CN104718265A - Adhesive composition and film-shaped adhesive - Google Patents

Adhesive composition and film-shaped adhesive Download PDF

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Publication number
CN104718265A
CN104718265A CN201380053352.7A CN201380053352A CN104718265A CN 104718265 A CN104718265 A CN 104718265A CN 201380053352 A CN201380053352 A CN 201380053352A CN 104718265 A CN104718265 A CN 104718265A
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Prior art keywords
agent composition
resin
polyamide resin
adhesion agent
monomer
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Chinese (zh)
Inventor
增田克之
品田咏逸
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Showa Denko Materials Co ltd
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Hitachi Chemical Co Ltd
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/34—Layered products comprising a layer of synthetic resin comprising polyamides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/38—Layered products comprising a layer of synthetic resin comprising epoxy resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/42—Layered products comprising a layer of synthetic resin comprising condensation resins of aldehydes, e.g. with phenols, ureas or melamines
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/02—Polycondensates containing more than one epoxy group per molecule
    • C08G59/04—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof
    • C08G59/06—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols
    • C08G59/08—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols from phenol-aldehyde condensates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/44—Amides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G69/00—Macromolecular compounds obtained by reactions forming a carboxylic amide link in the main chain of the macromolecule
    • C08G69/02—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids
    • C08G69/26—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids derived from polyamines and polycarboxylic acids
    • C08G69/265—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids derived from polyamines and polycarboxylic acids from at least two different diamines or at least two different dicarboxylic acids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G69/00—Macromolecular compounds obtained by reactions forming a carboxylic amide link in the main chain of the macromolecule
    • C08G69/40—Polyamides containing oxygen in the form of ether groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/0622—Polycondensates containing six-membered rings, not condensed with other rings, with nitrogen atoms as the only ring hetero atoms
    • C08G73/0633—Polycondensates containing six-membered rings, not condensed with other rings, with nitrogen atoms as the only ring hetero atoms with only two nitrogen atoms in the ring
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/14—Polyamide-imides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L67/00—Compositions of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Compositions of derivatives of such polymers
    • C08L67/06—Unsaturated polyesters
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C09J163/04—Epoxynovolacs
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J177/00—Adhesives based on polyamides obtained by reactions forming a carboxylic amide link in the main chain; Adhesives based on derivatives of such polymers
    • C09J177/06—Polyamides derived from polyamines and polycarboxylic acids
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J179/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09J161/00 - C09J177/00
    • C09J179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J179/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09J161/00 - C09J177/00
    • C09J179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C09J179/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • C09J201/02—Adhesives based on unspecified macromolecular compounds characterised by the presence of specified groups, e.g. terminal or pendant functional groups
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/70—Other properties
    • B32B2307/748—Releasability
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2405/00—Adhesive articles, e.g. adhesive tapes

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
  • Laminated Bodies (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)

Abstract

The present invention provides an adhesive composition containing an epoxy resin and a polyamide resin.

Description

Adhesion agent composition and membranaceous tackiness agent
Technical field
The present invention relates to adhesion agent composition and membranaceous tackiness agent.
Background technology
Acid amides system adhesion resin has thermotolerance to the temperature of such as 250 DEG C and tackiness concurrently, therefore can be used as the tackiness agent (for example, referring to patent documentation 1) of reply high-temperature technology.
Prior art document
Patent documentation
Patent documentation 1: No. 2012/140740th, International Publication
Summary of the invention
The problem that invention will solve
But, when wanting manufacturing process tackiness agent being used for electronic material, wish that it has performance, the i.e. chemical proofing of organic solvent used in the resist, resist stripper etc. being insoluble to and using in operation.But owing to being dissolved in the organic solvent (such as, N-Methyl pyrrolidone, tetrahydrofuran (THF) etc.) being generally used for such use, there is restriction on therefore using in acid amides system adhesion resin in the past.
Therefore, the object of the present invention is to provide a kind of chemical proofing excellence, adhesion agent composition containing polyamide resin and use the membranaceous tackiness agent of this adhesion agent composition.
For solving the means of problem
The invention provides a kind of adhesion agent composition containing epoxy resin and polyamide resin.The thermotolerance of such adhesion agent composition and chemical proofing excellence.Adhesion agent composition of the present invention can be especially suitable for use as the tackiness agent particularly used in the temperature range of 200 ~ 270 DEG C.
Polyamide resin preferably has polyoxy alkane two base.Because of the effect of polyoxy alkane two base, the flexibility of adhesion agent composition and tackiness become good.
Polyamide resin preferably has the fragrant cyclic group of divalence.Due to the existence of the fragrant cyclic group of divalence, adhesion agent composition tackiness at high temperature becomes better.
Polyamide resin preferably has hydroxyl.Thus, the chemical proofing of adhesion agent composition becomes better.
