CN104752133B - Cooling device and plasma processing equipment - Google Patents
Cooling device and plasma processing equipment Download PDFInfo
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- CN104752133B CN104752133B CN201310739828.4A CN201310739828A CN104752133B CN 104752133 B CN104752133 B CN 104752133B CN 201310739828 A CN201310739828 A CN 201310739828A CN 104752133 B CN104752133 B CN 104752133B
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Abstract
The invention relates to a cooling device and a piece of plasma processing equipment. The cooling device comprises a spraying device and a water tank. A side, directly facing a piece of corresponding equipment, of a reaction chamber is provided with a first opening used for communicating the reaction chamber with the corresponding equipment. The side wall of a side, the same as the first opening, of the water tank is provided with a second opening. The side, where the second opening is disposed, of the water tank is provided with a groove which surrounds the second opening along the two sides and the lower part of the second opening. A sealing ring matched with the groove is arranged in the groove, and a sealing space is formed between the sealing ring and the groove. The cooling device further comprises a gas source and a vacuum pumping device, both of which are communicated with the sealing space. The gas source is used for inputting gas into the sealing space when the cooling device is working so as to make the sealing ring partially extend out of the groove under the pressure of gas and make the sealing ring in close contact with the corresponding equipment. The vacuum pumping device is used for vacuum-pumping the sealing space when the cooling device is disassembled so as to enable the part of the sealing ring extending out of the groove retract into the groove.
Description
Technical field
The present invention relates to microelectronic processing technique field, in particular it relates to a kind of cooling device and plasma process set
Standby.
Background technology
Fig. 1 is the schematic diagram of plasma processing device.As shown in figure 1, plasma processing device includes reaction chamber
1st, transmission chamber 6, exhaust treatment system 7 and heating coil 3；Wherein, the both sides of reaction chamber 1 have lateral openings, use respectively
In being tightly connected with transmission chamber 6, exhaust treatment system 7, so that the manipulator within located at transmission chamber 6 is to reaction chamber 1
Internal transmission workpiece to be machined, and so that the gas in reaction chamber 1 is discharged by exhaust treatment system 7；Heating coil 3 is in order to right
Pallet in reaction chamber 1 is heated so as to be had higher temperature, and makes the temperature between its regional uniform, this
When carrying out technique, pallet can be heated opposed workpiece to be machined thereon sample, makes the regional of workpiece to be machined
There is uniform and higher technological temperature, it is hereby achieved that good technological effect.
During heating coil 3 heating pallet, the temperature of heating coil 3 and reaction chamber 1 also can rise therewith,
In actually used, generally require and cooling device is set in plasma processing device in order to reduce heating coil 3 and reaction chamber
The temperature of room 1, in case heating coil 3 and reaction chamber 1 damage because temperature is too high.Fig. 2 is the signal of existing cooling device
Figure.As shown in Fig. 2 this cooling device is included located at the spray equipment (not shown) of reaction chamber 1 top and located at reaction
The tank 2 of chamber 1 lower section；Wherein, it is provided with the induction coil 3 for heating pallet in tank 2.In technical process, spray dress
Put for reaction chamber 1 spraying cooling water, to reduce its temperature；Cooling water flows in tank 2 after flowing through reaction chamber 1,
The cooling water entering in tank 2 cools down to induction coil 3 simultaneously, and reenters spray equipment, is sprayed to by spray equipment
Reaction chamber 1, thus form a cyclic process.
In actual use, as shown in figure 3, must be provided with respective openings on the side of tank 2 so that reaction chamber 1 with
Transmission chamber 6 connects with exhaust treatment system 7, and this makes the respective side walls of tank 2 cannot have enough height, so that cold
But the water capacity is overflowed easily from the side wall of tank 2.
