CN104756403A - LC filter element and LC filter - Google Patents
LC filter element and LC filter Download PDFInfo
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- CN104756403A CN104756403A CN201480002753.4A CN201480002753A CN104756403A CN 104756403 A CN104756403 A CN 104756403A CN 201480002753 A CN201480002753 A CN 201480002753A CN 104756403 A CN104756403 A CN 104756403A
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H7/00—Multiple-port networks comprising only passive electrical elements as network components
- H03H7/01—Frequency selective two-port networks
- H03H7/09—Filters comprising mutual inductance
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H1/00—Constructional details of impedance networks whose electrical mode of operation is not specified or applicable to more than one type of network
- H03H2001/0021—Constructional details
- H03H2001/0085—Multilayer, e.g. LTCC, HTCC, green sheets
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Abstract
The present invention reduces the design costs for an LC filter in which the properties of an attenuation pole that is formed by jump coupling are changed in various ways. An LC filter element (100) is provided with: a ceramic stacked body (10) having stacked therein a plurality of ceramic layers (11-61); an LC filter circuit that is formed within the ceramic stacked body (10); and an input terminal, an output terminal, and a ground terminal that are formed on the surface of the ceramic stacked body (10). Mounting electrodes (64a, 64b) are formed on the surface of the ceramic stacked body (10) and are for mounting at least one of an externally-attached inductor, capacitor, and/or SAW resonator that are connected to the LC filter circuit in order to configure a circuit element that constitutes a jump coupling that forms an attenuation pole.
Description
Technical field
The present invention relates to the circuit element and the LC filter cell body that uses and LC filter that are connected to and form and jump over coupling.
Background technology
In the past, in the electronic equipment of mobile communication equipment etc., the electronic devices and components that LC filter is widely used as making the signal of allocated frequency band to pass through.
Such as in patent documentation 1 (Japanese Patent Laid-Open 2012-23752 publication), disclose the inside at multilayered ceramic body, utilize internal electrode to form the LC filter of circuit pattern.The circuit element that this circuit pattern jumps over coupling with formation is connected, and the frequency location of regulation has attenuation pole, plays a role as LC filter circuit.
Prior art document
Patent documentation
Patent documentation 1: Japanese Patent Laid-Open 2012-23752 publication
Summary of the invention
Invent technical problem to be solved
LC filter, according to purposes, requires to possess variously to pass through characteristic.And, what make LC filter has a kind of multifarious method by characteristic and is, make by connecting and composing the circuit element jumping over coupling (" jumping over coupling " refers to that the circuit structure separating a section or multistage carries out electric coupling) on the regulation place of LC filter circuit, thus make the attenuation characteristic of formed attenuation pole that the method changed occur.
But, in described LC filter in the past, in order to by connecting and composing the circuit element that jumps over coupling and making the attenuation characteristic of formed attenuation pole change, must at each LC filter, change the pattern form of the internal electrode of multilayered ceramic body inside or cross the position etc. of pore electrod, the problem that the design cost producing LC filter uprises.
The technical scheme that technical solution problem adopts
The design cost that the LC filter of various change occurs the characteristic that the object of the invention is to make utilization jump over the attenuation pole that coupling is formed reduces.
The present invention is used for LC filter cell body, and uses the LC filter of this LC filter cell body.
LC filter cell body of the present invention, is characterized in that, comprising: the multilayered ceramic body that multiple ceramic layer is laminated; The LC filter circuit formed in the inside of described multilayered ceramic body; And the surface of described multilayered ceramic body formed input terminal, lead-out terminal, earth terminal, as by with described LC filter circuit be connected to form attenuation pole, form the circuit element jumping over and be coupled, form the installation electrode of at least one for installing in the inductance of peripheral hardware, electric capacity and SAW resonator (SAW:Surface Acoustic Wave) on the surface of described multilayered ceramic body.
LC filter of the present invention, is characterized in that, on the described installation electrode of described LC filter cell body, installs at least one in the inductance of described peripheral hardware, electric capacity and SAW resonator.
Invention effect
According to the present invention, by only install in order to make described LC filter cell body have predetermined characteristic prepare, connect this LC filter cell body thus play jump over coupling, suitably the peripheral hardware inductance of kind and/or electric capacity, the LC filter of various characteristic can be obtained, therefore can reduce the design cost of LC filter.
Accompanying drawing explanation
Fig. 1 is the decomposition diagram of LC filter cell body 100 of the first embodiment of the present invention.
Fig. 2 is the cross-sectional view of LC filter cell body 100 of the first embodiment of the present invention.
Fig. 3 is the figure of the equivalent electric circuit for illustration of LC filter cell body 100 of the first embodiment of the present invention and LC filter 1100.
Fig. 4 is the cross-sectional view of LC filter 1100 of the first embodiment of the present invention.
Fig. 5 is the figure by characteristic representing LC filter 1100 of the first embodiment of the present invention.
Fig. 6 is the cross-sectional view of that installed the SAW resonator of peripheral hardware, of the present invention LC filter 1100 of the first embodiment.
Fig. 7 represents the figure by characteristic that installed the SAW resonator of peripheral hardware, LC filter 1100 of the first embodiment of the present invention.
Fig. 8 is the decomposition diagram of LC filter cell body 200 of the second embodiment of the present invention.
Fig. 9 is the cross-sectional view of LC filter cell body 200 of the second embodiment of the present invention.
Figure 10 is the figure of the equivalent electric circuit for illustration of LC filter cell body 200 of the second embodiment of the present invention and LC filter 1200.
Figure 11 is the cross-sectional view of LC filter 1200 of the second embodiment of the present invention.
Figure 12 is the figure by characteristic representing LC filter 1200 of the second embodiment of the present invention.
Figure 13 is the decomposition diagram of LC filter cell body 300 of the third embodiment of the present invention.
Figure 14 is the cross-sectional view of LC filter cell body 300 of the third embodiment of the present invention.
Figure 15 is the figure of the equivalent electric circuit for illustration of LC filter cell body 300 of the third embodiment of the present invention and LC filter 1300.
Figure 16 is the cross-sectional view of LC filter 1300 of the third embodiment of the present invention.
Figure 17 is the figure by characteristic representing LC filter 1300 of the third embodiment of the present invention.
Figure 18 is the cross-sectional view of that installed the SAW resonator of peripheral hardware, of the present invention LC filter 1300 of the third embodiment.
Figure 19 represents the figure by characteristic that installed the SAW resonator of peripheral hardware, LC filter 1300 of the third embodiment of the present invention.
Figure 20 is the figure of the equivalent electric circuit of the LC filter 1400 related to for illustration of other execution mode of the present invention.
Figure 21 is the figure by characteristic representing the LC filter 1400 that other execution mode of the present invention relates to.
