage card 700
In, second groove 764 can be formed in top surface 741 close in the region of second side 746.The longitudinal direction side of first groove 763
To first direction 12 can be parallel to.First groove 763 can have constant width G in their longitudinal directionW1.First groove
763 end extends to 743 before storage card 700.The length G of first groove 763 and second groove 764L1Can be
The length C of storage card 700LAbout 1/4 to about 3/4.For example, length GL1Can be the length C of storage card 700LAbout 1/2.This
Outside, the side of first groove 763 extends to first side 745.The width G of first groove 763W1It can be storage card 700
Width CWAbout 1/20 to about 1/10.For example, the width G of first groove 763W1It can be the width C of storage card 700WPact
1/12.First groove 763 can extend to predetermined depth from 700 top surface 741.For example, the predetermined depth can be storage card
About the 1/2 of 700 thickness.First groove 763 and second groove 764 can be about the dotted lines at the center by storage card 700
(imaginary line) 18 is symmetrical and is roughly parallel to first side 745.
As described above, controller chip 736 can be less than memory chip 734.In this case, when from top surface
When memory chip 734, memory chip 734 can partly overlap with groove 763 and 764；When the controller core from top surface
When piece 736, controller chip 736 can be arranged outside groove 763 and 764.In addition, when being controlled from first side 745
When device chip 736, controller chip 736 can partly overlap with groove 763 and 764.Although storage card 700 includes groove 763
With 764 and with limited size, but the memory chip 734 with large-size can also be arranged in storage card 700.
Alternatively, only one of first groove 763 and second groove 764 can be formed in storage card 700.In addition, first
Groove 763 and second groove 764 can extend to the bottom surface 742 of storage card 700 from top surface 741.
In the above examples, the end of groove 763 and 764 extends to front 743, and another end of groove 763 and 764
Extend to the position being spaced apart with below 744.However, alternatively, the end of groove 763 and 764 extends to front 743,
And another end of groove 763 and 764 extends to next 744.
In addition, in the above examples, the outer side edges of groove 763 and 764 extend to first side 745 and second side 746.
However, alternatively, the outer side edges of groove 763 and 764, which extend to, inwardly separates with first side 745 and second side 746
Position.
When storage card 700 is inserted into the slot of electronic device by user, groove 763 and 764 can prevent reversely
It is inserted into.For example, the storage card 700 of Figure 14 can be used together with electronic device 5400 (with reference to Figure 40), the electronic device 5400
Include and groove 763 and 764 corresponding protrusions 5460 (with reference to Figure 40) in slot 5420 (with reference to Figure 40).Such as Figure 16 institutes
Show, storage card 700 further includes molded components 720 and circuit board 730.
Figure 18 and Figure 19 shows storage card 800.Figure 18 is the birds-eye perspective for showing storage card 800, and Figure 19 is to show
The face upwarding view of storage card 800.Storage card 800 can have the Boping similar with storage card shown in Fig. 1 to Fig. 3 200
Row hexahedral shape.It the position of the interconnection terminals 838 of storage card 800 can be mutual with storage card shown in Fig. 1 to Fig. 3 200
Even terminal 238 is similar.The protrusion 812 similar with the protrusion 312 of storage card 300 of Fig. 4 can be arranged in the top surface of storage card 800
On 841.It is similar with the first groove 763 and second groove 764 of Figure 14 and storage card shown in figure 15 700,863 He of first groove
Second groove 864 can be formed in the side 845 and 846 the two of storage card 800.In addition, the first recess 865 can be formed in
In first side 845.The length G of the first groove 863 of storage card 800L2Storage card 700 shown in Figure 14 and 15 can be less than
First groove 763 length.First groove 863 extends to front 843, the length G of first groove 863L2It can be shorter than
The length C of storage card 800LAbout 1/2.For example, the length G of first groove 863L2Can be the length C of storage card 800LPact
1/4 to about 3/8.The central portion in the first side 845 of storage card 800 can be arranged in first recess 865.First recess
865 width NWThe width G of first groove 863 can be equal toW2.The length N of first recess 865LIt can be first groove 863
Length GL2About 1/8 Dao about 1/6.First recess 865 can extend to predetermined depth from top surface 841.For example, the first recess 865
Thickness NTThe thickness G of first groove 863 can be equal toT.For example, the predetermined depth of first side 845 can not include protruding
About the 1/2 of the thickness of the storage card 800 of 812 thickness.In addition, second groove 864 and the second recess 866 can be formed in second
In side 864.Second groove 864 and the second recess 866 can be about the dotted lines 18 and the first ditch at the center by storage card 800
Slot 863 and the first recess 865 are symmetrical and be roughly parallel to first side 845.First recess 865 is in a first direction on 12 with first
Groove 863 is spaced a predetermined distance from.
Alternatively, only one of first groove 863 and second groove 864 can be formed in storage card 800.In addition, first
Groove 863 and second groove 864 can extend to bottom surface 842 from the top surface of storage card 800 841.In addition, only the first recess 865
It can be formed in storage card 800 with one of the second recess 866.Prominent 812 can not be provided in the top surface of storage card 800 841
On.In addition, the first recess 865 can extend to bottom surface 842 from the top surface of storage card 800 841.
Figure 20 and Figure 21 shows storage card 900.Figure 20 is the birds-eye perspective for showing storage card 900, and Figure 21 is to show
The face upwarding view of storage card 900.Storage card 900 can have the Boping row similar with storage card 200 shown in Fig. 1 to 3
Hexahedral shape.The position of the interconnection terminals 938 of storage card 900 can be similar to the mutual of storage card 200 shown in Fig. 1 to 3
The even position of terminal 238.The protrusion 912 similar with the protrusion 312 of storage card 300 of Fig. 4 can be arranged on the top of storage card 900
On face 941.Similar to the first groove 763 and second groove 764 of storage card 700 shown in Figure 14 and Figure 15, first groove
963 and second groove 964 can be formed in the side 945 and 946 the two of storage card 900.In addition, the storage card 400 with Fig. 6
The similar chamfering 961 of chamfering 461 can be provided in the corner of storage card 900.Alternatively, chamfering 961 can with Fig. 8 fall
Angle 461a is similar.
