CN104711520B - Evaporation equipment - Google Patents
Evaporation equipment Download PDFInfo
- Publication number
- CN104711520B CN104711520B CN201410057314.5A CN201410057314A CN104711520B CN 104711520 B CN104711520 B CN 104711520B CN 201410057314 A CN201410057314 A CN 201410057314A CN 104711520 B CN104711520 B CN 104711520B
- Authority
- CN
- China
- Prior art keywords
- crucible body
- demarcation plate
- deposition materials
- evaporation equipment
- thermal conductivity
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000001704 evaporation Methods 0.000 title claims abstract description 29
- 230000008020 evaporation Effects 0.000 title claims abstract description 28
- 239000000463 material Substances 0.000 claims abstract description 58
- 230000008021 deposition Effects 0.000 claims abstract description 54
- 230000004308 accommodation Effects 0.000 claims abstract description 29
- 239000007921 spray Substances 0.000 claims abstract description 29
- 238000010438 heat treatment Methods 0.000 claims abstract description 15
- 238000009413 insulation Methods 0.000 claims abstract description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 4
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 4
- 239000010949 copper Substances 0.000 claims description 4
- 229910052802 copper Inorganic materials 0.000 claims description 4
- 239000010936 titanium Substances 0.000 claims description 4
- 229910052719 titanium Inorganic materials 0.000 claims description 4
- 238000005192 partition Methods 0.000 claims description 2
- 238000000151 deposition Methods 0.000 description 51
- 238000000034 method Methods 0.000 description 5
- 239000011368 organic material Substances 0.000 description 4
- 238000009792 diffusion process Methods 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000000758 substrate Substances 0.000 description 2
- 238000007740 vapor deposition Methods 0.000 description 2
- NFGXHKASABOEEW-UHFFFAOYSA-N 1-methylethyl 11-methoxy-3,7,11-trimethyl-2,4-dodecadienoate Chemical compound COC(C)(C)CCCC(C)CC=CC(C)=CC(=O)OC(C)C NFGXHKASABOEEW-UHFFFAOYSA-N 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000004925 denaturation Methods 0.000 description 1
- 230000036425 denaturation Effects 0.000 description 1
- 235000013399 edible fruits Nutrition 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000006698 induction Effects 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 229920002521 macromolecule Polymers 0.000 description 1
- 239000003550 marker Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000005693 optoelectronics Effects 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 238000004513 sizing Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
- C23C14/243—Crucibles for source material
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
Abstract
Evaporation equipment includes crucible body, heating part, spray nozzle part and multiple thermal insulation boards.Deposition materials are accommodated in crucible body.Evaporate the deposition materials being contained in crucible body in heating part.Spray nozzle part has at least one spray orifice, and deposition materials are sprayed by the spray orifice.Multiple thermal insulation boards are arranged in crucible body so that crucible body is divided into multiple accommodation spaces, and demarcation plate has opening, and accommodation space is communicated with each other by opening.
Description
Technical field
One aspect of the present invention is related to evaporation equipment.
Background technique
In a display device, organic light emitting display (OLED) generates having for light using by the compound of electrons and holes
Machine light emitting diode shows image.OLED has rapid response speed and with low-power drive.Therefore, OLED is as next-generation
Display device and attract attention.
In general, the depositing operation for forming the film made of organic material on substrate should be executed in order to manufacture OLED.Such as
Fruit is loaded into the deposition materials in crucible and is heated, then the steam for the deposition materials being evaporated passes through scheduled mask pattern and pacifies
On substrate.
Summary of the invention
According to an aspect of the invention, there is provided a kind of vaporising device comprising crucible body, heating part, spray nozzle part with
And multiple demarcation plates, wherein crucible body is configured to accommodate deposition materials wherein, and heating part is configured to evaporation and is contained in crucible body
In deposition materials, spray nozzle part be configured to have at least one spray orifice, deposition materials by spray nozzle part injection and multiple separations
Plate is arranged inside crucible body so that crucible body is divided into multiple accommodation spaces, and multiple demarcation plates have opening, and accommodation space passes through
It is open and communicates with each other.
