CN104704072A - Adhesive composition, laminate body, and delamination method - Google Patents

Adhesive composition, laminate body, and delamination method Download PDF

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Publication number
CN104704072A
CN104704072A CN201380053010.5A CN201380053010A CN104704072A CN 104704072 A CN104704072 A CN 104704072A CN 201380053010 A CN201380053010 A CN 201380053010A CN 104704072 A CN104704072 A CN 104704072A
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China
Prior art keywords
adhesion agent
agent composition
based polymer
compound
resin
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Chinese (zh)
Inventor
增田克之
江尻贵子
品田咏逸
鲤渕滋
山口正利
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Showa Denko Materials Co ltd
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Hitachi Chemical Co Ltd
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Publication of CN104704072A publication Critical patent/CN104704072A/en
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/34—Layered products comprising a layer of synthetic resin comprising polyamides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/38—Layered products comprising a layer of synthetic resin comprising epoxy resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/42—Layered products comprising a layer of synthetic resin comprising condensation resins of aldehydes, e.g. with phenols, ureas or melamines
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/04—Interconnection of layers
    • B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/02—Polycondensates containing more than one epoxy group per molecule
    • C08G59/04—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof
    • C08G59/06—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols
    • C08G59/08—Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols from phenol-aldehyde condensates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/44—Amides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G69/00—Macromolecular compounds obtained by reactions forming a carboxylic amide link in the main chain of the macromolecule
    • C08G69/02—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids
    • C08G69/26—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids derived from polyamines and polycarboxylic acids
    • C08G69/265—Polyamides derived from amino-carboxylic acids or from polyamines and polycarboxylic acids derived from polyamines and polycarboxylic acids from at least two different diamines or at least two different dicarboxylic acids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G69/00—Macromolecular compounds obtained by reactions forming a carboxylic amide link in the main chain of the macromolecule
    • C08G69/40—Polyamides containing oxygen in the form of ether groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/0622—Polycondensates containing six-membered rings, not condensed with other rings, with nitrogen atoms as the only ring hetero atoms
    • C08G73/0633—Polycondensates containing six-membered rings, not condensed with other rings, with nitrogen atoms as the only ring hetero atoms with only two nitrogen atoms in the ring
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/14—Polyamide-imides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L67/00—Compositions of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Compositions of derivatives of such polymers
    • C08L67/06—Unsaturated polyesters
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C09J163/04—Epoxynovolacs
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J177/00—Adhesives based on polyamides obtained by reactions forming a carboxylic amide link in the main chain; Adhesives based on derivatives of such polymers
    • C09J177/06—Polyamides derived from polyamines and polycarboxylic acids
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J179/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09J161/00 - C09J177/00
    • C09J179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J179/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09J161/00 - C09J177/00
    • C09J179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • C09J179/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • C09J201/02—Adhesives based on unspecified macromolecular compounds characterised by the presence of specified groups, e.g. terminal or pendant functional groups
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/70—Other properties
    • B32B2307/748—Releasability
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2405/00—Adhesive articles, e.g. adhesive tapes

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Health & Medical Sciences (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
  • Laminated Bodies (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)

Abstract

This adhesive composition contains: a condensed polymer; and a reactive compound that forms a graft or cross-links by reacting with a functional group of the condensed polymer and/or a polymerizable compound that is polymerized and generates a mixture with the condensed polymer.

Description

Adhesion agent composition, duplexer and stripping means
Technical field
The present invention relates to adhesion agent composition, duplexer and stripping means.
Background technology
Tackiness agent is widely used in and adherend is attached fixing purposes, but sometimes needs the adherend attached to peel off.For example, Patent Document 1 discloses reduced stripping film by the expansion of swelling property particulate or the air release of foaminess particulate relative to the peeling force of adhering agent layer to carry out the adhesive sheet peeled off.
Prior art document
Patent documentation
Patent documentation 1: Japanese Unexamined Patent Publication 2007-254580 publication
Summary of the invention
The problem that invention will solve
For the adhesive sheet of patent documentation 1, there is restriction in the expansion temperature of swelling property particulate or foaminess particulate or blowing temperature, sometimes cannot be used for 200 ~ 270 DEG C.Therefore, the object of the present invention is to provide a kind of adhesion agent composition, it can be attached at adherend when room temperature, even if also have sufficient cementability at 200 ~ 270 DEG C, can easily peel off as required.The present invention also aims to provide a kind of duplexer and the stripping means that use this adhesion agent composition.
The method of dealing with problems
The invention provides a kind of adhesion agent composition, comprise condensation based polymer, and with the functional group reactions of condensation based polymer and form the reactive compounds of crosslinked or grafting and/or carry out polymer quantification and form the polymerizable compound of mixture with aforementioned condensation based polymer.
Such adhesion agent composition can be adhered to adherend when room temperature, even if also can maintain its cementability at 200 ~ 270 DEG C.In addition, quantize based on the formation of crosslinked or grafting or polymer, cementability is fully reduced, thus can peel off.Here, the formation of crosslinked or grafting, polymer quantize the irradiation preferably by heating or active ray and occur.Be explained, compound that can be identical plays reactive compounds and the function both polymerizable compound.That is, crosslinked or grafting and polymer quantize to occur simultaneously.
Condensation based polymer is good with polymeric amide, polyimide or polyamidoimide.In addition, the functional group of reacting with reactive compounds is with at least one main chain functional group selected in the group formed from amido linkage, imide bond and amido acid structure, or at least one functional end-group selected from the group of carboxyl, amino, carboxylic acid halide's structure and carboxylic anhydride structure's composition is good.Here, end also comprises side chain except two ends of molecule.
Condensation based polymer preferably has polyoxy alkane two base.By polyoxy alkane two base, flexibility and tackiness become good.Condensation based polymer is good to have the fragrant cyclic group of divalence, and by there is the fragrant cyclic group of divalence, tackiness during high temperature becomes better.In addition, condensation based polymer can have Isosorbide-5-Nitrae-piperazine two base.
As reactive compounds, the combination of isocyanate compound, masked isocyanate compound, epoxy resin or epoxy resin and its solidifying agent can be used.By such reactive compounds, easily tackiness can be reduced in specified temperature.
Reactive compounds can be multifunctional reactive compounds.By for multifunctional, easily can import crosslinking structure, thus easily under desired conditions, tackiness be reduced.
Polymerizable compound preferably includes at least one heat-curable compounds selected from the group of epoxy resin, cresol resin, melamine resin, urea-formaldehyde resin, unsaturated polyester resin, urethane resin, cyanate ester resin, isocyanate compound and masked isocyanate compound composition, and/or produce at least one in free radical, positively charged ion and negatively charged ion by active ray thus the compound of auto-polymerization or crosslinking reaction occurs, or produce functional group by active ray thus the compound of curing reaction occurs.During applied heat thermoset compounds, can be used together its solidifying agent, when being suitable for photocurable compound, can be used together light trigger or sensitizing agent.
In such adhesion agent composition, quantized by the formation of crosslinked or grafting and/or polymer, can tackiness be reduced.
The Applicable temperature of adhesion agent composition within the scope of 200 ~ 270 DEG C can use as tackiness agent, is exceeding the temperature of Applicable temperature, and formation and/or polymer that crosslinked or grafting occurs quantize, and tackiness can be made thus to reduce.
In addition, the Applicable temperature of adhesion agent composition within the scope of 200 ~ 270 DEG C can use as tackiness agent, by carrying out the irradiation of active ray (ultraviolet etc.), the formation and/or the polymer that make to occur crosslinked or grafting quantize, and tackiness can be made thus to reduce.
Adhesion agent composition of the present invention may be used for the layer of the adhesion agent composition formed on supporter, can provide as the duplexer of the layer being provided with adhesion agent composition on supporter.
In addition, the invention provides the application of a kind of composition as tackiness agent, said composition comprises: condensation based polymer, and with the functional group reactions of condensation based polymer and form the reactive compounds of crosslinked or grafting and/or carry out polymer quantification and form the polymerizable compound of mixture with condensation based polymer.In this case, tackiness agent can make irradiation by heating and/or active ray and tackiness agent that clinging power is reduced.
Further, the invention provides a kind of stripping means of the conjugant formed by the joint adherend of the layer containing adhesion agent composition in above-mentioned adhesion agent composition or above-mentioned duplexer, by to heat adhesion agent composition or active ray irradiates and makes clinging power reduce, thus by the stripping at least partially of bonding part.Wherein, irradiating about heating or active ray, when engaging adherend by adhesion agent composition, this adhesion agent composition being carried out, when engaging adherend by the layer containing adhesion agent composition, the adhesion agent composition in this layer being carried out or layer entirety is carried out.