Polyamide resin can have Isosorbide-5-Nitrae-piperazine two base.
Be explained, adhesion agent composition can provide to be formed as membranaceous membranaceous tackiness agent form.
The effect of invention
According to the present invention, can provide chemical proofing excellence, adhesion agent composition containing polyamide resin and employ the membranaceous tackiness agent of this adhesion agent composition.
Embodiment
The adhesion agent composition of present embodiment contains polyamide resin and epoxy resin.Be explained, in the present invention, " tackiness " refers to that the storage modulus (G ') recorded with 10 radian per seconds at the temperature of 20 DEG C ~ 22 DEG C is less than 3 × 10 5pascal's (Dahlquist benchmark).
(polyamide resin)
The main chain of polyamide resin has amide group, and the end of main chain has amino, carboxyl, carboxylic acid halide's structure or carboxylic anhydride structure.The end of main chain can for being derived from the group of the compound used in aftermentioned modification.Be explained, as carboxylic acid halide's structure, can enumerate the acyl halide group of such as-COCl ,-COBr and so on, carboxylic anhydride structure refers to the anhydride group generated by multiple carboxyl.
Polyamide resin preferably has the structural unit shown in following formula (1-1).
[chemical formula 1]
In above-mentioned formula (1-1), R 1and R 2represent the organic group of divalence.R 1be preferably from being selected from chain type fatty compounds, ring type fatty compounds (comprises ester ring type compound, endocyclic compound, spiro hydrocarbon.), the compound with phenyl ring (comprises fused polycyclic hydrocarbon and the benzene such as naphthalene, anthracene, tetracene, Bi, perylene.) and hetero ring type compound in compound remove the divalent organic group of 2 hydrogen atoms.
As R 2, be preferably from being selected from chain type fatty compounds, ring type fatty compounds (comprise ester ring type compound, endocyclic compound, the spiro hydrocarbons such as the compound with methylene dicyclohexyl.), the compound with phenyl ring (comprises fused polycyclic hydrocarbon and the benzene such as naphthalene, anthracene, tetracene, Bi, perylene.), hetero ring type compound, polyalkylene oxide (comprise polyethylene oxide, poly(propylene oxide).) and organopolysiloxane (comprise polydimethylsiloxane, PSI.) in compound or its halogenide (fluorochemical etc.) removing 2 hydrogen atoms divalent organic group.Be explained, above-mentioned conduct provides R 2compound and the compound with phenyl ring recorded comprises 2; two (4-Phenoxyphenyl) propane, 2 of 2-; two (4-Phenoxyphenyl) sulfone, 2 of 2-; two (4-Phenoxyphenyl) methane, 4 of 2-; 4 '-two aminophenoxy biphenyl, two (4-Phenoxyphenyl) ether, two (4-Phenoxyphenyl) ketone, 1; 3-phenoxy group benzene, 1; 4-phenoxy group benzene, 2; 2 '-dimethyl diphenyl, 5; 5 '-dimethyl-2,2 '-alkylsulfonyl-biphenyl, phenyl ether, sulfobenzide, benzophenone, ditan etc.
Polyamide resin preferably has polyoxy alkane two base.By making polyamide resin contain polyoxy alkane two base, the second-order transition temperature of adhesion agent composition reduces, and the laminating under the low temperature such as such as room temperature becomes easy, and tackiness is excellent.As polyoxy alkane two base, the group shown in following formula (2) can be enumerated.In formula, n represents the integer being more than or equal to 2, R 6represent alkane two base (alkanediyl).Here, multiple R of existence 6can mutually the same also can be different.
[chemical formula 2]
In above-mentioned formula (2), R 6can be that straight-chain also can for branched, preferred carbon number be alkane two base of 2 ~ 4, and more preferably carbon number is alkane two base of 2 ~ 3.As R 6, such as ethane-1,2-bis-base, propane-1,2-bis-base, propane-1,3-bis-base, butane-Isosorbide-5-Nitrae-two base can be enumerated.N is preferably 2 ~ 70, is more preferably 6 ~ 33.
As polyoxy alkane two base, more preferably by the group that the polyalkylene oxides such as polyethylene oxide, poly(propylene oxide), polybutylene oxide, polytetrahydrofuran, polyethylene oxide polypropylene oxide copolymers, polyoxyethylene glycol polytetramethylene glycol multipolymer, polypropylene glycol polytetramethylene glycol multipolymer, polyoxyethylene glycol polypropylene glycol polytetramethylene glycol multipolymer are derivative, more preferably polyoxyethylene, polyoxy propane-1,2-bis-base.
As the method importing polyoxy alkane two base in polyamide resin, the raw material with polyoxy alkane two base is used to be easy as at least one of raw material (polymerizable monomer).
