CN104703387A - PCB of power circuit for automobile instrument and design method of PCB - Google Patents
PCB of power circuit for automobile instrument and design method of PCB Download PDFInfo
- Publication number
- CN104703387A CN104703387A CN201510141034.7A CN201510141034A CN104703387A CN 104703387 A CN104703387 A CN 104703387A CN 201510141034 A CN201510141034 A CN 201510141034A CN 104703387 A CN104703387 A CN 104703387A
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- CN
- China
- Prior art keywords
- copper clad
- clad layers
- pcb board
- layers
- top layer
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0355—Metal foils
Abstract
The invention provides a PCB of a power circuit for an automobile instrument and a design method of the PCB and belongs to the design field of the PCBs of the power circuits for the automobile instruments. The PCB is used for solving the problems of unstable voltage output due to heating of the power circuit for the automobile instrument, and low working efficiency and inconvenience for the production of the production line due to the fixation of a cooling fin, a screw and a nut. The PCB of the power circuit for the automobile instrument is characterized in that the bonding pad of each heating element is covered with a large-area top copper coating. According to the design method of the PCB of the power circuit for the automobile instrument, the large-area top copper coating is designed on the bonding pad of each heating element. The top copper coating is advantageous for quickly dissipating heat and guaranteeing stable voltage output. The PCB and the design method are suitable for the production of the PCBs of the power circuits for the automobile instruments.
Description
Technical field
The invention belongs to the design field of the pcb board of automobile instrument power source circuit, particularly relate to the design of the heat radiation pcb board of large power, electrically source circuit.
Background technology
The power circuit of 12V automobile instrument generally only adopts a SMD power supply chip to be that whole instrument is powered, along with the development of automotive engineering, the signal of the required instruction of automobile instrument gets more and more, the electric current that automobile instrument power source chip carries constantly increases, while electric current increases, in power circuit, the caloric value of heater element also constantly increases thereupon, be illustrated in figure 1 main heat sink device in 12V automobile instrument power source circuit, in power circuit, element heating can cause voltage to export instability, in order to ensure that circuit can steady operation under golf calorific value, need to carry out radiating treatment to automobile instrument power source circuit.
In this case heat radiation typically uses high-power electric appliance element radiating face in special fin and power circuit and is secured together, and typically uses screw and nut is fixed.But because each high-power electric appliance element will use fin, screw, nut fixedly to make operating efficiency very low, be unfavorable for the large-scale production of production line.
Summary of the invention
The present invention can cause voltage to export instability to solve the heating of automobile instrument power circuit, and use fin, screw, nut fixedly to make inefficiency, be unfavorable for the problem of the production of production line, pcb board and the method for designing thereof of automobile instrument power circuit are now provided.
The pcb board of automobile instrument power circuit, the pad place of each heater element is all coated with large-area top layer copper clad layers, and the area of this top layer copper clad layers is greater than 10 times of heater element bonding pad area.
Top layer copper clad layers on pcb board has multiple via hole, and is coated with bottom copper clad layers at the pcb board bottom that multiple via hole is corresponding.
The bottom copper clad layers of pcb board bottom is close with the area of corresponding top layer copper clad layers, and described bottom coating layers of copper partially overlaps with corresponding top layer copper clad layers.
Bottom copper clad layers 2/1 to three/2nds surface area be coated with tin layers, and this tin layers region is the non-coincidence region of bottom copper clad layers and top layer copper clad layers.
The method for designing of the pcb board of automobile instrument power circuit, the method is: design large-area top layer copper clad layers at the pad place of each heater element, and the area of this layers of copper is greater than 10 times of heater element bonding pad area.
The top layer copper clad layers of pcb board designs multiple via hole, and in pcb board bottom-layer design bottom copper clad layers corresponding to multiple via hole.
The bottom copper clad layers of pcb board bottom is close with the area of corresponding top layer copper clad layers, and described bottom coating layers of copper partially overlaps with corresponding top layer copper clad layers.
Bottom copper clad layers 2/1 to three/2nds surface area be coated with tin layers, and this tin layers region is the non-coincidence region of bottom copper clad layers and top layer copper clad layers.
The pcb board of automobile instrument power circuit of the present invention, the pad place of each heater element is all coated with large-area top layer copper clad layers, because the thermal conductivity of copper is good, such increase heater element pad connect the area of layers of copper, can make heat Quick diffusing on element above connected layers of copper, heat is not accumulated on element, effectively prevent the damage that heater element raises along with operating time, temperature and causes, extend the useful life of element; Simultaneously due to the Quick diffusing of heat, ensure the stable output of voltage.Do not need fin in the present invention, simplify circuit structure, be more conducive to the production of production line, and then increase work efficiency.
