CN104773541A - Slice supplying device for silicon slice inserting machine - Google Patents
Slice supplying device for silicon slice inserting machine Download PDFInfo
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- CN104773541A CN104773541A CN201510079997.9A CN201510079997A CN104773541A CN 104773541 A CN104773541 A CN 104773541A CN 201510079997 A CN201510079997 A CN 201510079997A CN 104773541 A CN104773541 A CN 104773541A
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- load
- transfer device
- silicon chip
- slice
- silicon
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Abstract
The invention provides a slice supplying device for a silicon slice inserting machine. The slice supplying device comprises a silicon slice sorting mechanism and a silicon slice conveying mechanism, wherein a first conveyor belt of the silicon slice sorting mechanism is located above a second conveyor belt; the projection of a first end of the first conveyor belt is located on the second conveyor belt; a slice storage box is arranged in a manner of corresponding to a second end of the first conveyor belt; the slice storage box is internally provided with a silicon slice up-down movable driving device; an air blowing opening is formed under the first conveyor belt and the air blowing direction is set towards the slice storage box; a driven shaft of a third conveyor belt of the silicon slice conveying mechanism is hinged to a piston rod of a driving cylinder; a waste silicon slice storage box is arranged under one end of the driven shaft of the third conveyor belt; the third conveyor belt and a fourth conveyor belt are arranged in series; the second conveyor belt of the silicon slice sorting mechanism is in butt joint with the silicon slice conveying mechanism. According to the slice supplying device, the silicon slice sorting mechanism is used for continuously sorting and taking slices, and the silicon slice conveying mechanism is used for continuously conveying the silicon slices; the slice supplying device has the advantage of high slice inserting efficiency.
Description
Technical field
The present invention relates to a kind of silicon chip inserting machine film feeding apparatus, belong to solar battery sheet and prepare attendant equipment field.
Background technology
Since 21 century, global Energy Consumption sharply rises, and traditional fossil energy is day by day exhausted, and energy problem and environmental problem become two large Important Problems of global concern gradually.Under the pressure of the pressure of sustainable development, solar photovoltaic industry is listed in the emphasis that regenerative resource develops by each major country one after another.Become the second in the world economy along with China, in October, 2013, China's petroleum import in October amount reaches every day 6,300,000 barrels, exceedes the every day 6,240,000 barrels of the U.S., and replacing the U.S. first becomes global maximum net import of oil state.2013, the external dependence degree of CNPC and natural fuels reached 58.1% and 31.6% respectively, and China has become global the third-largest natural gas consumption state.Traditional fossil energy is more and more difficult to the thriving demand meeting Chinese national economy.In in the past 20 years, the artificial CO2 emissions in the whole world nearly about 75% derive from combustion of fossil fuel.Therefore, be no matter the energy development angle from low-carbon environment-friendly, still comply with Industry Structure upgrading and transition pressure, China must accelerate development New Energy Industry.
Solar power belongs to clean reproducible energy.According to " European renewable energy technologies strategic plan " that EU Committee proposes, to the year two thousand twenty, solar power will account for 15% of European Union's electricity needs.2010, USDOE developed planning, and planned the year two thousand thirty, and solar power accounts for 10% ~ 15% of total energy consumption.Take temperature from worldwide solar power and the generating of tidal energy aggregate net, China is 3,000,000,000 kilowatt hours, and Germany is 19,000,000,000 dry watt-hours, and Italy is 10,700,000,000 dry watt-hours, and Spain is 9,100,000,000 kilowatt hours, and Japan is 3,800,000,000 kilowatt hours.Following China water power growth space is limited, and nuclear energy exists safety hazard.Fossil energy will rise by energy-saving and emission-reduction committed cost, the wide market of solar energy power generating.
The processing of monocrystalline silicon piece comprises the first evolution of silicon single crystal rod, then cuts into slices, and the processing of polysilicon chip comprises polycrystal silicon ingot cutting, then cuts into slices, and the processing of quasi-monocrystalline silicon comprises mono-like silicon ingot cutting, then cuts into slices.Generally speaking, section is one of requisite technique in crystal silicon solar cell sheet processing technology.The silicon wafer layer obtained after section stacks, and inserts in silicon wafer bearing box and transport after needing burst, and because silicon chip has thin, crisp, therefore the difficulty of burst, inserted sheet is very large.
Publication number is the application for a patent for invention of CN103681968A, discloses a kind of automatic machine for inserting silicon wafers, and it adopts sucker to capture silicon chip to carry out burst, inserted sheet, and the action capturing silicon chip due to sucker is discontinuous operation, therefore there is inefficient problem.
