CN105205582B - A kind of management method and system for EDM - Google Patents
A kind of management method and system for EDM Download PDFInfo
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- CN105205582B CN105205582B CN201410309094.0A CN201410309094A CN105205582B CN 105205582 B CN105205582 B CN 105205582B CN 201410309094 A CN201410309094 A CN 201410309094A CN 105205582 B CN105205582 B CN 105205582B
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- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
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Abstract
The present invention discloses a kind of management method for EDM, comprising: when board is abnormal, by BS system according to the original process conditions information recorded on board, is grouped to original batch wafer, and packet data is sent to MES system；The packet data received is converted to batch wafer data in batches by MES system；After EAP system is transferred and carried out in batches according to batch wafer data in batches to original wafer batch, it is transported on normal board and carries out corresponding manufacturing process；After the completion of manufacturing process, the wafer data of batch in batches is merged into original batch wafer data by MES system, and the wafer after in batches is merged into original batch wafer according to the original batch wafer data after merging by EAP system.The invention also discloses a kind of EDM management system, by entire method and system fully achieve automation in batches with merges wafer, thus reduction bring wafer loss due to manual operation.
Description
Technical field
The present invention relates to factory's wafer sort fields in semiconductor devices preparation, and in particular to one kind is used for equipment downtime
Manage the management method and system of (Equipment Down Management, EDM).
Background technique
Board occurs abnormal being frequent thing in field of semiconductor manufacture, factory, for example, artificial maloperation or carelessness
Caused by various maloperations.Now, when board has situation, the product to defects different on board is needed to carry out at manual sort
Reason, but finally scrapping for product is being easily caused to the human error in faulty goods manual sort's treatment process.
Summary of the invention
In view of the above-mentioned problems, the present invention provides a kind of management methods for equipment downtime management, wherein be applied to just
On the board for executing original batch wafer manufacturing process, which comprises S1: when the board is abnormal, pass through
(Batch Split, the BS) system of grouping is brilliant to the original batch according to the original process conditions information recorded on the board
Circle is grouped, and packet data is sent to MES system；S2: the production executes (Manufacturing Execution
System, MES) packet data received is converted to batch wafer data in batches by system；S3: equipment automatization scheme
(Equipment Automation Project, EAP) system is transferred and according to the wafer data of batch in batches to the original
After beginning batch wafer carries out in batches, it is transported on normal board and carries out corresponding manufacturing process；S4: Yu Suoshu manufacturing process is completed
Afterwards, the wafer data of batch in batches is merged into the original batch wafer data, the equipment by the production executive system
It is brilliant that wafer after in batches according to the original batch wafer data after merging is merged into original batch by automation scheme system
Circle.
The above-mentioned management method for equipment downtime management, wherein the equipment automatization scheme system is by batches
Board carries out in batches the original batch wafer, and also by this, the wafer after in batches is merged into original batch crystalline substance by board in batches
Circle.
The above-mentioned management method for equipment downtime management, wherein the original batch wafer includes at least one batch
Secondary wafer, it is described in batches after wafer include at least two sub- batches wafer.
The above-mentioned management method for equipment downtime management, wherein it is described in batches after wafer include: completely processing
Sub- batch wafer, undressed sub- batch wafer and processes sub- batch wafer completely.
The above-mentioned management method for equipment downtime management, wherein the wafer data of batch in batches includes: incomplete
It processes sub- batch wafer data, undressed sub- batch wafer data and processes sub- batch wafer data completely.
The above-mentioned management method for equipment downtime management, wherein the equipment automatization scheme system is transferred and root
After being carried out in batches according to the wafer data of batch in batches to the original batch wafer:
Undressed sub- batch wafer is transported on the normal board of current process step and continues to execute the processing step；
Sub- batch wafer being processed completely and being transported on the normal board of next processing step continue to execute next work
Skill step；
Sub- batch wafer will not be processed completely and be transported on the normal board of new definition process step and executes the new definition
Processing step；
Wherein, the new definition work is arranged according to the data information for not processing sub- batch wafer completely and process conditions
Skill step.