Demarcation plate and crucible body can have different thermal conductivities.
Multiple demarcation plates can have different thermal conductivities.
Multiple demarcation plates may include: the first demarcation plate and the second demarcation plate, and the first demarcation plate has lower than crucible body
Second thermal conductivity of the first thermal conductivity, the second demarcation plate have the third thermal conductivity higher than the first thermal conductivity.
Each demarcation plate may include: the first surface being configured to the first thermal conductivity and be configured to have difference
In the second surface of the second thermal conductivity of the first thermal conductivity, second surface is opposite with first surface.
The size or quantity for the opening that each demarcation plate has can be different from other demarcation plates.
Demarcation plate can be configured to attach to crucible body/with crucible body and can separate.
Crucible body may include titanium, and demarcation plate may include copper.
Evaporation equipment can also include: the thermal insulation board being mounted at the side of crucible body.
The bottom surface of crucible body can be formed to have different height.
Bottom surface at the edge part of crucible body can be formed as than the bottom at the central part of crucible body
Surface is high.
Detailed description of the invention
Illustrative embodiments are described more fully with below by reference to attached drawing；However, illustrative embodiments can be with
Different forms is realized and should not be construed as limited to embodiment mentioned by this paper.On the contrary, providing these embodiment party
Formula is so that the disclosure is thorough and complete, and the range of illustrative embodiments is fully conveyed to those skilled in the art
Member.
In the accompanying drawings, in order to which clearly illustrate can up-sizing.It should be understood that being located at two members when an element is referred to as
Part " between " when, which can be the sole component between two elements, or one or more intermediary elements also may be present.
In the text, identical reference marker indicates identical element.
Fig. 1 is the schematic sectional view of evaporation equipment according to the first embodiment of the present invention.
Fig. 2 is the plan view of the evaporation equipment of Fig. 1.
Fig. 3 is to show the figure that the intracorporal demarcation plate of crucible is arranged in.
Fig. 4 A, Fig. 4 B, Fig. 4 C and Fig. 4 D are the figures for showing each embodiment of demarcation plate.
Fig. 5 is the sectional view for showing another embodiment of crucible body.
Specific embodiment
In the following detailed description, it only shows by way of example and describes certain exemplary embodiment party of the invention
Formula.As it will be understood by those skilled in the art that can be with a variety of different without departing substantially from the spirit or scope of the present invention
Mode modifies described embodiment.Therefore, attached drawing and description are substantially considered as illustrative and not restrictive.
Fig. 1 is the schematic sectional view of evaporation equipment according to the first embodiment of the present invention.Fig. 2 is the evaporation of Fig. 1
The plan view of equipment.
The evaporation equipment of the embodiment be for example applicable as manufacture device layers therein by deposition by liquid or
The reaction product of steam caused by solid deposition materials or steam and formed semiconductor device (such as memory or logic electricity
Road) vapor deposition apparatus, or be applicable as the vapor deposition of the display device for manufacturing such as Organic Light Emitting Diode
Equipment.However, being only for illustratively, it is other electrooptical devices that evaporation equipment can be applied according to deposition materials, such as electrification
Learn battery, photoconductive cell, light resistance, optoelectronic switch, phototransistor and photoelectric tube.
Although only describing the evaporation equipment with linear source structure in this embodiment, but the invention is not restricted to this.
In another embodiment, evaporation equipment can have point type source structure or region-type source structure.
Referring to Figures 1 and 2, evaporation equipment may include crucible body 10, heating part 20, spray nozzle part 30, demarcation plate 40 and every
Hot plate 50.