Figure 22 is the figure of the equivalent electric circuit of the LC filter 1500 related to for illustration of other execution mode of the present invention.
Figure 23 is the figure by characteristic representing the LC filter 1500 that other execution mode of the present invention relates to.
Figure 24 is the figure of the equivalent electric circuit of the LC filter 1600 related to for illustration of other execution mode of the present invention.
Figure 25 is the figure by characteristic representing the LC filter 1600 that other execution mode of the present invention relates to.
Figure 26 is the figure of the equivalent electric circuit of the LC filter 1700 related to for illustration of other execution mode of the present invention.
Figure 27 is the figure by characteristic representing the LC filter 1700 that other execution mode of the present invention relates to.
Embodiment
(the 1st execution mode)
Below, based on accompanying drawing, the 1st execution mode of the present invention is described.
Fig. 1 is the decomposition diagram representing LC filter cell body 100 of the first embodiment of the present invention.Fig. 2 is the cross-sectional view representing LC filter cell body 100.Fig. 3 is the equivalent electric circuit representing LC filter cell body 100 and LC filter 1100 of the first embodiment of the present invention.Fig. 4 is the cross-sectional view representing LC filter 1100.In addition, LC filter 1100 is used as band pass filter.
As shown in Figure 1, LC filter 100 possesses the multilayered ceramic body 10 be made up of multiple ceramic layer.The material of multilayered ceramic body 10 is not particularly limited to, such as, can use barium titanate.
Multilayered ceramic body 10 is by the stacked from lower to upper Structure composing of six ceramic layers 11,21,31,41,51,61.
Internal electrode 12a, 12b, 12c of three rectangles is formed on the surface of ceramic layer 11.Two internal electrodes 12a, 12c lead to the side of duplexer 10 respectively from two minor faces that ceramic layer 11 is relative.
Internal electrode 22a, 22b of two rectangles is formed on the surface of ceramic layer 21.In addition, form two and cross the through ceramic layer 21 of pore electrod 23a, 23b.Cross pore electrod 23a and internal electrode 12a and internal electrode 22a conducting.Cross pore electrod 23b and internal electrode 12c and internal electrode 22b conducting.
A grounding electrode 35a is formed on the surface of ceramic layer 31.Grounding electrode 35a leads to the side of duplexer 10 respectively from relative two long limits of ceramic layer 31.In addition, form two and cross the through ceramic layer 31 of pore electrod 33a, 33b.Cross pore electrod 33a and cross pore electrod 23a conducting.Cross pore electrod 33b and cross pore electrod 23b conducting.
A rectangular internal electrode 42a is formed on the surface of ceramic layer 41.In addition, form five and cross the through ceramic layer 41 of pore electrod 43a, 43b, 43c, 43d, 43e.Cross pore electrod 43a and grounding electrode 35a conducting.Cross pore electrod 43b and grounding electrode 35a conducting.Cross pore electrod 43c and cross pore electrod 33b conducting.Cross pore electrod 43d and grounding electrode 35a conducting.Cross pore electrod 43e and cross pore electrod 33a conducting.
Three rectangular internal electrode 52a, 52b, 52c are formed on the surface of ceramic layer 51.In addition, form six and cross the through ceramic layer 51 of pore electrod 53a, 53b, 53c, 53d, 53e, 53f.Cross pore electrod 53a and one end conducting of crossing pore electrod 43a and internal electrode 52a.Cross one end of pore electrod 53b and internal electrode 42a and one end conducting of internal electrode 52b.Cross pore electrod 53c and one end conducting of crossing pore electrod 43b and internal electrode 52c.Cross pore electrod 53d and the other end conducting of crossing pore electrod 43c and internal electrode 52c.Cross pore electrod 53e and the other end conducting of crossing pore electrod 43d and internal electrode 52b.Cross pore electrod 53f and the other end conducting of crossing pore electrod 43e and internal electrode 52a.
Two rectangular installation electrode 64a, 64b are formed on the surface of ceramic layer 61.In addition, form two and cross the through ceramic layer 61 of pore electrod 63a, 63b.Cross pore electrod 63a and installation electrode 64a and cross pore electrod 53f conducting.Cross pore electrod 63b and installation electrode 64b and cross pore electrod 53d conducting.
As shown in Figure 2, in the relative side of the short brink of multilayered ceramic body 10, form input terminal IN and lead-out terminal OUT.But input terminal IN is blocked by multilayered ceramic body 10 and not shown.Input terminal IN connects internal electrode 12a.Lead-out terminal OUT connects internal electrode 12c.
In the relative side of the long side of multilayered ceramic body 10, form a pair earth terminal GND.But one of a pair earth terminal GND is blocked not shown by multilayered ceramic body 10.A pair earth terminal GND, GND are connected with grounding electrode 35a respectively.
Internal electrode 12a ~ 12c, 22a, 22b, 42a, 52a ~ 52c, grounding electrode 35a, excessively pore electrod 23a, 23b, 33a, 33b, 43a ~ 43c, 53a ~ 53f, 63a, 63b, install with electrode 64a, 64b, input terminal IN, lead-out terminal OUT, the material of earth terminal GND, GND is not particularly limited, such as, can adopt the conductor thickener etc. containing Cu (copper).
The LC filter cell body 100 be made up of said structure, in the equivalent electric circuit shown in Fig. 3, is made up of the part of dotted line.
In LC filter cell body 100, between the path connecting input terminal IN and lead-out terminal OUT and earth terminal GND, insertion inductance L 1 in parallel and electric capacity C1, form LC resonant circuit Q1.Inductance L 1 is primarily of internal electrode 12a, cross pore electrod 23a, cross pore electrod 33a, cross pore electrod 43e, cross pore electrod 53f, internal electrode 52a, cross pore electrod 53a, cross the circulus that pore electrod 43a and grounding electrode 35a forms.Electric capacity C1 is formed primarily of sandwiching the electric capacity formed between the internal electrode 22a of ceramic layer 31 and grounding electrode 35a.
Between the path connecting input terminal IN and lead-out terminal OUT and earth terminal GND, at the back segment of LC resonant circuit Q1, insertion inductance L 2 in parallel and electric capacity C2, form LC resonant circuit Q2.Inductance L 2 is primarily of grounding electrode 35a, excessively pore electrod 43d, the circulus crossing pore electrod 53e, internal electrode 52b, excessively pore electrod 53b, internal electrode 42a formation.Electric capacity C2 is formed primarily of sandwiching the electric capacity formed between the internal electrode 42a of ceramic layer 41 and grounding electrode 35a.