Invention effect
By the present invention, provide a kind of adhesion agent composition, it can be attached at adherend when room temperature, even if also have sufficient cementability at 200 ~ 270 DEG C, and can easily peel off as required.In addition, the duplexer using this adhesion agent composition and stripping means is also provided.
Embodiment
Adhesion agent composition of the present invention contains condensation based polymer, and with the functional group reactions of condensation based polymer and form the reactive compounds of crosslinked or grafting and/or carry out polymer quantification and form the polymerizable compound of mixture with condensation based polymer.Wherein, in the present invention, " tackiness " refers to that the storage modulus (G ') measured with 10 radian per seconds the temperature of 20 DEG C ~ 22 DEG C is less than 3 × 10 5handkerchief (reaching Kui benchmark (Dahlquistcriterion)).Adhesion agent composition of the present invention plays sufficient cementability at 200 ~ 270 DEG C, and this sufficient cementability such as refers to that the bonding force measured in 90 ° of stripping tests described later is more than or equal to 0.1N/cm.
As the 1st mode of condensation based polymer, polymeric amide can be enumerated.This polymeric amide has amide group on main chain, and the end of main chain has amino, carboxyl, carboxylic acid halide's structure or carboxylic anhydride structure.As carboxylic acid halide's structure, include, for example the acid halide group that-COCl ,-COBr are such, carboxylic anhydride structure refers to the anhydride group generated by multiple carboxyl.Polymeric amide preferably has the structural unit shown in following formula (1-1).
[changing 1]
In above-mentioned formula (1-1), R 1and R 2represent divalent organic group.R 1be preferably and (comprise ester ring type compound, crosslinked ring type compound, spiro hydrocarbon from being selected from by chain type fatty compounds, ring type fatty compounds.), the compound with phenyl ring (comprises condensation polycyclic formula hydrocarbon and the benzene such as naphthalene, anthracene, naphthacene, Bi, perylene.) and hetero ring type compound composition group compound in remove 2 hydrogen atoms and the divalent organic group that obtains.
As R 2, preferably (comprise the ester ring type compounds such as the compound possessing methylene biscyclohexyl, crosslinked ring type compound, spiro hydrocarbon from being selected from by chain type fatty compounds, ring type fatty compounds.), the compound with phenyl ring (comprises condensation polycyclic formula hydrocarbon and the benzene such as naphthalene, anthracene, naphthacene, Bi, perylene.), hetero ring type compound, polyalkylene oxide (comprise polyethylene oxide, poly(propylene oxide).) and organopolysiloxane (comprise polydimethylsiloxane, PSI.) remove 2 hydrogen atoms and the divalent organic group obtained in the compound of group that forms or its halogenide (fluorochemical etc.).Wherein, as providing R 2compound; have in the compound of phenyl ring above-mentioned; comprise 2; two (4-Phenoxyphenyl) propane, 2 of 2-; two (4-Phenoxyphenyl) sulfone, 2 of 2-; two (4-Phenoxyphenyl) methane, 4 of 2-; 4 '-two aminophenoxy biphenyl, two (4-Phenoxyphenyl) ether, two (4-Phenoxyphenyl) ketone, 1; 3-phenoxy group benzene, 1; 4-phenoxy group benzene, 2; 2 '-dimethyl diphenyl, 5,5 '-dimethyl-2,2 '-alkylsulfonyl-biphenyl, phenyl ether, sulfobenzide, benzophenone, ditane etc.
As the 2nd mode of condensation based polymer, polyimide can be enumerated.This polyimide has imide on main chain, and the end of main chain has amino, carboxyl, carboxylic acid halide's structure or carboxylic anhydride structure.Polyimide preferably has the structural unit shown in following formula (1-2).
[changing 2]
In above-mentioned formula (1-2), R 2represent the organic group of divalence, R 3represent the organic group of tetravalence.As R 2preferred group is same with the situation of above-mentioned formula (1-1).R 3be preferably and (comprise ester ring type compound, crosslinked ring type compound, spiro hydrocarbon from being selected from by chain type fatty compounds, ring type fatty compounds.), the compound with phenyl ring (comprises condensation polycyclic formula hydrocarbon and the benzene such as naphthalene, anthracene, naphthacene, Bi, perylene.) and hetero ring type compound composition group compound in remove 4 hydrogen atoms and the quadrivalent organic radical group that obtains.
As the 3rd mode of condensation based polymer, polyamidoimide can be enumerated.This polyamidoimide has amide group and imide on main chain, and the end of main chain has amino, carboxyl, carboxylic acid halide's structure or carboxylic anhydride structure.Polyamidoimide preferably has following formula (1-3) or the structural unit shown in (1-4), can the part of polyamidoimide has the structure of (1-3), a part has the structure of (1-4).
[changing 3]
In above-mentioned formula (1-3) and (1-4), R 2and R 5represent the organic group of divalence, R 4represent the organic group of trivalent.As R 2preferred group is same with the situation of above-mentioned formula (1-1), as R 5r in preferred group and above-mentioned formula (1-1) 2equally.R 4be preferably and (comprise ester ring type compound, crosslinked ring type compound, spiro hydrocarbon from being selected from by chain type fatty compounds, ring type fatty compounds.), have the compound (comprising condensation polycyclic formula hydrocarbon and the benzene such as naphthalene, anthracene, naphthacene, Bi, perylene) of phenyl ring and hetero ring type compound composition group compound in remove 3 hydrogen atoms and the trivalent organic group that obtains.
Above-mentioned polymeric amide, polyimide or polyamidoimide are applicable to having polyoxy alkane two base.By making these condensation based polymers contain polyoxy alkane two base, the second-order transition temperature of adhesion agent composition reduces, and easily attaches when low temperature such as such as room temperatures, and tackiness becomes excellent.As polyoxy alkane two base, the group shown in following formula (2) can be enumerated.In formula, n represents the integer being more than or equal to 2, R 6represent alkane two base.Here, multiple R of existence 6can be the same or different each other.
[changing 4]
In above-mentioned formula (2), R 6can be that straight-chain also can for branched, alkane two base of preferred carbonatoms 2 ~ 4, more preferably alkane two base of carbonatoms 2 ~ 3.As R 6, include, for example ethane-1,2-bis-base, propane-1,2-bis-base, propane-1,3-bis-base, butane-Isosorbide-5-Nitrae-two base.N is preferably 2 ~ 70, is more preferably 6 ~ 33.
As polyoxy alkane two base, preferably from the group that the polyalkylene oxides such as polyethylene oxide, poly(propylene oxide), polybutylene oxide, polytetrahydrofuran, polyethylene oxide polypropylene oxide copolymers, polyoxyethylene glycol polytetramethylene glycol multipolymer, polypropylene glycol polytetramethylene glycol multipolymer, polyoxyethylene glycol polypropylene glycol polytetramethylene glycol multipolymer are derivative, more preferably polyethylene oxide base, polyoxygenated propane-1,2-bis-base.
As the method importing polyoxy alkane two base in polymeric amide, polyimide or polyamidoimide, easy is that at least one raw material (polymerizable monomer) uses the raw material with polyoxy alkane two base.
Polymeric amide such as can pass through the polycondensation of the monomer (A-1) shown in following formula (A-1) and the monomer (B-1) shown in following formula (B-1) and obtain.The carboxyl of monomer (A-1) can be made to become acid chloride group thus form polymeric amide, also can with other method manufacture.Monomer (A-1) and monomer (B-1) individually can use one, also can combinationally use two or more.Wherein, following formula (A-1) and (B-1) middle R 1and R 2definition and suitable examples described above.
[changing 5]
HOOC-R 1-COOH (A-1)
[changing 6]
H 2N-R 2-NH 2(B-1)
Polyimide such as by making the monomer (A-2) shown in following formula (A-2) and monomer (B-1) polycondensation and generating polyamic acid, and can make the method for its dehydration closed-loop to obtain.Also can substitute monomer (A-2) and use acid anhydride shown in following formula (A-2 ') (monomer (A-2 ')).Wherein, polyimide not necessarily must be manufactured by the method, as long as have the structural unit shown in above-mentioned formula (1-2), then also can be manufactured by additive method.Monomer (A-2) and monomer (B-1) individually can use one, also can combinationally use two or more.Wherein, R in following formula (A-2) and (A-2 ') 3definition and suitable examples described above.