Crucible body 10 has in the space for wherein accommodating deposition materials SM.The crucible body 10 of the embodiment be with
The linear sources of rectangular vessel shape, wherein being disposed with multiple unit accommodation spaces (or bag) in one direction.Deposition materials SM
It may include macromolecule organic material, low molecule organic material, polymer, organic material etc..Deposition materials SM may be at solid-state
Or liquid.The deposition materials SM being contained in crucible body 10 can have fills a large amount of deposition materials SM while not executing technique
Structure so that the technique can be performed the long period.It in another embodiment, can be from crucible body 10 while executing technique
Externally supply deposition materials SM.
The material of a part of crucible body 10 or entire crucible body 10 can be selected from the metal material of such as stainless steel, aluminium, titanium or copper
Material passes through the material of such as quartz or glass inside its observable and such as ceramic material with thermal insulation effect
Any one of or their combination.However, the invention is not limited thereto.
Heating part 20 is the heating device for evaporating the deposition materials SM being contained in crucible body 10.Heating part 20 is placed in
10 inside of crucible body or the outer surface for being attached at crucible body 10.It is not particularly limited the type of heating part 20.For example, heating part 20
It can be heating coil or heating sheet.Alternatively, heating part 20 can be another heating device, such as pharoid,
Circulation of fluid heater or induction heater.
There is spray nozzle part 30 at least one spray orifice NH, the deposition materials SM being evaporated to spray across spray orifice NH.Spray nozzle part 30
It can be configured to be attached to crucible body 10/ to separate from crucible body 10.Spray nozzle part 30 can have following structure, that is, the upward shape of spray orifice NH
At covering crucible body 10 upper end plate in so that the deposition materials SM being evaporated pass through its spray.Spray orifice NH can be set
Correspond respectively to multiple spray orifices of accommodation space SA1 to SA4.Alternatively, it is possible to only form a spray orifice NH.It can be linearly
Arrange all spray orifice NH.Interval between the size and/or spray orifice NH of spray orifice NH can be uniformly, or can be according to spray orifice NH
Position and change.Spray nozzle part 30 can be suitably used by the type of consideration technique and the property of deposition materials SM.
The inside of crucible body 10 is arranged in dividing crucible body 10 for multiple accommodation space SA1 to SA4 in demarcation plate 40.Separate
Plate 40 obstructs the inner space of crucible body 10 and crucible body 10 is divided into accommodation space SA1 to SA4, and can be in crucible body 10
Two side walls in be respectively formed groove so that demarcation plate 40 pass through groove be inserted into crucible body 10 in.It can be to divided appearance
The size and number of space S A1 to SA4 received carry out a variety of modifications.For example, the size of accommodation space SA1 to SA4 can be equal to each other
Or it is different from each other.
Demarcation plate 40 includes opening OA to allow accommodation space SA1 to SA4 to be connected with each other.Accommodation space SA1 to SA4 is not
It is fully sealed, but is communicated with each other by the OA that is open.The deposition materials SM being contained in any one accommodation space may pass through out
Mouth OA is moved to another adjacent space.In depositing operation, deposition materials SM is not consumed not instead of equably, can be according to crucible
The interior location of body 10 differently consumes.In this case, deposition materials SM passes through opening OA and is moved to and relatively quickly disappears
It consumes in the accommodation space of deposition materials SM.
The amount of movement of deposition materials SM can be controlled by changing size or the quantity of opening OA.For this purpose, having difference
The demarcation plate 40 of size and number can be predisposed to be selectively arranged in crucible body 10.For example, being opened with large scale
The demarcation plate of mouth OA or a large amount of opening OA may be arranged in the accommodation space of the deposition materials SM with relatively large consumption, and
Demarcation plate with small orifices OA or a small amount of opening OA may be arranged at the deposition materials SM's with relatively small consumption
In accommodation space.