Between the path connecting input terminal IN and lead-out terminal OUT and earth terminal GND, at the back segment of LC resonant circuit Q2, insertion inductance L 3 in parallel and electric capacity C3, form LC resonant circuit Q3.Inductance L 3 is primarily of internal electrode 12c, cross pore electrod 23b, cross pore electrod 33b, cross pore electrod 43d, cross pore electrod 53d, internal electrode 52c, cross pore electrod 53c, cross the circulus that pore electrod 43b and grounding electrode 35a forms.Electric capacity C3 is formed primarily of sandwiching the electric capacity formed between the grounding electrode 35a of ceramic layer 31 and internal electrode 22a.
By forming mutual inductance M1 between inductance L 1 and inductance L 2, make LC resonant circuit Q1 and LC resonant circuit Q2 electromagnetic coupled.By forming mutual inductance M2 between inductance L 2 and inductance L 3, make LC resonant circuit Q2 and LC resonant circuit Q3 electromagnetic coupled.Thus, on the path connecting input terminal IN and lead-out terminal OUT, multiple LC resonant circuit Q1, Q2, Q3 electromagnetic coupled is successively set.
On the path connecting input terminal IN and lead-out terminal OUT, insert the circuit element that formation jumps over coupling C13a (in the present invention, " jumping over coupling " refers to that the circuit structure crossing over one or more snippets carries out electric coupling).Jumping over coupling C13a is primarily of sandwiching the electric capacity formed between the internal electrode 22a of ceramic layer 21 and internal electrode 12b, and the combined capacity being connected in series formation sandwiching the electric capacity formed between the internal electrode 12b of ceramic layer 21 and internal electrode 22b is formed.
In the LC filter cell body 100 of above Structure composing, between input terminal IN and lead-out terminal OUT, installation electrode 64a, 64b is utilized to be provided with two open ends.Between these two open ends, connect the electric capacity (recording with dotted line in figure 3) played a role as redirect coupling C13b, thus can use as LC filter 1100.
Specifically, as jumping over coupling C13b, as shown in Figure 4, by the electric capacity 80 of peripheral hardware is arranged on installation electrode 64a, 64b, LC filter 1100 is completed.The electric capacity 80 of peripheral hardware is the chip capacitor forming terminal electrode 80a, 80b at two ends, and terminal electrode 80a, the 80b at two ends are welded on installation electrode 64a, 64b respectively.But, in Fig. 4, omit the diagram of wlding.
Above-mentioned installation results is at LC filter circuit, jumps over coupling C13, can form attenuation pole at desired frequency domain with jumping over coupling C13a and jumping over coupling C13b formation.
According to the present invention, due to the peripheral hardware electric capacity 80 by means of only the suitable kind of installation, just can obtain the LC filter 1100 of various characteristic, therefore the design cost of LC filter can be reduced, the peripheral hardware electric capacity 80 of above-mentioned suitable kind prepares in order to the characteristic making LC filter cell body 100 and have regulation, plays a role as jumping over coupling C13b by connecting this LC filter cell body 100.
In addition, according to the present invention, a part of C13a of coupling is jumped over by being formed in the inside of multilayered ceramic body 10, can to controlling when having installed the characteristic range etc. as the attenuation pole realized when jumping over the peripheral hardware electric capacity 80 of the regulation that the C13b that is coupled plays a role.
In addition, in the present invention, connection is crossed pore electrod 63a with electrode 64a, with the part near input terminal IN on circuit in internal electrode 52a, namely, internal electrode 52a is connected with the part that pore electrod 53f is connected excessively.Similarly, pore electrod 63b will be crossed with the part near lead-out terminal OUT on circuit in internal electrode 52c, namely, internal electrode 52c is connected with the part that pore electrod 53d is connected excessively.This is to make the link position at the two ends of jumping over coupling C13b as far as possible near the position of the equivalent electric circuit of Fig. 3.
Then, an example of the manufacture method of LC filter cell body 100 of the first embodiment of the present invention is described.
First, the ceramic green sheet for the formation of ceramic layer 11,21,31,41,51,61 is prepared.Ceramic green sheet can utilize the known method manufacture be widely used in the manufacturing process of multilayered ceramic electronic devices and components in the past.
Then, on ceramic green sheet, the hole for the formation of crossing pore electrod 23a, 23b, 33a, 33b, 43a ~ 43e, 53a ~ 53f, 63a, 63b is formed.Hole can utilize the formation such as punching or laser irradiation.
Then, respectively with desired shape applying conductive thickener on the surface of ceramic green sheet, form internal electrode 12a ~ 12c, 22a, 22b, 42a, 52a ~ 52c, grounding electrode 35a and install with electrode 64a, 64b.At this moment, simultaneously also filled conductive thickener in for the formation of the hole crossing pore electrod, formed pore electrod 23a, 23b, 33a, 33b, 43a ~ 43e, 53a ~ 53f, 63a, 63b.
Then, with the stacked ceramic green sheet of order from the bottom up, crimp, make unfired multilayered ceramic body 10.
Then, on the surface of unfired multilayered ceramic body 10, with the shape applying conductive thickener specified, input terminal IN, lead-out terminal OUT and a pair earth terminal GND, GND is formed.
Finally, while the section bar firing ceramics duplexer 10 specified, by input terminal IN, lead-out terminal OUT, a pair earth terminal GND, GND calcining on multilayered ceramic body 10, complete LC filter cell body 100 of the first embodiment of the present invention.
(the 1st experimental example of the 1st execution mode)
In order to confirm validity of the present invention, carry out ensuing simulated experiment.
First, LC filter 1100 of the present invention of the first embodiment described in supposing, circuit simulator (ADS:Advanced Design System (Agilent Technology Inc.)) is utilized to simulate by characteristic, as experimental example 1.Then, suppose in experimental example 1, only make the capacitance of the electric capacity 80 (chip capacitor) of the peripheral hardware of LC filter 1100 change, simulate by characteristic, as experimental example 2.In addition, suppose that peripheral hardware electric capacity 80 capacitance installed in experimental example 1 is greater than experimental example 2.
What Fig. 5 represented the LC filter 1100 utilizing described simulation to obtain passes through characteristic.Solid line be experimental example 1 by characteristic, dotted line be experimental example 2 pass through characteristic.
As shown in Figure 5, experimental example 1 and experimental example 2 all have the function at about 2.3 ~ 2.6GHz with the pass filter of passband.In addition, produce an attenuation pole at the high frequency side of passband, produce two attenuation poles at the lower frequency side of passband.Experimental example 1 and experimental example 2 being compared known, by installing the large peripheral hardware electric capacity 80 of capacitance, the attenuation characteristic (frequency location, attenuation) by connecting and composing the circuit element jumping over coupling and three attenuation poles formed being made to change.Specifically, the attenuation pole formed at the high frequency side of passband can be made, and the frequency location of the attenuation pole (about near 2GHz) formed at the lower frequency side of passband moves to high frequency side.In addition, the frequency location of the attenuation pole (about near 1GHz) formed at the lower frequency side of passband can be made to move to lower frequency side.
