CN104733405A - Pin-type heat-radiating semiconductor packaging structure - Google Patents
Pin-type heat-radiating semiconductor packaging structure Download PDFInfo
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- CN104733405A CN104733405A CN201510177357.1A CN201510177357A CN104733405A CN 104733405 A CN104733405 A CN 104733405A CN 201510177357 A CN201510177357 A CN 201510177357A CN 104733405 A CN104733405 A CN 104733405A
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- heat
- radiating part
- radiating
- heat radiation
- semiconductor chip
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Abstract
The invention discloses a pin-type heat-radiating semiconductor packaging structure. The pin-type heat-radiating semiconductor packaging structure comprises a semiconductor chip, a packaging layer, a curved heat-radiating pin and a copper wire net. The copper wire net is laid on the upper surface of the semiconductor chip. The curved heat-radiating pin comprises a heat-conducting portion and a heat-radiating portion connected with the heat-conducting portion. The heat-conducting portion is laid on the surface of the copper wire net. The packaging layer wraps and covers the semiconductor chip, the copper wire net and the heat-conducting portion. The heat-radiating portion is exposed outside the packaging layer. The surface of the heat-radiating portion is coated with insulated heat-conducting glue. The pin-type heat-radiating semiconductor packaging structure has the advantages that temperature rise of the center of the semiconductor chip can be reduced remarkably, overall heat radiation area can be increased, dust is difficult to adhere, and heat radiation efficiency can be improved; direct dust accumulation is avoided by the curved heat-radiating pin, and heat radiation efficiency can be guaranteed; the height of the overall packaging structure is not increased, the width of the overall packaging structure is not increased obviously, and accordingly, the probability of short-circuit troubles of circuits in mounting space is lowered.
Description
Technical field
The present invention relates to a kind of semiconductor package, particularly relate to a kind of semiconductor package with heat sinking function.
Technical background
At present, for semiconductor packaging industry, the heating of powerful chip causes chip temperature to raise, and then cause the reduction in chip life-span, in order to reduce the temperature of chip, people are generally dispelled the heat at wafer surface attachment fin, and fin is all adopt the mode increasing height to realize usually, be difficult to the occasion being applied to ultra-thin installing space, and the installation of fin easily causes the circuit in installing space to occur short-circuit fault, and due in the long-term exposed air of fin, fin surface easily piles up increasing dust, the radiating efficiency of fin is caused to reduce, therefore, a kind of new solution is needed to solve the problem better.
Summary of the invention
Instant invention overcomes deficiency of the prior art, provide the semiconductor package of a kind of pin type heat radiation.
In order to solve the problems of the technologies described above, the present invention is achieved by the following technical solutions: a kind of semiconductor package of pin type heat radiation, comprise semiconductor chip, encapsulated layer, heat radiation looper and copper mesh, described copper mesh tiling is arranged on semiconductor chip upper surface, described heat radiation looper comprises heat-conducting part and radiating part, described heat-conducting part is connected with radiating part, described heat-conducting part tiling is arranged on the surface of copper mesh, described encapsulated layer parcel covers semiconductor chip, copper mesh and heat-conducting part, the exposed outside at encapsulated layer of described radiating part, described radiating part surface scribbles thermal plastic insulation.
As preferably, the cross section of described heat radiation looper is circular, and diameter is 0.2 ~ 1mm.
As preferably, described radiating part comprises the first radiating part, the second radiating part and the 3rd radiating part, described first radiating part is connected with heat-conducting part, described first radiating part to be contacted mutually with the 3rd radiating part by the second radiating part and is connect, described first radiating part, the second radiating part and the 3rd radiating part are in same plane, described second radiating part perpendicular to the upper surface of semiconductor chip to downward-extension, described second radiating part length is no more than the bottom surface of encapsulated layer, and described 3rd radiating part is arranged between the second radiating part and encapsulated layer.
As preferably, described 3rd radiating part is L shape, and one end is connected with the second radiating part, and the other end is upwards arranged perpendicular to the upper surface of semiconductor chip.
Compared with prior art, advantage of the present invention is: the assistance heat conduction of copper mesh significantly can reduce the temperature rise of semiconductor chip central part; The heat radiation looper of minor diameter can increase overall area of dissipation, also can allow the more difficult adhesion of dust simultaneously, improving heat radiation efficiency; 3rd radiating part of heat radiation looper is hidden in the first radiating part, avoids between the second radiating part and encapsulated layer directly accumulating dust, effectively ensures radiating efficiency; The surrounding being distributed in encapsulated layer due to heat radiation looper is close to encapsulated layer, makes overall package structure not increase height, does not also significantly increase simultaneously on width; Due to heat radiation looper scribbling thermal plastic insulation, the probability of extra short-circuit fault can be there is by the circuit effectively reduced in installing space.