It can be by the way that the demarcation plate 40 with different thermal conductivities be arranged in crucible body 10, to improve accommodation space SA1 to SA4
Between deposition materials SM different consumption.Herein, demarcation plate 40 and crucible body 10 can have different thermal conductivities.For example,
Demarcation plate 40 may include the first demarcation plate 42 and the second demarcation plate 41 and 43, wherein the first demarcation plate 42, which has, is lower than crucible
Second thermal conductivity of the first thermal conductivity of body 10, the second demarcation plate 41 and 43 have the third thermal conductivity higher than the first thermal conductivity.
Therefore, the first demarcation plate 42 can be located at the second accommodation space SA2 of the deposition materials SM with big consumption and third accommodates sky
Between between SA3, the second demarcation plate 41 can be located at the first receiving space SA1 and the second appearance of the deposition materials SM with small consumption
It receives between space S A2, the second demarcation plate 43 can be located at the of the third accommodation space SA3 and deposition materials SM with small consumption
Between four accommodation space SA4.Crucible body 10 may include titanium, and demarcation plate 40 may include the copper with high heat conductance.
In this way, the demarcation plate 40 with different openings OA or different thermal conductivities is arranged in crucible body 10, so as to
Improve the different consumption of accommodation space SA1 to the deposition materials SM between SA4.
Thermal insulation board 50 may be provided at the side of crucible body 10.For example, when in the temperature uniformity for detecting crucible body 10
When the temperature of the central part of crucible body 10 afterwards is higher, the mountable side table in central part of structure with 50 form of thermal insulation board
On face.In such a case, it is possible to improve crucible body 10 by the size, material, thickness and the shape that change thermal insulation board 50
Thermal gradient.
Fig. 3 is to show the figure that the intracorporal demarcation plate of crucible is arranged in.Fig. 4 A, Fig. 4 B, Fig. 4 C and Fig. 4 D are to show demarcation plate
Embodiment figure.Fig. 5 is the sectional view for showing another embodiment of crucible body.
Referring to Fig. 3, demarcation plate 40 can be set to attach to crucible body 10/ and can separate from crucible body 10.In spray nozzle part 30
In the case where being separated with crucible body 10, the upper end that demarcation plate 40 may pass through the opening of crucible body 10 be inserted into crucible body 10 or
It separates to the outside of crucible body 10.After confirming the different consumption of accommodation space SA1 to the deposition materials SM between SA4, tool
There are the demarcation plate of large scale opening OA or a large amount of opening OA or the demarcation plate with high heat conductance to be arranged with relatively large
In the accommodation space of the deposition materials SM of consumption, and there is the demarcation plate of small orifices OA or a small amount of opening OA or have
The demarcation plate of lower thermal conductivity is arranged in the accommodation space of the deposition materials SM with relatively small consumption.
There can be a variety of implementations referring to Fig. 4 A, Fig. 4 B and Fig. 4 C, the number and shape for the opening OA being formed in demarcation plate
Mode.Shown in Fig. 4 A in the case where demarcation plate 40a, a part of the upper end of demarcation plate 40a is formed in an open-ended fashion, by
This increases thermal diffusion.Shown in Fig. 4 B in the case where demarcation plate 40b, other than being formed in the opening OA at its lower end, point
Partition 40b has air-tightness shape, so that the thermal diffusion between accommodation space is slowly held compared to above-mentioned demarcation plate 40a
Row.Shown in Fig. 4 C in the case where demarcation plate 40c, opening OA be may be integrally formed in demarcation plate 40c.In this case,
Demarcation plate 40c can have thermal expansion divergence corresponding with the intermediate degree of thermal diffusion of above-mentioned demarcation plate 40a and 40b.
Shown in Fig. 4 D in the case where demarcation plate 40d, demarcation plate 40d is had following structure, that is, has different thermal conductivities
Material be bonded to each other.Specifically, the demarcation plate 40d of the embodiment can be configured to include first with the first thermal conductivity
Surface 401 and second surface 402 with the second thermal conductivity for being different from the first thermal conductivity, second surface 402 and first surface
401 is opposite.For example, first surface 401 can be set to the accommodation space in face of the deposition materials SM with big consumption, thermal conductivity
The second surface 402 lower than first surface 401 can be set to the receiving in face of the deposition materials SM with relatively small consumption
Space.