Fig. 4 is the schematic diagram of the plasma processing device using another kind of cooling device.This cooling device and plasma
Body process equipment overcomes drawbacks described above；Specifically, this plasma processing device includes reaction chamber 1, transmission chamber 6, tail
Gas processing system 7, cooling device and driving means 5；Wherein, the both sides of reaction chamber 1 have lateral openings, are respectively used to and pass
Defeated chamber 6 and exhaust treatment system 7 closely connect；Driving means 5 are connected with exhaust treatment system 7, and it is used for vent gas treatment
System 7 applies the power to reaction chamber 1 direction, so that tight between reaction chamber 1 and transmission chamber 6 and exhaust treatment system 7
Thickly contact so as between there is good sealing effectiveness；Cooling device compares above-mentioned cooling device, and it is corresponding tank 2
On the side of opening place, sealing ring 4 is set, in order to apply exhaust treatment system 7 to reaction chamber 1 direction in driving means 5
During power, so that this sealing ring 4 is contacted with transmission chamber 6 and exhaust treatment system 7, and be subject to exhaust treatment system 7 to reaction chamber 1
The pressure in direction and reaction chamber 1 are to the pressure in transmission chamber 6 direction, so that sealing ring 4 and transmission chamber 6 and vent gas treatment
Seal between system 7, and then the opening of tank 2 is blocked, make cooling water cannot overflow screw clamp 2 at the opening of tank 2
Outside.
But above-mentioned cooling device is inevitably present following problems in actual use：
First, in above process, because the spacing between reaction chamber 1 and transmission chamber 6, exhaust treatment system 7 is
Fixing, so between reaction chamber 1 and transmission chamber 6, exhaust treatment system 7 during tight seal, the tail that sealing ring 4 is subject to
Gas processing system 7 is certain to the pressure in reaction chamber 1 direction and reaction chamber 1 to the pressure in transmission chamber 6 direction, here
In the case of, driving means 5 to exhaust treatment system 7 apply bigger power when, the pressure that sealing ring 4 is subject to can't therefore increase
Greatly, this makes the contact between sealing ring 4 and transmission chamber 6, exhaust treatment system 7 is not close in any case, its
Sealing effectiveness is poor, thus leading to junction easily between sealing ring 4 and transmission chamber 6, exhaust treatment system 7 for the cooling water
Leak out.
Secondly, in plasma processing device, need often reaction chamber 1 to be safeguarded, and in maintenance process,
Need to dismantle tank 2, in this unloading process, due to sealing ring 4 with the distance between transmission chamber 6, exhaust treatment system 7 relatively
Little or directly contact, leads to produce friction between sealing ring 4 and transmission chamber 6, exhaust treatment system 7, even results in sealing ring 4
It is scratched, this makes sealing ring 4 need in actual use to be often replaced, thus increased the maintenance cost of reaction chamber 1.
Content of the invention
It is contemplated that at least solving one of technical problem present in prior art it is proposed that a kind of cooling device and waiting
Plasma processing apparatus, its can in technical process from source of the gas to the sealing space between groove and sealing ring in input gas
Body, so that sealing ring and the other equipment being connected with reaction chamber are in close contact and realize good sealing；And equity from
When daughter process equipment is safeguarded, by vacuum extractor, the sealing space between groove and sealing ring is vacuumized, make sealing
In circle retraction groove, prevent sealing ring from being scratched by the other equipment being connected with reaction chamber.
There is provided a kind of cooling device for realizing the purpose of the present invention, for cooling down reaction chamber, it is included located at reaction
Spray equipment above chamber and the tank below reaction chamber, described spray equipment is used for towards the spray of described reaction chamber
Drench cooling water, described cooling water flows into described tank after flowing through described reaction chamber；Described reaction chamber with accordingly set
Standby relative side is provided with the first opening, in order to connect described reaction chamber and relevant device；Described tank with described
It is provided with the second opening on the side wall of first opening phase the same side；Described second opening place tank side is provided with groove, institute
State groove to surround described second opening along the both sides of described second opening and bottom；It is provided with described groove and to match with it
Form sealing space between sealing ring, and described sealing ring and described groove；Described cooling device also includes source of the gas and vacuumizes
Device, described source of the gas is all connected with described sealing space with vacuum extractor；Wherein said source of the gas is used in described cooling device
To Input gas in described sealing space during work so that a part for described sealing ring under gas pressure to described groove it
Overhang, and so that described sealing ring is in close contact with relevant device；Described vacuum extractor is used for dismantling described cooling device
When described sealing space is vacuumized so that stretch out the sealing ring of described groove a part retract described groove in.