In experimental example, making two kinds of LC filters, by changing the capacitance of the peripheral hardware electric capacity installed, a greater variety of LC filter can have been obtained, reduced the burden of design cost.
In 1st execution mode, on the surface of multilayered ceramic body 10, the element beyond electric capacity can also be installed, such as SAW resonator.SAW resonator is the resonator utilizing elastic surface wave (SAW:Surface AcousticWave).
That is, as shown in Fig. 3 jump over coupling C13b, as shown in Figure 6, by being arranged on installation electrode 64a, 64b by the SAW resonator 83 of peripheral hardware, complete LC filter 1100.SAW resonator 83 is the resonant elements forming terminal electrode 83a, 83b at two ends, and terminal electrode 83a, the 83b at two ends are welded on installation electrode 64a, 64b respectively.But, in Fig. 6, omit the diagram of wlding.
(the 2nd experimental example of the 1st execution mode)
Fig. 7 is the figure of the example by characteristic for illustration of the LC filter 1100 having installed peripheral hardware SAW resonator.In Fig. 7, represent the analog result by characteristic of experimental example 1A respectively with solid line, dotted line represents the analog result by characteristic of experimental example 2A.The experimental example 1 of experimental example 1A and Fig. 3 of Fig. 7 similarly, represents as jumping over coupling C13b shown in Fig. 3, passes through characteristic when having installed electric capacity 80 (Fig. 4) of peripheral hardware.At experimental example 1 (Fig. 3) and experimental example 1A (Fig. 7), the constant value of each element (L1, C1 etc. of Fig. 3) of LC filter 1100 and the capacitance of electric capacity 80 also can be different.The experimental example 2A of Fig. 7, represent as shown in Fig. 3 jump over coupling C13b, that has installed the situation of the SAW resonator 83 (Fig. 6) of peripheral hardware passes through characteristic.
Experimental example 1A and experimental example 2A compares known, by installing peripheral hardware SAW resonator 83, forms attenuation pole.Specifically, attenuation pole is formed at the high frequency side by characteristic.Thus, at the high frequency side by characteristic, the attenuation characteristic sharply that make use of SAW resonator 83 can be realized.Utilize the characteristic of SAW resonator 83, attenuation pole can be formed at the lower frequency side by characteristic.In this situation, at the lower frequency side by characteristic, the attenuation characteristic that SAW resonator 83 realizes sharply can be utilized.
(the 2nd execution mode)
Below, based on accompanying drawing, the 2nd execution mode of the present invention is described.
Fig. 8 represents the decomposition diagram of LC filter cell body 200 of the second embodiment of the present invention.Fig. 9 represents the cross-sectional view of LC filter cell body 200.Figure 10 represents the equivalent electric circuit of LC filter cell body 200 and LC filter 1200 of the second embodiment of the present invention.Figure 11 represents the cross-sectional view of LC filter 1200.In addition, although LC filter 1100 is used as band pass filter, LC filter 1200 also can use as low pass filter.
As shown in Figure 8, LC filter cell body 200 possesses the multilayered ceramic body 10 that multiple ceramic layer is formed.Multilayered ceramic body 10 is 12 ceramic layers 11,21,31,41,51,61,71,81,91,101,111,121 stacked formations from lower to upper.
Form the input terminal IN of two rectangles, lead-out terminal OUT at the back side of ceramic layer 11, contact with the relative both sides of the short brink of ceramic layer 11.In addition, form a pair earth terminal GND, contact with the relative both sides of the long side of ceramic layer 11.
On the surface of ceramic layer 21, form grounding electrode 25a.Grounding electrode 25a leads to the side of multilayered ceramic body 10 from two relative long limits of ceramic layer 21.
On the surface of ceramic layer 41, form internal electrode 42a, 42b of two rectangles.Two internal electrodes 42a, 42b lead to the side of multilayered ceramic body 10 respectively from relative two minor faces.
On the surface of ceramic layer 51, form the internal electrode 52a of a rectangle.
On the surface of ceramic layer 61, form internal electrode 62a, 62b of two rectangles.Two internal electrodes 62a, 62b lead to the side of multilayered ceramic body 10 respectively from relative both sides.
On the surface of ceramic layer 81, form a spiral helicine internal electrode 82a.One end of internal electrode 82a from ceramic layer 81 short brink while lead to the side of multilayered ceramic body 10.
On the surface of ceramic layer 91, form the internal electrode 92a of a U-shaped.In addition, form one and cross the through ceramic layer 91 of pore electrod 93a.Cross one end of pore electrod 93a and internal electrode 92a and the other end conducting of internal electrode 82a.
On the surface of ceramic layer 101, form a spiral helicine internal electrode 102a.The other end of internal electrode 102a from ceramic layer 101 short brink while lead to the side of multilayered ceramic body 10.In addition, form one and cross the through ceramic layer 101 of pore electrod 103a.Cross one end of pore electrod 103a and internal electrode 102a and the other end conducting of internal electrode 92a.
On the surface of ceramic layer 121, form two rectangular installation electrode 121a, 121b.Two installation electrodes 121a, 121b extend to the relative side of multilayered ceramic body 10 respectively and are formed.In addition, form a pair earth terminal GND, GND to contact with the relative both sides of the long side of ceramic layer 121.
As shown in Figure 9, in the side that the short brink of multilayered ceramic body 10 is relative, form input terminal IN and lead-out terminal OUT.But input terminal IN is blocked by multilayered ceramic body 10, not shown.Input terminal IN is connected with internal electrode 42a, internal electrode 62a, internal electrode 102a and installation electrode 121a.Lead-out terminal OUT is connected with internal electrode 42b, internal electrode 62b, internal electrode 82a and installation electrode 121b.
In the side that the long side of multilayered ceramic body 10 is relative, form a pair earth terminal GND.But one of them of a pair earth terminal GND is blocked by multilayered ceramic body 10, not shown.One of them of a pair earth terminal GND is connected with grounding electrode 25a.A pair earth terminal GND wherein another is connected with grounding electrode 25a.
The LC filter cell body 200 be made up of said structure, in the equivalent electric circuit shown in Figure 10, is made up of the part of dotted line.
In LC filter cell body 200, on the path connecting input terminal IN and lead-out terminal OUT, insert an inductance L 1.Inductance L 1 is primarily of internal electrode 102a, excessively pore electrod 103a, internal electrode 92a, the ring-type formation crossing pore electrod 93a, internal electrode 82a formation.
