CN104776396A - Led反射结构 - Google Patents

Led反射结构 Download PDF

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Publication number
CN104776396A
CN104776396A CN201510233762.0A CN201510233762A CN104776396A CN 104776396 A CN104776396 A CN 104776396A CN 201510233762 A CN201510233762 A CN 201510233762A CN 104776396 A CN104776396 A CN 104776396A
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reflection
led
substrate
separation
partition
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李峰
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Priority to CN201510233762.0A priority Critical patent/CN104776396A/zh
Priority to EP15891429.1A priority patent/EP3296625A4/en
Priority to US15/310,765 priority patent/US20180119939A1/en
Priority to KR1020167027448A priority patent/KR20160145566A/ko
Priority to JP2016559889A priority patent/JP2017527098A/ja
Priority to KR1020187015295A priority patent/KR20180061425A/ko
Priority to PCT/CN2015/000332 priority patent/WO2016179721A1/zh
Priority to KR2020187000043U priority patent/KR20180001965U/ko
Publication of CN104776396A publication Critical patent/CN104776396A/zh
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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V7/00—Reflectors for light sources
    • F21V7/22—Reflectors for light sources characterised by materials, surface treatments or coatings, e.g. dichroic reflectors
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
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    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/502—Cooling arrangements characterised by the adaptation for cooling of specific components
    • F21V29/505—Cooling arrangements characterised by the adaptation for cooling of specific components of reflectors
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
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    • F21V19/001—Fastening of light sources or lamp holders the light sources being semiconductors devices, e.g. LEDs
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    • F21—LIGHTING
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    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50—Cooling arrangements
    • F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V7/00—Reflectors for light sources
    • F21V7/0066—Reflectors for light sources specially adapted to cooperate with point like light sources; specially adapted to cooperate with light sources the shape of which is unspecified
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V7/00—Reflectors for light sources
    • F21V7/0083—Array of reflectors for a cluster of light sources, e.g. arrangement of multiple light sources in one plane
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V7/00—Reflectors for light sources
    • F21V7/04—Optical design
    • F21V7/041—Optical design with conical or pyramidal surface
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V7/00—Reflectors for light sources
    • F21V7/22—Reflectors for light sources characterised by materials, surface treatments or coatings, e.g. dichroic reflectors
    • F21V7/24—Reflectors for light sources characterised by materials, surface treatments or coatings, e.g. dichroic reflectors characterised by the material
    • F21V7/26—Reflectors for light sources characterised by materials, surface treatments or coatings, e.g. dichroic reflectors characterised by the material the material comprising photoluminescent substances
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
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    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
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    • H01—ELECTRIC ELEMENTS
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    • H01L33/64—Heat extraction or cooling elements
    • H01L33/642—Heat extraction or cooling elements characterized by the shape
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    • F21—LIGHTING
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    • F21Y2105/00—Planar light sources
    • F21Y2105/10—Planar light sources comprising a two-dimensional array of point-like light-generating elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
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Abstract

一种LED反射结构，该LED反射结构包括LED反射基板，在基板上具有若干分隔反射腔，该分隔反射腔互相贴合密布，每两个分隔反射腔之间具有一个分隔筋板。本发明在基板上通过分隔筋板隔离分来每颗LED发光芯片，让每颗LED发光芯片发出的光线都得到侧面的反光，而不会互相干扰，在分隔反射腔内壁侧面喷涂的纳米反射材料，提高光照辐射通量；该分隔筋板抗压能力强，强化保护设置其中的芯片；而且该外壳一体化基板能够将外壳保护、传导散热功能融合于一体，有利于产品的超薄化、精简化、微型化设计。