Figure 22 and Figure 23 shows storage card 1000.Figure 22 is the birds-eye perspective for showing storage card 1000, and Figure 23 is to show
Go out the face upwarding view of the storage card 1000 including bottom surface 1042.Storage card 1000 can have to be deposited with shown in Fig. 1 to Fig. 3
The similar thin parallelepiped shape of card storage 200.The position of the interconnection terminals 1038 of storage card 1000 can in Fig. 1 to Fig. 3
The position of the interconnection terminals 238 of the storage card 200 shown is similar.The protrusion similar with the protrusion 312 of storage card 300 of Fig. 4
1012 can be arranged on the top surface of storage card 1,000 1041.In addition, the chamfering similar with the chamfering 461 of storage card 400 of Fig. 6
1061 can be provided in the corner of storage card 1000.Similar to the first groove of storage card 700 shown in Figure 14 and Figure 15
763, groove 1063 can be formed in the first side 1045 of storage card 1000.Similar to storage card 500 shown in Figure 11
The second recess 562, recess 1066 can be formed in the second side 1046 of storage card 1000.
Figure 24 shows storage card 1100.Figure 24 is the face upwarding view for showing storage card 1100.Storage card 1100 can be with
With the thin parallelepiped shape similar with storage card shown in Fig. 1 to Fig. 3 200.Storage card 1100 includes interconnection terminals
1138, and one or more of interconnection terminals 1138 interconnection terminals 1138a can be longer than other terminal 1138b.For example, mutually
Even terminal 1138a can be twice or more times of the power terminal that length is other terminal 1138b.The face of interconnection terminals 1138
Below 1144 end can be arranged along identical line, and another end of power terminal 1138a can be than other terminals
Another end of 1138b is closer to front 1143.For example, interconnection terminals 1138a can be power terminal 1138a.Show another
In example, multiple interconnection terminals 1138a can be provided, these interconnection terminals 1138a can be power terminal.
Figure 25 shows storage card 1200.Figure 25 is the face upwarding view for showing storage card 1200.Storage card 1200 can be with
With the thin parallelepiped shape similar with storage card shown in Fig. 1 to Fig. 3 200.Protection zone 1242b can be in front
It is provided on the bottom surface of storage card 1,200 1242 between 1243 and interconnection terminals 1238.Protection zone 1242b can by with for
The material that the material for another region 1242a for forming bottom surface 1242 is different is formed.With the material for being used to form other region 1242a
Compare, protection zone 1242b can by when storage card 1200 contacts interconnection terminals 5140b to the interconnection terminals of electronic device
(such as, the interconnection terminals 5140b of the electronic device 5100 of Figure 36) damages smaller material and is formed.Protection zone 1242b can be with
With rectangular shape.The longitudinal direction of protection zone 1242b can be parallel to second direction 14.Protection zone 1242b's
Length PLIt can be sufficiently large with throughout the width T of interconnection terminals 1238W.For example, protection zone 1242b can be from close to the first side
The position in face 1245 extends proximate to the position of second side 1246.Alternatively, protection zone 1242b can be from first side
1245 extend to second side 1246.The width P of protection zone 1242bWThe length of each interconnection terminals 1238 can be more than.It protects
Shield region 1242b can be arranged from the interconnection terminals of different storage cards (such as, the interconnection terminals of the storage card 5160 of Figure 37
5162) at corresponding position, the size of the different storage card is similar to the size of the storage card 1200 of present example.Example
Such as, different storage cards 5160 can be above-mentioned micro- safe digital card.
In the examples described above, interconnection terminals are parallel to second direction 14 and are disposed proximate to storage card on the bottom surface of storage card
Before.However, interconnection terminals can be arranged in close to behind storage card on the bottom surface of storage card.In addition, interconnection terminals can
To be not parallel to second direction 14.In addition, interconnection terminals can be arranged on the top surface of storage card.
Figure 26 is the perspective view for showing the storage card 1300 according to another example embodiment of the present invention.Figure 26 is to show to store
The face upwarding view of card 1300.Storage card 1300 can have the Boping row six similar with storage card 200 shown in Fig. 1 to 3
Face shape.Storage card 1300 includes multigroup interconnection terminals 1338.For example, storage card 1300 may include two groups of interconnection terminals
1338.For example, with Fig. 1 to the interconnection to the corresponding storage card of the interconnection terminals 238 of storage card shown in Fig. 3 200 1300
Terminal 1338 will be referred to as first group of interconnection terminals 1338a now, and other interconnection terminals 1338 will be referred to as second group of interconnection end
Sub- 1338b.
The number of first group of interconnection terminals 1338a can be different from the number of second group of interconnection terminals 1338b.For example, the
The number of one group of interconnection terminals 1338a can be nine, and the number of second group of interconnection terminals 1338b can be eight.In such case
Under, first group of interconnection terminals 1338a can also include the pin (pin) for being exclusively used in I/O.Being exclusively used in the pin of I/O can most connect
Nearly first side.Alternatively, the number of first group of interconnection terminals 1338a can be equal to the number of second group of interconnection terminals 1338b.
Second group of interconnection terminals 1338b setting is in front between 1343 and first group of interconnection terminals 1338a.For example, wherein
The region that second group of interconnection terminals 1338b is arranged can correspond to be provided with the size different storages similar from storage card 1300
The region of the interconnection terminals (such as, the interconnection terminals 5162 of the storage card 5160 of Figure 37) of card.For example, different storing card 5160 can
To be above-mentioned micro- safe digital card.The number of second group of interconnection terminals 1338b can be equal to the number of first group of interconnection terminals 1338a
Mesh, and second group of interconnection terminals 1338b can be arranged with interval identical with first group of interconnection terminals 1338a.In this feelings
Under condition, as shown in figure 26, second group of interconnection terminals 1338b can be aligned with first group of interconnection terminals 1338a respectively.Alternatively,
Interconnection terminals 1438 can be staggered.For example, the first group of interconnection terminals 1438a and second group of interconnection terminals of storage card 1400
1438b can be staggered, as shown in figure 27.