[changing 7]
The polyamidoimide of above-mentioned formula (1-3) such as can generate imide dicarboxylic acid by making the monomer (A-3) shown in following formula (A-3) and monomer (B-1) react, and makes the monomer (C-1) shown in itself and following formula (C-1) react and obtain.Also can substitute monomer (A-3) and use acid anhydride shown in following formula (A-3 ') (monomer (A-3 ')).In addition, the polyamidoimide of above-mentioned formula (1-4) such as can obtain by making monomer (A-3) and monomer (B-1) polycondensation.Also can substitute monomer (A-3) and use monomer (A-3 ').Polyamidoimide not necessarily must be manufactured by the method, as long as have above-mentioned formula (1-3) or the structural unit shown in (1-4), then also can be manufactured by additive method.Monomer (A-3), monomer (A-3 '), monomer (B-1), monomer (C-1) individually can use one, also can combinationally use two or more.Wherein, R in following formula (A-3), (A-3 ') and (C-1) 4and R 5definition and suitable examples described above.
[changing 8]
OCN-R 5-NCO (C-1)
As monomer (A-1) (there is the monomer of 2 carboxyls), oxalic acid can be enumerated, propanedioic acid, succsinic acid, pentanedioic acid, hexanodioic acid, pimelic acid, suberic acid, nonane diacid, sebacic acid, 1, 9-dicarboxylic acid in the ninth of the ten Heavenly Stems, dodecanedioic acid, tetradecane diacid, pentadecane diacid, the alkylene dicarboxylic acids such as octadecane diacid, phthalic acid, terephthalic acid, m-phthalic acid, 1, 4-naphthalene dicarboxylic acids, 1, 5-naphthalene dicarboxylic acids, 2, the arylidene dicarboxylic acid such as 6-naphthalene dicarboxylic acids, 4-methylhexahydrophthaacid acid, 3-methylhexahydrophthaacid acid, 2-methylhexahydrophthaacid acid, 3-ethyl hexahydrophthalic acid, 2-ethyl hexahydrophthalic acid, methyl norbornane-2, 3-dicarboxylic acid, methyl norbornane-3, 4-dicarboxylic acid etc. has the dicarboxylic acid etc. of hexanaphthene skeleton.Improve from the viewpoint of the thermotolerance of adhesion agent composition, preferred arylidene dicarboxylic acid.
As monomer (A-2) (there is the monomer of 4 carboxyls), pyromellitic acid can be enumerated, 1,2,5,6-naphthalene tetracarboxylic acid, 2,3,6,7-naphthalene tetracarboxylic acid, 1,2,4,5-naphthalene tetracarboxylic acid, Isosorbide-5-Nitrae, 5,8-naphthalene tetracarboxylic acid, 3,3 ', 4,4 '-benzophenone tetracarboxylic acid, 3,3 ', 4,4 '-Biphenyl Ether tetracarboxylic acid, 3,3 ', 4,4 '-biphenyltetracarboxyacid acid, 2,3,5,6-pyridine tetracarboxylic acid, 3,4,9,10-perylene tetracarboxylic acid, 4,4 '-alkylsulfonyl two phthalic acid, 1-trifluoromethyl-2,3,5,6-benzene tertacarbonic acid, 2,2 ', 3,3 '-biphenyltetracarboxyacid acid, two (3, the 4-dicarboxyphenyi) propane of 2,2-, two (2, the 3-dicarboxyphenyi) propane of 2,2-, two (2, the 3-dicarboxyphenyi) ethane of 1,1-, two (3, the 4-dicarboxyphenyi) ethane of 1,1-, two (2,3-dicarboxyphenyi) methane, two (3,4-dicarboxyphenyi) methane, two (3,4-dicarboxyphenyi) sulfone, two (3,4-dicarboxyphenyi) ether, benzene-1,2,3,4-tetracarboxylic acid, 2,3,2 ', 3-benzophenone tetracarboxylic acid, 2,3,3 ', 4 '-benzophenone tetracarboxylic acid, luxuriant and rich with fragrance-1,8,9,10-tetracarboxylic acids, pyrazine-2,3,5,6-tetracarboxylic acid, thiophene-2,3,4,5-tetracarboxylic acid, 2,3,3 ', 4 '-biphenyltetracarboxyacid acid, 3,4,3 ', 4 '-biphenyltetracarboxyacid acid, 2,3,2 ', 3 '-biphenyltetracarboxyacid acid, two (3,4-dicarboxyphenyi) dimethylsilane, two (3,4-dicarboxyphenyi) aminomethyl phenyl silane, two (3,4-dicarboxyphenyi) diphenyl silane, Isosorbide-5-Nitrae-bis-(3,4-dicarboxyphenyi dimetylsilyl) benzene, 1,3-two (3,4-dicarboxyphenyi)-1,1,3,3-tetramethyl-bicyclohexane, to penylene two (trimellitate), ethylidene tetracarboxylic acid, 1,2,3,4-BTCA, perhydronaphthalene-Isosorbide-5-Nitrae, 5,8-tetracarboxylic acid, 4,8-dimethyl-1,2,3,5,6,7-hexahydro naphthalene-1,2,5,6-tetracarboxylic acid, pentamethylene-1,2,3,4-tetracarboxylic acid, tetramethyleneimine-2,3,4,5-tetracarboxylic acid, 1,2,3,4-tetramethylene tetracarboxylic acid, two rings-(2,2,2)-Xin (7)-alkene 2,3,5,6-tetracarboxylic acid, two (3, the 4-dicarboxyphenyi) HFC-236fa of 2,2-, two (4-(3, the 4-di carboxyl phenyloxy) phenyl) HFC-236fa of 2,2-, 4,4 '-bis-(3,4-di carboxyl phenyloxy) diphenyl sulfide, 4,4 '-(4,4 ' isopropylidene two phenoxy group)-bis-(phthalic acid), tetrahydrofuran (THF)-2,3,4,5-tetracarboxylic acid, two (external form two ring (2,2,1) heptane-2,3-dicarboxylic acid) sulfone, 1,2,4,5-tetracarboxylic hexanaphthene, two rings [2.2.2] octane-2,3,5,6-tetracarboxylic acid, 5,5 '-inner mold-(polysiloxane-1,5-bis-base)-bis-two rings [2,2,1] heptane-external form-2,3-dicarboxylic acid etc.
As monomer (A-3) (there is the monomer of 3 carboxyls), the ester ring type tricarboxylic acid etc. such as the aromatic tricarboxylic acids such as trimellitic acid, hexanaphthene-1,2,4-tricarboxylic acid can be enumerated.
As monomer (B-1), two [4-(4-amino-benzene oxygen) phenyl] propane of 2,2-can be enumerated, two [4-(3-amino-benzene oxygen) phenyl] sulfone, two [4-(4-amino-benzene oxygen) phenyl] sulfone, two [4-(4-amino-benzene oxygen) phenyl] HFC-236fa of 2,2-, two [4-(4-amino-benzene oxygen) phenyl] methane, 4,4 '-bis-(4-amino-benzene oxygen) biphenyl, two [4-(4-amino-benzene oxygen) phenyl] ether, two [4-(4-amino-benzene oxygen) phenyl] ketone, two (4-amino-benzene oxygen) benzene of 1,3-, Isosorbide-5-Nitrae-bis-(4-amino-benzene oxygen) benzene, 2,2 '-dimethyl diphenyl-4,4 '-diamines, 2,2 '-bis-(trifluoromethyl) biphenyl-4,4 '-diamines, 5,5 '-dimethyl-2,2 '-alkylsulfonyl-biphenyl-4,4 '-diamines, (4,4 '-diamino) phenyl ether, (4,4 '-diamino) sulfobenzide, (4,4 '-diamino) benzophenone, (3,3 '-diamino) benzophenone, (4,4 '-diamino) ditane, (4,4 '-diamino) phenyl ether, (3,3 '-diamino) phenyl ether, N, N ' aromatic diamine such as-bis-(4-aminophenyl) piperazine, quadrol, the Alkylenediamines such as propylene diamine, polyoxyethylene bis amine, the polyalkylene oxide diamines such as Polypropylene oxide diamine, (4,4 '-diamino) dicyclohexyl methyl hydride, isophorone diamine, Isosorbide-5-Nitrae-bis-aminopropylpiperazine, [two (1-the Aminoheptyl)-6-hexyl-5-(1-octenyl) of 3,4-] tetrahydrobenzene, the aliphatie diamines such as two amino methyl norbornylenes, the siloxane diamines etc. such as PDMS.