On the path connecting input terminal IN and lead-out terminal OUT, insert the circuit element forming and jump over coupling C12a, in parallel with inductance L 1.Jumping over coupling C12a is primarily of sandwiching the electric capacity formed between internal electrode 42a, 42b of ceramic layer 51 and internal electrode 52a, and the combined capacity sandwiching the electric capacity formed between internal electrode 62a, 62b of ceramic layer 61 and internal electrode 52b is formed.
Between the path connecting input terminal IN and lead-out terminal OUT and earth terminal GND, insert electric capacity C1.One end of electric capacity C1 connects one end of input terminal IN and inductance L 1, and the other end connects earth terminal GND.Electric capacity C1 is formed primarily of sandwiching the electric capacity formed between the internal electrode 42a of ceramic layer 31,41 and grounding electrode 25a.
Between the path connecting input terminal IN and lead-out terminal OUT and earth terminal GND, insert electric capacity C2.One end of electric capacity C2 connects the other end of lead-out terminal OUT and inductance L 2, and the other end connects earth terminal GND.Electric capacity C2 is formed primarily of sandwiching the electric capacity formed between the internal electrode 42b of ceramic layer 31,41 and grounding electrode 25a.
As indicated above, in LC filter cell body 200, possess one section of lc circuit, this section of lc circuit contains: connecting the inductance L 1 that the path of input terminal IN and lead-out terminal OUT is inserted, and inductance C1, C2 of inserting between this path and earth terminal GND.
In the LC filter cell body 200 of above Structure composing, on the path connecting input terminal IN and lead-out terminal OUT, installation electrode 121a, 121b is utilized to be provided with two open ends.In these two open ends, connect the electric capacity (in Fig. 10 with dotted line record) as jumping over coupling C12b and playing a role, thus can connect in the mode of crossing over one section of lc circuit and jump over the C12b that is coupled, use as LC filter 1200.
Specifically, as forming the circuit element jumping over coupling C12b, as shown in figure 11, by the electric capacity 130 of peripheral hardware is arranged on installation electrode 121a, 121b, thus LC filter 1200 is completed.
Above-mentioned installation results is at LC filter circuit, with jump over coupling C12a and jump over coupling C12b is formed jump over coupling C12, can desired frequency domain formation attenuation pole.
According to the 2nd execution mode, in a same manner as in the first embodiment, due to the peripheral hardware electric capacity 130 by means of only the suitable kind of installation, just can obtain the LC filter 1200 of various characteristic, therefore the design cost of LC filter can be reduced, the peripheral hardware electric capacity 130 of above-mentioned suitable kind prepares in order to the characteristic making LC filter cell body 200 and reach regulation, plays a role as jumping over coupling C12b by connecting this LC filter cell body 200.
(experimental example of the 2nd execution mode)
In order to confirm validity of the present invention, to the LC filter 1200 of the 2nd execution mode, in a same manner as in the first embodiment, carry out the simulated experiment by characteristic.
First, the LC filter 1200 of the present invention of the second embodiment described in supposing, simulates by characteristic, as experimental example 3.Then, suppose in experimental example 3, only make the capacitance of the electric capacity 130 (chip capacitor) of the peripheral hardware of LC filter 1200 change, simulate by characteristic, as experimental example 4.In addition, suppose that the capacitance of the peripheral hardware electric capacity 130 installed in experimental example 3 is greater than experimental example 4.
What Figure 12 represented the LC filter 1200 utilizing described simulation to obtain passes through characteristic.Solid line be experimental example 3 by characteristic, dotted line be experimental example 4 pass through characteristic.
As can be seen from Figure 12, experimental example 3 and experimental example 4 all have the function at the lower frequency side lower than about 1GHz with the low pass filter of passband.Near the about 2GHz of the high frequency side higher than passband, occur by connecting the attenuation pole jumping over coupling and formation.In addition, compare known to experimental example 3 and experimental example 4, by installing the large peripheral hardware electric capacity of capacitance, the frequency location that connection can be made to jump over the attenuation pole that coupling is formed moves to lower frequency side, and the attenuation of attenuation pole can be made, and the bandwidth of passband changes.
In addition, in the 2nd execution mode, also in a same manner as in the first embodiment, in the surface energy of multilayered ceramic body 10, the element beyond electric capacity is installed, such as SAW resonator.
(the 3rd execution mode)
Below, based on accompanying drawing, the 3rd execution mode of the present invention is described.
Figure 13 represents the decomposition diagram of LC filter cell body 300 of the third embodiment of the present invention.Figure 14 represents the cross-sectional view of LC filter cell body 300.Figure 15 represents the equivalent electric circuit of LC filter cell body 300 and LC filter 1300 of the third embodiment of the present invention.Figure 16 represents the cross-sectional view of LC filter 1300.In addition, LC filter cell body 300 and LC filter 1300, in the same manner as LC filter 1200, as low pass filter.
As shown in figure 13, LC filter cell body 300 possesses the multilayered ceramic body 10 that multiple ceramic layer is formed.Multilayered ceramic body 10 be 7 ceramic layers 11,21,31,41,51,61,71, from lower to upper stacked formation.
Input terminal IN, lead-out terminal OUT and a pair earth terminal GND, GND of rectangle is formed at the back side of ceramic layer 11.
On the surface of ceramic layer 21, form grounding electrode 25a.Grounding electrode 25a leads to the side of multilayered ceramic body 10 from two relative long limits of ceramic layer 21.
On the surface of ceramic layer 31, form internal electrode 32a, 32b, 32c, 32d of four rectangles.Two internal electrodes 32a, 32b lead to the side of multilayered ceramic body 10 respectively from two relative minor faces of ceramic layer 31.
On the surface of ceramic layer 41, form internal electrode 42a, 42b of two wire.In addition, form two and cross the through ceramic layer 41 of pore electrod 43a, 43b.Cross one end of pore electrod 43a and internal electrode 32b and the pars intermedia conducting of internal electrode 42a.Cross one end of pore electrod 43b and internal electrode 32c and one end conducting of internal electrode 42b.
On the surface of ceramic layer 51, form internal electrode 52a, 52b, 52c of three wire.In addition, form four and cross the through ceramic layer 51 of pore electrod 53a, 53b, 53c, 53d.Cross one end of pore electrod 53a and internal electrode 42a and one end conducting of internal electrode 52a.Cross the other end of pore electrod 53b and internal electrode 42a and one end conducting of internal electrode 52b.Cross pore electrod 53c and one end conducting of crossing pore electrod 43b and internal electrode 42b.Cross the other end of pore electrod 53d and internal electrode 42b and one end conducting of internal electrode 52c.