First group of interconnection terminals 1338a and second group of interconnection terminals 1338b can be used for different electronic devices.First group
Interconnection terminals 1338a is inserted into the slot of the first electronic device, for being electrically connected with first electronic device, and second
Group interconnection terminals 1338b is inserted into the slot of second electronic device, for being electrically connected with second electronic device.
First electronic device and second electronic device can be used for different purposes.First electronic device and the second electronics dress
It may include slot that storage card can be fully inserted therein each of to set.First electronic device and second electronic device can be with
Different storage cards are used together, and the quantity, size and arrangement for providing the interconnection terminals at the slot of the first electronic device can
With different from the quantity, size and the arrangement that provide the interconnection terminals at the slot of second electronic device.
Figure 28 shows the example of the example and second electronic device 2200 of the first electronic device 2100.First electronic device
2100 can be one of the device of such as computer, digital camera, digital camera, mobile phone and personal digital assistant (PDA),
And second electronic device 2200 can be another in these devices.Alternatively, the first electronic device 2100 and the second electronics
Device 2200 can be the electronic device of same type.For example, the first electronic device 2100 and second electronic device 2200 can be
Mobile phone.
First electronic device 2100 and second electronic device 2200 may include having similarly sized 2120 He of slot
2220.Interconnection terminals 2140 and 2240 are provided in slot 2120 and 2220, are used for external memory card (such as, shown in Figure 26
Storage card 1300) electrical connection.For example, interconnection terminals 2140 and 2240 can be provided in the bottom surface of slot 2120 and 2220.
The distance between the interconnection terminals 2140 of the slot 2120 of first electronic device 2100 and the entrance 2122 of slot 2120 shorter than the
The distance between the interconnection terminals 2240 of the slot 2220 of two electronic devices 2200 and the entrance 2222 of slot 2220.In this feelings
Under condition, if storage card 1300 is inserted into (with reference to Figure 26) in the slot 2120 of the first electronic device 2100, first group mutual
Even terminal 1338a is electrically connected to the interconnection terminals 2140 of the first electronic device 2100.In addition, if storage card 1300 is (with reference to figure
26) it is inserted into the slot 2220 of second electronic device 2200, then second group of interconnection terminals 1338b is electrically connected to the second electronics
The interconnection terminals 2240 of device 2200.
Figure 29 shows another example storage card 1500.Figure 29 is the face upwarding view for showing storage card 1500.Storage card
1500 can have the thin parallelepiped shape similar with storage card shown in Fig. 1 to Fig. 3 200.Storage card 1500 wraps
Include multiple interconnection terminals 1538a and 1538b.For example, storage card 1500 may include first group of interconnection terminals 1538a and second group
Interconnection terminals 1538b.First group of interconnection terminals 1538a of storage card 1500 can be arranged in the bottom surface of storage card 1,500 1542
Close in 1544 region below.Second group of interconnection terminals 1538b of storage card 1500 can be arranged at the bottom of storage card 1500
In the region close to front 1543 in face 1542.
Figure 30 and Figure 31 shows storage card 1600.Figure 30 is the birds-eye perspective for showing storage card 1600, and Figure 31 is to show
The face upwarding view of storage card 1600.Storage card 1600 can have similar with storage card shown in Fig. 1 to Fig. 3 200 thin
Parallelepiped shape.Storage card 1600 includes multiple interconnection terminals 1638a and 1638b.For example, storage card 1600 may include
First group of interconnection terminals 1638a and second group of interconnection terminals 1638b.First group of interconnection terminals 1638a can be arranged in storage card
On 1600 top surface 1641, second group of interconnection terminals 1638b can be arranged on the bottom surface of storage card 1,600 1642.For example, the
One group of interconnection terminals 1638a can be arranged in the region close to front 1643 of the top surface of storage card 1,600 1641, second group
Interconnection terminals 1638b can be arranged in the region close to front 1643 of the bottom surface of storage card 1,600 1642.
In the storage card 1300,1400,1500 and 1600 of Figure 26,27,29 and 31, first group of interconnection terminals 1338a,
One group in 1438a, 1538a and 1638a and second group of interconnection terminals 1338b, 1438b, 1538b and 1638b can use protection
Layer covering.Protective layer can be solder resist (solder resist) or other materials.For example, protective layer can be epoxy
Compound or epoxidation zone (epoxy tape).
With reference to Figure 32, the first electronic device 3100 includes slot 3120, and interconnection terminals 3140 are provided on the top of slot 3120
On face.Second electronic device 3200 includes slot 3220, and interconnection terminals 3240 are provided on the bottom surface of slot 3220.Storage card
1600 can be used for both the first electronic device 3100 and second electronic device 3200.
In the examples described above, storage card shown in Figure 25,26,27,29 and 30 has and is deposited with shown in Fig. 1 to Fig. 3
The similar shape of card storage.However, storage card can have and storage card shown in Fig. 4,6,8,11,13,14,18,20 and 22
Shape any one similar shape.It is, storage card shown in Figure 25,26,27,29 and 30 may include protruding
312 or 612, chamfering 461 or 461a, recess 562,562a, 865,866 or 1066, first groove 763 or 863 and the second ditch
One or more of slot 764 or 864.