Accompanying drawing explanation
Fig. 1 is the structural representation of the embodiment of the present invention.
Embodiment
Below in conjunction with accompanying drawing and embodiment, the present invention is described in further detail.
As shown in Figure 1, a kind of semiconductor package of pin type heat radiation, comprise semiconductor chip 1, encapsulated layer 2, heat radiation looper 3 and copper mesh 4, described copper mesh 4 tiling is arranged on semiconductor chip 1 upper surface, described heat radiation looper 3 comprises heat-conducting part 34 and radiating part, described heat-conducting part 34 is connected with radiating part, described heat-conducting part 34 tiling is arranged on the surface of copper mesh 4, described encapsulated layer 2 wraps up and covers semiconductor chip 1, copper mesh 4 and heat-conducting part 34, the exposed outside at encapsulated layer 2 of described radiating part, described radiating part surface scribbles thermal plastic insulation, the cross section of described heat radiation looper 3 is circular, diameter is 0.5mm, described radiating part comprises the first radiating part 31, second radiating part 32 and the 3rd radiating part 33, described first radiating part 31 is connected with heat-conducting part 34, described first radiating part 31 to be contacted mutually with the 3rd radiating part 33 by the second radiating part 32 and is connect, described first radiating part 31, second radiating part 32 and the 3rd radiating part 33 are in same plane, described second radiating part 32 perpendicular to the upper surface of semiconductor chip 1 to downward-extension, described second radiating part 32 length is no more than the bottom surface of encapsulated layer 2, described 3rd radiating part 33 is arranged between the second radiating part and encapsulated layer, described 3rd radiating part 33 is L shape, one end is connected with the second radiating part 32, the other end is upwards arranged perpendicular to the upper surface of semiconductor chip 1.
When the present invention works, the heat that semiconductor chip 1 produces rises to copper mesh 4, and copper mesh 4 conducts heat on heat radiation looper 3 and externally dispels the heat, and can effectively avoid the central part of semiconductor chip 1 to produce high temperature rise; The heat radiation looper of 0.5mm diameter can increase overall area of dissipation more, also can allow the more difficult adhesion of dust simultaneously, improving heat radiation efficiency; 3rd radiating part 33 of heat radiation looper is hidden between the first radiating part 31, second radiating part 32 and encapsulated layer 2 to be avoided directly accumulating dust, effectively ensures radiating efficiency; The surrounding being distributed in encapsulated layer due to heat radiation looper 3 is close to encapsulated layer, makes overall package structure not increase height, does not also significantly increase simultaneously on width; Due to heat radiation looper 3 scribbling thermal plastic insulation, the probability of extra short-circuit fault can be there is by the circuit effectively reduced in installing space.
Except the above embodiments, other execution modes do not stated also should within protection scope of the present invention.Specific embodiment as herein described is only to the explanation for example of the present invention's spirit, those skilled in the art can make various amendment or supplement or adopt similar mode to substitute to described specific embodiment, but can't depart from spirit of the present invention or surmount the scope that appended claims defines.Although be described through specific term herein, but do not get rid of the possibility using other terms, use these terms to be only used to describe and explain essence of the present invention easily, the restriction that they are construed to any one additional is all contrary with spirit of the present invention.
Claims (4)
1. the semiconductor package of a pin type heat radiation, it is characterized in that, comprise semiconductor chip, encapsulated layer, heat radiation looper and copper mesh, described copper mesh tiling is arranged on semiconductor chip upper surface, described heat radiation looper comprises heat-conducting part and radiating part, described heat-conducting part is connected with radiating part, described heat-conducting part tiling is arranged on the surface of copper mesh, described encapsulated layer parcel covers semiconductor chip, copper mesh and heat-conducting part, the exposed outside at encapsulated layer of described radiating part, described radiating part surface scribbles thermal plastic insulation.
2. the semiconductor package of a kind of pin type heat radiation according to claim 1, is characterized in that, the cross section of described heat radiation looper is circular, and diameter is 0.2 ~ 1mm.