The present invention adds the copper clad layers for dispelling the heat at the bottom of pcb board, makes heat be distributed in top layer and the bottom of pcb board, can also effective the distributing of accelerated heat.
The area of bottom copper clad layers of the present invention and top layer copper clad layers is close, makes the heat dissipation capacity of the top layer of pcb board and bottom close.Bottom coating layers of copper partially overlaps with corresponding top layer copper clad layers, that is: partially overlapping at via hole, and the heat of top layer copper clad layers is delivered to bottom copper clad layers by described via hole.
Above-mentioned technical characteristic ensure that bottom copper clad layers does not have large-area coincidence with the top layer copper clad layers of consolidated network, this is because, top layer can be unfavorable for dispersing of heat with large-area coincidence of the heat radiation layers of copper of bottom, therefore reduces overlapping area, also can ensure the radiating rate of the pcb board of circuit.
The present invention increases tin layers in the non-coincidence region of bottom copper clad layers and top layer copper clad layers, the rate of heat dissipation of bottom copper clad layers can be increased, and then be distributed in air by the heat in bottom copper clad layers faster, and then ensure the radiating efficiency of heater element in power circuit.
In the method for designing of the pcb board of automobile instrument power circuit of the present invention, large-area top layer copper clad layers is designed with at the pad place of each heater element, because the thermal conductivity of copper is good, adopt the pcb board that the method designs, can make heat Quick diffusing on element above connected layers of copper, heat is not accumulated on element, effectively prevent the damage that heater element raises along with operating time, temperature and causes, extend the useful life of element; Simultaneously due to the Quick diffusing of heat, ensure the stable output of voltage.Do not need fin in present embodiment, simplify circuit structure, be more conducive to the production of production line, and then increase work efficiency.
The power of the power device of automobile instrument inside is generally 1w-3w, and for the device of this kind of power, the heat dissipating method that this area adopts is all adopt fin to realize.The present invention has abandoned fin completely, but adopts the copper clad layers of pcb board to realize, and the caloric value of this kind of power device adopts the copper clad layers on pcb board to realize heat radiation, when the area of copper clad layers reaches 4cm
2-6cm
2in time, can realize, and the area of the pcb board of automobile instrument and the layout of components and parts can meet the requirement of above-mentioned copper clad layers area completely, therefore adopts method of the present invention can reach the effect of heat radiation completely.
Accompanying drawing explanation
Fig. 1 is the circuit theory diagrams of main heat sink device in 12V automobile instrument power circuit;
Fig. 2 is the layout of the top layer copper clad layers of the pcb board of the automobile instrument power circuit described in embodiment one;
Fig. 3 is the layout of the bottom copper clad layers of the pcb board of the automobile instrument power circuit described in embodiment three.
Embodiment
Embodiment one: illustrate present embodiment with reference to Fig. 2, the pcb board of the automobile instrument power circuit described in present embodiment, the pad place of each heater element is all coated with large-area top layer copper clad layers 1, and the area of this top layer copper clad layers 1 is greater than 10 times of heater element bonding pad area.
The pcb board of the automobile instrument power circuit described in present embodiment, the pad place of each heater element is all coated with large-area top layer copper clad layers 1, because the thermal conductivity of copper is good, such increase heater element pad connect the area of layers of copper, can make heat Quick diffusing on element above connected layers of copper, heat is not accumulated on element, effectively prevent the damage that heater element raises along with operating time, temperature and causes, extend the useful life of element; Simultaneously due to the Quick diffusing of heat, ensure the stable output of voltage.Do not need fin in present embodiment, simplify circuit structure, be more conducive to the production of production line, and then increase work efficiency.
Embodiment two: present embodiment is described see Fig. 3.Present embodiment is described further the pcb board of the automobile instrument power circuit described in embodiment one, in present embodiment, top layer copper clad layers 1 on pcb board has multiple via hole 2, and is coated with bottom copper clad layers 3 at the pcb board bottom of multiple via hole 2 correspondence.
Present embodiment adds copper clad layers 3 for dispelling the heat at the bottom of pcb board, makes heat be distributed in top layer and the bottom of pcb board, can also effective the distributing of accelerated heat.
Embodiment three: illustrate present embodiment with reference to Fig. 3, present embodiment is described further the pcb board of the automobile instrument power circuit described in embodiment two, in present embodiment, the bottom copper clad layers 3 of pcb board bottom is close with the area of corresponding top layer copper clad layers 1, and described bottom coating layers of copper 3 partially overlaps with corresponding top layer copper clad layers 1.