Figure 33 and Figure 34 shows storage card 1700.Figure 33 is the birds-eye perspective for showing storage card 1700, and Figure 34 is to show
The face upwarding view of storage card 1700.Storage card 1700 can have the Boping similar with Fig. 4 and storage card shown in fig. 5 300
Row hexahedral shape.However, the second side 1746 in storage card 1700 is arranged (with first side in protrusion 1758 and recess portion 1759
1745 is opposite) on.Protrusion 1758 can be arranged close to recess portion 1759.It protrusion 1758 can be than recess portion 1759 closer to front
1743.As shown, storage card 1700 includes top surface 1741 and prominent 1712.
Figure 35 is the decomposition perspective view for showing another example storage card 1800.In the examples described above, it has been described that storage
The system in such a way that method of molding (molding method) is around the circuit board of installation semiconductor chip thereon of card 200 to 1700
It makes.However, on the contrary, storage card 1800 can be by that will be equipped with semiconductor chip 1834 and 1836 (for example, controller core thereon
Piece and memory chip) circuit board 1830 be inserted into shell 1801 in and manufactured.For example, shell 1801 includes upper cover 1810 and lower cover
1820.Upper cover 1810 faces the top surface of circuit board 1830, and lower cover 1820 faces the bottom surface of circuit board 1830.When upper cover 1810 is under
When lid 1820 engages, accommodation space is formed in inside upper cover 1810 and lower cover 1820, to which circuit board 1830 can be received.Under
Lid 1820 is shaped so that the interconnection terminals 1838 of circuit board 1830 can be exposed to outside shell 1801.For example, size and shape
Opening corresponding with interconnection terminals 1,838 1822 can be at position corresponding with the interconnection terminals 1838 of circuit board 1830
It is formed in lower cover 1820.
Figure 36 is the perspective view for showing the electronic device 5100 according to the example embodiment of present inventive concept.Electronic device
5100 can be electrically connected with external memory card (such as, storage card 5150 or 5160 shown in Figure 37), for will such as light data,
The data of voice data, video data or other information be stored in storage card 5150 or 5160 and from storage card 5150 or
5160 read such data.For example, electronic device 5100 can be computer, digital camera, digital camera, mobile phone or
PDA.Electronic device 5100 includes main body and slot 5120.
Slot 5120 can be provided in the outside of main body so that slot 5120 can be directly exposed to electronic device 5100
It is external.The entrance 5122 of slot 5120 can be closed or opened by the lid (not shown) for providing in main body.Slot 5120 includes
Accommodation space for receiving storage card 5150 or 5160.For example, the accommodation space can have enough volumes to connect completely
Receive and keep card storage 5150 or 5160.
Slot 5120 includes multigroup interconnection terminals 5140.For example, slot 5120 may include first group of interconnection terminals 5140a
With second group of interconnection terminals 5140b.First group of interconnection terminals 5140a and second group of interconnection terminals 5140b can be with different types
Storage card electrical connection.For example, first group of interconnection terminals 5140a is arranged at a position so that when (first) storage card 5150
When being inserted into the accommodation space of slot 5120, first group of interconnection terminals 5140a may be electrically connected to the interconnection of the first storage card 5150
Terminal 5152；Second group of interconnection terminals 5140b is arranged at a position so that when (second) storage card 5160 is inserted into slot 5120
Accommodation space when, second group of interconnection terminals 5140b may be electrically connected to the interconnection terminals 5162 of the second storage card 5160.First
Quantity, size and the arrangement of the interconnection terminals 5152 of storage card 5150 are different from the interconnection terminals 5162 of the second storage card 5160
Quantity, size and arrangement.
For example, first group of interconnection terminals 5140a and second group of interconnection terminals 5140b provide the accommodation space in slot 5120
Bottom surface on.First group of interconnection terminals 5140a and second group of interconnection terminals 5140b can be arranged in a same direction.First
Group interconnection terminals 5140a can than second group interconnection terminals 5140b closer to entrance 5122.
Figure 37 shows that electronic device 5100 is used with storage card 5150 and 5160 example together.For example, the second storage card
5160 can be above-mentioned micro- safe digital card, and the first storage card 5150 can be different types of storage card.First storage card
5150 can be existing storage card or novel storage card.For example, the first storage card 5150 can be Fig. 1,4,6,8,11,
13, storage card shown in 14,18,20 or 22.When storage card 5150 is inserted into accommodation space, the slot of electronic device 5100
5120 first group of interconnection terminals 5140a is electrically connected to the interconnection terminals 5152 of the first storage card 5150.In addition, when the second storage
When card 5160 is inserted into accommodation space, second group of interconnection terminals 5140b of the slot 5120 of electronic device 5100 is electrically connected to second
The interconnection terminals 5162 of storage card 5160.First storage card 5150 can be more than the second storage card 5160.Optionally, the first storage
The size of card 5150 can be identical as the size of the second storage card 5160.
Figure 38 show include multiple interconnection terminals 5240 another electronic device 5200.Electronic device 5200 is similar to Figure 36
Electronic device 5100.However, first group of interconnection terminals 5240a is arranged on the top surface of the accommodation space of slot 5220, and the
Two groups of interconnection terminals 5240b are arranged on the bottom surface of the accommodation space of slot 5220.As shown, slot 5220 includes entrance
5222。
Figure 41 and Figure 42 shows exemplary three-dimensional (3D) memory chip that can be used in said memory card.Figure 41 and figure
42 memory chip is stored disclosed in Korean Patent Application Publication No. 2009-93770 and No. 2007-96972
The example of device, entire contents are incorporated herein by reference.The memory chip of above-described embodiment can be Korean Patent Shen
It please disclose in vertical-type memory device disclosed in No. 2009-93770 or Korean Patent Application Publication the 2007-96972nd
Disclosed nonvolatile semiconductor memory.