3. the semiconductor package of a kind of pin type heat radiation according to claim 2, it is characterized in that, described radiating part comprises the first radiating part, second radiating part and the 3rd radiating part, described first radiating part is connected with heat-conducting part, described first radiating part to be contacted mutually with the 3rd radiating part by the second radiating part and is connect, described first radiating part, second radiating part and the 3rd radiating part are in same plane, described second radiating part perpendicular to the upper surface of semiconductor chip to downward-extension, described second radiating part length is no more than the bottom surface of encapsulated layer, described 3rd radiating part is arranged between the second radiating part and encapsulated layer.
4. the semiconductor package of a kind of pin type heat radiation according to claim 3, it is characterized in that, described 3rd radiating part is L shape, and one end is connected with the second radiating part, and the other end is upwards arranged perpendicular to the upper surface of semiconductor chip.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510177357.1A CN104733405A (en) | 2015-04-15 | 2015-04-15 | Pin-type heat-radiating semiconductor packaging structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510177357.1A CN104733405A (en) | 2015-04-15 | 2015-04-15 | Pin-type heat-radiating semiconductor packaging structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104733405A true CN104733405A (en) | 2015-06-24 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510177357.1A Pending CN104733405A (en) | 2015-04-15 | 2015-04-15 | Pin-type heat-radiating semiconductor packaging structure |
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| CN (1) | CN104733405A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11239211B2 (en) | 2019-08-28 | 2022-02-01 | Industrial Technology Research Institute | Electronic device having a curved portion between a plurality of conductive portions on a substrate |
Citations (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5909057A (en) * | 1997-09-23 | 1999-06-01 | Lsi Logic Corporation | Integrated heat spreader/stiffener with apertures for semiconductor package |
| CN1463075A (en) * | 2002-05-27 | 2003-12-24 | 三星电机株式会社 | Ceramic packing with radiating cap |
| CN1585115A (en) * | 2003-08-22 | 2005-02-23 | 矽品精密工业股份有限公司 | Semiconductor sealer with radiating structure |
| CN1914530A (en) * | 2003-12-18 | 2007-02-14 | 3M创新有限公司 | Display including a solid state light device and method using same |
| US20090273062A1 (en) * | 2003-11-24 | 2009-11-05 | Virgil Cotoco Ararao | Semiconductor package heat spreader |
| CN201805666U (en) * | 2010-09-07 | 2011-04-20 | 无锡鸿声铝业有限公司 | Radiating fin for electronic heating component |
| CN201869494U (en) * | 2010-11-29 | 2011-06-15 | 无锡鸿声铝业有限公司 | Cooling fin |
| CN201893328U (en) * | 2010-11-29 | 2011-07-06 | 无锡鸿声铝业有限公司 | Radiating fin of heating element |
| CN201905000U (en) * | 2010-11-27 | 2011-07-20 | 无锡鸿声铝业有限公司 | Radiating fin |
| CN202120917U (en) * | 2011-05-11 | 2012-01-18 | 江阴市赛英电子有限公司 | Large power IGBT flat crimping type packaging structure |
| CN102387692A (en) * | 2010-09-06 | 2012-03-21 | 无锡鸿声铝业有限公司 | Radiating fin of electronic component |
| CN102404965A (en) * | 2010-09-07 | 2012-04-04 | 无锡鸿声铝业有限公司 | Radiating fin of heating electronic element |
| CN102404963A (en) * | 2010-09-07 | 2012-04-04 | 无锡鸿声铝业有限公司 | Radiating fin of heating electronic component |
| CN102404964A (en) * | 2010-09-07 | 2012-04-04 | 无锡鸿声铝业有限公司 | Radiating fin |
| CN102437132A (en) * | 2010-09-29 | 2012-05-02 | 晟铭电子科技股份有限公司 | Heat radiating device and manufacturing method thereof |
| CN203225144U (en) * | 2013-03-27 | 2013-10-02 | 广东福德电子有限公司 | High-efficiency water-cooling resistor with heat radiation rib |
| CN203298264U (en) * | 2013-06-27 | 2013-11-20 | 重庆亮康光电科技有限公司 | Needle column type LED (light-emitting diode) lamp tube heat dissipation device |