Summary of the invention
The object of the invention is to provide a kind of silicon chip inserting machine film feeding apparatus.
For achieving the above object, the technical solution used in the present invention is: a kind of silicon chip inserting machine film feeding apparatus, comprises silicon chip separating mechanism and silicon chip conveying mechanism; Described silicon chip separating mechanism comprises the first load-transfer device, the second load-transfer device, hopper and puff port; Described first load-transfer device and the second load-transfer device are between the upper and lower every setting, described first load-transfer device is positioned at the top of described second load-transfer device, and the projection of the first end of described first load-transfer device is positioned on described second load-transfer device, second end of corresponding described first load-transfer device of described hopper is arranged, and is provided with silicon chip and moves up and down actuating device in described hopper; Described puff port is positioned at the below of described first load-transfer device, and blowing direction is arranged towards described hopper; Described silicon chip conveying mechanism comprises at least one the 3rd load-transfer device and at least one the 4th load-transfer device; The driven shaft of described 3rd load-transfer device is articulated with on the piston rod of a driving cylinder, and the below of one end of the driven shaft of described 3rd load-transfer device is provided with useless silicon chip receiver; Described 3rd load-transfer device and the 4th load-transfer device series winding are arranged; Second load-transfer device of described silicon chip separating mechanism docks with described silicon chip conveying mechanism.
Preferred technical scheme is: described puff port is communicated with a gas feeder by pipeline.
Preferred technical scheme is: described first load-transfer device is obliquely installed.
Preferred technical scheme is: accommodate water in described hopper.
Preferred technical scheme is: described 4th load-transfer device is horizontally disposed with.
Preferred technical scheme is: accommodate water in described useless silicon chip receiver.
Because technique scheme is used, the present invention compared with prior art has following advantages and effect:
The present invention adopts the continuous burst of silicon chip separating mechanism and gets sheet, adopts silicon chip conveying mechanism to carry out continuative transport to silicon chip, has the advantage that inserted sheet efficiency is high.
Accompanying drawing explanation
Accompanying drawing 1 is silicon chip inserting machine schematic diagram.
Accompanying drawing 2 is the A portion enlarged drawing of accompanying drawing 1.
Accompanying drawing 3 is the first load-transfer device and the second load-transfer device relation schematic diagram.
Accompanying drawing 4 silicon chip inserting machine film feeding apparatus.
In above accompanying drawing: 1, the first load-transfer device; 2, the second load-transfer device; 3, drive motor; 4, puff port; 5, the 3rd load-transfer device; 6, the 4th load-transfer device; 7, useless silicon chip receiver; 8, driving cylinder.
Detailed description of the invention
Below in conjunction with drawings and Examples, the invention will be further described:
Notice, structure, ratio, size etc. that this specification sheets institute accompanying drawings illustrates, content all only in order to coordinate specification sheets to disclose, understand for person skilled in the art scholar and read, and be not used to limit the enforceable qualifications of the present invention, therefore the not technical essential meaning of tool, the adjustment of the modification of any structure, the change of proportionate relationship or size, do not affecting under effect that the present invention can produce and the object that can reach, still all should drop on disclosed technology contents and obtain in the scope that can contain.Simultaneously, quote in this specification sheets as " on ", D score, "left", "right", " centre " and " one " etc. term, also only for ease of understanding of describing, and be not used to limit the enforceable scope of the present invention, the change of its relativeness or adjustment, under changing technology contents without essence, when being also considered as the enforceable category of the present invention.
Embodiment: a kind of silicon chip inserting machine film feeding apparatus
Shown in accompanying drawing 1 ~ 4, a kind of silicon chip inserting machine film feeding apparatus, comprises silicon chip separating mechanism and silicon chip conveying mechanism; Described silicon chip separating mechanism comprises the first load-transfer device 1, second load-transfer device 2, hopper and puff port 3; Described first load-transfer device 1 is obliquely installed, and described first load-transfer device 1 and the second load-transfer device 2 are between the upper and lower every setting; Described first load-transfer device 1 is positioned at the top of described second load-transfer device 2, and the projection of the first end of described first load-transfer device 1 is positioned on described second load-transfer device 2, second end of corresponding described first load-transfer device 1 of described hopper is arranged, and is provided with silicon chip and moves up and down actuating device in described hopper; Described puff port 4 is positioned at the below of described first load-transfer device 1, and blowing direction is arranged towards described hopper; Water is accommodated in described hopper.Described puff port 4 is communicated with a gas feeder by pipeline.