The storage card of the above example embodiment can also include protector, to protect semiconductor chip not by static discharge
(ESD) it damages.Figure 43 is the schematic diagram for the storage card for showing to be provided with protector.Specifically, Figure 43 shows that protector 280 is wrapped
Include the situation in storage card 200 '.Other than storage card 200 ' includes protector 280, storage card 200 ' and storage card 200
It is identical.It should be appreciated that storage card 200 ' can replace storage card 200 using in the exemplary embodiment.Such protector can be with
It is included in the storage card of other examples embodiment.With reference to Figure 43, protector 280 includes ground terminal 281, protection pattern 282
With switching device 283.Circuit board 230 is segmented into first area, second area and third region.Semiconductor chip 232 is installed
In the first region, ground terminal 281 is arranged in the second area.Pattern 282 is protected to be arranged in third region with protection half
Conductor chip 232.For example, first area can be the central area of circuit board 230, second area can be the side of central area
Portion, third region can be other than second area around the region of first area setting.
The end of ground terminal 281 is connected to external ground portion, and another end of ground terminal 281 is connected to protection pattern
282.Ground terminal 281 can direct or through conductive pattern and be connected to grounding parts or ground terminal 281.Ground terminal 281
Quantity can be two, protection pattern 282 both ends can be connected respectively to ground terminal 281.Although showing two ground connection
Terminal 281, but the quantity of ground terminal 281 can change.Ground terminal 281 can be formed from conductive materials.The conduction material
Material may include metal or metallic compound.For example, the conductive material can be copper or copper compound.
Protection pattern 282 is formed in the second area of circuit board 230 and is spaced apart pre- spacing with semiconductor chip 232
From.Protection pattern 282 is connected to ground terminal 281.Using two ground terminal 281, the two of protection pattern 282
End can be connected respectively to ground terminal 281, and semiconductor chip 232 is surrounded with annular.Protect pattern 282 can be by conductive material
It is formed.The conductive material may include metal or metallic compound.For example, the conductive material can be copper or copper compound.
Switching device 283 is connected in series between ground terminal 281 and protection pattern 282.For example, switching device 283 can
To be formed in as shown in figure 43 on protection pattern 282.In another example, switching device 283 can be directly connected to ground terminal
Son 281.In the present example, the quantity of switching device 283 is two, and ground terminal 281 is connected by switching device 283 respectively
It is connected to the both ends of protection pattern 282.Although showing two switching devices 283, the quantity of switching device 283 can change.
In addition, switching device 283 could be provided as close to ground terminal 281, with minimize switching device 283 and ground terminal 281 it
Between distance.In this case, when generating spark (spark) under such as high pressure conditions of static discharge state, high electricity
The electric current of pressure can be by protecting pattern 282 to flow to ground terminal 281 rapidly.Switching device 283 may include Zener diode,
One of inductance and variable resistance (rheostat).
The storage card of the above example embodiment can also include accessory power supply 6101, when generation powers off (power- suddenly
Off) unexpected power operation of the accessory power supply 6101 for steadily implementing such as data backup operation when event.Figure 44 shows to wrap
Include the storage card of accessory power supply 6101.With reference to Figure 44, accessory power supply 6101 includes the first ultracapacitor 6111, the second super electricity
Container 6112, charging circuit 6120, switch 6130, voltage detector 6140 and control circuit 6150.
First ultracapacitor 6111 and the second ultracapacitor 6112 can be the energy storage that can store large capacity charge
Device.When storage card is powered or operates in normal condition, the first ultracapacitor 6111 and the second ultracapacitor
6112 can be electrically charged.The charge being stored in the first ultracapacitor 6111 and the second ultracapacitor 6112 can be used as auxiliary
Electric power is helped to be supplied to internal circuit 6102.The capacitance of first ultracapacitor 6111 and the second ultracapacitor 6112 can be at any time
Between and reduce.If the first ultracapacitor 6111 cannot be used due to the reduction of its capacitance, the unexpected power-off of storage card
Operation can cannot be well carried out.In this case, the second ultracapacitor 6112 can provide auxiliary power, thus, it deposits
The unexpected power operation of card storage can normally be implemented.
The auxiliary power of first ultracapacitor 6111 and the second ultracapacitor 6112 can be provided sequentially.Also
It is, if the first ultracapacitor 6111 cannot be used due to deterioration, to use the second ultracapacitor 6112.Earthed circuit
GND may be coupled to the second ultracapacitor 6112.When using the first ultracapacitor 6111 when, earthed circuit GND for pair
Second ultracapacitor 6112 discharges.Charging circuit 6120 is used for the first ultracapacitor 6111 and the second super capacitor
Device 6112 charges.Charging circuit 6120 may include internal electric source (not shown).In this case, charging circuit 6120
It can charge by using internal electric source pair the first ultracapacitor 6111 and the second ultracapacitor 6112.
Alternatively, charging circuit 6120 can be super by using the electric power pair first provided from external power supply (not shown)
Capacitor 6111 and the second ultracapacitor 6112 charge.Charging circuit 6120 can be by charge path 1. to the first surpassing
Grade capacitor 6111 and the second ultracapacitor 6112 provide charging current.Switch 6130 is connected to the second ultracapacitor 6112
Between charging circuit 6120.Switch 6130, which can be used for controlling to the second ultracapacitor 6112, supplies charging current.Also
It is that, when switch 6130 is connected, charging current is supplied to the second ultracapacitor 6112；When switch 6130 disconnects, charging
Electric current is not supplied to the second ultracapacitor 6112.In addition, switch 6130 can be used for controlling the second ultracapacitor 6112
Electric discharge.It is, if switch 6130 is connected, the second ultracapacitor 6112 provides discharge current；If switch 6130
It disconnects, then the second ultracapacitor 6112 does not provide discharge current.First ultracapacitor 6111 and the second ultracapacitor
2. 6112 can provide discharge current by discharge path.
Voltage detector 6140 can detect the charging electricity of the first ultracapacitor 6111 and the second ultracapacitor 6112
Pressure or discharge voltage.When the first ultracapacitor 6111 or the second 6112 charge or discharge of ultracapacitor, voltage detector
6140 can detect charging voltage or discharge voltage by measuring the voltage of N nodes.
