CN104751258B - Product mix processing system and method - Google Patents
Product mix processing system and method Download PDFInfo
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- CN104751258B CN104751258B CN201310739262.5A CN201310739262A CN104751258B CN 104751258 B CN104751258 B CN 104751258B CN 201310739262 A CN201310739262 A CN 201310739262A CN 104751258 B CN104751258 B CN 104751258B
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
- Y02P90/30—Computing systems specially adapted for manufacturing
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Abstract
Present invention discloses a kind of product mix processing system and method, the product mix processing system includes: recovery system, at least one processing scheme of the multiple wafer to be arranged；Integrated system and client, the integrated system connection recovery system and client.The product mix processing method, comprising: at least one processing scheme of the multiple wafer is set in recovery system；The information for obtaining the wafer from client by integrated system, verifies the processing scheme, and when the processing scheme is correct, the processing scheme is transferred to client to execute by integrated system.So as to carry out different operations to wafer corresponding in a collection of wafer for needing to carry out different operation simultaneously, avoid manual operation bring potential threat, improve the degree of automation, furthermore, it can also ensure that wafer will not be repeatedly processed through vaporization, condensation and absorption or drain process such case occurs, production efficiency is improved, and ensure that quality.
Description
Technical field
The present invention relates to semiconductor products to process control system technical field, more particularly to for same a collection of product
Multiple wafers restore a kind of product mix processing system and method for processing.
Background technique
The manufacturing process of IC wafers is sufficiently complex, a piece of IC wafers from raw material wafer to final production at
Product needs that hundreds of procedures is undergone to be processed, and every procedure is needed by different boards.In production process, appoint
The exception of what board state can all influence the quality of product, or even cause directly scrapping for product.Therefore, factory (Fab)
It needs constantly to monitor the working condition of board, and is loaded into the production inside board to board and just immediately when board occurs abnormal
Product carry out proper treatment.
Product after proper treatment can continue to complete subsequent production, have no effect on product quality, but such as
Fruit is dealt with improperly, and the quality of product just cannot be guaranteed, and is possible to the product that process in this board after influencing.Machine
Platform is multiple regions Fab, the difference of the board in the different regions Fab due to operational characteristic according to the processing technology different demarcation of wafer
It is different, but cause board reset mode and product processing mode it is different.
The processing mode of product usually has taking-up board (Track out), cancels load (Cancel Track In), holds
Row especially processing (Follow Run card) is several.Due to the limitation of prior art means, list can only be carried out for a collection of product
The processing of one mode, and the product in certain regions Fab, it is desirable that for the different wafers of a collection of product, it is taken out board respectively,
Cancel load or execute especially processing, existing restoration methods and be not able to satisfy the requirement in these regions, then just needing behaviour by hand
Make the recovery processing operation that board carries out product, the requirement due to manual operations to technical staff is very high, and is easy error, because
This not only will affect the processing efficiency of product, influences the degree of automation of factory, and the quality of product also cannot be guaranteed.
Summary of the invention
The object of the present invention is to provide a kind of product mix processing system and method, can in same a collection of wafer into
The different processing of row, improves the degree of automation, reduces manually-operated risk.
In order to solve the above technical problems, the present invention provides a kind of product mix processing system, for same a collection of product
Multiple wafers carry out recovery processing, comprising:
Recovery system, at least one processing scheme of the multiple wafer to be arranged；
Integrated system and client, the integrated system connection recovery system and client.
Optionally, for the product mix processing system, the processing scheme include take out board, cancel load and
Especially at least one of processing.
Optionally, for the product mix processing system, the client include manufacturing execution system and board from
Dynamicization system, the manufacturing execution system and board automated system are realized by integrated system connect with recovery system respectively
It is logical, and the manufacturing execution system is mutually connected with board automated system by integrated system.
Optionally, for the product mix processing system, the board automated system is also connected to an at least board,
The board is controlled to be produced.
The present invention provides a kind of product mix processing method, carries out at recovery for multiple wafers to same a collection of product
Reason, comprising:
At least one processing scheme of the multiple wafer is set in recovery system；
The information for obtaining the wafer from client by integrated system, verifies the processing scheme, to the place
When reason scheme is correct, the processing scheme is transferred to client to execute by integrated system.
Optionally, for the product mix processing method, the processing scheme include take out board, cancel load and
Especially at least one of processing.
Optionally, for the product mix processing method, the client include manufacturing execution system and board from
Dynamicization system.
Optionally, for the product mix processing method, the integrated system is obtained from the manufacturing execution system
The information of the wafer verifies the processing scheme, if the processing scheme is correct, the integrated system will be described
Processing scheme is transferred to the board automated system to execute.
Optionally, for the product mix processing method, the integrated system is obtained from the manufacturing execution system
The information of the wafer verifies the processing scheme, if the processing scheme is abnormal, executes in conjunction with by the manufacture
The information that system obtains the wafer is adjusted, until processing scheme is correct.