On the surface of ceramic layer 61, form internal electrode 62a, 62b, 62c of three wire.In addition, form four and cross the through ceramic layer 61 of pore electrod 63a, 63b, 63c, 63d.Cross the other end of pore electrod 63a and internal electrode 52a and one end conducting of internal electrode 62a.Cross the other end of pore electrod 63b and internal electrode 52b and one end conducting of internal electrode 62b.Cross pore electrod 63c and the other end conducting of crossing pore electrod 53c and internal electrode 62b.Cross the other end of pore electrod 63d and internal electrode 52c and one end conducting of internal electrode 62c.The other end of internal electrode 62a leads to the side of duplexer 10 from the short brink of ceramic layer 61.The other end of internal electrode 62c leads to the side of duplexer 10 from the minor face with the minor face opposite side of drawing internal electrode 62a.
On the surface of ceramic layer 71, form two and install with electrode 74a, 74b.The side that the short brink that two installation electrodes 74a, 74b extend to multilayered ceramic body 10 is respectively relative and being formed.As shown in Figure 9 B, in the side that the short brink of multilayered ceramic body 10 is relative, form input terminal IN and lead-out terminal OUT.But input terminal IN is blocked by multilayered ceramic body 10, not shown.Input terminal IN is connected with internal electrode 32a, 62a and installation electrode 74a.Lead-out terminal OUT is connected with internal electrode 32d, 62c and installation electrode 74b.
In another relative side of multilayered ceramic body 10, form a pair earth terminal GND, GND.But one of them of a pair earth terminal GND, GND is blocked by multilayered ceramic body 10, not shown.A pair earth terminal GND, GND are connected with grounding electrode 25a respectively.
The LC filter cell body 300 be made up of said structure, in the equivalent electric circuit shown in Figure 15, is made up of the part of dotted line.
In LC filter cell body 300, on the path connecting input terminal IN and lead-out terminal OUT, series connection insertion three inductance L 1, L2, L3.Inductance L 1 is primarily of internal electrode 62a, excessively pore electrod 63a, internal electrode 52a, the ring-type formation crossing pore electrod 53a, internal electrode 42a formation.Inductance L 2 primarily of internal electrode 42a, cross pore electrod 53b, internal electrode 52b, cross pore electrod 63b, internal electrode 62b, cross pore electrod 63c, cross the ring-type that pore electrod 53c, internal electrode 42b formed and form.Inductance L 3 is primarily of internal electrode 42b, excessively pore electrod 53d, internal electrode 52c, the ring-type formation crossing pore electrod 63d, internal electrode 62c formation.
Between the path connecting input terminal IN and lead-out terminal OUT and earth terminal GND, insert electric capacity C1.One end of electric capacity C1 connects one end of input terminal IN and inductance L 1, and the other end connects earth terminal GND.Electric capacity C1 is formed primarily of sandwiching the electric capacity formed between the internal electrode 32a of ceramic layer 31 and grounding electrode 25a.
Between the path connecting input terminal IN and lead-out terminal OUT and earth terminal GND, insert electric capacity C2.One end of electric capacity C2 connects one end of inductance L 1 and inductance L 2, and the other end connects earth terminal GND.Electric capacity C2 is formed primarily of sandwiching the electric capacity formed between the internal electrode 32b of ceramic layer 31 and grounding electrode 25a.
Between the path connecting input terminal IN and lead-out terminal OUT and earth terminal GND, insert electric capacity C3.One end of electric capacity C3 connects one end of inductance L 2 and inductance L 3, and the other end connects earth terminal GND.Electric capacity C3 is formed primarily of sandwiching the electric capacity formed between the internal electrode 32c of ceramic layer 31 and grounding electrode 25a.
Between the path connecting input terminal IN and lead-out terminal OUT and earth terminal GND, insert electric capacity C4.One end of electric capacity C4 connects one end of inductance L 3 and lead-out terminal OUT, and the other end connects earth terminal GND.Electric capacity C4 is formed primarily of sandwiching the electric capacity formed between the internal electrode 32d of ceramic layer 31 and grounding electrode 25a.
As indicated above, in LC filter cell body 300, three sections of lc circuit cascades are connected, these three sections of lc circuits comprise: the first lc circuit be made up of inductance L 1 and electric capacity C1, C2, and on the path of this inductance L 1 insertion connection input terminal IN and lead-out terminal OUT, electric capacity C1, C2 insert between path and earth terminal GND; The second lc circuit be made up of inductance L 2 and electric capacity C2, C3, this inductance L 2 inserts path, and electric capacity C2, C3 insert between path and earth terminal GND; The 3rd lc circuit be made up of inductance L 3 and electric capacity C3, C4, this inductance L 3 inserts path, and electric capacity C3, C4 insert between path and earth terminal GND.
In the LC filter cell body 300 of above Structure composing, on the path connecting input terminal IN and lead-out terminal OUT, installation electrode 74a, 74b is utilized to be provided with two open ends.Between these two open ends, connect the electric capacity (in fig .15 with dotted line record) as jumping over coupling C14 and playing a role, thus connect in the mode of crossing over three sections of lc circuits and jump over the C14 that is coupled, can use as LC filter 1300.
Specifically, as forming the circuit element jumping over coupling C14, as shown in figure 16, by the electric capacity 80 of peripheral hardware being arranged on installation electrode 74a, 74b, attenuation pole can being formed at desired frequency domain, completing LC filter 1300.
According to the present invention, due to the peripheral hardware electric capacity 80 by means of only the suitable kind of installation, the LC filter 1300 of various characteristic can be obtained, therefore the design cost of LC filter can be reduced, the peripheral hardware electric capacity 80 of this suitable kind prepares in order to the characteristic making LC filter cell body 300 and reach regulation, plays a role as jumping over coupling C14 by connecting this LC filter cell body 300.
In addition, 1st, in the LC filter cell body 100,200 related in the 2nd execution mode, the part jumping over coupling is made up of peripheral hardware electric capacity, but also as LC filter cell body 300 of the third embodiment, can jump over coupling and be all made up of peripheral hardware electric capacity.That is, in multilayered ceramic body, also can not be formed as jumping over the circuit pattern being coupled and playing a role, and form the installation electrode for making peripheral hardware electric capacity connecting circuit pattern on the surface of multilayered ceramic body.
In addition, in LC filter 1200 of the second embodiment, insert an inductance in the path connecting input terminal IN and lead-out terminal OUT, but in LC filter 1300 of the third embodiment, series connection insertion three inductance.As described above, in the present invention, the inductance number that the path connecting input terminal and lead-out terminal is inserted, can change according to desired characteristic.
(the 1st experimental example of the 3rd execution mode)
In order to confirm validity of the present invention, to the LC filter 1300 of the 3rd execution mode, in the same manner as the 1st, the 2nd execution mode, carry out the simulated experiment by characteristic.