A kind of management system for equipment downtime management, applied to being carrying out original batch wafer manufacturing process
On board, to be automatically processed to the extremely caused abnormal semiconductor crystal wafer of board, wherein include: BS system, production executes
System and equipment automatization scheme system are remembered by the BS system according on the board when the board is abnormal
The original process conditions information carried, is grouped the original batch wafer, and packet data is sent to production and executes system
System；The packet data received is converted to batch wafer data in batches by the production executive system；Equipment automatization side
After case system is transferred and carried out in batches according to the wafer data of batch in batches to the original batch wafer, it is transported to normal machine
Corresponding manufacturing process is carried out on platform；After the completion of the manufacturing process, the production executive system will the crystalline substance of batch in batches
Circle data merge into the original batch wafer data, and the equipment automatization scheme system is according to described original batch after merging
Wafer after in batches is merged into original batch wafer by secondary wafer data.
The above-mentioned management system for equipment downtime management, wherein the equipment automatization scheme system is by batches
Board carries out in batches the original batch wafer, and also by this, the wafer after in batches is merged into original batch crystalline substance by board in batches
Circle.
The above-mentioned management system for equipment downtime management, wherein the original batch wafer includes at least one batch
Secondary wafer, it is described in batches after wafer include at least two sub- batches wafer.
The above-mentioned management system for equipment downtime management, wherein it is described in batches after wafer include: completely processing
Sub- batch wafer, undressed sub- batch wafer and processes sub- batch wafer completely.
The above-mentioned management system for equipment downtime management, wherein the wafer data of batch in batches includes: incomplete
It processes sub- batch wafer data, undressed sub- batch wafer data and processes sub- batch wafer data completely.
The above-mentioned management system for equipment downtime management, wherein the equipment automatization scheme system is transferred and root
After being carried out in batches according to the wafer data of batch in batches to the original batch wafer:
Undressed sub- batch wafer is transported on the normal board of current process step and continues to execute the processing step；
Sub- batch wafer being processed completely and being transported on the normal board of next processing step continue to execute next work
Skill step；
Sub- batch wafer will not be processed completely and be transported on the normal board of new definition process step and executes the new definition
Processing step；
Wherein, the new definition work is arranged according to the data information for not processing sub- batch wafer completely and process conditions
Skill step.
In conclusion being fully achieved automatically since present invention employs above technical schemes by entire method and system
Chemical combination and with wafer in batches, reduce due to manual operation bring wafer loss.
Detailed description of the invention
Upon reading the detailed description of non-limiting embodiments with reference to the following drawings, the present invention and its feature, outer
Shape and advantage will become more apparent upon.Identical label indicates identical part in all the attached drawings.Not deliberately proportionally
Draw attached drawing, it is preferred that emphasis is show the gist of the present invention.
Fig. 1 is the flow diagram of method of the invention；
Fig. 2 is the structural schematic diagram of system of the invention.
Specific embodiment
A specific embodiment of the invention is further described with reference to the accompanying drawing:
As shown in Figure 1, the present invention relates to a kind of management method for equipment downtime management, it is applied to executing original
On the board of beginning batch wafer manufacturing process, to be automatically processed to the extremely caused abnormal semiconductor crystal wafer of board, wherein
The described method includes:
S1: when the board is abnormal, believed by BS system according to the original process conditions recorded on the board
Breath, is grouped the original batch wafer, and packet data is sent to production executive system, grouping information such as the following table 1
It is shown, wherein the quantity of the wafer is at least 25, and the wafer is influenced by different quality when machine failure.
Specifically, as the Lotxx01 in table 1 by production executive system can by batches at Lotxx01.01, Lotxx01.02,
Lotxx01.03 respectively corresponds to process sub- batch completely, and undressed sub- batch processes sub- batch completely.Wherein, for
Lotxx01.01, that is, complete the batch (processing sub- batch completely) of the processing, the equipment automatization scheme system executes next
Process is walked, that is, needs not continue to carry out making technology on same board.It is incomplete for Lotxx01.02, that is, processing
Batch (does not process sub- batch) completely, and the equipment automatization scheme system executes the procedure technology step newly defined, that is, continues
Making technology is executed in same board.For Lotxx01.03, that is, undressed sub- batch, the production executes process of doing over again,
Re-work.The packet data received is converted to batch wafer data in batches by the production executive system；Equipment
Automation scheme system receives and according to the batch wafer data in batches, is divided the original batch wafer by board in batches
It criticizes into several sub- batch wafers；The equipment automatization scheme system divides according to the classification of several sub- batch wafers
Several sub- batch wafers are not transported on corresponding normal board and carry out manufacturing process, go to machine in batches after the completion
Platform；Or several sub- batch wafers are directly transported to board in batches；The production executive system receives the equipment
The implementing result of automation scheme system, and order the equipment automatization scheme system will be described by the board in batches
Several sub- batch wafers reconsolidate as an original batch wafer.