In present embodiment, bottom copper clad layers 3 is close with the area of top layer copper clad layers 1, makes the heat dissipation capacity of the top layer of pcb board and bottom close.Bottom coating layers of copper 3 partially overlaps with corresponding top layer copper clad layers 1, that is: partially overlapping at via hole 2, and the heat of top layer copper clad layers is delivered to bottom copper clad layers 3 by described via hole 2.This technical characteristic ensure that bottom copper clad layers 3 does not have large-area coincidence with the top layer copper clad layers 1 of consolidated network, this is because, top layer can be unfavorable for dispersing of heat with large-area coincidence of the heat radiation layers of copper of bottom, therefore reduces overlapping area, also can ensure the radiating rate of the pcb board of circuit.
Embodiment four: present embodiment is described further the pcb board of the automobile instrument power circuit described in embodiment three, in present embodiment, bottom copper clad layers 3 2/1 to three/2nds surface area be coated with tin layers 4, and this tin layers 4 region is bottom copper clad layers 3 and the non-coincidence region of top layer copper clad layers 1.
In present embodiment, tin layers 4 is increased in bottom copper clad layers 3 and the non-coincidence region of top layer copper clad layers 1, the rate of heat dissipation of bottom copper clad layers can be increased, and then faster the heat in bottom copper clad layers 3 is distributed in air, and then ensure the radiating efficiency of heater element in power circuit.
Embodiment five: present embodiment is the method for designing of the pcb board of automobile instrument power circuit described in embodiment one, the method is: design large-area top layer copper clad layers at the pad place of each heater element, and the area of this layers of copper is greater than 10 times of heater element bonding pad area.
In the method for designing of the pcb board of the automobile instrument power circuit described in present embodiment, large-area top layer copper clad layers is designed with at the pad place of each heater element, because the thermal conductivity of copper is good, adopt the pcb board that the method designs, can make heat Quick diffusing on element above connected layers of copper, heat is not accumulated on element, effectively prevent the damage that heater element raises along with operating time, temperature and causes, extend the useful life of element; Simultaneously due to the Quick diffusing of heat, ensure the stable output of voltage.Do not need fin in present embodiment, simplify circuit structure, be more conducive to the production of production line, and then increase work efficiency.
Embodiment six: present embodiment is described further the method for designing of the pcb board of the automobile instrument power circuit described in embodiment five, in present embodiment, the top layer copper clad layers of pcb board designs multiple via hole, and in pcb board bottom-layer design bottom copper clad layers corresponding to multiple via hole.
Present embodiment adds copper clad layers for dispelling the heat at the bottom of pcb board, makes heat be distributed in top layer and the bottom of pcb board, can also effective the distributing of accelerated heat.
Embodiment seven: present embodiment is described further the method for designing of the pcb board of the automobile instrument power circuit described in embodiment six, in present embodiment, the bottom copper clad layers of pcb board bottom is close with the area of corresponding top layer copper clad layers, and described bottom coating layers of copper partially overlaps with corresponding top layer copper clad layers.
In present embodiment, the area of bottom copper clad layers and top layer copper clad layers is close, makes the heat dissipation capacity of the top layer of pcb board and bottom close.Bottom coating layers of copper partially overlaps with corresponding top layer copper clad layers, that is: partially overlapping at via hole, and the heat of top layer copper clad layers is delivered to bottom copper clad layers by described via hole.This technical characteristic ensure that bottom copper clad layers does not have large-area coincidence with the top layer copper clad layers of consolidated network, this is because, top layer can be unfavorable for dispersing of heat with large-area coincidence of the heat radiation layers of copper of bottom, therefore reduces overlapping area, also can ensure the radiating rate of the pcb board of circuit.
Embodiment eight: present embodiment is described further the method for designing of the pcb board of the automobile instrument power circuit described in embodiment seven, in present embodiment, bottom copper clad layers 2/1 to three/2nds surface area be coated with tin layers, and this tin layers region is the non-coincidence region of bottom copper clad layers and top layer copper clad layers.
In present embodiment, tin layers is increased in the non-coincidence region of bottom copper clad layers and top layer copper clad layers, the rate of heat dissipation of bottom copper clad layers can be increased, and then faster the heat in bottom copper clad layers is distributed in air, and then ensure the radiating efficiency of heater element in power circuit.
Claims (8)
1. the pcb board of automobile instrument power circuit, is characterized in that, the pad place of each heater element is all coated with large-area top layer copper clad layers (1), and the area of this top layer copper clad layers (1) is greater than 10 times of heater element bonding pad area.