First, the LC filter 1300 of the present invention of the third embodiment described in supposing, simulates by characteristic, as experimental example 5.Then, suppose in experimental example 5, only make the capacitance of the electric capacity 80 (chip capacitor) of the peripheral hardware of LC filter 1200 change, simulate by characteristic, as experimental example 6.In addition, suppose that the capacitance of the peripheral hardware electric capacity 80 installed in experimental example 5 is greater than experimental example 6.
What Figure 17 represented the LC filter 1300 utilizing described simulation to obtain passes through characteristic.Solid line be experimental example 5 by characteristic, dotted line be experimental example 6 pass through characteristic.
As shown in Figure 17, experimental example 5 and experimental example 6 all have the function at the lower frequency side lower than about 1.1GHz with the low pass filter of passband.Near the about 1.5 ~ 1.7GHz of the high frequency side higher than passband, occur by connecting the attenuation pole jumping over coupling and formed.In addition, compare known to experimental example 5 and experimental example 6, by installing the large peripheral hardware electric capacity of capacitance, the frequency location that connection can be made to jump over the attenuation pole that coupling is formed moves to lower frequency side, and attenuation can be made to change.
In addition, in the 3rd execution mode, also in a same manner as in the first embodiment, on the surface of duplexer 10, the element beyond electric capacity can also be installed, such as SAW resonator.
That is, as shown in Figure 15 jump over coupling C14, as shown in figure 18, by being arranged on installation electrode 74a, 74b by the SAW resonator 84 of peripheral hardware, complete LC filter 1300.SAW resonator 84 is the resonators defining terminal electrode 84a, 84b at two ends, and terminal electrode 84a, the 84b at two ends are welded on installation electrode 74a, 74b respectively.But, in Figure 18, omit the diagram of wlding.
(the 2nd experimental example of the 3rd execution mode)
Figure 19 is the figure of the example by characteristic for illustration of the LC filter 1300 having installed peripheral hardware SAW resonator.In Figure 19, represent the analog result by characteristic of experimental example 5A respectively with solid line, dotted line represents the analog result by characteristic of experimental example 6A.The experimental example 5 of experimental example 5A and Figure 17 of Figure 19 similarly, represents as jumping over coupling C14 shown in Figure 15, passes through characteristic when having installed electric capacity 80 (Figure 16) of peripheral hardware.In experimental example 5 (Figure 17) and experimental example 5A (Figure 19), the constant value of the circuit element (L1, C1 etc. of Figure 15) of LC filter 1300 and the capacitance of electric capacity 80 also can be different.The experimental example 6A of Figure 19, represents as jumping over coupling C14 shown in Figure 15, passes through characteristic when having installed SAW resonator 84 (Figure 18) of peripheral hardware.
As can be seen from Figure 19, experimental example 5A and experimental example 6A has the function at the lower frequency side lower than about 2.0GHz with the low pass filter of passband.Near the about 2.7GHz of the high frequency side higher than passband and near 3.0GHz, there are two attenuation poles.In addition, experimental example 5A and experimental example 6A compares known, by installing peripheral hardware SAW resonator 84, near about 2.4GHz, also forms attenuation pole.Thus, at the high frequency side by characteristic, SAW resonator 84 characteristic can be utilized to realize precipitous attenuation characteristic.
(other execution mode)
Above, to of the present invention 1st, the 2nd, LC filter cell body of the third embodiment 100,200,300 and the structure of LC filter 1100,1200,1300 and an example of its manufacture method be illustrated.But LC filter cell body of the present invention and LC filter are not limited to these contents, according to the purport of invention, various change can be carried out.
In addition, although LC filter 1100 plays a role as band pass filter, LC filter 1200,1300 plays a role as low pass filter, and the LC filter that the present invention relates to also can play a role as high pass filter.
Specifically, as shown in the equivalent electric circuit of Figure 20, as in the LC filter 1400 that high pass filter plays a role, peripheral hardware electric capacity also can be used as forming the circuit element jumping over coupling C13.As Figure 21 by shown in characteristic (compared with dotted line side, the capacitance of peripheral hardware electric capacity C13 is larger in solid line side), according to LC filter 1400, by making the electric capacitance change of peripheral hardware electric capacity C13, various attenuation characteristic can be obtained.
In addition, although in LC filter 1100,1200,1300, as forming the circuit element jumping over coupling, employing electric capacity C13b, C12b, C14, as mentioned below, inductance also can be used to replace electric capacity.
Specifically, as shown in the equivalent electric circuit of Figure 22, in LC filter 1500, on the path connecting input terminal IN and lead-out terminal OUT, insert peripheral hardware inductance L 14 as forming the circuit element jumping over coupling.As Figure 23 by shown in characteristic (compared with dotted line side, the inductance value of peripheral hardware inductance L 14 is less in solid line side), according to LC filter 1500, by making the inductance value of peripheral hardware inductance L 14 change, various attenuation characteristic can be obtained.
In addition, as shown in the equivalent electric circuit of Figure 24, in LC filter 1600, on the path connecting input terminal IN and lead-out terminal OUT, insert peripheral hardware inductance L 13 as forming the circuit element jumping over coupling.As Figure 25 by shown in characteristic (compared with dotted line side, the inductance value of peripheral hardware inductance L 13 is less in solid line side), according to LC filter 1600, by making the inductance value of peripheral hardware inductance L 13 change, various attenuation characteristic can be obtained.
In addition, as shown in the equivalent electric circuit of Figure 26, in LC filter 1700, on the path connecting input terminal IN and lead-out terminal OUT, insert peripheral hardware inductance L 13 as forming the circuit element jumping over coupling.As Figure 27 by shown in characteristic (compared with solid line side, the inductance value of peripheral hardware inductance L 13 is less in dotted line side), according to LC filter 1700, by making the inductance value of peripheral hardware inductance L 13 change, various attenuation characteristic can be obtained.
In addition, from equivalent electric circuit (Figure 24) shown above, the low pass filter of two sections comprises: first lc circuit with inductance L 1 and electric capacity C1 and electric capacity C2, this inductance L 1 inserts the path connecting input terminal IN and lead-out terminal OUT, and electric capacity C1 and electric capacity C2 inserts between path and earth terminal GND; There is second lc circuit of inductance L 2 and electric capacity C2 and electric capacity C3, this inductance L 2 inserts path, electric capacity C2 and electric capacity C3 inserts between path and earth terminal GND, in this low pass filter of two sections, cross over the coupling of jumping over that the first lc circuit and the second lc circuit amount to two sections of lc circuits and be made up of inductance.Like this, when the hop count of the lc circuit jumping over coupling leap is even number, also can connect inductance as forming the circuit element jumping over coupling.In addition, from equivalent electric circuit (Figure 10, Figure 15), when the hop count of the lc circuit jumping over coupling leap is odd number, not connect inductance, but connect electric capacity as forming the circuit element jumping over coupling.