Described silicon chip conveying mechanism comprises the 3rd load-transfer device 5 and three the 4th load-transfer devices 6.Described 4th load-transfer device 6 is common Timing Belt, and the distance that its quantity is carried according to silicon chip is determined, can certainly be extended the distance of silicon chip conveying by the length increasing by the 4th load-transfer device 6.3rd load-transfer device 5 drives with drive motor respectively with the imput shaft of the 4th load-transfer device 6 and is connected, and concrete mode can be V belt translation or Chain conveyer.The driven shaft of described 3rd load-transfer device 5 is articulated with on the piston rod of a driving cylinder 8, driving cylinder 8 can be cylinder, also can be hydraulic ram, the present embodiment specifically adopts hydraulic ram, under the piston rod of hydraulic ram is in the state of stretching out, then the 3rd load-transfer device 5 is for being horizontally disposed with, at this moment the silicon chip be positioned on the 3rd load-transfer device 5 can normally be carried, when piston rod is in retracted mode, then the 3rd load-transfer device 5 is for being obliquely installed, at this moment the useless silicon chip receiver 7 that the below that the silicon chip be positioned on the 3rd load-transfer device 5 then slides to one end of the driven shaft of described 3rd load-transfer device 5 is arranged.Described 3rd load-transfer device 5 and the 4th load-transfer device 6 series winding are arranged, and namely described 3rd load-transfer device 5 and the 4th load-transfer device 6 continue and to carry silicon chip.
Second load-transfer device 2 of described silicon chip separating mechanism docks with described silicon chip conveying mechanism, and the silicon chip namely on the second load-transfer device 2 is delivered on the 4th load-transfer device 6 of silicon chip conveying mechanism.Described puff port is communicated with a gas feeder by pipeline, and this gas feeder can be blowing engine.Described first load-transfer device is obliquely installed.Water is accommodated in described hopper.Described 4th load-transfer device is horizontally disposed with.Water is accommodated in described useless silicon chip receiver.
The axle drive shaft of the first load-transfer device 1 and the axle drive shaft of the second load-transfer device drive with same drive motor 3 and are connected, and drive and connect the concrete mode adopting V belt translation.It can be screw-nut body that silicon chip moves up and down actuating device, and the silicon chip of stacking is placed on a platform, and under this platform, effect has screw-nut body, and this screw-nut body is by driving stepper motor.First load-transfer device has two ends, and the one end be positioned at above the second load-transfer device is referred to as first end, and the one end be positioned at above hopper is referred to as the second end.
Method of work: water-filling in hopper, also can adopt the fluid instead of water of other kind, but is advisable with the following process do not damaged with do not affect silicon chip.Then the silicon chip that the silicon chip of stacking is placed in hopper is moved up and down on the platform of actuating device, then start silicon chip and move up and down actuating device and stepping motor, make silicon chip moves until the first silicon chip of top layer of silicon chip of stacking touches the downside of the second end of the first load-transfer device 1, then start drive motor and rotate to drive the first load-transfer device 1 and the second load-transfer device 2.When silicon chip touches the downside of the second end of the first load-transfer device, due to the rotation of the first load-transfer device, and the surface of silicon chip has water, therefore one end of silicon chip utilizes the inertia of the cohesive force of water and the rotation of the first load-transfer device and is absorbed and fixed at the lower surface of the first load-transfer device, gap can be produced between the silicon chip contacted with the first load-transfer device like this and the silicon chip under it, puff port is then blown towards gap, the silicon chip contacted with the first load-transfer device is thoroughly separated with the silicon chip under it, silicon chip separately utilizes the inertia of the rotation of the first load-transfer device and the cohesive force of water, silicon chip is moved to one end of load-transfer device by the second end of the first load-transfer device, this moves is carry out in the downside of the first load-transfer device.When moving to the first end end of the first load-transfer device, then drop down onto the second load-transfer device upper surface, by the second load-transfer device, silicon chip is sent to realize Fragmentation.
Silicon chip is delivered on first the 4th load-transfer device by the second load-transfer device, the top of the 4th load-transfer device arranges silicon chip check implement, namely a camera lens is set, contrasted by the shooting photo of silicon chip and the silicon chip of control system, when silicon chip nonconformity, control system sends instruction, the piston rod of driving cylinder is retracted, inferior-quality silicon chip slides in useless silicon chip receiver from the 3rd load-transfer device, and owing to accommodating water in useless silicon chip receiver, therefore useless silicon chip can not be broken into pieces again.
Above-described embodiment, only for technical conceive of the present invention and feature are described, its object is to person skilled in the art can be understood content of the present invention and implement according to this, can not limit the scope of the invention with this.All equivalences done according to Spirit Essence of the present invention change or modify, and all should be encompassed within protection scope of the present invention.