2. the pcb board of automobile instrument power circuit according to claim 1, it is characterized in that, top layer copper clad layers (1) on pcb board has multiple via hole (2), and is coated with bottom copper clad layers (3) at the pcb board bottom that multiple via hole (2) is corresponding.
3. the pcb board of automobile instrument power circuit according to claim 2, it is characterized in that, the bottom copper clad layers (3) of pcb board bottom is close with the area of corresponding top layer copper clad layers (1), and described bottom coating layers of copper (3) is heavy with corresponding top layer copper clad layers (1) part.
4. the pcb board of automobile instrument power circuit according to claim 3, it is characterized in that, bottom copper clad layers (3) 2/1 to three/2nds surface area be coated with tin layers (4), and this tin layers (4) region is bottom copper clad layers (3) and the non-coincidence region of top layer copper clad layers (1).
5. the method for designing of the pcb board of automobile instrument power circuit according to claim 1, it is characterized in that, the method is: design large-area top layer copper clad layers at the pad place of each heater element, and the area of this layers of copper is greater than 10 times of heater element bonding pad area.
6. the method for designing of the pcb board of automobile instrument power circuit according to claim 5, is characterized in that, the top layer copper clad layers of pcb board designs multiple via hole, and in pcb board bottom-layer design bottom copper clad layers corresponding to multiple via hole.
7. the method for designing of the pcb board of automobile instrument power circuit according to claim 6, it is characterized in that, the bottom copper clad layers of pcb board bottom is close with the area of corresponding top layer copper clad layers, and described bottom coating layers of copper partially overlaps with corresponding top layer copper clad layers.
8. the method for designing of the pcb board of automobile instrument power circuit according to claim 7, it is characterized in that, bottom copper clad layers 2/1 to three/2nds surface area be coated with tin layers, and this tin layers region is the non-coincidence region of bottom copper clad layers and top layer copper clad layers.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510141034.7A CN104703387A (en) | 2015-03-27 | 2015-03-27 | PCB of power circuit for automobile instrument and design method of PCB |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510141034.7A CN104703387A (en) | 2015-03-27 | 2015-03-27 | PCB of power circuit for automobile instrument and design method of PCB |
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| Publication Number | Publication Date |
|---|---|
| CN104703387A true CN104703387A (en) | 2015-06-10 |
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ID=53350040
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510141034.7A Pending CN104703387A (en) | 2015-03-27 | 2015-03-27 | PCB of power circuit for automobile instrument and design method of PCB |
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Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201298958Y (en) * | 2008-09-20 | 2009-08-26 | 深圳市神舟电脑股份有限公司 | MOSFET soldering pad design circuit board with heat dissipation holes |
| CN102683302A (en) * | 2011-03-08 | 2012-09-19 | 中国科学院微电子研究所 | Radiating structure for single chip package and system-in-package |
| CN203368927U (en) * | 2013-06-26 | 2013-12-25 | 深圳市晶福源电子技术有限公司 | PCB pad |
| CN103747610A (en) * | 2013-12-24 | 2014-04-23 | 苏州欢颜电气有限公司 | PCB thermal pad |
| CN104393160A (en) * | 2014-10-24 | 2015-03-04 | 苏州德鲁森自动化系统有限公司 | Six-pin 5050 LED lamp welding pad |
| CN204425783U (en) * | 2015-03-27 | 2015-06-24 | 航天科技控股集团股份有限公司 | The pcb board of automobile instrument power circuit |
-
2015
- 2015-03-27 CN CN201510141034.7A patent/CN104703387A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201298958Y (en) * | 2008-09-20 | 2009-08-26 | 深圳市神舟电脑股份有限公司 | MOSFET soldering pad design circuit board with heat dissipation holes |
| CN102683302A (en) * | 2011-03-08 | 2012-09-19 | 中国科学院微电子研究所 | Radiating structure for single chip package and system-in-package |
| CN203368927U (en) * | 2013-06-26 | 2013-12-25 | 深圳市晶福源电子技术有限公司 | PCB pad |
| CN103747610A (en) * | 2013-12-24 | 2014-04-23 | 苏州欢颜电气有限公司 | PCB thermal pad |
| CN104393160A (en) * | 2014-10-24 | 2015-03-04 | 苏州德鲁森自动化系统有限公司 | Six-pin 5050 LED lamp welding pad |
| CN204425783U (en) * | 2015-03-27 | 2015-06-24 | 航天科技控股集团股份有限公司 | The pcb board of automobile instrument power circuit |
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Application publication date: 20150610 |