As monomer (C-1), ditane-2,4 '-vulcabond can be enumerated, 3,2 '-, 3,3 '-, 4,2 '-, 4,3 '-, 5,2 '-, 5,3 '-, 6,2 '-or 6,3 '-dimethyl diphenyl methane-2,4 '-vulcabond, 3,2 '-, 3,3 '-, 4,2 '-, 4,3 '-, 5,2 '-, 5,3 '-, 6,2 '-or 6,3 '-diethyl ditane-2,4 '-vulcabond, 3,2 '-, 3,3 '-, 4,2 '-, 4,3 '-, 5,2 '-, 5,3 '-, 6,2 '-or 6,3 '-dimethoxy ditane-2,4 '-vulcabond, ditane-4,4 '-vulcabond, ditane-3,3 '-vulcabond, ditane-3,4 '-vulcabond, phenyl ether-4,4 '-vulcabond, UVINUL MS 40,4 '-vulcabond, sulfobenzide-4,4 '-vulcabond, Toluene-2,4-diisocyanate, 4-vulcabond, Toluene-2,4-diisocyanate, 6-vulcabond, between xylylene diisocyanate, terephthaldehyde's group diisocyanate, naphthalene-2,6-vulcabond, the aromatic polyisocyanates such as 4,4 '-[2,2 pairs of (4-Phenoxyphenyl) propane] vulcabond.As monomer (C-1), hexamethylene diisocyanate, 2 can also be illustrated, 2,4-trimethyl hexamethylene diisocyanate, isophorone diisocyanate, 4, the aliphatics such as xylylene diisocyanate, lysinediisocyanate or ester ring type isocyanic ester between 4 '-dicyclohexyl methane diisocyanate, trans cyclohexane-Isosorbide-5-Nitrae-vulcabond, hydrogenation.As monomer (C-1), in order to avoid with number of days change, can use and carry out the material of stabilization by encapsulant, as such encapsulant, alcohol, phenol, oxime can be enumerated.
About condensation based polymer, preferably described above have polyoxy alkane two base in the structural unit shown in above-mentioned formula (1-1), (1-2), (1-3) or (1-4), there is polyoxy alkane two base in the structure from monomer (B-1) more preferably in structural unit.Namely, at least one in preferred monomers (A-1), (A-2), (A-2 '), (A-3), (A-3 ') and (B-1) has aforementioned polyoxy alkane two base, and at least one more preferably in monomer (B-1) has polyoxy alkane two base.
Therefore, condensation based polymer preferably has following structural unit, and described structural unit is by making to comprise the polymerizable monomer generation polycondensation with polyoxy alkane two base and at least 2 amino monomers (monomer (b-1)) and obtaining.
In polymerizable monomer, the content of monomer (b-1) is preferably 5 ~ 20mol% relative to the total amount of monomer (B-1), is more preferably 7 ~ 15mol%, more preferably 8 ~ 10mol%.Have and make such polymerizable monomer generation polycondensation and the adhesion agent composition of structural unit that obtains exists the more excellent tendency of adaptation between adherend.
As monomer (b-1), polyalkylene oxide polyamines can be enumerated.As polyalkylene oxide polyamines, preferred polyalkylene oxide diamines or polyalkylene oxide triamine, as such amine, can be applicable to using JEFFAMINED-230 (HUNTSMAN, trade(brand)name), JEFFAMINE D-400 (HUNTSMAN, trade(brand)name), JEFFAMINE D-2000 (HUNTSMAN, trade(brand)name), JEFFAMINED-4000 (HUNTSMAN, trade(brand)name) etc. Polypropylene oxide diamine, JEFFAMINE ED-600 (HUNTSMAN, trade(brand)name), JEFFAMINE ED-900 (HUNTSMAN, trade(brand)name) etc. the multipolymer diamines of poly(propylene oxide) and polyethylene oxide, JEFFAMINE EDR-148 (HUNTSMAN, trade(brand)name), JEFFAMINE EDR-176 (HUNTSMAN, trade(brand)name) etc. polyoxyethylene bis amine, JEFFAMINE T-403 (HUNTSMAN, trade(brand)name), JEFFAMINE T-3000 (HUNTSMAN, trade(brand)name), JEFFAMINE T-5000 (HUNTSMAN, trade(brand)name) etc. polyamines (poly(propylene oxide) triglyceride level triamine) etc.They may be used singly or in combination of two or more.
Condensation based polymer also preferably has ester ring type structure.The adhesion agent composition with such structure can suppress water-absorbent.As ester ring type structure, cyclohexyl, dicyclohexyl, methylene biscyclohexyl, isophorone base, cyclohexyldimethyl can be enumerated.
As the carboxylic serials monomer with such ester ring type structure, 1 as monomer (A-1) can be enumerated respectively, 4-dicarboxyl hexanaphthene, hexanaphthene-1,2,4 as monomer (A-2 '), 5-tetracarboxylic dianhydride and dicyclohexyl-3,3 ', 4,4 '-tetracarboxylic dianhydride, hexanaphthene-1 as monomer (A-3 '), 2,4-tricarboxylic acid anhydride.In addition, as the amine system monomer with above-mentioned ester ring type structure, can exemplified as two (amino methyl) hexanaphthene of two (4-aminocyclohexyl) methane, isophorone diamine and 1,3-of monomer (B-1).They may be used singly or in combination of two or more.
In addition, condensation based polymer preferably has methylene biscyclohexyl in structural unit, there is methylene biscyclohexyl in the structure from monomer (B-1) more preferably in structural unit.Namely, at least one in preferred monomers (A-1), (A-2), (A-2 '), (A-3), (A-3 ') and (B-1) has methylene biscyclohexyl, and at least one more preferably in monomer (B-1) has aforementioned methylene biscyclohexyl.
That is, condensation based polymer preferably has following structural unit, and described structural unit is by making to comprise the polymerizable monomer generation polycondensation with methylene biscyclohexyl and at least 2 amino monomers (monomer (b-2)) and obtaining.
In polymerizable monomer, the content of monomer (b-2) is preferably 4 ~ 28.5mol% relative to the total amount of monomer (B-1), is more preferably 8 ~ 28.5mol%, more preferably 8 ~ 20mol%.Have and enable such polymerizable monomer generation polycondensation and the adhesion agent composition of the structural unit obtained suppresses water-intake rate, storage stability is more excellent.
As monomer (b-2), can be applicable to using two (4-aminocyclohexyl) methane.
About condensation based polymer, from the structure of monomer (B-1), there is Isosorbide-5-Nitrae-piperazine two base in preferred structure unit, more preferably there is piperazine-N, N '-dipropyl.
That is, condensation based polymer preferably has following structural unit, and described structural unit has piperazine-N by making to comprise, the polymerizable monomer generation polycondensation of N '-dipropyl and at least 2 amino monomers (monomer (b-3)) and obtaining.
In polymerizable monomer, the content of monomer (b-3) is not particularly limited, and the residual quantity used after monomer (b-1) and (b-2) can be used as maximum.Making such polymerizable monomer generation polycondensation and the condensation based polymer of the structural unit obtained according to having, the adhesion agent composition of thermotolerance and adhesive balancing good can be obtained.
As monomer (b-3), can be applicable to using Isosorbide-5-Nitrae-bis-(3-aminopropyl) piperazine.
Condensation based polymer can by such as comprising monomer (A-1), the polycondensation of polymerizable monomer of (A-2) or (A-3) and monomer (B-1) obtains.In addition, monomer (A-1), (A-2) and (A-3) and use their carboxylate, sour halogenide etc. can also be substituted.In addition, monomer (A-2) and (A-3) can also be substituted and use their acid anhydride.
The method of polycondensation is not particularly limited, such as, can adopt and be dissolved in solvent by polymerizable monomer, and carries out the method for reacting according to temperature of reaction 0 ~ 200 DEG C, 1 ~ 10 hour reaction times degree.
As the solvent that polycondensation uses, N-Methyl pyrrolidone, N-ethyl pyrrolidone, N-methyl succimide, dimethyl furan, toluene, N can be enumerated, N '-dimethyl ethanamide, hexa-methylene phosphamide, methyl-sulphoxide etc.In the middle of these, consider from the solvability viewpoint of resin, preferred N-Methyl pyrrolidone.
In addition, in polycondensation, to promote for the purpose of condensation reaction, the accelerators such as catalyzer can be used.The addition of accelerator is preferably 0.1 ~ 50mol equivalent relative to polymerizable monomer 10mol equivalent.As accelerator, the quaternary ammonium salts etc. such as the tertiary amines such as the inorganic salt such as lithium chloride, calcium chloride, calcium thiocyanate, triethylamine, pyridine, tetramethyl ammonium chloride, tetraethylammonium bromide, tetra-n-butyl ammonium bromide can be enumerated.