Claims (6)
1. a silicon chip inserting machine film feeding apparatus, is characterized in that: comprise silicon chip separating mechanism and silicon chip conveying mechanism; Described silicon chip separating mechanism comprises the first load-transfer device, the second load-transfer device, hopper and puff port; Described first load-transfer device and the second load-transfer device are between the upper and lower every setting, described first load-transfer device is positioned at the top of described second load-transfer device, and the projection of the first end of described first load-transfer device is positioned on described second load-transfer device, second end of corresponding described first load-transfer device of described hopper is arranged, and is provided with silicon chip and moves up and down actuating device in described hopper; Described puff port is positioned at the below of described first load-transfer device, and blowing direction is arranged towards described hopper; Described silicon chip conveying mechanism comprises at least one the 3rd load-transfer device and at least one the 4th load-transfer device; The driven shaft of described 3rd load-transfer device is articulated with on the piston rod of a driving cylinder, and the below of one end of the driven shaft of described 3rd load-transfer device is provided with useless silicon chip receiver; Described 3rd load-transfer device and the 4th load-transfer device series winding are arranged; Second load-transfer device of described silicon chip separating mechanism docks with described silicon chip conveying mechanism.
2. silicon chip inserting machine film feeding apparatus according to claim 1, is characterized in that: described puff port is communicated with a gas feeder by pipeline.
3. silicon chip inserting machine film feeding apparatus according to claim 1, is characterized in that: described first load-transfer device is obliquely installed.
4. silicon chip inserting machine film feeding apparatus according to claim 1, is characterized in that: accommodate water in described hopper.
5. silicon chip inserting machine film feeding apparatus according to claim 1, is characterized in that: described 4th load-transfer device is horizontally disposed with.
6. silicon chip inserting machine film feeding apparatus according to claim 1, is characterized in that: accommodate water in described useless silicon chip receiver.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510079997.9A CN104773541A (en) | 2015-02-13 | 2015-02-13 | Slice supplying device for silicon slice inserting machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510079997.9A CN104773541A (en) | 2015-02-13 | 2015-02-13 | Slice supplying device for silicon slice inserting machine |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104773541A true CN104773541A (en) | 2015-07-15 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510079997.9A Pending CN104773541A (en) | 2015-02-13 | 2015-02-13 | Slice supplying device for silicon slice inserting machine |
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| CN (1) | CN104773541A (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4217977A (en) * | 1978-09-15 | 1980-08-19 | The Silicon Valley Group, Inc. | Conveyor system |
| DE102006011870A1 (en) * | 2006-03-15 | 2007-09-20 | Insotech Ohg | Isolating device for supplying plate-shaped objects like semiconductor wafers piece-by-piece from a stack has a belt feeder device with conveyor belts |
| CN102364668A (en) * | 2011-10-28 | 2012-02-29 | 北京太阳能电力研究院有限公司 | Silicon wafer box and silicon wafer feeding device |
| CN103601015A (en) * | 2013-11-19 | 2014-02-26 | 张家港市超声电气有限公司 | Piece separating and conveying device |
| CN203932030U (en) * | 2014-06-19 | 2014-11-05 | 温州海旭科技有限公司 | A kind of silicon chip conveyer of Full-automatic silicon chip inserting machine |
| CN204453918U (en) * | 2015-02-13 | 2015-07-08 | 苏州博阳能源设备有限公司 | A kind of silicon chip inserting machine film feeding apparatus |
-
2015
- 2015-02-13 CN CN201510079997.9A patent/CN104773541A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4217977A (en) * | 1978-09-15 | 1980-08-19 | The Silicon Valley Group, Inc. | Conveyor system |
| DE102006011870A1 (en) * | 2006-03-15 | 2007-09-20 | Insotech Ohg | Isolating device for supplying plate-shaped objects like semiconductor wafers piece-by-piece from a stack has a belt feeder device with conveyor belts |
| CN102364668A (en) * | 2011-10-28 | 2012-02-29 | 北京太阳能电力研究院有限公司 | Silicon wafer box and silicon wafer feeding device |
| CN103601015A (en) * | 2013-11-19 | 2014-02-26 | 张家港市超声电气有限公司 | Piece separating and conveying device |
| CN203932030U (en) * | 2014-06-19 | 2014-11-05 | 温州海旭科技有限公司 | A kind of silicon chip conveyer of Full-automatic silicon chip inserting machine |
| CN204453918U (en) * | 2015-02-13 | 2015-07-08 | 苏州博阳能源设备有限公司 | A kind of silicon chip inserting machine film feeding apparatus |
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Application publication date: 20150715 |
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| RJ01 | Rejection of invention patent application after publication |