Wherein, it is provided with first passage in described tank, the outlet side of described first passage is connected with described sealing space；
The inlet end of described first passage is connected with described source of the gas, and the gas being provided by described source of the gas flows into institute via described first passage
State sealing space.
Wherein, the quantity of the outlet side of described first passage is multiple, and is uniformly distributed with respect to described groove surfaces.
Wherein, it is provided with second channel in described tank, the inlet end of described second channel is connected with described sealing space；
The outlet side of described second channel is connected with described vacuum extractor, by described vacuum extractor by the gas in described sealing space
Body is extracted out via described second channel, so that being vacuum in described sealing space.
Wherein, the quantity of the inlet end of described second channel is multiple, and is uniformly arranged with respect to described groove surfaces.
Wherein, described cooling device also includes plugging device, and described plugging device is used for the two ends of described sealing ring are solid
On the relevant position in groove, to prevent in described source of the gas is to the sealing space between described groove and described sealing ring
During Input gas, the gas entering in described sealing space leaks from the two ends of described groove.
Wherein, described gas includes compressed air.
Wherein, the material of described sealing ring includes foamed silastic.
Wherein, described vacuum extractor includes vavuum pump.
As another technical scheme, the present invention also provides a kind of plasma processing device, including reaction chamber, transmission
Chamber, exhaust treatment system and cooling device, described reaction chamber be respectively provided on two sides with the first opening, respectively with transmission chamber
It is tightly connected with exhaust treatment system, wherein, described cooling device adopts the above-mentioned cooling device that the present invention provides, and described
Sealing ring is protruding when described source of the gas is to Input gas in the sealing space between described groove and sealing ring, and with transmission
Chamber and exhaust treatment system are in close contact；Described sealing ring is in described vacuum extractor by between described groove and sealing ring
Disengage with transmission chamber or exhaust treatment system when sealing space vacuumizes, and be retracted in described groove.
The invention has the advantages that：
The cooling device that the present invention provides, it inputs gas by source of the gas into the sealing space between groove and sealing ring
Body, makes there is certain gas pressure in sealing space, and this gas pressure orders about a part of protruding of sealing ring, makes sealing
Circle and the relevant device adjacent with reaction chamber are in close contact；And, in the contact process with relevant device for the sealing ring, sealing
Circle continues to bear the gas pressure in sealing space, thus realizing good sealing between sealing ring and relevant device.Meanwhile,
The cooling device that embodiments of the invention provide, also by vacuum extractor, the sealing space between groove and sealing ring is taken out very
Sky, makes the part that sealing ring stretches out groove be retracted in groove, so that having larger between sealing ring and relevant device
Interval, is made sealing ring not contacted with relevant device in the unloading process of cooling device, prevents it to be scratched.
The plasma processing device that the present invention provides, it inputs gas by the source of the gas of cooling device into sealing space
Body, so that sealing ring is protruding under the gas pressure in sealing space, is contacted with transmission chamber and exhaust treatment system,
And realize good sealing between sealing ring and transmission chamber and exhaust treatment system；Meanwhile, embodiments of the invention provide
Plasma processing device by vacuum extractor, sealing space can also be vacuumized, so that sealing ring is retracted in groove,
Make that there is between sealing ring and transmission chamber and exhaust treatment system larger interval, so that sealing ring tearing open in cooling device
Do not contact with transmission chamber, exhaust treatment system during unloading, it can be prevented to be scratched.