Control circuit 6150 controls earthed circuit GND, charging circuit 6120, switch 6130 and voltage detector 6140.When
When using the first ultracapacitor 6111, control circuit 6150 controls earthed circuit GND so that the second ultracapacitor 6112 is put
Electricity.In addition, control circuit 6150 controls charging circuit 6120 so that charging current is provided to 6111 He of the first ultracapacitor
Second ultracapacitor 6112.Control circuit 6150 can control switch 6130, so as not to use the second ultracapacitor 6112.
For example, if the capacitance of the first ultracapacitor 6111 is enough, can not used under the control of control circuit 6150
Second ultracapacitor 6112.When without using the second ultracapacitor 6112, it is not necessary to which strategic point is stored in the second ultracapacitor
Charge in 6112 can be completely released under the control of control circuit 6150 by earthed circuit GND.Control circuit 6150
It can be by charging voltage or discharge voltage calculating equivalent series resistance ESR received from voltage detector 6140.ESR is saved from N
O'clock to the first ultracapacitor 6111 or the resistive component of the second ultracapacitor 6112.The first surpass when charging current is provided to
When grade capacitor 6111, the voltage of N nodes suddenly increases the predetermined time due to ESR.ESR can be by using charging current Ic
It is calculated with N node voltages Vn.
Control circuit 6150 can receive charging voltage or discharge voltage from voltage detector 6140, the first surpass for calculating
The capacitance of grade capacitor 6111 or the second ultracapacitor 6112.For example, when control circuit 6150 can be by charging current, charging
Between and N node voltages Vn calculate the capacitance Cs1 of the first ultracapacitor 6111.Control circuit 6150 may include internal timer
(not shown), to calculate the charging time.Control circuit 6150 can be by using ESR and the first ultracapacitor 6111 or the second
The capacitance of ultracapacitor 6112 connects the time of switch 6130 to determine.
The storage card of the above example embodiment can also include bypass weld pad (by-pass pad).Bypassing weld pad can electricity
It is connected to memory chip.Operator can test the electrical characteristics of memory chip by bypassing weld pad.Figure 45 to Figure 47 is shown
Example storage card 2000 including bypassing weld pad 2040.Figure 45 is the upward view of storage card 2000.Figure 46 is to show to work as from storage
The view of storage card 2000 when 2000 removal protective cover 2044 of card, Figure 47 is the sectional view taken along the line B-B ' of Figure 45.
With reference to Figure 45 to Figure 47, storage card 2000 can have similar with storage card shown in Fig. 1 to Fig. 3 200
Thin parallelepiped shape.The position of the interconnection terminals 2038 of storage card 2000 can be similar to shown in Fig. 1 to Fig. 3 and store
The position of the interconnection terminals 238 of card 200.Controller chip 2036 and memory chip 2034 can be mounted on circuit in such manner
On plate 2030 so that controller chip 2036 is spaced apart in the horizontal direction with memory chip 2034.Alternatively, extremely with Fig. 1
The case where storage card 200 shown in Fig. 3, is similar, and controller chip 2036 can be arranged on memory chip 2034.Interconnection
Line 2039 can be formed in circuit board 2030, and controller chip 2036 and memory chip 2034 can pass through interconnection line 2039
It is connected to each other with conducting wire 2048.Weld pad 2040 is bypassed to provide on the bottom surface of circuit board 2030.Bypass weld pad 2040 be connected to from
The by-pass line 2042 that interconnection line 2039 extends.If 2000 abnormal work of storage card, operator can be by bypassing weld pad
The function of 2040 test storage cards 2000, the mistake for checking storage card 2000.
It is furthermore possible to also provide protective cover 2044 is so that bypass weld pad 2040 from being exposed to outside storage card 2000.Protection
2044 covering bypass weld pad 2040 of cover.Protective cover 2044 can be provided in the form of insulating layer.For example, protective cover 2044 can be by
Solder resist is formed.It is, the bottom surface of circuit board 2030 can use solder resist to coat so that all bypass weld pads
2040 can be capped.Storage card 2000 is tested if necessary, then operator can remove by using etching or polishing
Solder resist and expose bypass weld pad 2040 after tested.Protective cover 2044 can be by being readily able to selectively be lost
The insulating layer that the insulating materials of carving technology removal is formed.For example, protective cover 2044 can be formed by epoxy-based polymerization object.Alternatively
Ground, protective cover 2044 can be formed by encapsulating material.Alternatively, protective cover 2044 can be formed by insulating tape.
Figure 48 shows selectively mutual using two groups in the storage card of storage card shown in such as Figure 26,29,30 and 31
The even exemplary construction of one of terminal.Figure 48 is the schematic, bottom view of storage card.The storage card of Figure 48 has to be shown with Figure 26
1300 similar structure of storage card.In the storage card, from memory chip receive data or storage will be stored in
Data in device chip pass through the first interconnection end by using the output signal Tx or input signal Rx of controller chip 2136
Sub- 2138a or the second interconnection terminals 2138b send or receive.Only one controller chip 2136 may be mounted at circuit board 2130
On.First capacitor weld pad 2171 and the second capacitor weld pad 2172 can be arranged interconnects end in controller chip 2136 and first
Between sub- 2138a.
First capacitor weld pad 2171 provides the electrical connection between controller chip 2136 and the first interconnection terminals 2138a.
First capacitor weld pad 2171 includes the first weld pad 2171a and the second weld pad 2171b.First weld pad 2171a and the second weld pad
2171b, which is separated from each other, preset distance and is set as facing with each other.First signal wire 2162 and second signal line 2163 are formed in
On circuit board 2130.Controller chip 2136 and the first weld pad 2171a are directly electrically connected by the first signal wire 2162.Second weldering
2171b and the first interconnection terminals 2138a is padded directly to be electrically connected by second signal line 2163.
Second capacitor weld pad 2172 provides the electrical connection between controller chip 2136 and the second interconnection terminals 2138b.