Referring to Fig. 5, the bottom surface 11 in crucible body 10 may be formed to have different height.For example, working as deposition materials SM
Consumption at the central part of crucible body 10 is larger and consumption that deposition materials SM is at the edge part of crucible body 10 is smaller
When, the bottom surface 11 at the edge part of crucible body 10 can form than the bottom table at the central part of crucible body 10
Face 11 is higher.Therefore, deposition materials SM is initiatively moved to the central part of the deposition materials SM with larger consumption, thus changes
The different consumption of kind deposition materials SM.
By way of summarizing and looking back, the evaporation of deposition materials is preferably in depositing operation completely homogeneously in crucible
It carries out.However, in the presence of the feelings for not being uniform consumption but consuming deposition materials according to the interior location difference of crucible are likely to occur
Condition.For example, the deposition materials do not exhaust at moderate temperatures when deposit material is at the edge part of crucible.In addition,
When a part of deposition materials changes from gaseous state to when having lost energy during liquid, deposition materials can further accumulate.?
In this case, it may appear that the problems such as denaturation of such as deposition materials, heat loss, deposition efficiency deteriorate.
According to the present invention, evaporation equipment has multiple demarcation plates, and demarcation plate is arranged in crucible body to divide crucible body
For multiple accommodation spaces, and demarcation plate has opening, and accommodation space is communicated with each other by being open, and thus prevents deposition materials
Different consumption.
Illustrative embodiments have been disclosed herein, although using specific term, specific term is only applied to
And the purpose for being interpreted general and descriptive sense, rather than limiting.In some cases, in submission the application field
It is obvious to the skilled person that unless expressly stated otherwise, feature, characteristic in conjunction with described in particular implementation and/or
Element can be used alone, or be used together with feature, characteristic and/or element described in other embodiments is combined.Therefore,
It will be understood by those skilled in the art that without departing substantially from the spirit and scope of the present invention described in appended claims,
Various changes can be carried out to form and details.
Claims (10)
1. a kind of evaporation equipment, comprising:
Crucible body is configured to accommodate deposition materials wherein；
Heating part is configured to the deposition materials that evaporation is contained in the crucible body；
Spray nozzle part is configured to have at least one spray orifice, and the deposition materials are sprayed by the spray nozzle part；And
Multiple demarcation plates are arranged inside the crucible body so that the crucible body is divided into multiple accommodation spaces, the multiple point
Partition has opening, and the accommodation space is communicated with each other by the opening,
Wherein, the demarcation plate and the crucible body have different thermal conductivities.
2. evaporation equipment as described in claim 1, wherein multiple demarcation plates have different thermal conductivities.
3. evaporation equipment as claimed in claim 2, wherein
Multiple demarcation plates include the first demarcation plate and the second demarcation plate, and first demarcation plate, which has, is lower than the crucible body
The first thermal conductivity the second thermal conductivity, second demarcation plate have higher than first thermal conductivity third thermal conductivity.
4. evaporation equipment as described in claim 1, wherein each demarcation plate includes:
First surface is configured to have the first thermal conductivity；And
Second surface is configured to have second thermal conductivity different from first thermal conductivity, wherein the second surface and institute
It is opposite to state first surface.
5. evaporation equipment as described in claim 1, wherein the size or quantity of the opening that each demarcation plate has and its
Its demarcation plate is different.
6. evaporation equipment as described in claim 1, wherein the demarcation plate be configured to attach to the crucible body and with
The crucible body can separate.
7. evaporation equipment as described in claim 1, wherein the crucible body includes titanium, and the demarcation plate includes copper.
8. evaporation equipment as described in claim 1, further includes:
The thermal insulation board being mounted at the side of the crucible body.