Condensation based polymer can be by the material (modification condensation based polymer) of the further modification gained of polymkeric substance obtained by polycondensation, as modification condensation based polymer, olefin-modified polymeric amide can be enumerated, alkoxysilane-modified polymeric amide, silicone-modified polyimide, epoxide-modifying polyamide, polycarbonate modified polymeric amide, isocyanate-modified polymeric amide, olefin-modified polyimide, silicone-modified polyimide, epoxide modified polyimide, polycarbonate modified polyimide, silicone-modified polyimide, isocyanate-modified polyimide, olefin-modified polyamidoimide, alkoxysilane-modified polyamidoimide, silicone-modified polyamidoimide, epoxide-modifying polyamide imide, epoxide-modifying polyamide imide, polycarbonate modified polyamidoimide, isocyanate-modified polyamidoimide etc.
Adhesion agent composition contains and the functional group reactions of condensation based polymer described above and form reactive compounds that is crosslinked or grafting and (be sometimes only called below " reactive compounds ".) or carry out polymer quantification and (be sometimes only called below " polymerizable compound " with the polymerizable compound that condensation based polymer described above forms mixture.) or reactive compounds and polymerizable compound both (exist and use reactive compounds and this situation of 2 kinds of polymerizable compound and a kind of compound to have the situation of the function of both reactive compounds and polymerizable compound).Wherein, form the situation of " being cross-linked " as reactive compounds, can enumerate this compound and have situation that the is multiple and functional group of the functional group reactions of condensation based polymer, multiple condensation based polymer carries out bridge joint by reactive compounds in this case.On the other hand, form the situation of " grafting " as reactive compounds, can enumerate this compound have 1 with the situation of the functional group of the functional group reactions of condensation based polymer, reactive compounds is linked to the side chain etc. of condensation based polymer in this case.Wherein, reactive compounds and polymerizable compound are not limited to low molecular compound, also can be oligopolymer or macromolecular compound.
The functional group of the condensation based polymer reacted with reactive compounds is preferably from amido linkage (-CONH-), imide bond ((-CO) 2-N-) and amido acid structure (-R 0(COOH)-CONH-, R 0be the organic group of more than 3 valencys) at least one main chain functional group selected in the group that forms, or from carboxyl (-COOH), amino (-NH 2), at least one functional end-group selected in the group that forms of carboxylic acid halide's structure (-COOX, X are the halogen atoms such as chlorine atom) and carboxylic anhydride structure (-CO-O-CO-).
Reactive compounds can be the combination of the solidifying agent of such as isocyanate compound, masked isocyanate compound, epoxy resin or epoxy resin and this epoxy resin.
On the other hand, as polymerizable compound, the heat-curable compounds selected from the group of epoxy resin, cresol resin, melamine resin, urea-formaldehyde resin, unsaturated polyester resin, urethane resin, cyanate ester resin, isocyanate compound and masked isocyanate compound composition can be enumerated; Produce at least one in free radical, positively charged ion and negatively charged ion by active ray thus the compound of auto-polymerization or crosslinking reaction occurs; Or produce functional group thus the compound of generation curing reaction by active ray.Wherein, as in the epoxy resin of polymerizable compound, the solidifying agent of this epoxy resin can be added.
As producing free radical by active ray thus the compound (optical free radical polymerizable compound) of auto-polymerization occurring, (methyl) vinylformic acid can be enumerated, compound that (methyl) acrylate etc. has ethene unsaturated link(age).As producing negatively charged ion by active ray thus the compound (time photopolymerizable compound) of auto-polymerization occurring, cyanoacrylate and cyanoacrylate can be enumerated.As producing positively charged ion by active ray thus the compound (cationically photopolymerizable compound) of auto-polymerization occurring, epoxy compounds can be enumerated.Wherein (methyl) acrylic acid or the like refers to methacrylic or acrylic acid or the like, and other similar compounds are also same.
There is the compound of crosslinking reaction as at least one produced by active ray in free radical, positively charged ion and negatively charged ion, can be set forth in above-mentioned optical free radical polymerizable compound, time photopolymerizable compound, there is the compound of multiple reactive functional group in cationically photopolymerizable compound.
As producing functional group by active ray thus the compound of curing reaction occurring, light transfevent resin can be enumerated.As light transfevent resin, be the combination of isocyanate compound or urethane resin and Photobase generator, produce amine compound by active ray, by the amino of this amine compound, polymerization and solidification occur.
About above-mentioned reactive compounds and polymerizable compound, congener compound can be enumerated, this is because sometimes identical compound plays reactive compounds and the function both polymerizable compound.
As the functional group of reacting with amino, carboxyl and amido linkage, epoxy group(ing) can be enumerated.Epoxy group(ing) and amino carry out reacting according to such as following formula (3-1) and combine.In addition, epoxy group(ing) and carboxyl react according to such as following formula (3-2), and epoxy group(ing) and amido linkage combine according to such as following formula (3-3) or (3-4).Wherein, R in formula 7~ R 10represent the organic group of monovalence.
[changing 9]
As the functional group except epoxy group(ing) of reacting with amino, carboxyl and amido linkage, isocyanate group can be enumerated.Isocyanate group is carried out reacting according to such as following formula (4-1) with amino and combine.In addition, isocyanate group and carboxyl carry out reacting according to such as following formula (4-2) and combine, and isocyanate group and amide group carry out reacting according to such as following formula (4-3) and combine.Wherein, R in formula 8~ R 11represent the organic group of monovalence.
[changing 10]
From the viewpoint of being cross-linked efficiently, the epoxy resin as the compound with epoxy group(ing) preferably has the epoxy group(ing) of more than 2.As concrete example, bisphenol A type epoxy resin can be illustrated, biphenyl type epoxy resin, naphthalene type epoxy resin, bisphenol f type epoxy resin, phosphorous epoxy resin, bisphenol-s epoxy resin, alicyclic epoxy resin, aliphatics chain epoxy resin, phenol novolak type epoxy resin, cresol novolak type epoxy resin, bisphenol A novolac type epoxy resin, the 2-glycidyl etherate of bis-phenol, the 2-glycidyl etherate of naphthalene glycol, the 2-glycidyl etherate of phenols, the 2-glycidyl etherate of alcohols, and their alkyl substituents, halogenide, hydride etc.These epoxy resin may be used singly or in combination of two or more.
Epoxy resin is preferably further containing epoxy hardener.Thus, the reaction of epoxy resin is promoted, and the cementability reduction of adhesion agent composition becomes remarkable.As epoxy hardener, phenol type epoxy solidifying agent, cresols type epoxy hardener, ester type epoxy hardener etc. can be enumerated.In the middle of these, the excellent reduced from the viewpoint of the cementability of adhesion agent composition, preferred ester type epoxy hardener.Wherein, when using ester type epoxy hardener, think and to occur as follows with the reaction of epoxy resin.
[changing 11]
The addition of epoxy hardener is different according to the efficiency of solidification, preferably relative to epoxy 1 equivalent, uses 0.1 ~ 2.0 functional equivalent.
As the curing catalyst of epoxy resin, imidazoles can be added.As imidazoles, imidazoles can be enumerated, glyoxal ethyline, 2-undecyl imidazole, 1, 2-methylimidazole, 2-ethyl-4-imidazoles, 2-phenylimidazole, 2-phenyl-4-methylimidazole, 1-benzyl-2-phenylimidazole, 1 benzyl 2 methyl imidazole, 1-cyano ethyl-2-phenylimidazole, 1-cyano ethyl-2-ethyl-4-methylimidazole, 1-cyano ethyl-2-phenylimidazole, 2-benzylimidazoline, naphtho-imidazoles, pyrazoles, triazole, tetrazolium, indazole, pyridine, pyrazine, pyridazine, pyrimidine, benzotriazole, 1-cyano ethyl-glyoxal ethyline, 1-cyano ethyl-2-ethyl-4-methylimidazole, 1-cyano ethyl-2-undecyl imidazole, 1-cyano ethyl-2-phenylimidazole, trimellitic acid 1-cyano ethyl-2-undecyl imidazole salt, trimellitic acid 1-cyano ethyl-2-phenylimidazole salt etc.Consider from viewpoints such as the solidified nature of epoxy resin, curing catalyst preferably uses 0.01 ~ 5.0 mass parts relative to epoxy resin 100 mass parts.