Second capacitor weld pad 2172 includes third weld pad 2172a and the 4th weld pad 2172b.Third weld pad 2172a and the 4th weld pad
2172b, which is separated from each other, preset distance and is set as facing with each other.Third signal wire 2164 and fourth signal line 2165 are formed in
On circuit board 2130.Third signal wire 2164 extends from the first signal wire 2162 and is electrically connected to third weld pad 2172a.4th weldering
2172b and the second interconnection terminals 2138b is padded directly to be electrically connected by fourth signal line 2165.
First weld pad 2171a is electrically connected to the second weld pad 2171b or third weld pad 2172a by capacitor 2173 and leads to
It crosses capacitor 2173 and is electrically connected to the 4th weld pad 2172b.Capacitor 2173 can be DC blocking capacitors (DC block
capacitor).If capacitor 2173 is connected between the first weld pad 2171a and the second weld pad 2171b, storage card can be with
It is connected to external electronic by the first interconnection terminals 2138a.If capacitor 2173 is connected to third weld pad 2172a and
Between four weld pad 2172b, then storage card can be connected to external electronic by the second interconnection terminals 2138b.
In the exemplary embodiment, storage card can be or can be with compact flash type (CompactFlash Type)
(for example, I types or II types), SD storage cards, miniSD, microSD, TransFlash, multimedia card (MMC), MMCplus, RS-
MMC, DVRS-MMC, MMCmobile, MMCmicro, memory stick (Memory Stick), Memory Stick PRO, Memory
Stick Duo, Memory Stick PRO Duo, smart media card (SmartMedia Card), xD-Picture cards, PC cards
(for example, I types, II types or type III) and/or USB flash drive (Flash Drive) are used together.
Theme disclosed above should be considered as it is illustrative rather than restrictive, claims be intended to covering fall
All such modifications, enhancing and other embodiments in the true spirit and range of present inventive concept.Thus, allowed in law
Maximum magnitude in, the range of present inventive concept will be come true by the most wide admissible explanation of claims and its equivalent
It is fixed, without being limited or limitation by being described in detail before.
This application claims in the priority of on 2 5th, 2010 South Korea patent applications submitted the 10-2010-0010989th
And the equity for the U.S. Provisional Application No. 61/282041 submitted on December 7th, 2009 is required, entire contents pass through reference
Entirety is hereby incorporated by.
Claims (16)
1. a kind of storage card, including：
Controller；
Memory；
The first row interconnection terminals are arranged on the first surface of the storage card, and the first surface includes first edge, second
Edge and third edge, the first edge and the second edge are positioned opposite, which is basically perpendicular to the first edge
With the second edge；
Second row interconnection terminals, setting is on the first surface；And
Ground terminal；
The wherein described the first row interconnection terminals are configured to when the storage card is operably connected to the first external equipment be not
Electrically actuatable,
The wherein described second row interconnection terminals are configured to when the storage card is operably connected to the second external equipment be not
Electrically actuatable,
The wherein described storage card is the operable insertion of one direction in the first direction of insertion, which is such that in
The first edge of the first surface in the case of being firstly inserted into the storage card be the direction being operably inserted,
The wherein described the first row interconnection terminals include power terminal,
The wherein described second row interconnection terminals include power terminal,
The wherein described third edge includes groove,
It is arranged in the firstth area without interconnection terminals, firstth area is in a first direction by the groove and first side
The shortest distance between edge limit and in a second direction by between the third edge and the most inner edge of the groove away from
From restriction,
In the second region without interconnection terminals setting, secondth area is on third direction by the groove and second side
The shortest distance between edge limit and in fourth direction by between the third edge and the most inner edge of the groove away from
From restriction,
It is arranged between the first row interconnection terminals and the first edge without interconnection terminals,
It is arranged between the second row interconnection terminals and the second edge without interconnection terminals.
2. storage card as described in claim 1, wherein the first surface of the storage card has single insertion edge, institute
The single insertion edge for stating first surface is the first edge of the first surface, the single insertion side of the first surface
Edge be such that in the first surface the single insertion edge be firstly inserted into the case of the storage card be operationally
The edge of insertion.
3. storage card as described in claim 1, wherein the first row interconnection terminals are configured to when the storage card is operable
Ground is operable when being connected to second external equipment, and
The wherein described second row interconnection terminals are configured to when the storage card is operably connected to first external equipment
It is operable.
4. a kind of storage card, including：
Controller；
Memory；
The first row interconnection terminals are arranged on the first surface of the storage card, and the first surface is included in the storage card
Longitudinally on first edge and second edge positioned opposite to each other；
Second row interconnection terminals, setting is on the first surface；
Ground terminal；And
Recess portion and protrusion are arranged in the storage card along the one side of the longitudinally,
The wherein described the first row interconnection terminals are configured to when the second row interconnection terminals are electrically operated be not electrically actuatable,
The wherein described storage card is the operable insertion of one direction in the first direction of insertion, which is such that in
The first edge of the first surface in the case of being firstly inserted into the storage card be the direction being operably inserted,
It is mutual that the shortest distance between the first row interconnection terminals and the second edge of the first surface is more than second row
It is even most short between the length and the second row interconnection terminals and the second edge of the first surface of first terminal in terminal
Apart from conjunction, the length of the first terminal is basically perpendicular to the second edge,
The wherein described the first row interconnection terminals include power terminal,
The wherein described second row interconnection terminals include power terminal.
5. storage card as claimed in claim 4, wherein being deposited described in when the storage card is inserted into the second direction of insertion
Card storage is inoperable, and second direction of insertion is such that in the feelings that the second edge of the first surface is firstly inserted into
The storage card is the direction being inserted into inoperablely under condition.
6. storage card as claimed in claim 4, wherein at least one and described second row is mutual in the first row interconnection terminals
Even at least one different electronic equipment and/or for different purposes of being configured in terminal.