Table 1
Preferably, the equipment automatization scheme system carries out in batches the original batch wafer by board in batches,
Also by this, the wafer after in batches is merged into original batch wafer by board in batches.
Preferably, the original batch wafer includes the wafer of at least one batch, it is described in batches after wafer include extremely
The wafer of few two sub- batches.
Preferably, it is described in batches after wafer include: not process sub- batch wafer completely, undressed sub- batch wafer and
Sub- batch wafer is processed completely.
Preferably, the wafer data of batch in batches includes: not process sub- batch wafer data completely, undressed sub- batch
Wafer data and process sub- batch wafer data completely.
Preferably, the equipment automatization scheme system is transferred and according to the wafer data of batch in batches to described original
After batch wafer carries out in batches: undressed sub- batch wafer being transported on the normal board of current process step and continues to execute this
Processing step；Sub- batch wafer being processed completely and being transported on the normal board of next processing step continue to execute next work
Skill step；It sub- batch wafer will not be processed completely is transported to and execute the work of the new definition on the normal board of new definition process step
Skill step；Wherein, the new definition work is arranged according to the data information for not processing sub- batch wafer completely and process conditions
Skill step.
In addition, as shown in Fig. 2, it is right to be applied to the present invention relates to a kind of management system for equipment downtime management
On the board for executing original batch wafer manufacturing process, to be located automatically to the extremely caused abnormal semiconductor crystal wafer of board
Reason, wherein include: BS system, production executive system and equipment automatization scheme system, when the board is abnormal, lead to
The BS system is crossed according to the original process conditions information recorded on the board, the original batch wafer is grouped,
And packet data is sent to production executive system；The production executive system is converted to the packet data received point
Criticize batch wafer data；Equipment automatization scheme system is transferred and according to the wafer data of batch in batches to the original batch
After wafer carries out in batches, it is transported on normal board and carries out corresponding manufacturing process；After the completion of the manufacturing process, the life
It produces execution system and the wafer data of batch in batches is merged into the original batch wafer data, the equipment automatization scheme
Wafer after in batches is merged into original batch wafer according to the original batch wafer data after merging by system.
It is not difficult to find that the present embodiment is with above-mentioned for the corresponding system of the embodiment of management method of equipment downtime management
It unites embodiment, the present embodiment can work in coordination implementation with the embodiment of the above-mentioned management method for equipment downtime management.It is above-mentioned
The relevant technical details mentioned in the embodiment of management method for equipment downtime management are still effective in the present embodiment, are
It reduces and repeats, which is not described herein again.Correspondingly, the relevant technical details mentioned in the present embodiment are also applicable in above-mentioned be used for
In the embodiment of the management method of equipment downtime management.
In conclusion fully achieving automatic chemical combination by entire method and system present invention employs above technical scheme
And with wafer in batches, reduce due to manual operation bring wafer loss.
Presently preferred embodiments of the present invention is described above.It is to be appreciated that the invention is not limited to above-mentioned
Particular implementation, devices and structures not described in detail herein should be understood as gives reality with the common mode in this field
It applies；Anyone skilled in the art, without departing from the scope of the technical proposal of the invention, all using the disclosure above
Methods and technical content many possible changes and modifications are made to technical solution of the present invention, or be revised as equivalent variations etc.
Embodiment is imitated, this is not affected the essence of the present invention.Therefore, anything that does not depart from the technical scheme of the invention, foundation
Technical spirit of the invention any simple modifications, equivalents, and modifications made to the above embodiment, still fall within the present invention
In the range of technical solution protection.
Claims (12)
1. a kind of management method for equipment downtime management, which is characterized in that applied to being carrying out original batch wafer system
It makes on the board of technique, which comprises
S1: when the board is abnormal, by grouping system according to the original process conditions information recorded on the board,
The original batch wafer is grouped, and packet data is sent to production executive system；
S2: the packet data received is converted to batch wafer data in batches by the production executive system；
S3: equipment automatization scheme system is transferred and is carried out according to the wafer data of batch in batches to the original batch wafer
After in batches, it is transported on normal board and carries out corresponding manufacturing process；
After the completion of S4: Yu Suoshu manufacturing process, the production executive system merges into the wafer data of batch in batches described
Original batch wafer data, the equipment automatization scheme system will in batches according to the original batch wafer data after merging
Wafer afterwards merges into original batch wafer.