Brief description
The schematic diagram of Fig. 1 plasma processing device；
Fig. 2 is the schematic diagram of existing cooling device；
Fig. 3 is the stereogram of cooling device shown in Fig. 2；
Fig. 4 is the schematic diagram of the plasma processing device using another kind of cooling device；
The structural representation of the cooling device that Fig. 5 provides for embodiments of the invention；
Fig. 6 is the stereogram of the tank in cooling device shown in Fig. 5；
Fig. 7 is the connected mode schematic diagram of groove and source of the gas and vacuum extractor；And
Fig. 8 is a kind of schematic diagram of alternate embodiment of cooling device shown in Fig. 5.
Specific embodiment
For making those skilled in the art more fully understand technical scheme, come to the present invention below in conjunction with the accompanying drawings
The cooling device providing and plasma processing device are described in detail.
Refer to Fig. 5 and Fig. 6, the structural representation of the cooling device that Fig. 5 provides for embodiments of the invention.Fig. 6 is Fig. 5
The stereogram of the tank in shown cooling device.Cooling device is used for cooling down reaction chamber 20, and it includes spray equipment 11, tank
12nd, groove 13, sealing ring 14, source of the gas 15 and vacuum extractor 16；Wherein, reaction chamber 20 and transmission chamber 21, vent gas treatment
The corresponding side of system 22 grade relevant device is provided with the first opening 200, in order to transmission chamber 21, exhaust treatment system 22
Deng relevant device connection；Above reaction chamber 20, it is used for orientating reaction chamber 20 spraying cooling water to spray equipment 11；Water
Below reaction chamber 20, it is used for making the cooling water that spray equipment 11 sprays to reaction chamber 20 flow through reaction chamber groove 12
Tank 12 is flowed into after 20.
Tank 12 with the side wall of the first opening 200 phase the same side are provided with the second opening 120；Groove 13 i.e. located at
On tank 12 side that second opening 120 is located, and along the both sides of the second opening 120 and bottom, the second opening 120 is surrounded；Close
Seal 14 is arranged in groove 13, and it is matched with groove 13；In the present embodiment, groove 13 does not extend to the top of tank 12
On wall, the two ends of groove 13 are made not contact with the external world, so that shape between the sealing ring 14 being arranged in groove 13 and groove 13
Become sealing space 17.
Source of the gas 15 is connected with groove 13, in order to empty to the sealing between groove 13 and sealing ring 14 when cooling device works
Between Input gas in 17, to order about a part of protruding of sealing ring 14, make sealing ring 14 and connect with reaction chamber 20
The relevant devices such as transmission chamber 21, exhaust treatment system 22 are in close contact.Specifically, as shown in fig. 7, in the present embodiment, water
It is provided with first passage 121, the outlet side of this first passage 121 is connected with sealing space 17, the entering of this first passage 121 in groove 12
Gas end is connected with source of the gas 15；Make the gas that source of the gas 15 provides can flow into sealing space 17 via first passage 121.
Preferably, in the present embodiment, the quantity of the outlet side of first passage 121 is multiple, and, the plurality of outlet side
It is uniformly distributed with respect to groove 13 surface, this makes source of the gas 15 to this sealing during Input gas, can be made in sealing space 17 empty
Between in 17 the gas density between regional more uniform, so that sealing ring 14 is located at suffered by the regional of inside grooves
The gas pressure arriving is identical, and when making sealing ring 14 protruding under the gas pressure in sealing space 17, it is in groove
Regional outside 13 is equably in close contact with relevant devices such as transmission chamber 21, exhaust treatment systems 22, it is to avoid close
Produce space in seal 14 and the contact site of relevant device such as transmission chamber 21, exhaust treatment system 22, lead to cooling water from this
Gap is overflowed.
In the present embodiment, vacuum extractor 16 can be the equipment such as vavuum pump, and it is connected with groove 13, in order in dismounting
During cooling device, the sealing space 17 between groove 13 and sealing ring 14 is vacuumized, to order about the sealing ring 14 stretching out groove 13
A part of retraction groove 13 in.Specifically, as shown in fig. 7, being provided with second channel 122 in tank 12, this second channel 122
Inlet end is connected with sealing space 17, and the outlet side of this second channel 122 is connected with vacuum extractor 16；Make vacuum extractor 16
Gas in sealing space 17 can be extracted out via second channel 122, so that being vacuum in sealing space 17.