Compared with prior art, in product mix processing system and method provided by the invention, recovery system, for being arranged
At least one processing scheme of the multiple wafer, so as to simultaneously to corresponding in a collection of wafer for needing to carry out different operation
Wafer carries out different operations, avoids manual operation bring potential threat, improves the degree of automation, additionally it is possible to
Guarantee that wafer will not be repeatedly processed through vaporization, condensation and absorption or drain process such case occurs, improves production efficiency, and ensure that quality.
Detailed description of the invention
Fig. 1 is the block diagram of product mix processing system in the present invention；
Fig. 2 is the flow chart of product mix processing method in the present invention.
Specific embodiment
Product mix processing system of the invention and method are described in more detail below in conjunction with schematic diagram, wherein
Illustrating the preferred embodiment of the present invention, it should be appreciated that those skilled in the art can modify invention described herein, and still
So realize advantageous effects of the invention.Therefore, following description should be understood as the widely known of those skilled in the art,
And it is not intended as limitation of the present invention.
For clarity, not describing whole features of practical embodiments.In the following description, it is not described in detail well known function
And structure, because they can make the present invention chaotic due to unnecessary details.It will be understood that opening in any practical embodiments
In hair, it is necessary to make a large amount of implementation details to realize the specific objective of developer, such as according to related system or related business
Limitation, changes into another embodiment by one embodiment.Additionally, it should think that this development may be complicated and expend
Time, but to those skilled in the art it is only routine work.
The present invention is more specifically described by way of example referring to attached drawing in the following passage.It is wanted according to following explanation and right
Book is sought, advantages and features of the invention will become apparent from.It should be noted that attached drawing is all made of very simplified form and using non-
Accurately ratio, only for the purpose of facilitating and clarifying the purpose of the embodiments of the invention.
Core of the invention thought is, a kind of product mix processing system and method is provided, for same a collection of product
Multiple wafers carry out recovery processing, introduce a recovery system, at least one processing scheme of the multiple wafer to be arranged,
To solve is difficult to same a collection of wafer the case where carrying out different processing, improves the degree of automation, reduce artificial behaviour
The risk of work.
It is exemplified below the preferred embodiment of the product mix processing system and method, clearly to illustrate in of the invention
Hold, it is understood that, the contents of the present invention are not restricted to following embodiment, other pass through those of ordinary skill in the art's
The improvement of conventional technical means is also within thought range of the invention.
Based on above-mentioned thought, the preferred embodiment of product mix processing system and method is provided below, please refers to Fig. 1 and figure
2, Fig. 1 be the block diagram of product mix processing system in the present invention；Fig. 2 is the process of product mix processing method in the present invention
Figure.As shown in Figure 1, 2, comprising:
Step S11: at least one processing scheme of the multiple wafer is set in recovery system 1；The processing scheme
Including taking out board (Track out), cancelling load (Cancel Track In) and especially processing (Follow Run card)
At least one of.For example, include 25 wafers in a collection of wafer, be denoted as #1~#25, in an accident, #1~#8 is complete
Shipment, the positive work in-process of #9~#17 are waited at processing, #18~#25 is not yet processed, then in the recovery system 1, respectively
It is especially processing that #1~#8, which is set, to take out board, #9~#17, and #18~#25 is to cancel load.Wafer state in which should be as
What alignment processing scheme, this is that those skilled in the art should be able to effectively determine that the present invention does not elaborate to this.
Then, step S12 is carried out, the information of the wafer is obtained from client 3 by integrated system 2, to the processing side
Case is verified, and when the processing scheme is correct, the processing scheme is transferred to client 3 to execute by integrated system 2.
Specifically, the client 3 includes manufacturing execution system (MES) 31 and board automated system 32, above-mentioned to wafer #1~#
In 25 setting, the integrated system 2 described first obtains the information of the wafer #1~#25 from the manufacturing execution system, to institute
It states processing scheme to be verified, if the processing hand that the processing scheme and wafer #1~#25 state in which should be taken
Section matching, i.e., the described processing scheme is correct, then the processing scheme is transferred to the board Department of Automation by the integrated system 2
System 32 is to execute.In the present embodiment, #1~#8 completes processing and waits shipment, should be taken out machine operations, #9~#17 is just
Work in-process should carry out special processing operation, and #18~#25 is not yet processed, and should carry out cancelling load operation, therefore, extensive
Setting is correct in complex system 1, therefore processing scheme is directly transferred to board automated system 32 and is handled.
But in actual operation, it inevitably will appear such as notification error, fill in situations such as mistake, so that extensive
Set processing scheme can not exactly match the operation that wafer should carry out in complex system 1, at this time by combining system
The information for making the wafer of the acquisition of execution system 31, can warn and technical staff is prompted to adjust processing scheme, until
Processing scheme is correct, to effectively avoid losing caused by information errors.Such as in above-mentioned wafer #1~#25, #1~#
8, which complete processing, waits shipment, the positive work in-process of #9~#17, and #18~#25 is not yet processed, and correct processing scheme is setting #1
~#8 is to take out board, and #9~#17 is especially processing, and #18~#25 is to cancel load, if being set as # when processing scheme is arranged
1~#8 is to take out board, and #8~#17 is especially processing, and #19~#25 is to cancel load, then occurs weighing the processing of #8
It is folded, and the processing of #18 is then missed, then recovery system 1 can show mistake, so that technical staff is verified, it is ensured that right
Wafer-process is properly and securely.