2. the management method according to claim 1 for equipment downtime management, which is characterized in that the equipment automatization
Scheme system carries out in batches the original batch wafer by board in batches, also by this in batches board by the wafer after in batches
Merge into original batch wafer.
3. the management method according to claim 2 for equipment downtime management, which is characterized in that the original batch is brilliant
Circle include at least one batch wafer, it is described in batches after wafer include at least two sub- batches wafer.
4. the management method according to claim 3 for equipment downtime management, which is characterized in that it is described in batches after crystalline substance
Circle includes: not process sub- batch wafer completely, undressed sub- batch wafer and processes sub- batch wafer completely.
5. the management method according to claim 4 for equipment downtime management, which is characterized in that the batch in batches is brilliant
Circle data include: not process sub- batch wafer data completely, undressed sub- batch wafer data and process sub- batch crystalline substance completely
Circle data.
6. the management method according to claim 5 for equipment downtime management, which is characterized in that the equipment automatization
After scheme system is transferred and is carried out in batches according to the wafer data of batch in batches to the original batch wafer:
Undressed sub- batch wafer is transported on the normal board of current process step and continues to execute the processing step；
Sub- batch wafer being processed completely and being transported on the normal board of next processing step continue to execute next technique step
Suddenly；
The technique that the new definition is executed on the normal board of new definition process step is transported to by sub- batch wafer is not processed completely
Step；
Wherein, it is walked according to the data information for not processing sub- batch wafer completely and the process conditions setting new definition process
Suddenly.
7. a kind of management system for equipment downtime management, applied to the machine for executing manufacturing process to original batch wafer
On platform, to be automatically processed to the extremely caused abnormal semiconductor crystal wafer of board characterized by comprising grouping system, it is raw
Produce execution system and equipment automatization scheme system；
When the board is abnormal, believed by the grouping system according to the original process conditions recorded on the board
Breath, is grouped the original batch wafer, and packet data is sent to production executive system；
The packet data received is converted to batch wafer data in batches by the production executive system；
The equipment automatization scheme system transfer and according to the wafer data of batch in batches to the original batch wafer into
After going in batches, it is transported on normal board and carries out corresponding manufacturing process, and after the completion of the manufacturing process, the production is held
The wafer data of batch in batches is merged into the original batch wafer data, the equipment automatization scheme system by row system
The wafer after in batches is merged into original batch wafer according to the original batch wafer data after merging.
8. the management system according to claim 7 for equipment downtime management, which is characterized in that the equipment automatization
Scheme system carries out in batches the original batch wafer by board in batches, also by this in batches board by the wafer after in batches
Merge into original batch wafer.
9. the management system according to claim 8 for equipment downtime management, which is characterized in that the original batch is brilliant
Circle include at least one batch wafer, it is described in batches after wafer include at least two sub- batches wafer.
10. the management system according to claim 9 for equipment downtime management, which is characterized in that it is described in batches after
Wafer includes: not process sub- batch wafer completely, undressed sub- batch wafer and processes sub- batch wafer completely.
11. the management system according to claim 10 for equipment downtime management, which is characterized in that the batch in batches
Wafer data includes: not process sub- batch wafer data completely, undressed sub- batch wafer data and processes sub- batch completely
Wafer data.
12. the management system according to claim 11 for equipment downtime management, which is characterized in that the equipment is automatic
Change scheme system to transfer and carry out the original batch wafer according to the wafer data of batch in batches in batches rear:
Undressed sub- batch wafer is transported on the normal board of current process step and continues to execute the processing step；
Sub- batch wafer being processed completely and being transported on the normal board of next processing step continue to execute next technique step
Suddenly；
The technique that the new definition is executed on the normal board of new definition process step is transported to by sub- batch wafer is not processed completely
Step；
Wherein, it is walked according to the data information for not processing sub- batch wafer completely and the process conditions setting new definition process
Suddenly.
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| CN110676191B (en) * | 2019-10-08 | 2022-05-24 | 东莞长城开发科技有限公司 | LED wafer test disassembly group combining and collecting method based on MES system |
| CN116207012A (en) * | 2023-03-09 | 2023-06-02 | 上海赛美特软件科技有限公司 | Wafer carrier replacement control method and device, electronic equipment and storage medium |
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| JP2003195922A (en) * | 2001-12-25 | 2003-07-11 | Mitsubishi Electric Corp | Standard information data managing method and system |
| CN1603066A (en) * | 2003-10-02 | 2005-04-06 | 台湾积体电路制造股份有限公司 | Manufacturing system, delivery system and delivery method |
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