| CN103779291A (en) * | 2014-01-24 | 2014-05-07 | 嘉兴斯达微电子有限公司 | Heat dissipation substrate for encapsulating power module |
| CN103985679A (en) * | 2013-02-07 | 2014-08-13 | 台湾积体电路制造股份有限公司 | 3DIC packaging member comprising perforated foil sheets |
| CN203774285U (en) * | 2014-01-24 | 2014-08-13 | 嘉兴斯达微电子有限公司 | Heat radiation substrate for power module packaging |
| CN204516749U (en) * | 2015-04-15 | 2015-07-29 | 江苏晟芯微电子有限公司 | A kind of semiconductor package of pin type heat radiation |
-
2015
- 2015-04-15 CN CN201510177357.1A patent/CN104733405A/en active Pending
Patent Citations (21)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5909057A (en) * | 1997-09-23 | 1999-06-01 | Lsi Logic Corporation | Integrated heat spreader/stiffener with apertures for semiconductor package |
| CN1463075A (en) * | 2002-05-27 | 2003-12-24 | 三星电机株式会社 | Ceramic packing with radiating cap |
| CN1585115A (en) * | 2003-08-22 | 2005-02-23 | 矽品精密工业股份有限公司 | Semiconductor sealer with radiating structure |
| US20090273062A1 (en) * | 2003-11-24 | 2009-11-05 | Virgil Cotoco Ararao | Semiconductor package heat spreader |
| CN1914530A (en) * | 2003-12-18 | 2007-02-14 | 3M创新有限公司 | Display including a solid state light device and method using same |
| CN102387692A (en) * | 2010-09-06 | 2012-03-21 | 无锡鸿声铝业有限公司 | Radiating fin of electronic component |
| CN201805666U (en) * | 2010-09-07 | 2011-04-20 | 无锡鸿声铝业有限公司 | Radiating fin for electronic heating component |
| CN102404963A (en) * | 2010-09-07 | 2012-04-04 | 无锡鸿声铝业有限公司 | Radiating fin of heating electronic component |
| CN102404964A (en) * | 2010-09-07 | 2012-04-04 | 无锡鸿声铝业有限公司 | Radiating fin |
| CN102404965A (en) * | 2010-09-07 | 2012-04-04 | 无锡鸿声铝业有限公司 | Radiating fin of heating electronic element |
| CN102437132A (en) * | 2010-09-29 | 2012-05-02 | 晟铭电子科技股份有限公司 | Heat radiating device and manufacturing method thereof |
| CN201905000U (en) * | 2010-11-27 | 2011-07-20 | 无锡鸿声铝业有限公司 | Radiating fin |
| CN201869494U (en) * | 2010-11-29 | 2011-06-15 | 无锡鸿声铝业有限公司 | Cooling fin |
| CN201893328U (en) * | 2010-11-29 | 2011-07-06 | 无锡鸿声铝业有限公司 | Radiating fin of heating element |
| CN202120917U (en) * | 2011-05-11 | 2012-01-18 | 江阴市赛英电子有限公司 | Large power IGBT flat crimping type packaging structure |
| CN103985679A (en) * | 2013-02-07 | 2014-08-13 | 台湾积体电路制造股份有限公司 | 3DIC packaging member comprising perforated foil sheets |
| CN203225144U (en) * | 2013-03-27 | 2013-10-02 | 广东福德电子有限公司 | High-efficiency water-cooling resistor with heat radiation rib |
| CN203298264U (en) * | 2013-06-27 | 2013-11-20 | 重庆亮康光电科技有限公司 | Needle column type LED (light-emitting diode) lamp tube heat dissipation device |
| CN103779291A (en) * | 2014-01-24 | 2014-05-07 | 嘉兴斯达微电子有限公司 | Heat dissipation substrate for encapsulating power module |
| CN203774285U (en) * | 2014-01-24 | 2014-08-13 | 嘉兴斯达微电子有限公司 | Heat radiation substrate for power module packaging |
| CN204516749U (en) * | 2015-04-15 | 2015-07-29 | 江苏晟芯微电子有限公司 | A kind of semiconductor package of pin type heat radiation |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11239211B2 (en) | 2019-08-28 | 2022-02-01 | Industrial Technology Research Institute | Electronic device having a curved portion between a plurality of conductive portions on a substrate |
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| C41 | Transfer of patent application or patent right or utility model | ||
| TA01 | Transfer of patent application right |
Effective date of registration: 20160602 Address after: 215300 Jiangsu province north of the city of Yushan town of Kunshan city Hanpu Road No. 998, room 3 Applicant after: Suzhou Juda senchip Microelectronics Co. Ltd. Address before: 225500 hi tech innovation center, Jiangyan District, Taizhou, Jiangsu Applicant before: Jiangsu Senchip Microelectronics Co., Ltd. |
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| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20150624 |
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| WD01 | Invention patent application deemed withdrawn after publication |