Isocyanate compound is preferably masked isocyanate compound.Masked isocyanate compound is generated by the reaction of isocyanate compound and encapsulant and passed through the compound of the temporary transient inactivation of group from encapsulant, should dissociate, and generated isocyanate group when being heated to specified temperature from the group of encapsulant.As the concrete example of the isocyanate compound that can react with encapsulant, can 4 be enumerated, 4 '-'-diphenylmethane diisocyanate, 2,4-tolylene diisocyanate, 2,6-tolylene diisocyanate, naphthalene-1,5-vulcabond, O-phthalic group diisocyanate, an xylylene diisocyanate, 2, the ester ring type such as aliphatic polyisocyante, the bicycloheptane triisocyanate polyisocyanates etc. such as the aromatic polyisocyanates such as 4-toluene dimer, hexamethylene diisocyanate, 4,4-methylene-biss (cyclohexyl isocyanate), isophorone diisocyanate.
As encapsulant, preferably there is active hydrogen, active methylene group, diketone, oxime, phenol, alkanol and hexanolactam etc. can be enumerated.Specifically methyl ethyl ketone oxime, ε-caprolactam etc. can be used.
Then not limiting as long as masked isocyanate compound can realize object of the present invention, can be the commercially available material of Sumidur BL-3175, BL-4165, BL-1100, BL-1265, Desmodur TPLS-2957, TPLS-2062, TPLS-2957, TPLS-2078, TPLS-2117, DESMOTHERM 2170, DESMOTHERM 2265 (above is Sumitomo Bayer urethane (strain) system, trade(brand)name), CORONATE2512, CORONATE 2513, CORONATE 2520 (being Nippon Polyurethane Industry (Ltd.), trade(brand)name above) etc.
What can contain as adhesion agent composition carries out polymer quantification and forms the polymerizable compound of mixture with condensation based polymer, cyanate ester resin as described above or isocyanate compound can be enumerated, there is in concrete preferably molecule the isocyanic ester etc. in more than 2 cyanate ester based cyanates, molecule with more than 2 isocyanate group.
There are in molecule more than 2 cyanate ester based cyanate esters and generate triazine ring by carrying out 3 dimerizations according to following formula (5-1) thus polymerization (multimerization).Wherein, R in formula 12represent the organic group of divalence.
[changing 12]
The isocyanate compound in molecule with more than 2 isocyanate group sometimes carries out 3 dimerizations according to following formula (5-2) and is polymerized.Therefore, isocyanic ester can be described as and to be combined with condensation based polymer and to carry out the compound of polymer quantification.Wherein, R in formula 11represent the organic group of divalence.
[changing 13]
In adhesion agent composition, reactive compounds or polymerizable compound are preferably 0.01 ~ 50 quality % relative to the solids component amount of adhesion agent composition relative to the addition of condensation based polymer, be more preferably 0.1 ~ 30 quality %, more preferably 0.5 ~ 25 quality %, is particularly preferably 1 ~ 20 quality %.If this scope, then easily obtain sufficient flatness and tackiness, cementability can be made fully to reduce.
From the viewpoint of raising adaptation, adhesion agent composition can contain the adhesion imparting agents etc. such as Gum Rosin, terpine resin, coumarone resin, resol, styrene resin, aliphatics through-stone oleo-resinous, aromatic series through-stone oleo-resinous, aliphatic aromatic copolymerization through-stone oleo-resinous in the scope not damaging goal of the invention.
In addition, adhesion agent composition can contain the organic materialss such as inorganic materials, polymer particle such as alloy particle, glass particle, clay particles.More specifically, as alloy particle, tin alloy can be enumerated, lead alloy, indium alloy, zinc alloy, au-alloy etc., as glass, plumbous system can be enumerated, phosphate-based, boric acid system, vanadate system, telluride system, fluoridize system glass etc., as clay, humite (stevensite) can be enumerated, montmorillonite, kaolinite, illite, smectite, chlorite, vermiculite etc., as polymer particle, polyethylene terephthalate can be enumerated, polyacrylonitrile, fluoro-resin (PTFE), epoxy resin, nylon, polyimide, polyamidoimide, Polyethylene Naphthalate etc.Further, these inside particles also can be made to comprise silicone oil or fluorine system oil, and particle oozes out while becoming fragility due to heat in adhesion agent composition, flows out to bonding interface, thus bonding force is reduced further.
In addition, adhesion agent composition can containing the foam material by thermogenesis gas.As foam material, inside can be illustrated and comprise the polymer particle of low-boiling compound or produced the organic materials of gas by thermolysis.More specifically, as foam material, as long as object of the present invention can be reached then to be not particularly limited, inside can be enumerated and comprise the polymer particle etc. such as aqueous organic polyethylene terephthalate, polyacrylonitrile, fluoro-resin (PTFE), epoxy resin, nylon, polyimide, polyamidoimide, Polyethylene Naphthalate with 200 ~ 400 DEG C of boiling points.On the other hand, as the organic materials being produced gas by thermolysis, the sulfonylsemicarbazide based compounds etc. such as four azole compounds such as the Azo such as barium azodicarboxylate, amino tetrazole, two tetrazoliums, toluene sulfonyl semicarbazide can be illustrated.
In addition, in order to improve thermo-efficiency, adhesion agent composition can containing the material generated heat by hertzian wave.As such material and electromagnetic combination, the induction heating utilizing infrared rays (wavelength 0.1mm ~ 1 μm) to carry out for particles such as organic polymer, carbon, silicon, metal acid compound, glass, potteries can be enumerated, the inductor block heating that the metallics for magnetic, ferrimagnetism, ferromegnetism, antiferromagnetism or superparamagnetism utilizes microwave (wavelength 1m ~ 1mm) to carry out.
Adhesion agent composition is not preferably containing curing catalysts such as amine, carboxylic acid, acid anhydrides, superoxide, when containing curing catalysts, its content preferably relative to the solids component amount of adhesion agent composition for being less than or equal to 1 quality %, be more preferably and be less than or equal to 0.5 quality %.
Adhesion agent composition can provide with film shape.That is, the membranaceous tackiness agent containing above-mentioned adhesion agent composition is provided.Membranaceous tackiness agent can for comprising the membranaceous tackiness agent of individual layer or multiple adhesion agent composition layer or being formed with the membranaceous tackiness agent of individual layer or multiple adhesion agent composition layer at the single or double of supporter.The example of the manufacture method of membranaceous tackiness agent is as follows.
Such as, dry in the one side adhesion agent composition varnish containing adhesion agent composition can being coated supporter, thus make membranaceous tackiness agent.
In addition, adhesion agent composition varnish can also be coated on supporter two-sided upper and dry, thus be produced on the two-sided membranaceous tackiness agent with the layer of adhesion agent composition of supporter.
Further, also adhesion agent composition varnish can be coated on the films such as mold release film and dry, thus form the layer of adhesion agent composition, by the layer of this adhesion agent composition lamination transfer printing on supporter, thus make membranaceous tackiness agent.
The making method of casting that utilizes so easily can obtain the layer of smooth adhesion agent composition, is thus suitable for.
Also the membranaceous tackiness agent comprising multiple adhesion agent composition layer can be made.This membranaceous tackiness agent such as makes by following method: in the one side of supporter, be coated with the varnish of tackiness agent and dry and after forming the layer of adhesion agent composition, the varnish of other tackiness agents that further coating characteristics is different on this layer drying.
In addition, the membranaceous tackiness agent comprising multiple adhesion agent composition layer also makes by following method: to be coated respectively by the varnish of multiple adhesion agent compositions different for characteristic on the films such as mold release film and dry thus form the layer of adhesion agent composition, and is laminated to successively on supporter by these layers.
Specifically, such as, adhesion agent composition varnish containing reactive compounds can be used and not containing the adhesion agent composition varnish of reactive compounds, thus form the layer of the adhesion agent composition had containing reactive compounds and do not contain the layer of adhesion agent composition of this 2 layers of layer of adhesion agent composition of reactive compounds.When peeling off the membranaceous tackiness agent comprising so multiple adhesion agent composition layers, the stripping of the interface contacted with the layer of the adhesion agent composition containing reactive compounds is preferentially carried out.The membranaceous tackiness agent be laminated by multiple adhesion agent composition layers different for characteristic also can be peeled off according to the condition corresponding to each adhesion agent composition layer stage by stage.
The thickness of the layer of adhesion agent composition is preferably 0.1 ~ 100 μm, is more preferably 1 ~ 50 μm.The thickness of the layer of adhesion agent composition can carry out suitable adjustment according to the concentration of adhesion agent composition in foregoing binder composition varnish or the glue spread of adhesion agent composition varnish.