Polyamide resin can be obtained by the polycondensation of monomer (A-1) such as shown in following formula (A-1) and the monomer (B-1) shown in following formula (B-1).The carboxyl of monomer (A-1) can be made to form acid chloride group and form polymeric amide, also can be manufactured by other method.Monomer (A-1) and monomer (B-1) individually can use one, also can combine two or more respectively and use.Be explained, the R in following formula (A-1) and (B-1) 1and R 2definition and preference described above.
[chemical formula 3]
HOOC-R 1-COOH (A-1)
[chemical formula 4]
H 2N-R 2-NH 2(B-1)
As monomer (A-1), alkylene dicarboxylic acid can be enumerated as oxalic acid, propanedioic acid, succsinic acid, pentanedioic acid, hexanodioic acid, pimelic acid, suberic acid, nonane diacid, sebacic acid, 1,9-nonane dicarboxylic acid, dodecanedioic acid, tetradecane diacid, pentadecane diacid, octadecane diacid etc.; Arylidene dicarboxylic acid is as phthalic acid, terephthalic acid, m-phthalic acid, Isosorbide-5-Nitrae-naphthalene dicarboxylic acids, 1,5-naphthalene dicarboxylic acids, 2,6-naphthalene dicarboxylic acids etc.; There is the dicarboxylic acid of hexanaphthene skeleton as 4-methylhexahydrophthaacid acid, 3-methylhexahydrophthaacid acid, 2-methylhexahydrophthaacid acid, 3-ethyl hexahydrophthalic acid, 2-ethyl hexahydrophthalic acid, methyl norbornane-2,3-dicarboxylic acid, methyl norbornane-3,4-dicarboxylic acid etc.; Deng.From the thermotolerance aspect improving adhesion agent composition, preferred arylidene dicarboxylic acid.
As monomer (B-1), aromatic diamine [4-(4-amino-benzene oxygen) phenyl] propane as two in 2,2-can be enumerated, two [4-(3-amino-benzene oxygen) phenyl] sulfone, two [4-(4-amino-benzene oxygen) phenyl] sulfone, two [4-(4-amino-benzene oxygen) phenyl] HFC-236fa of 2,2-, two [4-(4-amino-benzene oxygen) phenyl] methane, 4,4 '-bis-(4-amino-benzene oxygen) biphenyl, two [4-(4-amino-benzene oxygen) phenyl] ether, two [4-(4-amino-benzene oxygen) phenyl] ketone, two (4-amino-benzene oxygen) benzene of 1,3-, Isosorbide-5-Nitrae-bis-(4-amino-benzene oxygen) benzene, 2,2 '-dimethyl diphenyl-4,4 '-diamines, 2,2 '-bis-(trifluoromethyl) biphenyl-4,4 '-diamines, 5,5 '-dimethyl-2,2 '-alkylsulfonyl-biphenyl-4,4 '-diamines, (4,4 '-diamino) phenyl ether, (4,4 '-diamino) sulfobenzide, (4,4 '-diamino) benzophenone, (3,3 '-diamino) benzophenone, (4,4 '-diamino) ditan, (4,4 '-diamino) phenyl ether, (3,3 '-diamino) phenyl ether, N, N '-bis-(4-aminophenyl) piperazine etc., Alkylenediamine is as quadrol, propylene diamine etc., polyalkylene oxide diamines is as polyoxyethylene bis amine, Polypropylene oxide diamine etc., aliphatie diamine is as (4,4 '-diamino) dicyclohexyl methyl hydride, isophorone diamine, 1, the two aminopropylpiperazine of 4-, [two (1-the Aminoheptyl)-6-hexyl-5-(1-octenyl) of 3,4-] tetrahydrobenzene, two amino methyl norbornylenes etc., siloxane diamine is as PDMS etc., Deng.
Polyamide resin preferably has polyoxy alkane two base, there is polyoxy alkane two base in the structure from monomer (B-1) more preferably in structural unit.That is, at least one in preferred monomers (A-1) and (B-1) has polyoxy alkane two base, and at least one more preferably in monomer (B-1) has polyoxy alkane two base.
Therefore, polyamide resin preferably has: make to comprise the polymerizable monomer polycondensation and the structural unit obtained with polyoxy alkane two base and at least 2 amino monomers (monomer (b-1)).
The content of the monomer (b-1) in polymerizable monomer is preferably 5 ~ 20mol% relative to the total amount of monomer (B-1), is more preferably 7 ~ 15mol%, and then is preferably 8 ~ 10mol%.Have and make such polymerizable monomer polycondensation and the adhesion agent composition of the structural unit obtained has the tendency more excellent with the adaptation of clung body.