Preferably, in the present embodiment, the quantity of the inlet end of second channel 122 is multiple, and, the plurality of inlet end
It is uniformly distributed with respect to groove 13 surface；This makes vacuum extractor 15 vacuumize sealing space 17, so that sealing ring 14 is retracted
When in groove 13, sealing ring 14 will not block the inlet end of second channel 122, even if partial-air admission end is blocked by sealing ring 14
Live, other in sealing space 17 still can be extracted out by vacuum extractor 16 by other inlet ends；Without occur due to
Inlet end is blocked, and leads to the situation that the gas existing in sealing space 17 cannot be extracted out by vacuum extractor 16.
In the present embodiment, source of the gas 15 is to the gas of input in the sealing space 17 being formed between groove 13 and sealing ring 14
For compressed air, the gas pressure in sealing space 17 so can be made larger, thus relatively easily ordering about the one of sealing ring 4
Partly protruding, and, larger gas pressure in sealing space 17 can also make sealing ring 14 more closely with transmission cavity
The relevant devices such as room 21, exhaust treatment system 22 contact, so that sealing ring 14 and transmission chamber 21, exhaust treatment system 22 etc.
Sealing effectiveness between relevant device is more preferable.
In the present embodiment, sealing ring 14 is made up of foamed silastic；In the sealing ring 14 made using this material
Portion's structure is more loose, and this makes its lighter in weight, and has good elastic performance, so that sealing ring 14 can be preferably
Seal with relevant devices such as transmission chamber 21, exhaust treatment systems 22, and make it to the gas pressure change in sealing space 17
More sensitive.That is, when source of the gas 15 is to Input gas in sealing space 17, the gas pressure in sealing space 17 increases, sealing
A part for circle 14 is very rapidly protruding under the gas pressure in sealing space 17；To seal in vacuum extractor 16
When gas in space 17 vacuumizes, the gas pressure in sealing space 17 reduces, and sealing ring 14 stretches out a part for groove 13
Also can therefore and very rapidly retract in groove 13.
It should be noted that as shown in Figures 5 and 6, groove 13 does not prolong on tank 12 side of the second opening 120 both sides
Extend on the roof of tank 12, but the present invention is not limited to this, in actual applications, can also be by groove 13 in the second opening
Extend on tank 12 side of 120 both sides on the roof of tank 12；In the case, as shown in figure 8, being to prevent from extending to water
The two ends of groove 13 on the roof of groove 12 are contacted with the external world, and form sealing space 17 between groove 13 and sealing ring 14,
Plugging device 18 can be set in the second opening 120 both sides, the two ends of sealing ring 14 are fixed on the corresponding positions in groove 13 by it
Put, the two ends such that it is able to make groove 13 are not contacted with the external world, and form sealing space between groove 13 and sealing ring 14
17, prevent source of the gas 15 from, entering in sealing space 17 during Input gas in the sealing space 17 between groove 13 and sealing ring 14
Gas to groove 13 two ends leakage.
The cooling device that embodiments of the invention provide, it is by source of the gas 15 to the sealing between groove 13 and sealing ring 14
Input gas in space 17, make to have certain gas pressure in sealing space 17, and this gas pressure orders about the one of sealing ring 14
Partly protruding, make sealing ring 14 and the transmission chamber 21 to reaction chamber 20 connection, exhaust treatment system 22 etc. are corresponding sets
Standby close contact；And, in the contact process with the relevant device such as transmission chamber 21, exhaust treatment system 22 for the sealing ring 14,
Sealing ring 14 continues to bear the gas pressure in sealing space 17, thus in sealing ring 14 and transmission chamber 21, vent gas treatment system
Unite and realize good sealing between 22 grade relevant devices.Meanwhile, the cooling device that embodiments of the invention provide is also true by taking out
Empty device 16, the sealing space 17 between groove 13 and sealing ring 14 is vacuumized, and makes sealing ring 14 stretch out one of groove 13
Divide and be retracted in groove 13, so that having between the relevant device such as sealing ring 14 and transmission chamber 21, exhaust treatment system 22
Larger interval, make sealing ring 14 in the unloading process of cooling device not with the phases such as transmission chamber 21, exhaust treatment system 22
Answer equipment to contact, prevent it to be scratched.