7. storage card as claimed in claim 6, wherein the first row interconnection terminals are configured to when the storage card is with first
It is not electrically actuatable when pattern is electrically operated, and
The second row interconnection terminals are configured to when the storage card is electrically operated in a second mode be not electrically actuatable.
8. storage card as claimed in claim 4, wherein the first edge of the second row interconnection terminals and the first surface
Between the shortest distance be more than length and the first row interconnection terminals and the institute of Second terminal in the first row interconnection terminals
The conjunction of the shortest distance between the first edge of first surface is stated, the length of the Second terminal is basically perpendicular to first side
Edge.
9. storage card as claimed in claim 4, without interconnection terminals setting in the first row interconnection terminals and described
Between first edge, and
It is arranged between the second row interconnection terminals and the second edge without interconnection terminals.
10. a kind of storage card, including：
Controller；
Memory；
The first row interconnection terminals are arranged on the first surface of the storage card, and the first surface is included in the storage card
Longitudinally on first edge and second edge positioned opposite to each other；
Second row interconnection terminals, setting is on the first surface；
At least one ground terminal；And
Recess portion and protrusion are arranged in the storage card along the one side of the longitudinally,
The wherein described the first row interconnection terminals are configured to when the second row interconnection terminals are electrically operated be not electrically actuatable,
The first surface of the wherein described storage card have only one be inserted into edge, the insertion edge of the first surface be so that
In the case where the first edge of the first surface is firstly inserted into, the storage card is described first be operably inserted
The edge on surface,
The only one of the wherein described first surface is inserted into the first edge that edge is the first surface, and
The wherein described the first row interconnection terminals include at least one power terminal,
The wherein described second row interconnection terminals include at least one power terminal.
11. storage card as claimed in claim 10, wherein at least one and described second row in the first row interconnection terminals
At least one different electronic equipment and/or for different purposes of being configured in interconnection terminals.
12. storage card as claimed in claim 10, wherein the institute in the first surface is arranged in the first row interconnection terminals
It states between first edge and the second row interconnection terminals.
13. storage card as claimed in claim 10, wherein the storage card is that one direction is operable in the first direction of insertion
Be inserted into, first direction of insertion be such that in the first surface first edge be firstly inserted into the case of the storage
Card is the direction being operably inserted, and
The second edge of the wherein described first surface is not to be inserted into edge to make on second side of the first surface
Edge in the case of being firstly inserted into the storage card be not operable insertion.
14. storage card as claimed in claim 10 is arranged without interconnection terminals in the first row interconnection terminals and institute
Between stating first edge, and
It is arranged between the second row interconnection terminals and the second edge without interconnection terminals.
15. storage card as claimed in claim 10, wherein the first surface include basically perpendicular to the first edge and
The third edge of the second edge, which includes groove,
It is arranged in the firstth area without interconnection terminals, firstth area is in a first direction by the groove and first side
The shortest distance between edge limit and in a second direction by between the third edge and the most inner edge of the groove away from
From restriction,
In the second region without interconnection terminals setting, secondth area is on third direction by the groove and second side
The shortest distance between edge limit and in fourth direction by between the third edge and the most inner edge of the groove away from
From restriction.
16. storage card as claimed in claim 10, wherein described the of the first row interconnection terminals and the first surface
It is mutual that the shortest distance between two edges is more than the first length of first terminal and second row in the second row interconnection terminals
The even conjunction of the shortest distance between terminal and the second edge of the first surface, the first length base of the first terminal
This is perpendicular to the second edge.
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US28204109P | 2009-12-07 | 2009-12-07 | |
| US61/282,041 | 2009-12-07 | ||
| KR10989/10 | 2010-02-05 | ||
| KR1020100010989A KR101593547B1 (en) | 2009-12-07 | 2010-02-05 | Memory cards |
| CN2010105768156A CN102087879A (en) | 2009-12-07 | 2010-12-07 | Memory card and electronic device |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010105768156A Division CN102087879A (en) | 2009-12-07 | 2010-12-07 | Memory card and electronic device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104794523A CN104794523A (en) | 2015-07-22 |
| CN104794523B true CN104794523B (en) | 2018-10-12 |
Family
ID=53559309
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510208292.2A Active CN104794523B (en) | 2009-12-07 | 2010-12-07 | Storage card and electronic device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104794523B (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4791608A (en) * | 1983-01-10 | 1988-12-13 | Canon Kabushiki Kaisha | Memory card having shutter protected terminals |
| CN1452763A (en) * | 2000-04-28 | 2003-10-29 | 株式会社日立制作所 | IC card |
| CN1696972A (en) * | 2004-05-11 | 2005-11-16 | 株式会社瑞萨科技 | IC card module |
| CN1703717A (en) * | 2002-10-09 | 2005-11-30 | 株式会社瑞萨科技 | IC card and an adapter |
| CN1744110A (en) * | 2004-04-26 | 2006-03-08 | 株式会社瑞萨科技 | Memory card |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7416132B2 (en) * | 2003-07-17 | 2008-08-26 | Sandisk Corporation | Memory card with and without enclosure |
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2010
- 2010-12-07 CN CN201510208292.2A patent/CN104794523B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4791608A (en) * | 1983-01-10 | 1988-12-13 | Canon Kabushiki Kaisha | Memory card having shutter protected terminals |
| CN1452763A (en) * | 2000-04-28 | 2003-10-29 | 株式会社日立制作所 | IC card |
| CN1703717A (en) * | 2002-10-09 | 2005-11-30 | 株式会社瑞萨科技 | IC card and an adapter |
| CN1744110A (en) * | 2004-04-26 | 2006-03-08 | 株式会社瑞萨科技 | Memory card |
| CN1696972A (en) * | 2004-05-11 | 2005-11-16 | 株式会社瑞萨科技 | IC card module |
Also Published As
| Publication number | Publication date |
|---|---|
| CN104794523A (en) | 2015-07-22 |
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