As monomer (b-1), polyalkylene oxide polyamines can be enumerated.As polyalkylene oxide polyamines, preferred polyalkylene oxide diamines or polyalkylene oxide triamine, as such amine, can preferably use: Polypropylene oxide diamine is as JEFFAMINE D-230 (HUNTSMAN, trade(brand)name), JEFFAMINE D-400 (HUNTSMAN, trade(brand)name), JEFFAMINE D-2000 (HUNTSMAN, trade(brand)name), JEFFAMINE D-4000 (HUNTSMAN, trade(brand)name) etc.; The multipolymer diamines of poly(propylene oxide) and polyethylene oxide is as JEFFAMINE ED-600 (HUNTSMAN, trade(brand)name), JEFFAMINEED-900 (HUNTSMAN, trade(brand)name) etc.; Polyoxyethylene bis amine is as JEFFAMINE EDR-148 (HUNTSMAN, trade(brand)name), JEFFAMINE EDR-176 (HUNTSMAN, trade(brand)name) etc.; Polyamines (polyoxypropylene Witepsol W-S 55 triamine) is as JEFFAMINE T-403 (HUNTSMAN, trade(brand)name), JEFFAMINE T-3000 (HUNTSMAN, trade(brand)name), JEFFAMINE T-5000 (HUNTSMAN, trade(brand)name) etc.; Deng.These may be used singly or in combination of two or more.
Polyamide resin preferably has ester ring type structure in addition.There is the adhesion agent composition of such structure for absorptive composition can be suppressed.As ester ring type structure, cyclohexyl, dicyclohexyl, methylene dicyclohexyl, isophorone base, cyclohexyldimethyl can be enumerated.
As the monomer with such ester ring type structure, can 1 be exemplified as monomer (A-1), 4-dicarboxyl hexanaphthene, two (amino methyl) hexanaphthene of two (4-aminocyclohexyl) methane, isophorone diamine and 1,3-can be exemplified as monomer (B-1).These may be used singly or in combination of two or more.
In addition, polyamide resin preferably has methylene dicyclohexyl in structural unit, there is methylene dicyclohexyl in the structure from monomer (B-1) more preferably in structural unit.That is, at least one in preferred monomers (A-1) and (B-1) has methylene dicyclohexyl, and at least one more preferably in monomer (B-1) has methylene dicyclohexyl.
That is, polyamide resin preferably has: make to comprise the polymerizable monomer polycondensation and the structural unit obtained with methylene bis cyclohexyl and at least 2 amino monomers (monomer (b-2)).
The content of the monomer (b-2) in polymerizable monomer is preferably 4 ~ 28.5mol% relative to the total amount of monomer (B-1), is more preferably 8 ~ 28.5mol%, and then is preferably 8 ~ 20mol%.Have and make such polymerizable monomer polycondensation and the adhesion agent composition of the structural unit obtained can suppress water-intake rate, storage stability is more excellent.
As monomer (b-2), two (4-aminocyclohexyl) methane suitably can be used.
The structure from monomer (B-1) in polyamide resin preferred structure unit has piperazine two base, more preferably has piperazine-N, N '-dipropyl.
That is, polyamide resin preferably has: make to comprise and have piperazine-N, the polymerizable monomer polycondensation of N '-dipropyl and at least 2 amino monomers (monomer (b-3)) and the structural unit obtained.
The content of the monomer (b-3) in polymerizable monomer is not particularly limited, and can use using the residual after using monomer (b-1) and (b-2) as maximum.Making such polymerizable monomer polycondensation and the polyamide resin of the structural unit obtained according to having, the adhesion agent composition of thermotolerance and adhesive balance excellence can be obtained.
As monomer (b-3), Isosorbide-5-Nitrae-bis-(3-aminopropyl) piperazine suitably can be used.
It is suitable that polyamide resin has hydroxyl, has phenolic hydroxyl group more suitable.By making polyamide resin have hydroxyl, chemical proofing improves further.As the method importing hydroxyl in polyamide resin, the raw material with hydroxyl is used to be suitable as at least one of polymerizable monomer.As the raw material with hydroxyl, such as Hydroxy M Phthalic Acid can be enumerated.
Polyamide resin such as can obtain by comprising the polycondensation of the polymerizable monomer of monomer (A-1) and monomer (B-1).In addition, monomer (A-1) can also be substituted and use its carboxylate, etheride etc.As polymerizable monomer, other monomers such as vulcabond (monomer (C-1)) can also be contained.
The method of polycondensation is not particularly limited, such as, can adopts and polymerizable monomer is dissolved in a solvent, make it carry out the method for reacting at temperature of reaction 0 ~ 200 DEG C, reaction times 1 ~ 10 hours.
As the solvent used in polycondensation, N-Methyl pyrrolidone, N-ethyl pyrrolidone, N methyl succinimide, dimethyl furan, toluene, N can be enumerated, N '-dimethyl ethanamide, hexa-methylene sulphonamide, dimethyl sulfoxide (DMSO) etc.Among these, from the deliquescent viewpoint of resin, preferred N-Methyl pyrrolidone.