9. evaporation equipment as described in claim 1, wherein the bottom surface of the crucible body is formed with different height
Degree.
10. evaporation equipment as claimed in claim 9, wherein the bottom surface positioned at the marginal portion of the crucible body is by shape
Bottom surface as the central part than being located at the crucible body is high.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020130156440A KR102182114B1 (en) | 2013-12-16 | 2013-12-16 | Evaporation apparatus |
| KR10-2013-0156440 | 2013-12-16 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104711520A CN104711520A (en) | 2015-06-17 |
| CN104711520B true CN104711520B (en) | 2019-01-04 |
Family
ID=53411231
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410057314.5A Expired - Fee Related CN104711520B (en) | 2013-12-16 | 2014-02-20 | Evaporation equipment |
Country Status (2)
| Country | Link |
|---|---|
| KR (1) | KR102182114B1 (en) |
| CN (1) | CN104711520B (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2019186843A1 (en) * | 2018-03-28 | 2019-10-03 | シャープ株式会社 | Vapor deposition source, vapor deposition device and vapor deposition method |
| KR102426163B1 (en) * | 2020-12-22 | 2022-07-27 | (주)데포랩 | Crucible for linear evaporation source |
| KR20240007433A (en) * | 2022-07-08 | 2024-01-16 | 엘지전자 주식회사 | Linear Deposition Source |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1274871C (en) * | 2003-05-08 | 2006-09-13 | 三洋电机株式会社 | Evaporation apparatus |
| CN1940123A (en) * | 2005-09-30 | 2007-04-04 | 三星Sdi株式会社 | Evaporating source and vacuum evaporating apparatus using the same |
| CN101845612A (en) * | 2008-12-18 | 2010-09-29 | 维易科精密仪器国际贸易(上海)有限公司 | Linear deposition source |
| CN102102176A (en) * | 2009-12-22 | 2011-06-22 | 三星移动显示器株式会社 | Evaporation source and deposition apparatus having the same |
| CN102102175A (en) * | 2009-12-17 | 2011-06-22 | 三星移动显示器株式会社 | Linear evaporation source and deposition apparatus having the same |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5400653B2 (en) | 2010-02-16 | 2014-01-29 | 株式会社日立ハイテクノロジーズ | Vacuum deposition equipment |
| KR101186609B1 (en) * | 2010-04-23 | 2012-09-27 | (주)알파플러스 | Thermal radiation heating type linear effusion cell |
| JP5492120B2 (en) * | 2011-03-08 | 2014-05-14 | 株式会社日立ハイテクノロジーズ | Evaporation source and vapor deposition equipment |
| JP2013209696A (en) * | 2012-03-30 | 2013-10-10 | Samsung Display Co Ltd | Vacuum deposition device and vapor deposition source of the same |
-
2013
- 2013-12-16 KR KR1020130156440A patent/KR102182114B1/en active IP Right Grant
-
2014
- 2014-02-20 CN CN201410057314.5A patent/CN104711520B/en not_active Expired - Fee Related
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1274871C (en) * | 2003-05-08 | 2006-09-13 | 三洋电机株式会社 | Evaporation apparatus |
| CN1940123A (en) * | 2005-09-30 | 2007-04-04 | 三星Sdi株式会社 | Evaporating source and vacuum evaporating apparatus using the same |
| CN101845612A (en) * | 2008-12-18 | 2010-09-29 | 维易科精密仪器国际贸易(上海)有限公司 | Linear deposition source |
| CN102102175A (en) * | 2009-12-17 | 2011-06-22 | 三星移动显示器株式会社 | Linear evaporation source and deposition apparatus having the same |
| CN102102176A (en) * | 2009-12-22 | 2011-06-22 | 三星移动显示器株式会社 | Evaporation source and deposition apparatus having the same |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20150069833A (en) | 2015-06-24 |
| CN104711520A (en) | 2015-06-17 |
| KR102182114B1 (en) | 2020-11-24 |
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