The client further includes an at least board 33, and the board 33 is connected with the board automated system 32,
When the processing scheme is correct, the board automated system 32 can control the board 33 and be produced, and carry out subsequent
Operation.
In product mix processing system provided by the invention and method, including a recovery system, it is described more for being arranged
At least one processing scheme of a wafer, so as to simultaneously to wafer corresponding in a collection of wafer for needing to carry out different operation into
The different operation of row, avoids manual operation bring potential threat, improves the degree of automation, additionally it is possible to guarantee crystalline substance
Circle will not be repeatedly processed through vaporization, condensation and absorption or drain process such case occurs, and improve production efficiency, and ensure that quality.
Obviously, various changes and modifications can be made to the invention without departing from essence of the invention by those skilled in the art
Mind and range.In this way, if these modifications and changes of the present invention belongs to the range of the claims in the present invention and its equivalent technologies
Within, then the present invention is also intended to include these modifications and variations.
Claims (9)
1. a kind of product mix processing system carries out recovery processing for multiple wafers to same a collection of product, comprising:
Recovery system, at least one processing scheme of the multiple wafer to be arranged, with to needing to carry out in same a collection of wafer
Multiple wafers of different operation execute different operations respectively；
Integrated system and client, the integrated system connection recovery system and client.
2. product mix processing system as described in claim 1, which is characterized in that the processing scheme include take out board,
Cancel load and especially at least one of processing.
3. product mix processing system as described in claim 1, which is characterized in that the client includes manufacturing execution system
With board automated system, the manufacturing execution system and board automated system pass through integrated system realization and restorer respectively
The connection of system, and the manufacturing execution system is mutually connected with board automated system by integrated system.
4. product mix processing system as claimed in claim 3, which is characterized in that the board automated system is also connected to
A few board, controls the board and is produced.
5. a kind of product mix processing method carries out recovery processing for multiple wafers to same a collection of product, comprising:
At least one processing scheme of the multiple wafer is set in recovery system, with to needing to carry out not in same a collection of wafer
Multiple wafers of biconditional operation execute different operations respectively；
The information for obtaining the wafer from client by integrated system, verifies the processing scheme, to the processing side
When case is correct, the processing scheme is transferred to client to execute by integrated system.
6. product mix processing method as claimed in claim 5, which is characterized in that the processing scheme include take out board,
Cancel load and especially at least one of processing.
7. product mix processing method as claimed in claim 5, which is characterized in that the client includes manufacturing execution system
With board automated system.
8. product mix processing method as claimed in claim 7, which is characterized in that the integrated system is executed from the manufacture
System obtains the information of the wafer, verifies the processing scheme, if the processing scheme is correct, the integrated system
The processing scheme is transferred to the board automated system to execute by system.
9. product mix processing method as claimed in claim 7, which is characterized in that the integrated system is executed from the manufacture
System obtains the information of the wafer, verifies the processing scheme, if the processing scheme is abnormal, in conjunction with by described
The information that manufacturing execution system obtains the wafer is adjusted, until processing scheme is correct.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310739262.5A CN104751258B (en) | 2013-12-27 | 2013-12-27 | Product mix processing system and method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310739262.5A CN104751258B (en) | 2013-12-27 | 2013-12-27 | Product mix processing system and method |
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| Publication Number | Publication Date |
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| CN104751258A CN104751258A (en) | 2015-07-01 |
| CN104751258B true CN104751258B (en) | 2019-03-12 |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108615135A (en) * | 2016-12-13 | 2018-10-02 | 海太半导体（无锡）有限公司 | Semiconductor module set product goes out to keep accounts automatically system and goes out the method that keeps accounts |
| CN110391150B (en) * | 2018-04-20 | 2022-04-22 | 北京北方华创微电子装备有限公司 | Wafer box monitoring method, wafer box monitoring device and semiconductor processing system |
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| CN101615565A (en) * | 2009-07-21 | 2009-12-30 | 北京北方微电子基地设备工艺研究中心有限责任公司 | A kind of method and system of online board abnormality processing |
| CN1606018B (en) * | 2003-10-08 | 2012-06-06 | 台湾积体电路制造股份有限公司 | Integral production execution system and method |
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| US20030204528A1 (en) * | 2002-04-30 | 2003-10-30 | Yeaun-Jyh Su | Semiconductor wafer manufacturing execution system with special engineer requirement database |
| US7151975B2 (en) * | 2004-02-09 | 2006-12-19 | Macronix International Co., Ltd. | System and method for monitoring wafer furnace production efficiency |
| US7092778B2 (en) * | 2004-12-06 | 2006-08-15 | Taiwan Semiconductor Manufacturing Co., Ltd. | Fabrication management systems and methods |
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Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1606018B (en) * | 2003-10-08 | 2012-06-06 | 台湾积体电路制造股份有限公司 | Integral production execution system and method |
| CN101615565A (en) * | 2009-07-21 | 2009-12-30 | 北京北方微电子基地设备工艺研究中心有限责任公司 | A kind of method and system of online board abnormality processing |
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