In addition, in polycondensation, in order to promote condensation reaction, the accelerators such as catalyzer can be used.The addition of accelerator is preferably 0.1 ~ 50mol equivalent relative to polymerizable monomer 10mol equivalent.As accelerator, inorganic salt can be enumerated as lithium chloride, calcium chloride, calcium thiocyanide etc.; Tertiary amine is as triethylamine, pyridine etc.; Quaternary ammonium salt is as tetramethyl ammonium chloride, tetraethylammonium bromide, tetra-n-butyl ammonium bromide etc.; Deng.
Polyamide resin can also be the resin (modified polyamide resin) further for the polymkeric substance obtained by polycondensation modification obtained, as modified polyamide resin, olefin-modified polymeric amide, alkoxysilane-modified polymeric amide, silicone-modified polyimide, epoxide-modifying polyamide, polycarbonate modified polymeric amide, isocyanate-modified polymeric amide etc. can be enumerated.
(epoxy resin)
As the epoxy resin of compound with epoxy group(ing), from the view point of being efficiently cross-linked, preferably there is the epoxy resin being more than or equal to 2 epoxy group(ing).As concrete example, bisphenol A type epoxy resin can be exemplified, biphenyl type epoxy resin, naphthalene type epoxy resin, bisphenol f type epoxy resin, phosphorous epoxy resin, bisphenol-s epoxy resin, alicyclic epoxy resin, aliphatics chain epoxy resin, phenol novolak type epoxy resin, cresol novolak type epoxy resin, bisphenol A novolac type epoxy resin, the 2-glycidyl etherate of bis-phenol, the 2-glycidyl etherate of dihydroxy naphthlene, the 2-glycidyl etherate of phenols, the 2-glycidyl etherate of alcohols, and their alkyl substituents, halogenide, hydrogenation thing etc.These epoxy resin may be used singly or in combination of two or more.
Epoxy resin can also contain epoxy hardener.As epoxy hardener, phenolic epoxy hardener, cresols type epoxy hardener, ester type epoxy hardener etc. can be enumerated.
As the curing catalyst of epoxy resin, imidazoles can be added.As imidazoles, imidazoles can be enumerated, glyoxal ethyline, 2-undecyl imidazole, 1, 2-methylimidazole, 2-ethyl-4-imidazoles, 2-phenylimidazole, 2-phenyl-4-methylimidazole, 1-benzyl-2-phenylimidazole, 1 benzyl 2 methyl imidazole, 1-cyanoethyl-2-phenylimidazole, 1-cyanoethyl-2-ethyl-4-methylimidazole, 1-cyanoethyl-2-phenylimidazole, 2-benzylimidazoline, naphtho-imidazoles, pyrazoles, triazole, tetrazolium, indazole, pyridine, pyrazine, pyridazine, pyrimidine, benzotriazole, 1-1-cyanoethyl-2-methylimidazole, 1-cyanoethyl-2-ethyl-4-methylimidazole, 1-cyanoethyl-2-undecyl imidazole, 1-cyanoethyl-2-phenylimidazole, trimellitic acid 1-cyanoethyl-2-undecyl imidazole salt, trimellitic acid 1-cyanoethyl-2-phenylimidazole salt etc.
About in adhesion agent composition, epoxy resin is relative to the addition of polyamide resin, 0.01 ~ 50 quality % is preferably relative to the solids component amount of adhesion agent composition, be more preferably 0.1 ~ 30 quality %, and then be preferably 0.5 ~ 20 quality %, be particularly preferably 1 ~ 15 quality %.When within the scope of this, sufficient chemical proofing can be maintained, and also improve as the function of tackiness agent.
Epoxy resin in adhesion agent composition and the total content of polyamide resin are preferably 40 ~ 100 quality % relative to adhesion agent composition total amount, be preferably 80 ~ 100 quality %, be more preferably 100 quality %, be namely more preferably made up of epoxy resin and polyamide resin.
From the view point of raising adaptation, adhesion agent composition can contain the adhesion imparting agents etc. such as Gum Rosin, terpine resin, tonka bean camphor resin, resol, styrene resin, aliphatics through-stone oleo-resinous, aromatic series through-stone oleo-resinous, aliphatic aromatic copolymerization through-stone oleo-resinous in the scope not damaging goal of the invention.
In addition, adhesion agent composition can also containing organic and/or inorganic materials as alloy particle, glass particle, clay particles etc.; Organic materials is as polymer particle etc.More specifically, as alloy particle, tin alloy can be enumerated, lead alloy, indium alloy, zinc alloy, au-alloy etc., as glass, plumbous system can be enumerated, phosphate-based, boric acid system, vanadate system, tellurite system, fluoridize system glass etc., as clay, stevensite can be enumerated, polynite, kaolin, illite, terre verte, chlorite, vermiculite etc., as polymer particle, polyethylene terephthalate can be enumerated, polyacrylonitrile, fluoro-resin (PTFE), epoxy resin, nylon, polyimide, polyamidoimide, PEN etc.