As another technical scheme, embodiments of the invention also provide a kind of plasma processing device, its reaction chamber
Room 20, transmission chamber 21, exhaust treatment system 22 and cooling device, wherein, being respectively provided on two sides with of reaction chamber 20 first is opened
Mouth 200, is tightly connected with transmission chamber 21 and exhaust treatment system 22, cooling device is carried using the above embodiment of the present invention respectively
For cooling device, and sealing ring 14 inputs gas in source of the gas 15 is to the sealing space 17 between groove 13 and sealing ring 14
Protruding during body, and be in close contact with transmission chamber 21 and exhaust treatment system 22；Sealing ring 14 will in vacuum extractor 16
Disengage with transmission chamber 21 or exhaust treatment system 22 when sealing space 17 between groove 13 and sealing ring 14 vacuumizes,
And be retracted in groove 13.
The plasma processing device that embodiments of the invention provide, it can be by the source of the gas 15 of cooling device to sealing
Input gas in space 17, so that sealing ring 14 is protruding under the gas pressure in sealing space 17, with transmission chamber
21 contact with exhaust treatment system 22, and realize good sealing and transmission chamber 21 and exhaust treatment system 22 between；Meanwhile,
Sealing space 17 can also be vacuumized by the plasma processing device that embodiments of the invention provide by vacuum extractor, makes
Sealing ring 14 is retracted in groove 13, make to have between sealing ring 14 and transmission chamber 21 and exhaust treatment system 22 larger between
Every, so that sealing ring 14 is not contacted with transmission chamber 21, exhaust treatment system 22 in the unloading process of cooling device, can
To prevent it to be scratched.
It is understood that the embodiment of above principle being intended to be merely illustrative of the present and the exemplary enforcement adopting
Mode, but the invention is not limited in this.For those skilled in the art, in the essence without departing from the present invention
In the case of god and essence, various modifications and improvement can be made, these modifications and improvement are also considered as protection scope of the present invention.
Claims (10)
1. a kind of cooling device, for cooling down reaction chamber, it includes spray equipment above reaction chamber and located at anti-
Answer the tank below chamber, described spray equipment is used for towards described reaction chamber spraying cooling water, and described cooling water flows through institute
Described tank is flowed into after stating reaction chamber；It is characterized in that, on the side relative with relevant device of described reaction chamber
It is provided with the first opening, in order to connect described reaction chamber and relevant device；
Described tank with the side wall of described first opening phase the same side are provided with the second opening；
Described second opening place tank side is provided with groove, and described groove is along the both sides of described second opening and bottom by institute
State the second opening to surround；
It is provided with, in described groove, the sealing ring matching with it, and between described sealing ring and described groove, form sealing space；
Described cooling device also includes source of the gas and vacuum extractor, and described source of the gas and vacuum extractor are all with described sealing space even
Logical；Wherein
Described source of the gas is used for when described cooling device works to Input gas in described sealing space, so that described sealing ring
A part overhanging to described groove under gas pressure, and so that described sealing ring is in close contact with relevant device；
Described vacuum extractor is used for when dismantling described cooling device, described sealing space being vacuumized, so that stretching out described recessed
A part for the sealing ring of groove is retracted in described groove.
2. cooling device according to claim 1 is it is characterised in that be provided with first passage in described tank, and described
The outlet side of one passage is connected with described sealing space；The inlet end of described first passage is connected with described source of the gas, by described gas
The gas that source provides flows into described sealing space via described first passage.