The solvent used in adhesion agent composition varnish is not particularly limited, from the viewpoint of adhesion agent composition display good solubility, preferably use glycol series solvent, glycol ethers series solvent, diol ester series solvent etc.
Specifically, ethylene glycol, Diethylene Glycol, triethylene glycol, propylene glycol, ethylene glycol, Diethylene Glycol, triethylene glycol, propylene glycol, diethylene glycol monomethyl ether, triethylene glycol monomethyl ether, propylene glycol monomethyl ether can be enumerated, MMB, ethylene glycol monomethyl ether acetic acid ester, PMA (propylene glycol monomethyl ether), diethylene glycol monobutyl ether acetic ester, TC acetic ester etc.In addition, N-Methyl pyrrolidone, N-ethyl pyrrolidone, N-methyl succimide, N can also be used, N '-dimethyl ethanamide, dimethyl formamide etc.These solvents can be used alone or mix two or more and use.
As supporter, be not particularly limited, preferred use has the material of thermotolerance for the temperature being more than or equal to 200 DEG C, can enumerate the supporter containing organic materialss such as polyester, polyimide, polymeric amide, polyethersulfone, polyphenylene sulfide, polyetherketone, polyether-ether-ketone, cellulosetri-acetate, polyetherimide, Polyethylene Naphthalate, polypropylene, vinylformic acid, polystyrene, polycarbonate.In addition, also can use the supporter containing organic and/or inorganic materials, the supporter containing inorganic materials such as aluminium, magnesium, titanium, chromium, manganese, iron, nickel, zinc, tin, glass, silicon chip, alloys can be used.
Adhesion agent composition can attach when room temperature, 200 ~ 270 DEG C time, also have sufficient cementability, and cementability can be made as required fully to reduce thus can easily peel off.
As the method peeled off by adhesion agent composition, the temperature such as 275 DEG C of heating more than 270 DEG C can be set forth in, mention thus the method peeled off after the cementability of adhesion agent composition is reduced.Heat-up time can suitably set, such as, be 30 minutes.In addition, even if the temperature of 200 ~ 270 DEG C, by long-time continuous heating, the cementability of adhesion agent composition also can be made to reduce thus easily peel off.
As the heating means of adhesion agent composition, the method that adherend or supporter are directly contacted with thermals source such as hot-plates can be illustrated, the method for the hot blast of blowing hot-air stove, moisture eliminator etc., the electromagnetic method such as irradiating microwaves, laser etc.In addition, as hertzian wave, laser, infrared rays, visible rays, ultraviolet, X-ray etc. can be illustrated.
As the suitable adherend that adhesion agent composition can be bonding, preferably the temperature being more than or equal to 200 DEG C is had to the material of thermotolerance.As adherend more specifically, as long as object of the present invention can be reached then to be not particularly limited, include, for example nylon 6, nylon66 fiber, the polyamide resins such as nylon 46, polyethylene terephthalate, Polyethylene Naphthalate, polytrimethylene terephthalate, poly-naphthalic acid propylene diester, polybutylene terephthalate, the vibrin such as poly-naphthalic acid fourth diester, polypropylene, the polyolefin resines such as polyethylene, acrylic resin, polyimide resin, polyethersulfone resin, polyphenylene sulfide, polyether ketone resin, polyether-ether-ketone resin, cellulosetri-acetate resin, polyetherimide resin, polycarbonate resin, polyarylate resin or their hybrid resin, aluminium, magnesium, titanium, chromium, manganese, iron, nickel, zinc, tin, glass, copper, silicon chip and alloy.In the middle of these materials, vibrin, polyamide resin, polyolefin resin, polyimide resin, acrylic resin, aluminium, magnesium, titanium, chromium, manganese, iron, nickel, zinc, tin, glass, copper and silicon chip are more preferably because of display high heat resistance.
Embodiment
Below, further illustrate the present invention by embodiment, but the invention is not restricted to embodiment.
(synthesis example 1)
Add m-phthaloyl chloride 43.75 parts (mol ratio), p-phthaloyl chloride 6.25 parts, the polypropylene glycol diamine (number of repeat unit of JEFFAMINE (registered trademark) D-2000, HUNTSMAN Inc., polypropylene glycol: 33) 5 parts, 1, two (3-aminopropyl) piperazine 45 parts of 4-and triethylamine 110 parts, carry out polycondensation in N-Methyl pyrrolidone.After reaction terminates, in reaction mixture, add the water of 3 times amount, by insoluble component separating, drying, thus obtain polyamide resin.
(embodiment 1)
The mode making the polyamide resin 10.0g, NC3000H (Nippon Kayaku K. K's system) 1.15g as epoxy resin and KA1165 (Dainippon Ink Chemicals's system) 0.43g as cresol novolak type epoxy solidifying agent that are obtained by synthesis example 1 become 35 quality % according to solids component amount is dissolved in N, N '-dimethyl ethanamide, obtains the varnish of the adhesion agent composition of embodiment 1.
(embodiment 2)
The mode making the polyamide resin 10.0g, NC3000H (Nippon Kayaku K. K's system) 1.15g as epoxy resin and HCP-8000-65T (Dainippon Ink Chemicals's system) 1.25g as ester type epoxy hardener that are obtained by synthesis example 1 become 35 quality % according to solids component amount is dissolved in N, N '-dimethyl ethanamide, obtains the varnish of the adhesion agent composition of embodiment 2.
(embodiment 3)
The mode making the polyamide resin 10.0g, EPICLON850S (Dainippon Ink Chemicals's system) 0.28g as epoxy resin and KA1165 (Dainippon Ink Chemicals's system) 0.12g as cresol novolak type epoxy solidifying agent that are obtained by synthesis example 1 become 35 quality % according to solids component amount is dissolved in N, N '-dimethyl ethanamide, obtains the varnish of the adhesion agent composition of embodiment 3.
(embodiment 4)
The mode making the polyamide resin 10.0g, EPICLON850S (Dainippon Ink Chemicals's system) 0.28g as epoxy resin and HCP-8000-65T (Dainippon Ink Chemicals's system) 0.34g as ester type epoxy hardener that are obtained by synthesis example 1 become 35 quality % according to solids component amount is dissolved in N, N '-dimethyl ethanamide, obtains the varnish of the adhesion agent composition of embodiment 4.
(embodiment 5)
The polyamide resin 10.0g making to be obtained by synthesis example 1, the mode becoming 35 quality % according to solids component amount as NC3000H (Nippon Kayaku K. K's system) 0.76g of epoxy resin are dissolved in N, N '-dimethyl ethanamide, obtains the varnish of the adhesion agent composition of embodiment 5.
(embodiment 6)
The polyamide resin 10.0g making to be obtained by synthesis example 1, the mode becoming 35 quality % according to solids component amount as NC3000H (Nippon Kayaku K. K's system) 1.14g of epoxy resin are dissolved in N, N '-dimethyl ethanamide, obtains the varnish of the adhesion agent composition of embodiment 6.
(embodiment 7)
The polyamide resin 10.0g making to be obtained by synthesis example 1, the mode becoming 35 quality % according to solids component amount as NC3000H (Nippon Kayaku K. K's system) 1.90g of epoxy resin are dissolved in N, N '-dimethyl ethanamide, obtains the varnish of the adhesion agent composition of embodiment 7.
(comparative example 1)
The mode making the polyamide resin obtained by synthesis example 1 become 35 quality % according to solids component amount is dissolved in N, and N '-dimethyl ethanamide obtains the varnish of the adhesion agent composition of comparative example 1.
(comparative example 2)
The polyamide resin 10.0g making to be obtained by synthesis example 1, the mode becoming 35 quality % according to solids component amount as KA1165 (Dainippon Ink Chemicals's system) 0.43g of cresol novolak type epoxy solidifying agent are dissolved in N, N '-dimethyl ethanamide, obtains the varnish of the adhesion agent composition of comparative example 2.
(comparative example 3)
The polyamide resin 10.0g making to be obtained by synthesis example 1, the mode becoming 35 quality % according to solids component amount as EXB-8000-65T (Dainippon Ink Chemicals's system) 1.25g of ester type epoxy hardener are dissolved in N, N '-dimethyl ethanamide, obtains the varnish of the adhesion agent composition of comparative example 3.