Adhesion agent composition is not preferably containing curing catalysts such as amine, carboxylic acid, acid anhydrides, superoxide, when containing curing catalysts, its content is preferably less than or equal to 1 quality % relative to the solids component amount of adhesion agent composition, is more preferably and is less than or equal to 0.5 quality %.
Adhesion agent composition can provide with film shape.That is, the membranaceous tackiness agent containing above-mentioned adhesion agent composition can be provided.Membranaceous tackiness agent can be made up of the adhesion agent composition layer of single or multiple lift, or for being formed with the structure of the adhesion agent composition layer of single or multiple lift in the one or two sides of supporter.The example of the manufacture method of membranaceous tackiness agent is as follows.
Such as, can the adhesion agent composition varnish of adhesion agent composition be comprised by coating in the one side of supporter and make it dry and make membranaceous tackiness agent.
In addition, can by being coated with adhesion agent composition varnish and the two sides making it dry and be produced on supporter has the membranaceous tackiness agent of adhesion agent composition layer on the two sides of supporter.
And then, adhesion agent composition varnish can also to be coated on the films such as mold release film and to make it dry, the adhesion agent composition formed thus is pressed layer by layer, being transferred on supporter and making membranaceous tackiness agent.
The making method based on teeming practice so easily obtains smooth adhesion agent composition layer, is therefore suitable.
The thickness of adhesion agent composition layer is preferably 0.1 ~ 100 μm, is more preferably 1 ~ 50 μm.The thickness of adhesion agent composition layer suitably can adjust according to the glue spread of the concentration of the adhesion agent composition in adhesion agent composition varnish and adhesion agent composition varnish.
The solvent used in adhesion agent composition varnish being not particularly limited, from making adhesion agent composition show good solubility aspect, preferably using glycol series solvent, glycol ethers series solvent, diol ester series solvent etc.
Specifically, ethylene glycol, Diethylene Glycol, triethylene glycol, propylene glycol, ethylene glycol, Diethylene Glycol, triethylene glycol, propylene glycol, diethylene glycol monomethyl ether, triethylene glycol monomethyl ether, propylene glycol monomethyl ether, MMB, ethylene glycol monomethyl ether acetate, PMA (propylene glycol methyl ether acetate), butyl carbitol acetate, diethylene glycol monoethyl ether acetic ester etc. can be enumerated.In addition, N-Methyl pyrrolidone, N-ethyl pyrrolidone, N methyl succinimide, N can also be used, N '-dimethyl ethanamide, dimethyl formamide etc.These solvents can be used alone or two or more mixing used.
Supporter is not particularly limited, preferred use has the material of thermotolerance to the temperature being more than or equal to 200 DEG C, can enumerate the material comprising the organic materialss such as polyester, polyimide, polymeric amide, polyethersulfone, polyphenylene sulfide, polyetherketone, polyether-ether-ketone, cellulosetri-acetate, polyetherimide, PEN, polypropylene, acrylic acid or the like, polystyrene, polycarbonate.In addition, the supporter comprising inorganic materials can also be used, the supporter comprising the inorganic materials such as aluminium, magnesium, titanium, chromium, manganese, iron, nickel, zinc, tin, glass, silicon wafer, alloy can be used.
The adhesion agent composition of present embodiment can at room temperature be fitted, even if also have sufficient cementability at 200 ~ 270 DEG C.The clinging power of the adhesion agent composition of present embodiment is preferably 0.1 ~ 8.0N/cm, is more preferably 0.3 ~ 5.0N/cm, and then is preferably 0.5 ~ 2.0N/cm.
As the preferred clung body that adhesion agent composition can be bonding, be preferably the material temperature being more than or equal to 200 DEG C to thermotolerance.As clung body more specifically, be not particularly limited as long as object of the present invention can be realized, can enumerate such as polyamide resin nylon as 6, nylon66 fiber, nylon 46 etc.; Vibrin is as polyethylene terephthalate, PEN, Polytrimethylene terephthalate, poly-naphthalic acid Sanya methyl esters, poly terephthalic acid Aden ester, poly-naphthalic acid Aden ester etc.; Polyolefin resin is as polypropylene, polyethylene etc.; Acrylic resin, polyimide resin, polyethersulfone resin, polyphenylene sulfide, polyether ketone resin, polyether-ether-ketone resin, cellulosetri-acetate resin, polyetherimide resin, polycarbonate resin, polyarylate resin or these hybrid resin, aluminium, magnesium, titanium, chromium, manganese, iron, nickel, zinc, tin, glass, copper, silicon wafer and alloy.In these materials, vibrin, polyamide resin, polyolefin resin, polyimide resin, acrylic resin, aluminium, magnesium, titanium, chromium, manganese, iron, nickel, zinc, tin, glass, copper and silicon wafer are more preferred due to display high heat resistance.