On the other hand, equivalent electric circuit (Figure 20) is as described above known, lc circuit has: the electric capacity inserted in the path connecting input terminal IN and lead-out terminal OUT, and the inductance inserted between this path and earth terminal GND, in the high pass filter formed this lc circuit cascade is connected even number section, when to jump over the hop count of lc circuit that coupling crosses over be even number, also can connect electric capacity as forming the circuit element jumping over coupling.In addition, from equivalent electric circuit (Figure 22), when to jump over the hop count of lc circuit that coupling crosses over be odd number, not connect electric capacity, but connect inductance as forming the circuit element jumping over coupling.
In addition, as described above, when inductance should be connected as when jumping over coupling, if be connected to electric capacity to replace inductance, then jump over coupling by connection and cannot form attenuation pole.When connecting electric capacity, if be connected to inductance to replace electric capacity, then situation is identical.
Label declaration
10 (pottery) duplexer
11,21,31,41,51,61,71,81,91,101,111,121 ceramic layers
12a ~ 12c, 22a, 22b, 32a ~ 32d, 42a, 42b, 52a ~ 52c, 62a ~ 62c, 82a, 92a, 102a internal electrode
23a, 23b, 33a ~ 33b, 43a ~ 43e, 53a ~ 53f, 63a ~ 63d, 93a, 103a crosses pore electrod
64a, 64b, 74a, 74b, 121a, 121b installation electrode
25a, 35a grounding electrode
80,130 peripheral hardware electric capacity
83,84 peripheral hardware SAW resonators
80a, 80b, 83a, 83b, 84a, 84b, 130a, 130b terminal electrode
IN lead-out terminal
OUT lead-out terminal
GND earth terminal
100,200,300LC filter cell body
1100,1200,1300,1400,1500,1600LC filter
M1, M2 mutual inductance
L1 ~ L3 inductance
C1 ~ C4 electric capacity
C12a, C12b, C12, C13a, C13b, C13, C14, L13, L14 jump over coupling
Q1 ~ Q3LC resonant circuit
Claims (8)
1. a LC filter cell body, is characterized in that, comprising:
The multilayered ceramic body that multiple ceramic layer is laminated;
At the LC filter circuit that described multilayered ceramic body inside is formed; And
At input terminal, lead-out terminal, earth terminal that described multilayered ceramic surface is formed,
As by with described LC filter circuit be connected to form attenuation pole, form the circuit element jumping over and be coupled, form the installation electrode of at least one for installing in the inductance of peripheral hardware, electric capacity and SAW resonator on the surface of described multilayered ceramic body.
2. LC filter cell body as claimed in claim 1, it is characterized in that, except at least one in the inductance of described peripheral hardware, electric capacity and SAW resonator, at least one in inductance and electric capacity is formed, as the circuit element jumping over coupling described in formation in the inside of described multilayered ceramic body.
3. LC filter cell body as claimed in claim 1 or 2, is characterized in that,
Described LC filter circuit is low pass filter,
Cascade connection multistage has the lc circuit with lower component: the inductance inserted in the path connecting described input terminal and described lead-out terminal, and the electric capacity inserted between described path and described earth terminal,
Cross over the odd number section lc circuit in the lc circuit of described multistage, described in connection, jump over coupling,
Described jump over coupling be made up of electric capacity.
4. LC filter cell body as claimed in claim 1 or 2, is characterized in that,
Described LC filter circuit is low pass filter,
Cascade connection multistage has the lc circuit with lower component: the inductance inserted in the path connecting described input terminal and described lead-out terminal, and the electric capacity inserted between described path and described earth terminal,
Cross over the even number section lc circuit in the lc circuit of described multistage, described in connection, jump over coupling,
Described jump over coupling be made up of inductance.
5. LC filter cell body as claimed in claim 1 or 2, is characterized in that,
Described LC filter circuit is high pass filter,
Cascade connection multistage has the lc circuit with lower component: the electric capacity inserted in the path connecting described input terminal and described lead-out terminal, and the inductance inserted between described path and described earth terminal,
Cross over the odd number section lc circuit in the lc circuit of described multistage, described in connection, jump over coupling,
Described jump over coupling be made up of inductance.
6. LC filter cell body as claimed in claim 1 or 2, is characterized in that,
Described LC filter circuit is high pass filter,
Cascade connection multistage has the lc circuit with lower component: the electric capacity inserted in the path connecting described input terminal and described lead-out terminal, and the inductance inserted between described path and described earth terminal,
Cross over the even number section lc circuit in the lc circuit of described multistage, described in connection, jump over coupling,
Described jump over coupling be made up of electric capacity.
7. LC filter cell body as claimed in claim 1 or 2, is characterized in that,
Described LC filter circuit is band pass filter,
On the path connecting described input terminal and described lead-out terminal, multiple LC resonant circuit is set to electromagnetic coupled successively.
8. a LC filter, is characterized in that, on installation electrode as described in LC filter cell body as described according to any one of claim 1 to 7, installs at least one in the inductance of described peripheral hardware, electric capacity and SAW resonator.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
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| JP2013069273 | 2013-03-28 | ||
| JP2013-069273 | 2013-03-28 | ||
| PCT/JP2014/056876 WO2014156720A1 (en) | 2013-03-28 | 2014-03-14 | Lc filter element and lc filter |
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| JP (1) | JP5776862B2 (en) |
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| CN110429920A (en) * | 2019-09-04 | 2019-11-08 | 研创光电科技（赣州）有限公司 | A kind of miniature multilayer ceramic band-pass filter |
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| CN107408931B (en) * | 2015-07-28 | 2020-06-19 | 株式会社村田制作所 | Circuit board, filter circuit using the same, and capacitor element |
| JP7456797B2 (en) | 2020-02-25 | 2024-03-27 | 太陽誘電株式会社 | Filters and multiplexers |
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| JP3402256B2 (en) * | 1999-05-25 | 2003-05-06 | 株式会社村田製作所 | Laminated piezoelectric components |
| JP2003283284A (en) * | 2002-03-20 | 2003-10-03 | Hosiden Corp | Flat filter |
| JP2005026799A (en) * | 2003-06-30 | 2005-01-27 | Taiyo Yuden Co Ltd | Filter circuit and laminated filter |
| CN102549690B (en) * | 2010-03-18 | 2014-10-29 | 株式会社村田制作所 | High-frequency laminated component and laminated type high-frequency filter |
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| CN110429920A (en) * | 2019-09-04 | 2019-11-08 | 研创光电科技（赣州）有限公司 | A kind of miniature multilayer ceramic band-pass filter |
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| WO2014156720A1 (en) | 2014-10-02 |
| JPWO2014156720A1 (en) | 2017-02-16 |
| CN104756403B (en) | 2018-04-24 |
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