Description

LED反射结构
【技术领域】
本发明涉及LED照明技术领域，尤其涉及LED发光反射结构技术。
【背景技术】
LED芯片的结构为蓝宝石衬底之上PN结，PN结通电发光，会向四周发出光线，包括蓝宝石衬底方向。
在现有的LED照明设备中，通常多颗LED同时固晶在PCB板上，然后封装，或者单颗LED芯片固定在支架上封装后再固定到PCB板上并需要透镜进行调光。
LED芯片发光撞击到荧光粉上，会激发荧光粉发光，但是会有一次能量的损耗，每道光束都通过若干次荧光粉反射出去的光会存在总量上是损耗。
另外，两颗LED芯片互相之间的也存在发光互相抵消损耗的问题，有研究报告表明，不同LED芯片发出的光子互撞会湮灭，所以若干颗LED芯片布置在一起而产生的发光损耗也是不可忽视的。
本发明所涉及的反射结构与本人申请的一体式散热机构的技术密切联系，由该反射结构构成一体式散热结构的一部分。
【发明内容】
本发明针对以上问题提出了间隔开LED发光芯片，并且提高发光出光效率的LED反射结构。
本发明所述涉及LED反射结构包括LED反射基板，在基板上具有若干分隔反射腔，该分隔反射腔互相贴合密布，每两个分隔反射腔之间具有一个分隔筋板。
该分隔筋板是内嵌碳纤维骨架结构，外层为全金属制成。
每个分隔反射腔包含四个分隔筋板构成的侧壁和中空的容纳空间，四个侧壁围成的空间是LED芯片容纳空间，大小适合单颗LED芯片布置。
在分隔反射腔的侧壁内喷涂纳米反射材料。
该四个侧面与水平面之间的夹角为45°。
该分隔筋板的截面形状为三角形。
该分隔筋板的截面形状为梯形。
本发明在基板上通过分隔筋板隔离分来每颗LED发光芯片，让每颗LED发光芯片发出的光线都得到侧面的反光，而不会互相干扰，在分隔反射腔内壁侧面喷涂的纳米反射材料，提高光照辐射通量；该分隔筋板抗压能力强，强化保护设置其中的芯片；而且该外壳一体化基板能够将外壳保护、传导散热功能融合于一体，有利于产品的超薄化、精简化、微型化设计。
【附图说明】
图1是本发明所涉及的LED反射结构的示意图；
图2是本发明实施例1的分隔筋板的剖面示意图；
图3是本发明实施例2的分隔筋板的剖面示意图
其中： 10、反射基板；11、分隔反射腔；12、分隔筋板；121、碳纤维骨架；122、金属；123、纳米材料。
【具体实施方式】
下面将结合附图及实施例对本发明LED反射结构进行详细说明。
请参考附图1：其中示出了LED反射结构，该反射结构包括反射基板10，该反射基板10作为一个整体件，如本申请人另外一份专利《一体式散热结构的LED灯》，其中涉及到作为外壳也作为散热的一体式结构，该一体散热结构中的上盖板与本申请的反射结构具有相同的原理。
在反射基板10上具有若干分隔反射腔11，该分隔反射腔11互相贴合密布，每两个分隔反射腔11之间具有一个分隔筋板12。
在附图1中，可以明确看出分隔反射腔11是按照矩形阵列排布，当然在相同的原理、指导思想下，也可以让分隔反射腔按照圆心对称分布，制成发光面积为圆形的反射基板。
请参考附图2：该附图2示意出了，该分隔筋板12的内部结构，该分隔筋板内嵌碳纤维骨架121结构，外层为全金属122制成。
这样结构的作用在于，提高分隔筋板的抗压强度，能够在占据最小的体积的情况下强化保护LED芯片的抗压能力。所以采用较轻质坚碳纤维作为支承骨架，而采用全金属包裹是不影响其作为散热结构的优良性能。
每个分隔反射腔包含四个分隔筋板构成的侧壁和中空的容纳空间，四个侧壁围成的空间是LED芯片容纳空间，大小适合单颗LED芯片布置。结合上文所说明的分割筋板的结构，则该分割反射腔通过四道分割筋板的侧壁为芯片所处空间提供保护，以支承其他安装结构的压力或者锁紧力，而全包的金属质地以及反射基板10的其余部分全部为金属，这种结构的设计能够构成散热网络式结构，直接与外壳构成一体式化的结构。让该结构不仅仅为光器件，为将光器件、散热器、外壳融合为一体，制成一体化元件提供了技术基础支持。
在分隔反射腔的侧壁内喷涂纳米反射材料123。提高对LED芯片侧面发光的辐射通量。
在实施例1中，该四个侧面与水平面之间的夹角为45°，且分隔筋板的截面为三角形，最佳的方式是让分隔筋板的截面为等边三角形，这种形式的分隔筋板拥有最稳定坚固的结构，承重性能最好，最大程度保护内部的LED芯片。
在实施例2中：
请参考附图3：该分隔筋板的截面形状为梯形，该分隔筋板的截面形状为等腰梯形。
本发明在基板上通过分隔筋板隔离分来每颗LED发光芯片，让每颗LED发光芯片发出的光线都得到侧面的反光，而不会互相干扰，在分隔反射腔内壁侧面喷涂的纳米反射材料，提高光照辐射通量；该分隔筋板抗压能力强，强化保护设置其中的芯片；而且该外壳一体化基板能够将外壳保护、传导散热功能融合于一体，有利于产品的超薄化、精简化、微型化设计。
以上所述，仅是本发明较佳实施例而已，并非对本发明作任何形式上的限制，虽然本发明以较佳实施例揭露如上，然而并非用以限定本发明，任何熟悉本专业的技术人员，在不脱离本发明技术方案范围内，当利用上述揭示的技术内容作出些许变更或修饰为等同变化的等效实施例，但凡是未脱离本发明技术方案内容，依据本发明技术是指对以上实施例所作的任何简单修改、等同变化与修饰，均属于本发明技术方案的范围内。