Embodiment (synthesis example 1)
Having stirrer, reflux exchanger, temperature take into account in the removable flask of nitrogen ingress pipe, make m-phthaloyl chloride 529.3g, p-phthaloyl chloride 75.7g, polypropylene glycol diamine (JEFFAMINE (registered trademark) D-2000, HUNTSMAN Inc.) 447.2g, Isosorbide-5-Nitrae-bis-(3-aminopropyl) piperazine 462.8g and methylenecyclohexyl diamines (WONDAMINE HM (registered trademark), new Japan Chemical Inc.) 93.9g in N-Methyl pyrrolidone 7609g 1 hour under ice-cooling, within 2 hours, carry out polycondensation under room temperature.After reaction terminates, in reaction mixture, add the water of 3 times amount, be separated insoluble composition and drying, thus acquisition weight-average molecular weight is the polyamide resin of 45000.
(synthesis example 2)
There is stirrer, reflux exchanger, temperature is taken into account in the removable flask of nitrogen ingress pipe, make isophthaloyl acid 55.7g, terephthalic acid 41.8g, 5-Hydroxy M Phthalic Acid 15.3g, polypropylene glycol diamine (JEFFAMINE (registered trademark) D-2000, HUNTSMAN Inc., the number of repeat unit of polypropylene glycol: 33) 122.0g, 1, two (3-aminopropyl) the piperazine 97.7g of 4-, two (4-aminocyclohexyl) methane (WONDAMINE HM (registered trademark), new Japan Chemical Inc.) 12.8g and iron powder 0.37g carries out polycondensation in 10 hours in the watersides of 200 DEG C of following removing by-products in N-Methyl pyrrolidone 650g.Cool after reaction terminates, add Diphenylmethane diisocyanate 30.5g, react 3 hours at 160 DEG C, thus obtain the nmp solution that weight-average molecular weight is the polyamide resin of 40000.
(embodiment 1)
The polyamide resin 20g of synthesis example 1 and epoxy resin (Japanese chemical drug system, trade(brand)name: NC-3000H) 0.5g is dissolved in N,N-DIMETHYLACETAMIDE 32g, obtains resinous varnish.
Use the resinous varnish obtained, varnish is coated on demoulding PET (polyethylene terephthalate) film by mode bar coater equably that be 20 μm according to dried resin thickness, with hot air dryer at 160 DEG C dry 30 minutes, form membranaceous tackiness agent.
(embodiment 2)
The polyamide resin 20g of synthesis example 1 and epoxy resin (Japanese chemical drug system, trade(brand)name: NC-3000H) 1.0g is dissolved in N,N-DIMETHYLACETAMIDE 32g, obtains resinous varnish.
Use the resinous varnish obtained, varnish is coated in demoulding PET film by mode bar coater equably that be 20 μm according to dried resin thickness, with hot air dryer at 160 DEG C dry 30 minutes, forms membranaceous tackiness agent.
(embodiment 3)
The polyamide resin 20g of synthesis example 1 and epoxy resin (Japanese chemical drug system, trade(brand)name: NC-3000H) 2.0g is dissolved in N,N-DIMETHYLACETAMIDE 32g, obtains resinous varnish.
Use the resinous varnish obtained, varnish is coated in demoulding PET film by mode bar coater equably that be 20 μm according to dried resin thickness, with hot air dryer at 160 DEG C dry 30 minutes, forms membranaceous tackiness agent.
(embodiment 4)
Dissolved epoxy (Japanese chemical drug system, trade(brand)name: NC-3000H) 0.5g in the nmp solution of polyamide resin 20g comprising synthesis example 2, obtains resinous varnish.
Use the resinous varnish obtained, varnish is coated in demoulding PET film by mode bar coater equably that be 20 μm according to dried resin thickness, with hot air dryer at 160 DEG C dry 30 minutes, forms membranaceous tackiness agent.
(embodiment 5)
Dissolved epoxy (Japanese chemical drug system, trade(brand)name: NC-3000H) 1.0g in the nmp solution of polyamide resin 20g comprising synthesis example 2, obtains resinous varnish.
Use the resinous varnish obtained, varnish is coated in demoulding PET film by mode bar coater equably that be 20 μm according to dried resin thickness, with hot air dryer at 160 DEG C dry 30 minutes, forms membranaceous tackiness agent.
(embodiment 6)
Dissolved epoxy (Japanese chemical drug system, trade(brand)name: NC-3000H) 2.0g in the nmp solution of polyamide resin 20g comprising synthesis example 2, obtains resinous varnish.