(experimental example 1)
Use applicator by the varnish brushing of the adhesion agent composition of embodiment 1 on the polyimide film of thickness 50 μm, the layer of dried adhesion agent composition is made to be that 15cm is square and thickness is 20 μm, within 30 minutes, carry out drying 160 DEG C of heating, make the membranaceous tackiness agent of embodiment 1.Then, be configured in by the membranaceous tackiness agent of gained on 10cm × 10cm sheet glass of thickness 70 μm, under room temperature environment, (25 DEG C) make roll-in be that the laminating machine of 0.3MPa passes through with the speed of 0.8m/ minute, thus attach.Then, in order to bonding force afterwards measures, the wide indentation of 10mm is engraved to the membranaceous tackiness agent attached.
(experimental example 2 ~ 7)
Except using the varnish of the adhesion agent composition of embodiment 2 ~ 7, operate in the same manner as experimental example 1, make the membranaceous tackiness agent of embodiment 2 ~ 7 respectively.In addition, operate in the same manner as the membranaceous tackiness agent of embodiment 1, respectively the membranaceous tackiness agent of embodiment 2 ~ 7 is attached on a glass, engrave the indentation that 10mm is wide.
(experimental example 8 ~ 10)
Except using the varnish of the adhesion agent composition of comparative example 1 ~ 3, operate in the same manner as experimental example 1, the membranaceous tackiness agent of comparison example 1 ~ 3.In addition, operate in the same manner as the membranaceous tackiness agent of embodiment 1, the membranaceous tackiness agent of comparative example 1 ~ 3 is attached on a glass, engraves the indentation that 10mm is wide.
The composition of the membranaceous tackiness agent of embodiment 1 ~ 7 and comparative example 1 ~ 3 is shown in table 1.
[table 1]
(evaluation of separability)
By the membranaceous tackiness agent of the embodiment 1 ~ 7 be attached on sheet glass and comparative example 1 ~ 3 in hot-air drying stove with 200 DEG C/15 minutes, then 250 DEG C/30 minutes, then within 275 DEG C/30 minutes, to heat again.Outward appearance for membranaceous tackiness agent when attaching on sheet glass and after above-mentioned each heating is evaluated.Membranaceous tackiness agent is unconfirmed to be evaluated as " B " to being evaluated as when floating " A " when the end of membranaceous tackiness agent confirms and floats, and is evaluated as " C " when membranaceous tackiness agent is peeled off.Result is shown at table 2.Arbitrary membranaceous tackiness agent can attach when room temperature, even and if also show good cementability at 200 ~ 275 DEG C.
In addition, the cementability (bonding force) of the membranaceous tackiness agent after above-mentioned each heating and separation mode are evaluated.Specifically, the one end being cut to the wide membranaceous tackiness agent of 10mm is peeled off from sheet glass, is fixed on the stretching clamp of stretching tester.By sheet glass by being pressed on platform, membranaceous tackiness agent being mentioned thus peels off from sheet glass, carrying out 90 ° of stripping tests.The bonding force of membranaceous tackiness agent is measured by this mensuration.In addition, while bonding force measures, separation mode is evaluated.Further, calculate the bonding force after heating in 275 DEG C/30 minutes relative to 200 DEG C/heating in 15 minutes after the ratio (%) of bonding force, as the bonding force after lift-off processing.Result displayed in Table 3.Separation mode is evaluated as membranaceous tackiness agent/glass interface stripping (to be labeled as in table " α ".), polyimide film/membranaceous tackiness agent interface peel (is labeled as in table " β ".) and membranaceous tackiness agent aggegation destroy (be labeled as in table " γ ".) in any.
As shown in table 3, the membranaceous tackiness agent demonstrating embodiment 1 ~ 7 by with 200 DEG C/15 minutes, then 250 DEG C/30 minutes, then within 275 DEG C/30 minutes, to heat again, bonding force is reduced to less than 30% of the bonding force after heating in 200 DEG C/15 minutes.
Use ester type epoxy hardener low as the bonding force of membranaceous tackiness agent after heating in 275 DEG C/30 minutes of the embodiment 2,4 of epoxy hardener, there is the tendency more easily peeled off.
[table 2]
[table 3]
By the membranaceous tackiness agent of the embodiment 1 ~ 4 be attached on sheet glass and comparative example 1 to heat from above-mentioned different condition.Specifically, in hot-air drying stove with 200 DEG C/15 minutes, then 260 DEG C/30 minutes, more then 260 DEG C/30 minutes, more then 260 DEG C/30 minutes, then within 275 DEG C/30 minutes, heat again.
For cementability (bonding force) and the separation mode of the membranaceous tackiness agent after above-mentioned each heating, operate as described above to evaluate.Result is shown at table 4.
[table 4]

Claims (16)

1. an adhesion agent composition, comprises:
Condensation based polymer, and
With the functional group reactions of described condensation based polymer and form the reactive compounds of crosslinked or grafting and/or carry out polymer quantification and form the polymerizable compound of mixture with described condensation based polymer.
2. adhesion agent composition according to claim 1, the formation of described crosslinked or grafting or described polymer quantize the irradiation by heating or active ray and occur.
3. adhesion agent composition according to claim 1 and 2,
Described condensation based polymer is polymeric amide, polyimide or polyamidoimide,
The described functional group of reacting with described reactive compounds is at least one main chain functional group selected from the group that amido linkage, imide bond and amido acid structure form, or at least one functional end-group selected from the group of carboxyl, amino, carboxylic acid halide's structure and carboxylic anhydride structure's composition.
4. the adhesion agent composition according to any one of claims 1 to 3, described condensation based polymer has polyoxy alkane two base.
5. the adhesion agent composition according to any one of Claims 1 to 4, described condensation based polymer has the fragrant cyclic group of divalence.
6. the adhesion agent composition according to any one of Claims 1 to 5, described condensation based polymer has Isosorbide-5-Nitrae-piperazine two base.
7. the adhesion agent composition according to any one of claim 1 ~ 6, described reactive compounds is the combination of solidifying agent of isocyanate compound, masked isocyanate compound, epoxy resin or epoxy resin and this epoxy resin.
8. the adhesion agent composition according to any one of claim 1 ~ 7, described reactive compounds is multifunctional reactive compounds.
9. the adhesion agent composition according to any one of claim 1 ~ 8, described polymerizable compound comprises:
At least one heat-curable compounds selected from the group of epoxy resin, cresol resin, melamine resin, urea-formaldehyde resin, unsaturated polyester resin, urethane resin, cyanate ester resin, isocyanate compound and masked isocyanate compound composition; And/or
Produce at least one in free radical, positively charged ion and negatively charged ion by active ray thus the compound of auto-polymerization or crosslinking reaction occurs, or produce functional group by active ray thus the compound of curing reaction occurs.
10. the adhesion agent composition according to any one of claim 1 ~ 9, quantized by the formation of described crosslinked or grafting and/or described polymer, tackiness reduces.
11. adhesion agent compositions according to any one of claim 1 ~ 10, the Applicable temperature within the scope of 200 ~ 270 DEG C can use as tackiness agent,
Exceeding the temperature of described Applicable temperature, formation and/or described polymer that described crosslinked or grafting occurs quantize, and tackiness reduces.
12. adhesion agent compositions according to any one of claim 1 ~ 10, the Applicable temperature within the scope of 200 ~ 270 DEG C can use as tackiness agent,
By the irradiation of active ray, formation and/or described polymer that described crosslinked or grafting occurs quantize, and tackiness reduces.
13. 1 kinds of duplexers, possess:
Supporter and the layer containing the adhesion agent composition according to any one of claim 1 ~ 12 be arranged on this supporter.
14. 1 kinds of compositions are as the application of tackiness agent, and described composition comprises:
Condensation based polymer, and
With the functional group reactions of described condensation based polymer and form the reactive compounds of crosslinked or grafting and/or carry out polymer quantification and form the polymerizable compound of mixture with described condensation based polymer.
15. application according to claim 14, described tackiness agent is tackiness agent clinging power being reduced by heating and/or the irradiation of active ray.
The stripping means of 16. 1 kinds of conjugants formed by the joint adherend of the layer containing adhesion agent composition in the adhesion agent composition according to any one of claim 1 ~ 12 or duplexer according to claim 13,
By this adhesion agent composition is heated or active ray irradiate clinging power is reduced, by the stripping at least partially of bonding part.
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CN113574083A (en) * 2019-03-20 2021-10-29 积水化学工业株式会社 Adhesive composition, adhesive tape, and method for processing electronic component
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CN114829125A (en) * 2019-11-26 2022-07-29 杜邦聚合物公司 Polyamide-metal laminate
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CN111253851A (en) * 2020-04-17 2020-06-09 华光圣奥防水材料股份有限公司 High-strength polyurethane waterproof coating and preparation method thereof

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JP6252483B2 (en) 2017-12-27

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