Claims (6)

1.一种LED反射结构，其特征在于，该LED反射结构包括LED反射基板，在基板上具有若干分隔反射腔，该分隔反射腔互相贴合密布，每两个分隔反射腔之间具有一个分隔筋板。
2.根据权利要求1所述LED反射结构，其特征在于，该分隔筋板是内嵌碳纤维骨架结构，外层为全金属制成。
3.根据权利要求2所述LED反射结构，其特征在于，每个分隔反射腔包含四个侧壁和中空的容纳空间，四个侧壁围成的空间是LED芯片容纳空间，大小适合单颗LED芯片布置。
4.根据权利要求3所述LED反射结构，其特征在于，该四个侧面与水平面之间的夹角为45°。
5.根据权利要求4所述LED反射结构，其特征在于，该分隔筋板的截面形状为三角形。
6.根据权利要求4所述LED反射结构，其特征在于，该分隔筋板的截面形状为梯形。
CN201510233762.0A 2015-05-08 2015-05-08 Led反射结构 Pending CN104776396A (zh)

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Application Number Priority Date Filing Date Title
CN201510233762.0A CN104776396A (zh) 2015-05-08 2015-05-08 Led反射结构
EP15891429.1A EP3296625A4 (en) 2015-05-08 2015-05-18 Led reflective structure
US15/310,765 US20180119939A1 (en) 2015-05-08 2015-05-18 Reflection structure for LED lamp
KR1020167027448A KR20160145566A (ko) 2015-05-08 2015-05-18 Led 반사 구조
JP2016559889A JP2017527098A (ja) 2015-05-08 2015-05-18 Ｌｅｄ反射構造
KR1020187015295A KR20180061425A (ko) 2015-05-08 2015-05-18 Led 반사 구조
PCT/CN2015/000332 WO2016179721A1 (zh) 2015-05-08 2015-05-18 Led反射结构
KR2020187000043U KR20180001965U (ko) 2015-05-08 2015-05-18 Led 반사 구조

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105953117A (zh) * 2016-06-06 2016-09-21 李峰 具有内置式压力补偿器的led灯
EP3312881B1 (de) * 2016-10-19 2022-06-15 Tridonic GmbH & Co. KG Csp led-modul mit reflexionsmittel

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WO2016179721A1 (zh) 2016-11-17
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