Use the resinous varnish obtained, varnish is coated in demoulding PET film by mode bar coater equably that be 20 μm according to dried resin thickness, with hot air dryer at 160 DEG C dry 30 minutes, forms membranaceous tackiness agent.
(embodiment 7)
Dissolved epoxy (aurification length of schooling, trade(brand)name are lived by Nippon Steel: YDF-8170C) 1.0g in the nmp solution of polyamide resin 20g comprising synthesis example 2, obtains resinous varnish.
Use the resinous varnish obtained, varnish is coated in demoulding PET film by mode bar coater equably that be 20 μm according to dried resin thickness, with hot air dryer at 160 DEG C dry 30 minutes, forms membranaceous tackiness agent.
(comparative example 1)
The polyamide resin 20g of synthesis example 1 is dissolved in N,N-DIMETHYLACETAMIDE 32g, obtains resinous varnish.
Use the resinous varnish obtained, varnish is coated in demoulding PET film by mode bar coater equably that be 20 μm according to dried resin thickness, with hot air dryer at 160 DEG C dry 30 minutes, forms membranaceous tackiness agent.
(comparative example 2)
Use the resinous varnish of synthesis example 2, varnish is coated in demoulding PET film by mode bar coater equably that be 20 μm according to dried resin thickness, with hot air dryer at 160 DEG C dry 30 minutes, forms membranaceous tackiness agent.
Following evaluation is carried out to the membranaceous tackiness agent obtained in embodiment 1 ~ 7 and comparative example 1,2.The results are shown in table 1.
[evaluation chemical proofing]
Use the membranaceous tackiness agent made in embodiment 1 ~ 7 and comparative example 1,2 respectively, in glass phial, add film (2cm is square) and the solvent shown in table 1 (10mL), stir 8 hours at 25 DEG C with stirring rotator (mixer rotor).Taken out by film after solubility test, the residual film ratio according to the quality criteria of drying after 30 minutes at 160 DEG C evaluates chemical proofing.
[clinging power evaluation]
The membranaceous tackiness agent made in embodiment 1 ~ 7 and comparative example 1,2 is clipped between polyimide film (Dong Li E.I.Du Pont Company system, trade(brand)name: Kapton EN, thickness: 25 μm) and glass (NEG system, trade(brand)name: OA-10G) respectively, crimp with hand-held roller, the clinging power of heating after 30 minutes at 200 DEG C is measured.Specifically, one end of membranaceous tackiness agent is fixed on the stretching clamp of stretching tester after sheet glass is peeled off.By sheet glass by being pressed on platform, it being peeled off from sheet glass by membranaceous tackiness agent pull-up, carries out 90 ° of stripping tests.The clinging power of membranaceous tackiness agent is measured by this mensuration.
[Evaluation of Heat Tolerance]
For the structure made in clinging power evaluation, 250 DEG C will be heated to from room temperature and keep the operation of placing cool to room temperature after 30 minutes to repeat 3 times at such a temperature, and all carry out visual inspection at every turn and measure clinging power, evaluating thermotolerance thus.As the heat-resisting clinging power of Evaluation of Heat Tolerance project, the percentage of the value obtained divided by the clinging power after the 1st operation with the clinging power after clinging power velocity of variation, namely the 3rd time operation represents.
[table 1]
NMP:N-methyl-2-pyrrolidone
THF: tetrahydrofuran (THF)
The TMAH:2.38% tetramethyl ammonium hydroxide aqueous solution
Be explained, in table, " albefaction " refer to due to by solvent treatment thus film bleach.
By polyamide resin and epoxy resin to specify the membranaceous tackiness agent of the embodiment 1 ~ 7 of ratio combination, demonstrate and maintain thermotolerance and can chemical proofing be improved.In addition known, employ the membranaceous tackiness agent of the embodiment 4 ~ 7 of the polyamide resin with hydroxyl, chemical proofing improves further.In addition, from the measurement result of clinging power, the membranaceous tackiness agent of embodiment 1 ~ 7 all can be peeled off.

Claims (6)

1. an adhesion agent composition, it contains epoxy resin and polyamide resin.
2. adhesion agent composition according to claim 1, wherein, described polyamide resin has polyoxy alkane two base.
3. adhesion agent composition according to claim 1 and 2, wherein, described polyamide resin has the fragrant cyclic group of divalence.
4. the adhesion agent composition according to any one of claims 1 to 3, wherein, described polyamide resin has Isosorbide-5-Nitrae-piperazine two base.
5. the adhesion agent composition according to any one of Claims 1 to 4, wherein, described polyamide resin has hydroxyl.
6. a membranaceous tackiness agent, it is for being formed as membranaceous by the adhesion agent composition according to any one of Claims 1 to 5.
CN201380053352.7A 2012-10-11 2013-10-11 Adhesive composition and film-shaped adhesive Pending CN104718265A (en)

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