3. cooling device according to claim 2 is it is characterised in that the quantity of the outlet side of described first passage is many
Individual, and be uniformly distributed with respect to described groove surfaces.
4. cooling device according to claim 1 is it is characterised in that be provided with second channel in described tank, and described
The inlet end of two passages is connected with described sealing space；The outlet side of described second channel is connected with described vacuum extractor, by
Gas in described sealing space is extracted out by described vacuum extractor via described second channel, so that in described sealing space being
Vacuum.
5. cooling device according to claim 4 is it is characterised in that the quantity of the inlet end of described second channel is many
Individual, and be uniformly arranged with respect to described groove surfaces.
6. cooling device according to claim 1 is it is characterised in that described cooling device also includes plugging device, described
Plugging device is used for the relevant position being fixed on the two ends of described sealing ring in groove, to prevent in described source of the gas to described
In sealing space between groove and described sealing ring during Input gas, the gas in the described sealing space of entrance is from described groove
Two ends leakage.
7. cooling device according to claim 1 is it is characterised in that described gas includes compressed air.
8. cooling device according to claim 1 is it is characterised in that the material of described sealing ring includes foamed silastic.
9. cooling device according to claim 1 is it is characterised in that described vacuum extractor includes vavuum pump.
10. a kind of plasma processing device, including reaction chamber, transmission chamber, exhaust treatment system and cooling device, described
Reaction chamber be respectively provided on two sides with the first opening, be tightly connected with transmission chamber and exhaust treatment system respectively, its feature exists
In, described cooling device adopts the cooling device described in claim 1-9 any one, and
Described sealing ring is protruding when described source of the gas is to Input gas in the sealing space between described groove and sealing ring,
And be in close contact with transmission chamber and exhaust treatment system；
Described sealing ring is when the sealing space between described groove and sealing ring is vacuumized by described vacuum extractor and transmission
Chamber or exhaust treatment system disengage, and are retracted in described groove.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310739828.4A CN104752133B (en) | 2013-12-27 | 2013-12-27 | Cooling device and plasma processing equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310739828.4A CN104752133B (en) | 2013-12-27 | 2013-12-27 | Cooling device and plasma processing equipment |
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| CN104752133A CN104752133A (en) | 2015-07-01 |
| CN104752133B true CN104752133B (en) | 2017-02-15 |
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| CN201310739828.4A Active CN104752133B (en) | 2013-12-27 | 2013-12-27 | Cooling device and plasma processing equipment |
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Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4293755A (en) * | 1978-10-23 | 1981-10-06 | General Instrument Corporation | Method of cooling induction-heated vapor deposition apparatus and cooling apparatus therefor |
| CN101031671A (en) * | 2004-10-01 | 2007-09-05 | Lpe公司 | Epitaxial reactor cooling method and reactor cooled thereby |
| CN102534573A (en) * | 2012-01-10 | 2012-07-04 | 北京航空航天大学 | Plasma enhanced chemical vapor deposition vacuum equipment |
-
2013
- 2013-12-27 CN CN201310739828.4A patent/CN104752133B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4293755A (en) * | 1978-10-23 | 1981-10-06 | General Instrument Corporation | Method of cooling induction-heated vapor deposition apparatus and cooling apparatus therefor |
| CN101031671A (en) * | 2004-10-01 | 2007-09-05 | Lpe公司 | Epitaxial reactor cooling method and reactor cooled thereby |
| CN102534573A (en) * | 2012-01-10 | 2012-07-04 | 北京航空航天大学 | Plasma enhanced chemical vapor deposition vacuum equipment |
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| Publication number | Publication date |
|---|---|
| CN104752133A (en) | 2015-07-01 |
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Address after: 100176 No. 8 Wenchang Avenue, Beijing economic and Technological Development Zone Patentee after: Beijing North China microelectronics equipment Co Ltd Address before: 100176 Beijing economic and Technological Development Zone, Beijing, Wenchang Road, No. 8, No. Patentee before: Beifang Microelectronic Base Equipment Proces Research Center Co., Ltd., Beijing |